JPH11191605A - Electronic component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently dissipate the heat generated from a chip part contained in a cavity of a substrate. SOLUTION: A chip part 5 is packaged in a cavity 3 provided in a substrate 2, while a plate 7 having a plurality of holes 8 is fixed on a stepped part 3a of the cavity 3. Next, the cavity 3 is filled with resin 9 via the holes 8. At this time, the swell in the resin 9 due to surface tension can be suppressed by the plate 7. Then, since a part of the filled resin 9 passes through the holes 8 of the plate 7, the surface 9a of the resin 9 is formed into raggedness on the plate 7. The surface 9a of the resin 9 is formed into ruggedness to make the surface area larger than that of a flat surface, thereby heat dissipation from the surface 9a of the resin 9 is facilitated and reliability is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted on various electronic devices and a method of manufacturing the same, and more particularly, to mounting a chip component inside a cavity provided on the surface of a substrate and sealing the cavity with a resin. And a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventional electronic parts are disclosed in Japanese Utility Model Application Laid-Open No. 3-53.
The configuration disclosed in Japanese Patent Publication No. 853 will be described as an example, and its configuration will be described with reference to FIG.

In FIG. 5, reference numeral 100 denotes an electronic component;
A substrate 101 is provided. A cavity 102 is provided on a surface 101 a of the substrate 101. Further, an electrode (not shown) is provided on the bottom 102 a of the cavity 102, a chip component 104 is mounted, and the chip component 104 and the electrode are connected by a bonding wire 105. Then, the cavity 102 is sealed by being filled with the resin 106. Here, the surface 106a of the filled resin 106 is flat and the surface
Is set at the same position as the surface 101a of the mounting substrate 101, and the surface 101a of the mounting board 101 can be mounted as a mounting surface.

[0004]

However, the conventional electronic component 100 has the following problems. That is, for example, when the output power of the electronic component 100 is relatively large, the chip component 10
4, the amount of heat generated increases, and it is necessary to efficiently dissipate this heat. However, since the area of the surface 106a of the resin 106 that seals the cavity 102 is defined by the opening of the cavity 102, the heat is It is difficult to be dissipated, and the reliability of the electronic component 100 may be impaired.

Also, in order to make the surface 106a of the resin 106 flat, it is necessary to suppress the resin 106 from rising due to surface tension. In selecting a resin material, it is necessary to consider viscosity and wettability with the substrate. However, the selection of the resin material is restricted.

Therefore, in the present invention, there is provided an electronic component in which heat generated from a chip component housed in a cavity of a substrate is efficiently dissipated and a degree of freedom in selecting a resin material to be filled in the cavity is increased. It is intended to provide a manufacturing method.

[0007]

In order to achieve the above object, in an electronic component according to the present invention, a cavity is provided on a surface of a substrate, a chip component is arranged inside the cavity, and the cavity is made of resin. Sealing, in an electronic component having the surface of the resin set at substantially the same position as the surface of the substrate, a plate having a plurality of holes in the thickness direction,
The resin is disposed near the opening inside the cavity, and the surface of the resin is formed in an uneven shape on the plate.

The cavity of the substrate has a step and a bottom, and has a stepped cross section, and the plate is disposed on the step of the cavity.

Further, a part or the whole of the plate is made of a conductive material.

In the method of manufacturing an electronic component according to the present invention, a chip component is arranged inside the cavity of the substrate using a substrate having a cavity on a surface and a plate having a plurality of holes in a thickness direction. And the step of disposing the plate in the vicinity of the opening inside the cavity, and filling the cavity with the resin through the hole of the plate, so that the surface of the resin is the same as the surface of the substrate. Setting at substantially the same position, and forming a surface of the resin in an uneven shape on the plate.

Further, the cavity of the substrate has a step and a bottom and has a stepped cross section, and the plate is arranged on the step of the cavity.

A substrate having a cavity on the surface;
Using a plate having a plurality of holes, disposing a chip component inside the cavity of the substrate, filling the cavity with resin, and placing the plate on the filled resin. Thereby, while setting the surface of the resin at substantially the same position as the surface of the substrate,
Forming a surface of the resin in an uneven shape on the plate.

According to the electronic component of the present invention, the surface of the resin filled in the cavity of the substrate is formed in an uneven shape, and has a larger surface area than a flat surface. Therefore,
The heat generated from the chip component housed in the cavity is easily dissipated from the surface of the resin, and the reliability of the electronic component is improved.

According to the electronic component of the present invention,
Since part or all of the plate disposed inside the cavity is made of a conductive material, the chip components housed in the cavity can be electromagnetically shielded, eliminating the need to mount a shield case or a metal plate. In addition, the number of assembly members can be reduced and the height can be reduced.

