JPH1140705A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card which can prevent damage in function parts without any need for increasing the thickness of the card. SOLUTION: In a non-contact type IC card 10, an accommodation recess 16 is dug in a rectangular flat plate-shaped main body 11 along its long side direction, and a chip on board(COB) package IC 20 is housed in the recess 16. A board 22 of the COB IC 20 is provided in its both ends with left and right mounts 23A and 23B, to which rectangular frame-shaped reinforcing plates 24 are fixed, and chip parts 30, 31 and 32 forming function parts of the IC card are mounted within inner spaces of the reinforcing plates 24 and then sealed with resin. The chip parts are positioned in the ends of the card and are surrounded by the reinforcing plates and sealed with resin. As a result, even when the card is subjected to a strong bending stress at its end, it can be avoided that the chip parts and thus card functions be damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and more particularly, to a semiconductor integrated circuit device (hereinafter referred to as IC) having a chip-on-board package (hereinafter referred to as COB).
That. ) Relates to a card built in a plastic card, for example, a card which is effective for use in a non-contact type IC card.

[0002]

2. Description of the Related Art An IC card includes a semiconductor integrated circuit device having a COB (hereinafter referred to as a COB IC) built in a plastic card. Among IC cards, those in which a microcomputer is constructed by COB / IC are called smart cards, and those using ICs having an EEPROM, a flash memory, or the like are called memory cards. In general, C
The OB / IC is inserted into a storage recess submerged on the surface near one end of the plastic card and adhered by an adhesive, and the outer lead is exposed outside the storage recess to allow the COB / IC to communicate with the outside. Communication has been secured.

Recently, a non-contact type IC card has been proposed as an IC card used for a commuter pass or a highway toll payment card. In this non-contact type IC card,
An inductor (coil) for transmission and reception is mounted on the mounting substrate of the COB / IC.

Japanese Patent Application Laid-Open No. 2-112264 discloses an example describing an integrated circuit device, a method of manufacturing the same, and an IC card using the same.

[0005]

SUMMARY OF THE INVENTION The above-mentioned non-contact type IC
The present invention has a problem that the mounting substrate of the card is restricted by the inductor, so that the portion on which the IC and other chip components are mounted is easily damaged, and it is relatively difficult to make the card thinner. Was revealed by

An object of the present invention is to provide an IC card which can prevent a functional part from being damaged without increasing its thickness.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, an IC card which has solved the above-mentioned problem has a rectangular flat plate-shaped card main body in which a storage recess is long set down in the long side direction of the card main body, and is stored and fixed in the storage recess. Is characterized in that a rectangular frame-shaped reinforcing plate is fixed to at least one end in the longitudinal direction, and a chip component is mounted and resin-sealed in an inner space of the reinforcing plate.

According to the above-mentioned means, since the chip parts constituting the functional part of the IC card are arranged at the end of the cover body, even if a strong bending stress acts on the IC card,
The function of the C card is not impaired. That is, I
Since a strong bending stress acts on the C card in the center of the IC card, if the chip components constituting the functional part of the IC card are arranged at the ends, the function of the IC card is prevented from being impaired. can do. In addition, since the chip component is surrounded by the reinforcing plate and sealed with resin, the mechanical strength is extremely high. For this reason, IC
Even if a strong bending stress acts on the end of the card, damage to the chip components is prevented.

[0011]

1 shows a non-contact type IC card according to an embodiment of the present invention. FIG. 1 (a) is a partially cutaway rear view, and FIG. 1 (b) is an enlarged bottom sectional view. FIG. 2 et seq. Show respective components of a non-contact type IC card according to an embodiment of the present invention.

