JPH11176727A - 投影露光装置 - Google Patents
投影露光装置Info
- Publication number
- JPH11176727A JPH11176727A JP9341445A JP34144597A JPH11176727A JP H11176727 A JPH11176727 A JP H11176727A JP 9341445 A JP9341445 A JP 9341445A JP 34144597 A JP34144597 A JP 34144597A JP H11176727 A JPH11176727 A JP H11176727A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid
- optical system
- projection
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
(57)【要約】
【課題】 露光光を実質的に短波長化し、また、露光が
液体中で行われる場合であっても、基板表面の投影光学
系の光軸方向の位置を高精度に検出する。 【解決手段】 ウエハWに最も近い投影光学系のレンズ
4とウエハWとの間を満たすように側壁8内に液体7を
供給する。超音波射出系5から超音波を射出し、超音波
集束位置SSにおいて反射した超音波を超音波受信系6
により受信する。超音波受信系6からの検出信号に基づ
いて、超音波の集束位置SSにおけるベストフォーカス
位置からのデフォーカス量を求める。求められたデフォ
ーカス量に基づいて試料台9をZ方向に駆動し、フォー
カス位置の制御を行う。
液体中で行われる場合であっても、基板表面の投影光学
系の光軸方向の位置を高精度に検出する。 【解決手段】 ウエハWに最も近い投影光学系のレンズ
4とウエハWとの間を満たすように側壁8内に液体7を
供給する。超音波射出系5から超音波を射出し、超音波
集束位置SSにおいて反射した超音波を超音波受信系6
により受信する。超音波受信系6からの検出信号に基づ
いて、超音波の集束位置SSにおけるベストフォーカス
位置からのデフォーカス量を求める。求められたデフォ
ーカス量に基づいて試料台9をZ方向に駆動し、フォー
カス位置の制御を行う。
Description
【0001】
【発明の属する技術分野】本発明は、例えば、半導体素
子、液晶表示素子、又は薄膜磁気ヘッド等を製造するた
めのリソグラフィ工程に用いられる投影露光装置に関す
る。
子、液晶表示素子、又は薄膜磁気ヘッド等を製造するた
めのリソグラフィ工程に用いられる投影露光装置に関す
る。
【0002】
【従来の技術】半導体素子等を製造する際に、フォトマ
スクとしてのレチクルのパターンの像を投影光学系を介
して、基板としてのレジストが塗布されたウエハ(又は
ガラスプレート等)上の各ショット領域に転写するステ
ッパー型、又はステップ・アンド・スキャン方式等の投
影露光装置が使用されている。
スクとしてのレチクルのパターンの像を投影光学系を介
して、基板としてのレジストが塗布されたウエハ(又は
ガラスプレート等)上の各ショット領域に転写するステ
ッパー型、又はステップ・アンド・スキャン方式等の投
影露光装置が使用されている。
【0003】投影露光装置に備えられている投影光学系
の解像度は、使用する露光波長が短く、投影光学系の開
口数が大きいほど高くなる。そのため、集積回路の微細
化に伴い投影露光装置で使用される露光波長は年々短波
長化しており、投影光学系の開口数も増大してきてい
る。そして、現在主流の露光波長は、KrFエキシマレ
ーザの248nmであるが、更に短波長のArFエキシ
マレーザの193nmの使用も検討されている。
の解像度は、使用する露光波長が短く、投影光学系の開
口数が大きいほど高くなる。そのため、集積回路の微細
化に伴い投影露光装置で使用される露光波長は年々短波
長化しており、投影光学系の開口数も増大してきてい
る。そして、現在主流の露光波長は、KrFエキシマレ
ーザの248nmであるが、更に短波長のArFエキシ
マレーザの193nmの使用も検討されている。
【0004】また、露光を行う際には、解像度と同様に
焦点深度も重要となる。解像度R、及び焦点深度δはそ
れぞれ以下の式で表される。 R=k1 ・λ/NA (1) δ=k2 ・λ/NA2 (2) ここで、λは露光波長、NAは投影光学系の開口数、k
1 ,k2 はプロセス係数である。同じ解像度を得る場合
には短い波長の露光光を用いた方が大きな焦点深度を得
ることができる。しかしながら、投影光学系に使用され
る透過性の光学部材(硝材)の分光透過特性を考慮する
と、現時点ではArFエキシマレーザの193nmより
短い波長の露光光を透過できると共に、比較的大きなレ
ンズを形成できる均一な硝材はほとんどない。
焦点深度も重要となる。解像度R、及び焦点深度δはそ
れぞれ以下の式で表される。 R=k1 ・λ/NA (1) δ=k2 ・λ/NA2 (2) ここで、λは露光波長、NAは投影光学系の開口数、k
1 ,k2 はプロセス係数である。同じ解像度を得る場合
には短い波長の露光光を用いた方が大きな焦点深度を得
ることができる。しかしながら、投影光学系に使用され
る透過性の光学部材(硝材)の分光透過特性を考慮する
と、現時点ではArFエキシマレーザの193nmより
短い波長の露光光を透過できると共に、比較的大きなレ
ンズを形成できる均一な硝材はほとんどない。
【0005】
【発明が解決しようとする課題】上記の如く従来の投影
露光装置(投影光学系)では、ArFエキシマレーザの
193nmより短い波長の露光光を使用することは困難
である。そこで、実質的に露光波長を短くする方法とし
て、液浸法が提案されている。これは、ウエハを所定の
液体中に浸し、液体中での露光光の波長が、空気中の1
/n倍(nは液体の屈折率で通常1.2〜1.6程度)
になることを利用して解像度を向上し、焦点深度を増大
するというものである。
露光装置(投影光学系)では、ArFエキシマレーザの
193nmより短い波長の露光光を使用することは困難
である。そこで、実質的に露光波長を短くする方法とし
て、液浸法が提案されている。これは、ウエハを所定の
液体中に浸し、液体中での露光光の波長が、空気中の1
/n倍(nは液体の屈折率で通常1.2〜1.6程度)
になることを利用して解像度を向上し、焦点深度を増大
するというものである。
【0006】ところで、露光時には、露光範囲全体が投
影光学系の焦点深度の範囲内に入る必要があるため、投
影露光装置には、合焦機構(オートフォーカス機構)が
設けられている。これは、一般に露光すべきウエハの表
面に斜入射で光ビームを入射し、その反射光を対面の光
学系で受光してウエハ表面の合焦状態を検出し、ウエハ
を上下に移動して合焦位置へ追い込むというものであ
る。
影光学系の焦点深度の範囲内に入る必要があるため、投
影露光装置には、合焦機構(オートフォーカス機構)が
設けられている。これは、一般に露光すべきウエハの表
面に斜入射で光ビームを入射し、その反射光を対面の光
学系で受光してウエハ表面の合焦状態を検出し、ウエハ
を上下に移動して合焦位置へ追い込むというものであ