According to the method of manufacturing an electronic component of the present invention, a plate having a plurality of holes is provided inside the cavity, and the cavity is filled with the resin through the plate, whereby the resin rises. Is suppressed, and a part of the filled resin passes through the holes of the plate, and the surface of the resin becomes uneven. In addition, after filling the cavity of the substrate with the resin, a plate having a plurality of holes is placed on the resin, thereby suppressing the rise of the resin and allowing a part of the resin to pass through the holes of the plate. As a result, the surface of the resin becomes uneven.

In addition, since the rise of the resin is suppressed by the plate, there is no need to consider the viscosity and wettability to reduce the rise when selecting the resin material to be filled in the cavity, and the resin material can be freely selected. Great degree.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of an electronic component according to one embodiment of the present invention will be described with reference to FIG.

In FIG. 1, reference numeral 1 denotes an electronic component, which comprises a substrate 2. On the surface 2a of the substrate 2, there is provided a cavity 3 having a step portion 3a and a bottom portion 3b and having a stepped cross section. Further, an electrode (not shown) is provided on the bottom 3b of the cavity 3, and a chip component 5 composed of a semiconductor element or the like is mounted. Then, the chip component 5 and the electrode are connected by the bonding wire 6. A plate 7 is provided near the opening inside the cavity 3.
Is arranged. Here, the plate 7 is formed by molding a metal, and as shown in FIG. 2, a main surface portion 7a provided with a plurality of holes 8 in the thickness direction and a wall thickness below the drawing. The peripheral portion 7b. Then, the peripheral portion 7b is bonded and fixed to the step 3a of the cavity 3. The cavity 3 is sealed by being filled with a resin 9. In addition, a part of the resin 9 rises through the hole 8 of the plate 7, so that the surface 9 a of the resin 9 is formed in an uneven shape on the plate 7. The surface 9a of the resin 9 is set at substantially the same position as the surface 2a of the substrate 2. The plate 7 may be a punching plate generally used for printing an electrode on a substrate.

As described above, in the electronic component 1, the surface 9a of the resin 9 is formed in an uneven shape, and has a larger surface area than a flat surface. Therefore, for example, even when the output power of the electronic component 1 is large and the amount of heat generated by the chip component 5 housed in the cavity 3 is large, the heat generated from the chip component is easily dissipated from the surface 9 a of the resin 9, This is to improve the reliability of the electronic component 1.

In the electronic component 1, the plate 7
Is made of metal and is disposed so as to cover the opening of the cavity 3. Therefore, the chip component 5 can be electromagnetically shielded by the plate 7, and a shield case or a metal plate or the like is used to shield the chip component 5. It is not necessary to attach a, and the number of assembly members can be reduced and the height can be reduced.

The irregularities on the surface 9a of the resin 9
Is formed through the hole 8 of the plate 7 and has minute irregularities. Therefore, when the electronic component 1 is sucked by a mounter device or the like, there is no trouble due to the irregularities, and the electronic component 1 is handled. Is surely done.

Next, a method of manufacturing the electronic component 1 will be described with reference to FIG.

First, a substrate 2 having a cavity 3 and a plate 7 having a plurality of holes 8 are prepared.

Next, as shown in FIG. 3A, the chip component 5 is mounted on the bottom 3b of the cavity 3 of the substrate 2. Then, a wire 6 is formed by a bonding wire, and the chip component 5 is connected to an electrode (not shown) provided on the bottom 3 b of the cavity 3.

Next, the peripheral portion 7b of the plate 7 is bonded to the step 3a of the cavity 3, and the plate 7 is fixed on the step 3a. Thereby, the plate 7 is arranged near the opening inside the cavity 3. Here, the main surface 7a of the plate 7 is arranged at a distance from the wire 6 by the peripheral edge portion 7b, so that contact with the wire 6 is avoided.

Next, as shown in FIG. 3B, a resin 9 is supplied from a dispense needle 12 of the dispenser device, and the resin 9 is supplied to the cavity 3 through the hole 8 of the plate 7.
Fill. At this time, the swelling of the resin 9 due to surface tension is suppressed by the plate 7. And
As shown in FIG. 3C, a part of the filled resin 9 is
The surface 9 a of the resin 9 penetrates through the holes 8 of the plate 7 and is formed in an uneven shape on the plate 7. In this manner, the surface 9a of the resin 9 is substantially at the same position as the surface 2a of the substrate 2,
It is formed in an uneven shape.

Next, the resin 9 is heat-cured in an oven (not shown) to obtain the electronic component 1.

As described above, according to the electronic component manufacturing method of the present invention, the plate arranged inside the cavity of the substrate suppresses the resin swelling and partially fills the filled resin. And the surface of the resin becomes uneven.

Further, the resin provided in the cavity prevents the resin from rising when filling the cavity with the resin. Therefore, when selecting the resin material, the viscosity and the wettability with the substrate are adjusted so that the resin material does not rise excessively. There is no need to consider the properties, and the degree of freedom in selecting the resin material is high.