In the present embodiment, the IC card according to the present invention is configured as a non-contact type IC card (hereinafter, referred to as an IC card). The IC card 10 includes a card body (hereinafter, referred to as a body) 11 and a COB IC2.
0 is provided. The main body 11 is made of a plastic having appropriate flexibility such as vinyl chloride, and is integrally formed into a rectangular flat plate shape as shown in FIG.
For example, when the IC card 10 is used for a commuter pass, the front surface of the main body 11 (hereinafter referred to as the front surface).
12, a departure / arrival station name, a usable period, and the like (not shown) may be displayed. Further, as shown by imaginary lines in FIG. 2, a magnetic stripe 14 may be formed on a rear surface 13 (hereinafter, referred to as a rear surface) of the main body 11. Magnetic stripe 14 of body 11
The emboss area 15 is set to a rectangular shape that is substantially half of the rectangular shape of the main body 11 in a region on the opposite side to the above. For example, in the emboss area 15, characters, symbols, and the like (not shown) indicating the name, identification number, and the like of the card owner are embossed.

In a region opposite to the embossed area 15 on the back side surface 13 of the main body 11, a storage recess 16 for storing the COB / IC 20 is submerged in a rectangular shallow hole shape that is approximately half the rectangular shape of the main body 11. ing. The storage recess 16 has a first hole 17 having a shallow depth corresponding to the thickness of the board of the COB / IC 20 described later, and both end portions of the first hole 17 (hereinafter, referred to as the first hole 17).
Left end and right end. ) And a pair of left and right second hole portions 1 respectively corresponding to a pair of mounting portions described later.
8A and 18B, and a pair of left and right third hole portions 19A and 19B disposed near the center of the left and right second hole portions 18A and 18B and respectively corresponding to a pair of multilayer wiring portions described later.

The COB IC 20 has a mounting board 21 shown in FIG. A board 22, which is a main body of the mounting board 21, is a rectangular flat plate having a size substantially equal to that of the first hole 17 of the main body 11 using an insulating substrate having an appropriate flexibility such as a glass impregnated epoxy resin substrate. It is formed in a shape. A pair of left and right mounting parts 23A and 23B on the left and right sides of the board 22 are respectively located at positions closer to one side (emboss area side) at both ends in the longitudinal direction (hereinafter referred to as left end and right end). The reinforcing plates 24 are provided on the left and right mounting portions 23A and 23B.
Are respectively fixed. Each reinforcing plate 24 is made of a material having elasticity (spring property) such as metal or resin.
Each of the left and right second holes 18A and 18B of the main body 11 is formed in a rectangular frame shape having substantially the same size, and is fixed to the board 22 by bonding or the like. On the board 22 in each reinforcing plate 24, a chip component mounting pad 25 and a wire bonding pad 26
Are appropriately formed.

A left multilayer wiring section 27 is provided at the center of the board 22.
A and a right multilayer wiring portion 27B are respectively set, and spiral inductors 28 and electric wires (not shown) for transmission and reception are provided in the left and right multilayer wiring portions 27A and 27B in multiple layers with an insulating layer 29 interposed therebetween. Is formed. The left multilayer wiring part 27A and the right multilayer wiring part 27B are constructed in a flexible structure.

In the assembling process, as shown in FIG. 4, a semiconductor chip (hereinafter, referred to as an IC chip) 30 having an integrated circuit built therein and a chip are mounted on the mounting board 21 configured as described above. The capacitor 31 and the chip resistor 32 are mounted on the left and right mounting parts 23A and 23B, respectively. The IC chip 30 is diced into small pieces smaller than the size of each reinforcing plate 24 in a dicing process in a subsequent process, after an integrated circuit of a microcomputer is formed in a state of a semiconductor wafer in a so-called preprocess in an IC manufacturing process. As a result, the manufactured I
It is a C structure. A plurality of electrode pads are formed on the outer peripheral portion on one main surface of the IC chip 30.