る。
【0007】露光されるウエハ表面には感光膜(フォト
レジスト)が塗布されており、このフォトレジストにパ
ターンが転写される。そこで、このフォトレジスト表面
を投影光学系の焦点位置に一致させることが望ましく、
フォトレジスト表面の位置をを検出する必要がある。従
来の投影露光装置では、ウエハが配置される空間は空
気、又は窒素等の気体で満たされている。そして、例え
ば空気の屈折率は1であり、ウエハ表面に塗布されたフ
ォトレジストの屈折率は、約1.7である。従って、空
気−フォトレジスト界面における光の反射率は、フレネ
ルの式より以下のように計算される。 反射率={(1−1.7)/(1+1.7)}2 ×100 =6.7(%) (3) 空気−フォトレジスト界面では、合焦検出用の光束の比
較的多くが反射し、フォトレジスト表面の位置を検出す
ることができる。
レジスト)が塗布されており、このフォトレジストにパ
ターンが転写される。そこで、このフォトレジスト表面
を投影光学系の焦点位置に一致させることが望ましく、
フォトレジスト表面の位置をを検出する必要がある。従
来の投影露光装置では、ウエハが配置される空間は空
気、又は窒素等の気体で満たされている。そして、例え
ば空気の屈折率は1であり、ウエハ表面に塗布されたフ
ォトレジストの屈折率は、約1.7である。従って、空
気−フォトレジスト界面における光の反射率は、フレネ
ルの式より以下のように計算される。 反射率={(1−1.7)/(1+1.7)}2 ×100 =6.7(%) (3) 空気−フォトレジスト界面では、合焦検出用の光束の比
較的多くが反射し、フォトレジスト表面の位置を検出す
ることができる。
【0008】しかし、液浸法を採用した投影露光装置の
場合には、ウエハが配置される空間は液体で満たされる
ことになる。例えば液体が水である場合、その屈折率は
1.3であり、水−フォトレジスト界面における光の反
射率は、フレネルの式より以下のように計算される。 反射率={(1.3−1.7)/(1.3+1.7)}2 ×100 =1.8(%) (4) 水−フォトレジスト界面では、空気−フォトレジスト界
面に比べ空間とフォトレジストとの屈折率の差が著しく
小さくなるため、合焦検出用の光束の反射率が低下し、
フォトレジスト表面の位置を正確に検出することが困難
となる。
場合には、ウエハが配置される空間は液体で満たされる
ことになる。例えば液体が水である場合、その屈折率は
1.3であり、水−フォトレジスト界面における光の反
射率は、フレネルの式より以下のように計算される。 反射率={(1.3−1.7)/(1.3+1.7)}2 ×100 =1.8(%) (4) 水−フォトレジスト界面では、空気−フォトレジスト界
面に比べ空間とフォトレジストとの屈折率の差が著しく
小さくなるため、合焦検出用の光束の反射率が低下し、
フォトレジスト表面の位置を正確に検出することが困難
となる。
【0009】本発明は斯かる点に鑑み、露光光の波長を
短波長化し、より微細なパターンを転写できる投影露光
装置を提供することを目的とする。さらに、液体中で感
光材料が塗布された基板上に露光が行われる場合であっ
ても、その感光材料の表面の投影光学系の光軸方向の位
置を高精度に検出することができる投影露光装置を提供
することをも目的とする。
短波長化し、より微細なパターンを転写できる投影露光
装置を提供することを目的とする。さらに、液体中で感
光材料が塗布された基板上に露光が行われる場合であっ
ても、その感光材料の表面の投影光学系の光軸方向の位
置を高精度に検出することができる投影露光装置を提供
することをも目的とする。
【0010】
【課題を解決するための手段】本発明の投影露光装置
は、マスク(R)のパターン像を投影光学系(PL)を
介して基板(W)上に転写する投影露光装置において、
その基板(W)の表面に所定の液体(7)を供給する液
浸装置(2,8)と、その基板(W)の表面に液体
(7)を介して超音波を送出し、その表面で反射される
超音波を検出することによってその表面のその投影光学
系(PL)の光軸方向の位置を検出する超音波方式の面
位置検出装置(5,6)とを備えたものである。
は、マスク(R)のパターン像を投影光学系(PL)を
介して基板(W)上に転写する投影露光装置において、
その基板(W)の表面に所定の液体(7)を供給する液
浸装置(2,8)と、その基板(W)の表面に液体
(7)を介して超音波を送出し、その表面で反射される
超音波を検出することによってその表面のその投影光学
系(PL)の光軸方向の位置を検出する超音波方式の面
位置検出装置(5,6)とを備えたものである。
【0011】斯かる本発明の投影露光装置によれば、マ
スク(R)のパターン像を液体(7)を介して基板
(W)の表面に露光するため、基板表面における露光光
の波長を空気中における波長の1/n倍(nは液体
(7)の屈折率)に短波長化できる。また、超音波方式
の面位置検出装置(5,6)により基板(W)の表面の
光軸方向の位置を高精度に検出するため、光学式の面位
置検出装置では面位置の検出が困難な液体(7)中にお
いても、その位置を高精度に検出することができる。
スク(R)のパターン像を液体(7)を介して基板
(W)の表面に露光するため、基板表面における露光光
の波長を空気中における波長の1/n倍(nは液体
(7)の屈折率)に短波長化できる。また、超音波方式
の面位置検出装置(5,6)により基板(W)の表面の
光軸方向の位置を高精度に検出するため、光学式の面位
置検出装置では面位置の検出が困難な液体(7)中にお
いても、その位置を高精度に検出することができる。
【0012】また、基板(W)の表面に感光材料(P
R)が塗布されている際に、面位置検出装置(5,6)
は、その感光材料(PR)の表面の投影光学系(3,
4)の光軸方向の位置を検出することが望ましい。この
場合、投影光学系(3,4)の像面をその感光材料(P
R)の表面に合わせ込むことができる。また、投影光学
系(PL)の基板(W)側の光学素子(4)の先端部と
その基板(W)の表面との間を満たすように液体(7)
が供給されることが望ましい。この場合、基板(W)表
面における露光光の波長を、空気中における露光光の波
長の1/n倍(nは液体(7)の屈折率)に短波長化で
きる。さらに、投影光学系(PL)の鏡筒(3)が液体
(7)に接触しないため、鏡筒(3)が腐食しにくくな
るという利点がある。
R)が塗布されている際に、面位置検出装置(5,6)
は、その感光材料(PR)の表面の投影光学系(3,
4)の光軸方向の位置を検出することが望ましい。この
場合、投影光学系(3,4)の像面をその感光材料(P
R)の表面に合わせ込むことができる。また、投影光学
系(PL)の基板(W)側の光学素子(4)の先端部と
その基板(W)の表面との間を満たすように液体(7)
が供給されることが望ましい。この場合、基板(W)表
面における露光光の波長を、空気中における露光光の波
長の1/n倍(nは液体(7)の屈折率)に短波長化で
きる。さらに、投影光学系(PL)の鏡筒(3)が液体
(7)に接触しないため、鏡筒(3)が腐食しにくくな
るという利点がある。
【0013】また、その液体(7)は、水(屈折率1.