In the above embodiment, a case where a plate provided with a plurality of holes is used has been described.
When filling the cavity with resin, the shape of the plate
The resin is not limited to those shown in the above embodiments as long as it can transmit the resin and suppress the rise of the resin after filling. Therefore, for example, as in a plate 11 shown in FIG. 4, a so-called mesh-shaped main surface portion 11 a having a plurality of mesh-shaped holes in a thickness direction, and a peripheral portion that is thicker below the drawing. 11b.
Further, the peripheral portion of the plate may have the same thickness as the main surface portion.

In the above embodiment, the case where a metal plate is used has been described. However, the material of the plate may be other than metal as long as it has conductivity. For example, the plate may be formed of a conductive resin. May be.
Even when at least a part of the plate has conductivity, the chip components housed in the cavity can be electromagnetically shielded. Therefore, for example, a plate in which metal or conductive resin is applied or adhered to the surface of non-conductive resin may be used.

In the above embodiment, the case where the plate is fixed inside the cavity of the substrate and then the cavity is filled with the resin has been described. However, after the cavity is filled with the resin, the resin is filled through the opening of the cavity. A plate may be placed on the surface to suppress the rise of the resin, and the resin may have irregularities formed on its surface.

In the above embodiment, the case where the cavity provided on the substrate has a step and has a step-like shape has been described.
The present invention can be applied. In this case, for example, the plate can be stably arranged by providing a leg on a plate disposed inside the cavity and abutting the leg on the bottom of the cavity.

[0034]

According to the electronic component of the present invention, the surface of the resin filled in the cavity of the substrate is formed in an uneven shape, and has a larger surface area than a flat surface. Therefore, the heat generated from the chip component housed in the cavity is easily dissipated from the surface of the resin, and the reliability of the electronic component is improved.

According to the electronic component of the present invention,
Since part or all of the plate disposed inside the cavity is made of a conductive material, the chip components housed in the cavity can be electromagnetically shielded, eliminating the need to mount a shield case or a metal plate. In addition, the number of assembly members can be reduced and the height can be reduced.

According to the method for manufacturing an electronic component of the present invention, a plate having a plurality of holes is provided inside the cavity, and the cavity is filled with the resin via the plate, so that the resin rises. Is suppressed, and a part of the filled resin passes through the holes of the plate, and the surface of the resin becomes uneven. In addition, after filling the cavity of the substrate with the resin, a plate having a plurality of holes is placed on the resin, thereby suppressing the rise of the resin and allowing a part of the resin to pass through the holes of the plate. As a result, the surface of the resin becomes uneven.

Further, since the rise of the resin is suppressed by the plate, it is not necessary to consider the viscosity and the wettability in order to reduce the rise when selecting the resin material to be filled in the cavity. Great degree.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an electronic component according to one embodiment of the present invention.

FIG. 2 is a perspective view showing a plate constituting the electronic component of FIG. 1;

FIG. 3 is a cross-sectional view illustrating a method for manufacturing the electronic component of FIG.

FIG. 4 is a sectional view showing a modification of the plate of FIG. 2;

FIG. 5 is a cross-sectional view showing a conventional electronic component.

[Explanation of symbols]

 Reference Signs List 1 electronic component 2 substrate 2a (substrate) surface 3 cavity 3a step 3b bottom 5 chip component 7, 11 plate 7a, 11a main surface portion 7b, 11b peripheral portion 8 hole 9 resin 9a (resin) surface

Claims (6)

[Claims] 1. A cavity is provided on a surface of a substrate, a chip component is arranged inside the cavity, the cavity is sealed with a resin, and the surface of the resin is set at substantially the same position as the surface of the substrate. An electronic component comprising: a plate having a plurality of holes in a thickness direction disposed in the vicinity of an opening inside the cavity; and the surface of the resin is formed in an uneven shape on the plate. parts. 2. The method according to claim 1, wherein the cavity of the substrate has a step and a bottom, and has a stepped cross section, and the plate is arranged on the step of the cavity. Electronic components according to the above. 3. The electronic component according to claim 1, wherein part or all of the plate is made of a conductive material. 4. A step of using a substrate having a cavity on a surface thereof and a plate having a plurality of holes in a thickness direction, disposing a chip component inside the cavity of the substrate, and placing the plate inside the cavity. A step of disposing the resin in the vicinity of the opening; and filling the cavity with a resin through the hole of the plate to set the surface of the resin at substantially the same position as the surface of the substrate, and Forming a surface of the resin in an uneven shape. 5. The substrate according to claim 4, wherein the cavity of the substrate has a step and a bottom and has a stepped cross section, and the plate is arranged on the step of the cavity. 3. The method for manufacturing an electronic component according to claim 1. 6. A step of using a substrate having a cavity on a surface thereof and a plate having a plurality of holes to arrange chip components inside the cavity of the substrate, filling the cavity with a resin, Placing the plate on the filled resin to set the surface of the resin at substantially the same position as the surface of the substrate and forming the surface of the resin in an uneven shape on the plate And a method for manufacturing an electronic component.