In the assembling process, first, an IC chip 30, a chip capacitor 31, and a chip resistor 32 are provided on each of the chip component mounting pads 25 specified in advance in the left and right mounting portions 23A and 23B with an adhesive layer ( (Not shown). Next, as shown in FIG. 4, the wires 33 are bridged between each electrode pad of the IC chip 30 and each wire bonding pad 26. As a result, each IC chip 30 is electrically connected to the wire bonding pads 26 on both sides via each wire 33. And IC chip 3
0, the chip capacitor 31 and the chip resistor 32 are electrically connected to the left and right spiral inductors 28, 28 via the left and right multilayer wiring portions 27A and 27B, respectively.

Next, as shown in FIG. 5, the left and right mounting portions 23A and 23B of the mounting substrate 21
Each resin sealing body 34 is formed in each reinforcing plate 24 by a potting method or a transfer method.

COB / IC manufactured as described above
Reference numeral 20 is mounted on the main body 11 as shown in FIG. That is, the COB / IC 20 is housed in the housing recess 16 with the left and right mounting portions 23A and 23B sides facing inward, and the adhesive layer 35 formed thin on the step surface of the first hole 17 inside the housing recess 16. Glued by
At this time, the left and right mounting portions 23A and 23B are fitted into the left and right second holes 18A and 18B, respectively, and the left and right multilayer wiring portions 27A and 27B are fitted into the left and right third holes 19A and 19B, respectively. The adhesive layer 3 is provided in the storage recess 16 of the main body 11.
5, the COB IC 20
Is exposed on the back side surface 13 of the main body 11 in the storage recess 16. In addition, a transparent protective cover (not shown) is attached to each of the front side and the back side of the main body 11.

Next, the operation and effect of the IC card 10 according to the above configuration will be described.

For example, when the IC card 10 is used for a commuter pass, the IC card 10 is passed through an automatic ticket gate at a station without contact. When the IC card 10 passes through the automatic ticket gate, the IC chip 30 mounted on the IC card 10 communicates with the automatic ticket gate via the spiral inductor 28. When the record of the IC card 10 conforms to the regulation by this communication, the ticket examination procedure is performed normally.

By the way, since the IC card 10 used for a commuter pass is to be carried by a person, there is a high possibility that bending stress acts. In the present embodiment, the IC chip 30, the chip capacitor 31, and the chip resistor 32 that constitute the functional unit of the IC card 10 are COB IC
In FIG. 20, since the IC card 10 is disposed on the left and right mounting portions 23A and 23B and disposed on both the left and right end portions of the main body 11, the function of the IC card 10 is impaired even if a strong bending stress acts on the IC card 10. There is no. This is because the strong bending stress acts on the IC card 10 at the center of the IC card 10.
If the IC chip 30, the chip capacitor 31, and the chip resistor 32 which constitute the functional part are arranged at both left and right end portions, it is possible to prevent the function of the IC card 10 from being impaired.

Moreover, the left and right mounting parts 23A and 23B
In this case, since the IC chip 30, the chip capacitor 31, and the chip resistor 32 are surrounded by the reinforcing plate 24 and then resin-sealed by the resin sealing body 34, the mechanical strength is extremely high. For this reason, the IC card 10
Even if a strong bending stress acts on both ends of the IC chip 30, the IC chip 30, the chip capacitor 31, and the chip resistor 32 mounted on the left and right mounting portions 23A and 23B are prevented from being damaged. In this case, if the reinforcing plate 24 has elasticity, the resistance of the left and right mounting portions 23A and 23B to bending stress can be further increased.

On the other hand, the left multilayer wiring portion 27A and the right multilayer wiring portion 27B arranged at the center of the IC card 10 are constructed in a flexible structure.
Can flexibly withstand a strong bending stress acting on the central portion of the substrate. That is, since the left multilayer wiring portion 27A and the right multilayer wiring portion 27B are not resin-sealed by the fragile resin sealing body, they are not damaged even if bent greatly. In addition, the left and right mounting portions 2 are provided by performing multilayer wiring on the left multilayer wiring portion 27A and the right multilayer wiring portion 27B.
3A and 23B can be set thinner accordingly.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist thereof. Needless to say.