3)、又は有機溶媒(例えばアルコール(エタノール
(屈折率1.36)等)、セダー油(屈折率1.52)
等)である。この場合に液体(7)として水を用いる場
合には、その入手が容易であるという利点がある。ま
た、液体(7)として有機溶媒を用いる場合には、投影
光学系(PL)の鏡筒(3)が腐食しにくくなるという
利点がある。さらに、液体(7)としてセダー油を用い
る場合には、その屈折率が約1.5と大きく、露光光を
より短波長化することができる。
3)、又は有機溶媒(例えばアルコール(エタノール
(屈折率1.36)等)、セダー油(屈折率1.52)
等)である。この場合に液体(7)として水を用いる場
合には、その入手が容易であるという利点がある。ま
た、液体(7)として有機溶媒を用いる場合には、投影
光学系(PL)の鏡筒(3)が腐食しにくくなるという
利点がある。さらに、液体(7)としてセダー油を用い
る場合には、その屈折率が約1.5と大きく、露光光を
より短波長化することができる。
【0014】また、基板(W)を保持してこの基板
(W)を投影光学系(PL)の光軸に垂直な平面上で位
置決めする基板ステージ(10)と、面位置検出装置
(5,6)の検出結果に基づいてその基板(W)の投影
光学系の光軸方向(3,4)の位置を制御する高さ制御
ステージ(9)とを備えることが望ましい。この場合、
投影光学系(3,4)の像面に対して基板(W)の表面
を高精度に合わせ込むことができる。
(W)を投影光学系(PL)の光軸に垂直な平面上で位
置決めする基板ステージ(10)と、面位置検出装置
(5,6)の検出結果に基づいてその基板(W)の投影
光学系の光軸方向(3,4)の位置を制御する高さ制御
ステージ(9)とを備えることが望ましい。この場合、
投影光学系(3,4)の像面に対して基板(W)の表面
を高精度に合わせ込むことができる。
【0015】
【発明の実施の形態】以下、本発明の実施の形態の一例
につき図1〜図3を参照して説明する。図1(a)は本
例の投影露光装置の概略構成を示し、この図1(a)に
おいて、露光光源としてのArFエキシマレーザ光源、
オプティカル・インテグレータ、視野絞り、コンデンサ
レンズ等を含む照明光学系1から射出された波長193
nmの紫外パルス光よりなる露光光ILは、レチクルR
に設けられたパターンを照明する。レチクルRのパター
ンは、両側(又はウエハ側に片側)テレセントリックな
投影光学系PLを介して所定の投影倍率β(βは例えば
1/4,1/5等)でフォトレジストPRが塗布された
ウエハW上の露光領域に縮小投影される。なお、露光光
ILとしては、KrFエキシマレーザ光(波長248n
m)、F2エキシマレーザ光(波長157nm)や水銀
ランプのi線(波長365nm)等を使用してもよい。
以下、投影光学系PLの光軸AXに平行にZ軸を取り、
Z軸に垂直な平面内で図1(a)の紙面に垂直な方向に
沿ってY軸を取り、紙面に平行な方向に沿ってX軸を取
って説明する。
につき図1〜図3を参照して説明する。図1(a)は本
例の投影露光装置の概略構成を示し、この図1(a)に
おいて、露光光源としてのArFエキシマレーザ光源、
オプティカル・インテグレータ、視野絞り、コンデンサ
レンズ等を含む照明光学系1から射出された波長193
nmの紫外パルス光よりなる露光光ILは、レチクルR
に設けられたパターンを照明する。レチクルRのパター
ンは、両側(又はウエハ側に片側)テレセントリックな
投影光学系PLを介して所定の投影倍率β(βは例えば
1/4,1/5等)でフォトレジストPRが塗布された
ウエハW上の露光領域に縮小投影される。なお、露光光
ILとしては、KrFエキシマレーザ光(波長248n
m)、F2エキシマレーザ光(波長157nm)や水銀
ランプのi線(波長365nm)等を使用してもよい。
以下、投影光学系PLの光軸AXに平行にZ軸を取り、
Z軸に垂直な平面内で図1(a)の紙面に垂直な方向に
沿ってY軸を取り、紙面に平行な方向に沿ってX軸を取
って説明する。
【0016】レチクルRはレチクルステージRST上に
保持され、レチクルステージRSTにはX方向、Y方
向、回転方向に微動できる機構が組み込まれている。レ
チクルステージRSTの2次元的な位置、及び回転角は
レーザ干渉計(不図示)によってリアルタイムに計測さ
れている。一方、ウエハWはウエハホルダ(不図示)を
介して試料台9上に保持され、試料台9はウエハWのフ
ォーカス位置(Z方向の位置)及び傾斜角を制御するZ
ステージ10上に固定されている。試料台9上には円筒
状の側壁8が設けられおり、その内部は液体7で満たさ
れている。液体7は、ポンプ等からなる液体供給回収系
2により、ノズル2aを介して露光前に側壁8内に供給
され、露光後に回収される。なお、本例の投影露光装置
では液体7として水(屈折率1.3)を使用しており、
光の波長は水中において空気中の1/1.3倍になるた
め、ArFエキシマレーザ(波長193nm)よりなる
露光光の波長は実質的に約148nmに短波長化され
る。
保持され、レチクルステージRSTにはX方向、Y方
向、回転方向に微動できる機構が組み込まれている。レ
チクルステージRSTの2次元的な位置、及び回転角は
レーザ干渉計(不図示)によってリアルタイムに計測さ
れている。一方、ウエハWはウエハホルダ(不図示)を
介して試料台9上に保持され、試料台9はウエハWのフ
ォーカス位置(Z方向の位置)及び傾斜角を制御するZ
ステージ10上に固定されている。試料台9上には円筒
状の側壁8が設けられおり、その内部は液体7で満たさ
れている。液体7は、ポンプ等からなる液体供給回収系
2により、ノズル2aを介して露光前に側壁8内に供給
され、露光後に回収される。なお、本例の投影露光装置
では液体7として水(屈折率1.3)を使用しており、
光の波長は水中において空気中の1/1.3倍になるた
め、ArFエキシマレーザ(波長193nm)よりなる
露光光の波長は実質的に約148nmに短波長化され
る。
【0017】また、投影光学系PLの鏡筒3は金属製で
あり、液体7による腐食を防止するため、本例では、投
影光学系PLと液体7との接触部分は、ウエハWに最も
近いレンズ4のみとしている。また、投影光学系PLの
鏡筒3の側面には、超音波射出系5と超音波受信系6と
よりなる焦点位置検出系(以下「AFセンサ5,6」と
呼ぶ)が取り付けられている。
あり、液体7による腐食を防止するため、本例では、投
影光学系PLと液体7との接触部分は、ウエハWに最も
近いレンズ4のみとしている。また、投影光学系PLの
鏡筒3の側面には、超音波射出系5と超音波受信系6と
よりなる焦点位置検出系(以下「AFセンサ5,6」と
呼ぶ)が取り付けられている。
【0018】図1(b)は図1(a)の側壁8近傍の拡
大図であり、この図1(b)において、側壁8にはウエ
ハWの試料台9上への搬送、又は試料台9からの搬出の
際に使用する開閉自在の扉8aが設けられている。ま
た、液体供給回収系2のノズル2aは、液体の供給、及
び回収の際に上下に駆動することができる構成となって
いる。
大図であり、この図1(b)において、側壁8にはウエ
ハWの試料台9上への搬送、又は試料台9からの搬出の
際に使用する開閉自在の扉8aが設けられている。ま
た、液体供給回収系2のノズル2aは、液体の供給、及
び回収の際に上下に駆動することができる構成となって
いる。
【0019】図1(a)に戻り、Zステージ10は投影
光学系PLの像面と平行なXY平面に沿って移動するX
Yステージ11上に固定され、XYステージ11は不図
示のベース上に載置されている。Zステージ10は、ウ
エハWのフォーカス位置(Z方向の位置)、及び傾斜角
を制御してウエハW上のフォトレジストPR表面をオー
トフォーカス方式、及びオートレベリング方式で投影光
学系PLの像面に合わせ込み、XYステージ11はウエ
ハWのX方向、及びY方向の位置合わせを行う。試料台
9(ウエハW)の2次元的な位置、及び回転角は、移動
鏡12の位置としてレーザ干渉計13によってリアルタ
イムに計測されている。この計測結果に基づいて主制御
系14からウエハステージ駆動系15に制御情報が送ら
れ、Zステージ10、XYステージ11の動作が制御さ
れ、露光時にはウエハW上の各ショット領域が順次露光
位置に移動し、レチクルRのパターンが各ショット領域
へ露光転写される。
光学系PLの像面と平行なXY平面に沿って移動するX
Yステージ11上に固定され、XYステージ11は不図
示のベース上に載置されている。Zステージ10は、ウ
エハWのフォーカス位置(Z方向の位置)、及び傾斜角
を制御してウエハW上のフォトレジストPR表面をオー
トフォーカス方式、及びオートレベリング方式で投影光
学系PLの像面に合わせ込み、XYステージ11はウエ
ハWのX方向、及びY方向の位置合わせを行う。試料台
9(ウエハW)の2次元的な位置、及び回転角は、移動
鏡12の位置としてレーザ干渉計13によってリアルタ
イムに計測されている。この計測結果に基づいて主制御
系14からウエハステージ駆動系15に制御情報が送ら
れ、Zステージ10、XYステージ11の動作が制御さ
れ、露光時にはウエハW上の各ショット領域が順次露光
位置に移動し、レチクルRのパターンが各ショット領域
へ露光転写される。
【0020】次に、本例の投影露光装置のAFセンサ
5,6について説明する。図2(a)は、本例の投影光
学系の下部近傍を拡大して示し、この図2(a)におい
て、超音波射出系5には超音波発生素子5a、及び超音
波集束素子5bが設けられている。圧電素子等からなる
超音波発生素子5aから射出された周波数50MHz〜
200MHz程度の超音波は、超音波集束素子5bによ
りウエハWに塗布されたフォトレジストPR表面上の集
束位置SSに集束され、集束位置SSで反射して超音波
受信系6に入射する。超音波受信系6には超音波受信素
子6a、超音波集束素子6b、及び振動できる遮音板6
cが設けられており、超音波受信系6に入射した超音波
は超音波集束素子6bにより集束され、遮音板6cの開
口を介して超音波受信素子6aに入射する。超音波受信
素子6aの検出信号は主制御系14に供給される。な
お、遮音板6cの中央部には超音波を通過させる開口が
設けられて、主制御系14が遮音板駆動機構6dにより
遮音板6cを横シフト(又は振動)させて超音波受信素
子6aの検出信号が最大になる位置を検出する。又は、
遮音板6cを振動させるのに同期した信号で超音波受信
素子6aの検出信号を同期検波してもよい。
5,6について説明する。図2(a)は、本例の投影光
学系の下部近傍を拡大して示し、この図2(a)におい
て、超音波射出系5には超音波発生素子5a、及び超音
波集束素子5bが設けられている。圧電素子等からなる
超音波発生素子5aから射出された周波数50MHz〜
200MHz程度の超音波は、超音波集束素子5bによ
りウエハWに塗布されたフォトレジストPR表面上の集
束位置SSに集束され、集束位置SSで反射して超音波
受信系6に入射する。超音波受信系6には超音波受信素
子6a、超音波集束素子6b、及び振動できる遮音板6
cが設けられており、超音波受信系6に入射した超音波
は超音波集束素子6bにより集束され、遮音板6cの開
口を介して超音波受信素子6aに入射する。超音波受信
素子6aの検出信号は主制御系14に供給される。な
お、遮音板6cの中央部には超音波を通過させる開口が
設けられて、主制御系14が遮音板駆動機構6dにより
遮音板6cを横シフト(又は振動)させて超音波受信素
子6aの検出信号が最大になる位置を検出する。又は、
遮音板6cを振動させるのに同期した信号で超音波受信
素子6aの検出信号を同期検波してもよい。
【0021】図2(b)は、フォトレジストPR表面上
の超音波の集束位置SS付近を拡大して示し、この図2
(b)において、ウエハW上には感光用のフォトレジス
トPRが塗布されている。従来の光学式で斜入射方式の
AFセンサによりフォトレジストPR表面上の位置SS
を検出しようとしても、液体7とフォトレジストPRの
屈折率が同程度で反射率が極めて低くなり、光は経路1
7に沿ってウエハWの表面まで進むため、検出される位
置SS’はフォトレジストPRの表面上に位置せず、投
影光学系PLの像面にはウエハWの基板自体の表面が合
わせ込まれる。本例のAFセンサ5,6の超音波は経路
16に沿って進みフォトレジストPRの表面で反射され
るため、フォトレジストPR表面上の位置SSが正確に
検出され、高精度にフォトレジストPR表面を像面に合
焦させることができる。
の超音波の集束位置SS付近を拡大して示し、この図2
(b)において、ウエハW上には感光用のフォトレジス
トPRが塗布されている。従来の光学式で斜入射方式の
AFセンサによりフォトレジストPR表面上の位置SS
を検出しようとしても、液体7とフォトレジストPRの
屈折率が同程度で反射率が極めて低くなり、光は経路1
7に沿ってウエハWの表面まで進むため、検出される位
置SS’はフォトレジストPRの表面上に位置せず、投
影光学系PLの像面にはウエハWの基板自体の表面が合
わせ込まれる。本例のAFセンサ5,6の超音波は経路
16に沿って進みフォトレジストPRの表面で反射され
るため、フォトレジストPR表面上の位置SSが正確に
検出され、高精度にフォトレジストPR表面を像面に合
焦させることができる。
【0022】また、フォトレジストPR表面のZ方向の
位置は、従来の光学式で斜入射方式のAFセンサと同様
の原理によって超音波受信素子6a上での超音波の集束
位置の横シフト量から検出される。即ち、ウエハWが図
2(b)中の下方(−Z方向)にずれれば図2(a)の
超音波受信素子6a上での集束位置が上方にずれ、ウエ
ハWが図2(b)中の上方にずれれば超音波受信素子6
a上での集束位置は下方にずれるため、この横シフト量
よりフォトレジストPRの表面のフォーカス位置の変化
量を求めることができる。そのため、予めベストフォー
カス位置はテストプリント等によって定めておき、その
ときに遮音板6cの開口の中心(又は振動中心)と超音
波の集束位置の中心とを合わせておけばよい。
位置は、従来の光学式で斜入射方式のAFセンサと同様
の原理によって超音波受信素子6a上での超音波の集束
位置の横シフト量から検出される。即ち、ウエハWが図
2(b)中の下方(−Z方向)にずれれば図2(a)の
超音波受信素子6a上での集束位置が上方にずれ、ウエ
ハWが図2(b)中の上方にずれれば超音波受信素子6
a上での集束位置は下方にずれるため、この横シフト量
よりフォトレジストPRの表面のフォーカス位置の変化
量を求めることができる。そのため、予めベストフォー
カス位置はテストプリント等によって定めておき、その
ときに遮音板6cの開口の中心(又は振動中心)と超音
波の集束位置の中心とを合わせておけばよい。
【0023】図3は、一例として超音波受信系6からの
検出信号を同期検波して得られるフォーカス信号Dとフ
ォトレジストPR表面のフォーカス位置Zとの関係を示
す。主制御系14内で、超音波受信装置6aからの検出
信号を、遮音板6cの駆動信号で同期整流することによ
って、フォトレジストPR表面での超音波の集束位置S
Sに対応して、フォーカス位置Zに所定範囲でほぼ比例
して変化するフォーカス信号Dが生成される。本例で
は、超音波の集束位置SSに対応するフォーカス信号D
は、集束位置SSが投影光学系PLの像面(ベストフォ
ーカス位置)に合致しているときに0になるようにキャ
リブレーションが行われており、主制御系14は、フォ
ーカス信号Dよりデフォーカス量(ずれ量)を求めるこ
とができる。ウエハWのフォーカス位置が上方にある場
合には、Zステージ10(ウエハW)を下方に移動し、
逆にフォーカス位置が下方にある場合には、Zステージ
10(ウエハW)を上方に移動して露光を行うことにな
る。
検出信号を同期検波して得られるフォーカス信号Dとフ
ォトレジストPR表面のフォーカス位置Zとの関係を示
す。主制御系14内で、超音波受信装置6aからの検出