For example, the mounting part is not limited to the left and right ends, and when the number of parts to be mounted is small, etc.
It may be set to either the left end or the right end.
Further, when the number of components is large, the mounting units are not limited to the left and right pair, and may be distributed to more than one.

The inductor may be constituted by a reinforcing plate. When the inductor is constituted by the reinforcing plate, the spiral inductor in the multilayer wiring portion may be omitted. Further, an inductor for communication with the outside may be omitted.

In the above description, the case where the invention made by the present inventor is mainly applied to a non-contact type IC card which is a background of application is described. However, the present invention is not limited to this. The present invention can be applied to all IC cards such as smart cards and memory cards.

[0029]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

The chip component of the IC card is mounted in the internal space of the reinforcing plate disposed at one end of the main body and sealed with a resin, so that the IC card is subjected to a strong bending stress when the IC card is subjected to a strong bending stress.
The function of the card can be prevented from being impaired.

[Brief description of the drawings]

FIGS. 1A and 1B show a non-contact type IC card according to an embodiment of the present invention, wherein FIG. 1A is a partially cutaway rear view, and FIG.

2A and 2B show a card body used for the non-contact type IC card, wherein FIG. 2A is a rear view and FIG. 2B is an enlarged bottom sectional view.

3A and 3B also show the mounting substrate, wherein FIG. 3A is a plan view, and FIG. 3B is an enlarged cross-sectional view taken along line bb of FIG. 3A.

4A and 4B show a state after the assembling step, and FIG.
(B) is an enlarged sectional view along the bb line of (a).

5A and 5B show a state after a resin sealing step, in which FIG. 5A is a plan view, and FIG. 5B is an enlarged sectional view taken along line bb of FIG.

[Explanation of symbols]

10 Non-contact IC card, 11 Card body, 12
Front side, 13 Back side, 14 Magnetic stripe, 15 Emboss area, 16 Storage recess, 17 First hole, 18A, 18B Second hole, 19A, 19B
Third hole, 20: COB / IC, 21: mounting board, 22
... Board, 23A ... Left mounting part, 23B ... Right mounting part, 24
... Reinforcement plate, 25 ... Pad for chip component mounting, 26 ... Pad for wire bonding, 27A ... Left multilayer wiring part, 27
B: right multilayer wiring section, 28: spiral inductor, 29
... an insulating layer, 30 ... an IC chip, 31 ... a chip capacitor, 32 ... a chip resistor, 33 ... a wire, 34 ... a resin sealing body, 35 ... an adhesive layer.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tomomichi Koizumi 5-20-1, Josuihonmachi, Kodaira-shi, Tokyo In the semiconductor division of Hitachi, Ltd. No. 15 Inside Nippon Tobu Semiconductor Co., Ltd. (72) Inventor Fumito Moriyama No. 15 Asahidai, Oro-machi, Iruma-gun, Saitama

Claims (8)

[Claims] 1. A rectangular flat plate-shaped card body has a storage recess extending long in the long side direction of the card body, and at least one longitudinal end of a board stored and fixed in the storage recess. An IC card having a rectangular frame-shaped reinforcing plate fixed thereto, and a chip component mounted in a space inside the reinforcing plate and sealed with a resin. 2. The board is characterized in that the reinforcing plates are fixed to both ends in the longitudinal direction of the board, and chip components are mounted and resin-sealed in inner spaces of the reinforcing plates. The IC card according to claim 1. 3. The IC card according to claim 1, wherein the reinforcing plate is formed of a material having elasticity. 4. The IC card according to claim 1, wherein the reinforcing plate is formed so as to form an inductor. 5. The IC card according to claim 1, wherein a multi-layer wiring portion is disposed at a central portion of the board. 6. The IC card according to claim 5, wherein an inductor is formed in the multilayer wiring section. 7. The IC card according to claim 5, wherein the multilayer wiring section is formed in a structure having flexibility. 8. The IC card according to claim 1, wherein the IC card is of a non-contact type.