信号を、遮音板6cの駆動信号で同期整流することによ
って、フォトレジストPR表面での超音波の集束位置S
Sに対応して、フォーカス位置Zに所定範囲でほぼ比例
して変化するフォーカス信号Dが生成される。本例で
は、超音波の集束位置SSに対応するフォーカス信号D
は、集束位置SSが投影光学系PLの像面(ベストフォ
ーカス位置)に合致しているときに0になるようにキャ
リブレーションが行われており、主制御系14は、フォ
ーカス信号Dよりデフォーカス量(ずれ量)を求めるこ
とができる。ウエハWのフォーカス位置が上方にある場
合には、Zステージ10(ウエハW)を下方に移動し、
逆にフォーカス位置が下方にある場合には、Zステージ
10(ウエハW)を上方に移動して露光を行うことにな
る。
【0024】なお、本例では液体7として水(屈折率
1.3)を使用したが、液体7として有機溶媒(例えば
アルコール、セダー油等)を用いることもできる。この
場合には、投影光学系PLの鏡筒3が腐食しにくくなる
という利点がある。また、セダー油(屈折率1.5)を
用いる場合には、その屈折率が1.5と大きく、露光光
を実質的により短波長化することができる。
1.3)を使用したが、液体7として有機溶媒(例えば
アルコール、セダー油等)を用いることもできる。この
場合には、投影光学系PLの鏡筒3が腐食しにくくなる
という利点がある。また、セダー油(屈折率1.5)を
用いる場合には、その屈折率が1.5と大きく、露光光
を実質的により短波長化することができる。
【0025】なお、フォーカス位置の検出については、
超音波射出系5に複数の開口を有する遮音板を配置し、
フォトレジスト表面の複数点での各フォーカス位置を検
出するようにしてもよく、あるいは、大きな開口を有す
る遮音板を超音波射出系5内に配置し、且つ複数の開口
を有する遮音板を超音波受信系6内に配置して、同様に
複数点での各フォーカス位置を検出するようにしてもよ
い。
超音波射出系5に複数の開口を有する遮音板を配置し、
フォトレジスト表面の複数点での各フォーカス位置を検
出するようにしてもよく、あるいは、大きな開口を有す
る遮音板を超音波射出系5内に配置し、且つ複数の開口
を有する遮音板を超音波受信系6内に配置して、同様に
複数点での各フォーカス位置を検出するようにしてもよ
い。
【0026】なお、上記の実施の形態では、超音波を用
いてウエハのフォトレジスト表面のフォーカス位置を検
出したが、超音波を用いてフォトレジスト表面の傾斜角
を検出するレベリングセンサを用いてもよい。このレベ
リングセンサでは、ウエハの表面にほぼ平行に進む超音
波を照射して、反射される超音波の集音位置を検出すれ
ばよい。
いてウエハのフォトレジスト表面のフォーカス位置を検
出したが、超音波を用いてフォトレジスト表面の傾斜角
を検出するレベリングセンサを用いてもよい。このレベ
リングセンサでは、ウエハの表面にほぼ平行に進む超音
波を照射して、反射される超音波の集音位置を検出すれ
ばよい。
【0027】なお、本発明は上述の実施の形態に限定さ
れず、本発明の要旨を逸脱しない範囲で種々の構成を取
り得ることは勿論である。
れず、本発明の要旨を逸脱しない範囲で種々の構成を取
り得ることは勿論である。
【0028】
【発明の効果】本発明の投影露光装置によれば、マスク
のパターン像を液体を介して基板の表面に露光するた
め、基板表面における露光光の波長を実質的に空気中に
おける波長の液体の屈折率の逆数倍に短波長化できる。
また、超音波方式の面位置検出装置により基板表面の光
軸方向の位置を検出するため、光学式の面位置検出装置
では面位置の検出が困難な液体中においても、その位置
を高精度に検出することができる。
のパターン像を液体を介して基板の表面に露光するた
め、基板表面における露光光の波長を実質的に空気中に
おける波長の液体の屈折率の逆数倍に短波長化できる。
また、超音波方式の面位置検出装置により基板表面の光
軸方向の位置を検出するため、光学式の面位置検出装置
では面位置の検出が困難な液体中においても、その位置
を高精度に検出することができる。
【0029】また、面位置検出装置が、感光材料の表面
の投影光学系の光軸方向の位置を検出する場合には、そ
の検出情報に基づいて投影光学系の像面に対してその感
光材料の表面を高精度に合わせ込むことができる。ま
た、投影光学系の基板側の光学素子の先端部とその基板
の表面との間を満たすように液体が供給される場合に
は、露光光を空気中の1/n倍(nは液体の屈折率)に
短波長化できる、また、投影光学系の鏡筒が液体に接触
しないため、投影光学系の鏡筒が腐食しにくくなるとい
う利点がある。
の投影光学系の光軸方向の位置を検出する場合には、そ
の検出情報に基づいて投影光学系の像面に対してその感
光材料の表面を高精度に合わせ込むことができる。ま
た、投影光学系の基板側の光学素子の先端部とその基板
の表面との間を満たすように液体が供給される場合に
は、露光光を空気中の1/n倍(nは液体の屈折率)に
短波長化できる、また、投影光学系の鏡筒が液体に接触
しないため、投影光学系の鏡筒が腐食しにくくなるとい
う利点がある。
【0030】また、液体が、水である場合には、その入
手が容易であるという利点がある。液体が、有機溶媒
(例えばアルコール、セダー油等)である場合には、投
影光学系の鏡筒が腐食しにくいという利点がある。さら
に、液体としてセダー油を用いる場合には、その屈折率
が1.5と水(屈折率1.3)等に比べて大きく、露光
光をより短波長化することができる。
手が容易であるという利点がある。液体が、有機溶媒
(例えばアルコール、セダー油等)である場合には、投
影光学系の鏡筒が腐食しにくいという利点がある。さら
に、液体としてセダー油を用いる場合には、その屈折率
が1.5と水(屈折率1.3)等に比べて大きく、露光
光をより短波長化することができる。
【0031】また、基板を保持してこの基板を投影光学
系の光軸に垂直な平面上で位置決めする基板ステージ
と、面位置検出装置の検出結果に基づいてその基板の投
影光学系の光軸方向の位置を制御する高さ制御ステージ
とを備える場合には、投影光学系の像面を基板表面上の
露光位置に合わせ込むことができる。
系の光軸に垂直な平面上で位置決めする基板ステージ
と、面位置検出装置の検出結果に基づいてその基板の投
影光学系の光軸方向の位置を制御する高さ制御ステージ
とを備える場合には、投影光学系の像面を基板表面上の
露光位置に合わせ込むことができる。
【図1】(a)は本発明の実施の形態の一例の投影露光
装置を示す概略構成図、(b)は図1(a)の側壁8近
傍を示す拡大図である。
装置を示す概略構成図、(b)は図1(a)の側壁8近
傍を示す拡大図である。
【図2】(a)は図1(a)の投影露光装置下部の構成
を示す部分拡大図、(b)は図2(a)のB部の拡大図
である。
を示す部分拡大図、(b)は図2(a)のB部の拡大図
である。
【図3】ウエハW上のフォトレジスト表面のフォーカス
位置Zとフォーカス信号Dとの関係を示す図である。
位置Zとフォーカス信号Dとの関係を示す図である。
W ウエハ R レチクル PL 投影光学系 1 照明光学系 2 液体供給回収系 3 鏡筒 4 レンズ 5 超音波射出系 6 超音波受信系 7 液体 8 側壁 9 試料台 10 Zステージ 14 主制御系 15 ウエハステージ駆動系
Claims (5)
- 【請求項1】 マスクパターンを投影光学系を介して基
板上に転写する投影露光装置において、 前記基板の表面に所定の液体を供給する液浸装置と、 前記基板の表面に前記液体を介して超音波を送出し、前
記表面で反射される超音波を検出することによって前記
表面の前記投影光学系の光軸方向の位置を検出する超音
波方式の面位置検出装置と、 を備えたことを特徴とする投影露光装置。 - 【請求項2】 前記基板の表面に感光材料が塗布されて
いる際に、 前記面位置検出装置は、前記感光材料の表面の前記投影
光学系の光軸方向の位置を検出することを特徴とする請
求項1記載の投影露光装置。 - 【請求項3】 前記投影光学系の前記基板側の光学素子
の先端部と前記基板の表面との間を満たすように前記液
体が供給されることを特徴とする請求項1、又は2記載
の投影露光装置。 - 【請求項4】 前記液体は、水、又は有機溶媒であるこ
とを特徴とする請求項1、2、又は3記載の投影露光装
置。 - 【請求項5】 前記基板を保持して該基板を前記投影光
学系の光軸に垂直な平面上で位置決めする基板ステージ
と、 前記面位置検出装置の検出結果に基づいて前記基板の前
記投影光学系の光軸方向の位置を制御する高さ制御ステ
ージと、を備えたことを特徴とする請求項1〜4の何れ
か一項記載の投影露光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9341445A JPH11176727A (ja) | 1997-12-11 | 1997-12-11 | 投影露光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9341445A JPH11176727A (ja) | 1997-12-11 | 1997-12-11 | 投影露光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11176727A true JPH11176727A (ja) | 1999-07-02 |
Family
ID=18346144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9341445A Withdrawn JPH11176727A (ja) | 1997-12-11 | 1997-12-11 | 投影露光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11176727A (ja) |
Cited By (310)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004053954A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
WO2004053955A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
WO2004053956A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及び露光方法、デバイス製造方法 |
WO2004053958A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
WO2004053953A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
WO2004053957A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 面位置検出装置、露光方法、及びデバイス製造方法 |
JP2004207711A (ja) * | 2002-12-10 | 2004-07-22 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
WO2004068242A1 (ja) * | 2003-01-31 | 2004-08-12 | Tokyo Ohka Kogyo Co., Ltd. | レジスト組成物 |
WO2004077158A1 (ja) * | 2003-02-25 | 2004-09-10 | Tokyo Ohka Kogyo Co., Ltd. | ホトレジスト組成物およびレジストパターンの形成方法 |
WO2004079453A1 (ja) * | 2003-03-04 | 2004-09-16 | Tokyo Ohka Kogyo Co., Ltd. | 液浸露光プロセス用レジスト材料および該レジスト材料を用いたレジストパターン形成方法 |
JP2004259966A (ja) * | 2003-02-26 | 2004-09-16 | Nikon Corp | 露光装置及びデバイス製造方法 |
WO2004086468A1 (ja) * | 2003-02-26 | 2004-10-07 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法 |
WO2004086470A1 (ja) * | 2003-03-25 | 2004-10-07 | Nikon Corporation | 露光装置及びデバイス製造方法 |
WO2004088429A1 (ja) * | 2003-03-28 | 2004-10-14 | Tokyo Ohka Kogyo Co. Ltd. | 液浸露光プロセス用レジスト組成物および該レジスト組成物を用いたレジストパターン形成方法 |
EP1477856A1 (en) * | 2003-05-13 | 2004-11-17 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2004102646A1 (ja) | 2003-05-15 | 2004-11-25 | Nikon Corporation | 露光装置及びデバイス製造方法 |
EP1486827A2 (en) * | 2003-06-11 | 2004-12-15 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2004112108A1 (ja) * | 2003-06-13 | 2004-12-23 | Nikon Corporation | 露光方法、基板ステージ、露光装置、及びデバイス製造方法 |
EP1494074A1 (en) * | 2003-06-30 | 2005-01-05 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2005010962A1 (ja) * | 2003-07-28 | 2005-02-03 | Nikon Corporation | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
WO2005020299A1 (ja) * | 2003-08-21 | 2005-03-03 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法 |
JP2005101488A (ja) * | 2002-12-10 | 2005-04-14 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
JP2005116571A (ja) * | 2003-10-02 | 2005-04-28 | Nikon Corp | 露光装置及びデバイス製造方法 |
WO2005055296A1 (ja) * | 2003-12-03 | 2005-06-16 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法、並びに光学部品 |
JP2005159322A (ja) * | 2003-10-31 | 2005-06-16 | Nikon Corp | 定盤、ステージ装置及び露光装置並びに露光方法 |
WO2005057635A1 (ja) * | 2003-12-15 | 2005-06-23 | Nikon Corporation | 投影露光装置及びステージ装置、並びに露光方法 |
WO2005031799A3 (ja) * | 2003-09-29 | 2005-06-23 | Nippon Kogaku Kk | 露光装置、露光方法及びデバイス製造方法 |
WO2005062351A1 (en) * | 2003-12-19 | 2005-07-07 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
JP2005191557A (ja) * | 2003-12-03 | 2005-07-14 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
WO2005069076A1 (ja) * | 2004-01-15 | 2005-07-28 | Jsr Corporation | 液浸用上層膜形成組成物およびフォトレジストパターン形成方法 |
EP1420300A3 (en) * | 2002-11-12 | 2005-08-10 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1486828A3 (en) * | 2003-06-09 | 2005-08-10 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2005076325A1 (ja) * | 2004-02-04 | 2005-08-18 | Nikon Corporation | 露光装置及び方法、位置制御方法並びにデバイス製造方法 |
JP2005234458A (ja) * | 2004-02-23 | 2005-09-02 | Nikon Corp | 顕微鏡観察装置 |
WO2005085954A1 (ja) * | 2004-03-05 | 2005-09-15 | Tokyo Ohka Kogyo Co., Ltd. | 液浸露光用ポジ型レジスト組成物およびレジストパターンの形成方法 |
JP2005268742A (ja) * | 2003-07-28 | 2005-09-29 | Nikon Corp | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
JP2005268759A (ja) * | 2004-02-19 | 2005-09-29 | Nikon Corp | 光学部品及び露光装置 |
US6952253B2 (en) | 2002-11-12 | 2005-10-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2005106930A1 (ja) * | 2004-04-27 | 2005-11-10 | Nikon Corporation | 露光方法、露光装置及びデバイス製造方法 |
JP2005347617A (ja) * | 2004-06-04 | 2005-12-15 | Nikon Corp | 露光装置及びデバイス製造方法 |
EP1614000A2 (en) * | 2003-04-17 | 2006-01-11 | Nikon Corporation | Optical arrangement of autofocus elements for use with immersion lithography |
US7009682B2 (en) | 2002-11-18 | 2006-03-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7012673B2 (en) | 2003-06-27 | 2006-03-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7034917B2 (en) | 2004-04-01 | 2006-04-25 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
WO2006043597A1 (ja) * | 2004-10-19 | 2006-04-27 | Jsr Corporation | 感放射線性樹脂組成物 |
US7050146B2 (en) | 2004-02-09 | 2006-05-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG121822A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1674939A1 (en) | 2004-12-27 | 2006-06-28 | ASML Netherlands BV | Level sensor, lithographic apparatus and device manufacturing method |
EP1677156A1 (en) * | 2004-12-30 | 2006-07-05 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
JP2006179902A (ja) * | 2004-12-22 | 2006-07-06 | Asml Netherlands Bv | 超音波距離センサ |
US7075616B2 (en) | 2002-11-12 | 2006-07-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006190971A (ja) * | 2004-10-13 | 2006-07-20 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
US7081943B2 (en) | 2002-11-12 | 2006-07-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7110087B2 (en) | 2003-06-30 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7119876B2 (en) | 2004-10-18 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7119874B2 (en) | 2003-06-27 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7133114B2 (en) | 2004-09-20 | 2006-11-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7145630B2 (en) | 2004-11-23 | 2006-12-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7148494B2 (en) | 2004-12-29 | 2006-12-12 | Asml Netherlands B.V. | Level sensor, lithographic apparatus and device manufacturing method |
JP2006528835A (ja) * | 2003-07-24 | 2006-12-21 | カール・ツアイス・エスエムテイ・アーゲー | マイクロリソグラフィ投影露光装置および浸漬液体を浸漬空間へ導入する方法 |
US7158211B2 (en) | 2003-09-29 | 2007-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7161663B2 (en) | 2004-07-22 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus |
US7161654B2 (en) | 2004-12-02 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007005830A (ja) * | 2003-07-28 | 2007-01-11 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
US7175968B2 (en) | 2003-07-28 | 2007-02-13 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a substrate |
US7180574B2 (en) | 2004-03-29 | 2007-02-20 | Canon Kabushiki Kaisha | Exposure apparatus and method |
US7184122B2 (en) | 2003-07-24 | 2007-02-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007504646A (ja) * | 2003-08-29 | 2007-03-01 | 東京エレクトロン株式会社 | 基板を乾燥させる方法とシステム。 |
US7193681B2 (en) | 2003-09-29 | 2007-03-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7196770B2 (en) | 2004-12-07 | 2007-03-27 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
US7199858B2 (en) | 2002-11-12 | 2007-04-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7209213B2 (en) | 2004-10-07 | 2007-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7224431B2 (en) | 2005-02-22 | 2007-05-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7227619B2 (en) | 2004-04-01 | 2007-06-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007515798A (ja) * | 2003-12-23 | 2007-06-14 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びデバイス製造方法 |
WO2007069640A1 (ja) | 2005-12-14 | 2007-06-21 | Jsr Corporation | 新規化合物および重合体、ならびに樹脂組成物 |
US7242455B2 (en) * | 2002-12-10 | 2007-07-10 | Nikon Corporation | Exposure apparatus and method for producing device |
US7248334B2 (en) | 2004-12-07 | 2007-07-24 | Asml Netherlands B.V. | Sensor shield |
JP2007520893A (ja) * | 2004-02-03 | 2007-07-26 | ロチェスター インスティテュート オブ テクノロジー | 流体を使用したフォトリソグラフィ法及びそのシステム |
US7251013B2 (en) | 2004-11-12 | 2007-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007266375A (ja) * | 2006-03-29 | 2007-10-11 | Topcon Corp | 液浸光学系と、液浸光学系に用いられる液浸液と、その製造方法 |
US7291850B2 (en) | 2005-04-08 | 2007-11-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7295283B2 (en) | 2004-04-02 | 2007-11-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7304715B2 (en) | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7317507B2 (en) | 2005-05-03 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7324185B2 (en) | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7330238B2 (en) | 2005-03-28 | 2008-02-12 | Asml Netherlands, B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
JP2008042004A (ja) * | 2006-08-08 | 2008-02-21 | Tokyo Electron Ltd | パターン形成方法およびパターン形成装置 |
JP2008047879A (ja) * | 2006-07-18 | 2008-02-28 | Tokyo Electron Ltd | 高屈折率液体循環システム、パターン形成装置およびパターン形成方法 |
US7339650B2 (en) | 2003-04-09 | 2008-03-04 | Nikon Corporation | Immersion lithography fluid control system that applies force to confine the immersion liquid |
US7345742B2 (en) | 2003-04-10 | 2008-03-18 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
US7352440B2 (en) | 2004-12-10 | 2008-04-01 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US7352435B2 (en) | 2003-10-15 | 2008-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7355674B2 (en) | 2004-09-28 | 2008-04-08 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and computer program product |
US7359030B2 (en) | 2002-11-29 | 2008-04-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2008047678A1 (fr) | 2006-10-13 | 2008-04-24 | Jsr Corporation | Composition pour la formation d'un film de couche supérieure et procédé de formation d'un motif en photorésine |
US7365827B2 (en) | 2004-12-08 | 2008-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2008517473A (ja) * | 2004-10-22 | 2008-05-22 | カール・ツアイス・エスエムテイ・アーゲー | マイクロリソグラフィ用の投影露光装置 |
US7379159B2 (en) | 2004-05-03 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7379155B2 (en) | 2004-10-18 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7378025B2 (en) | 2005-02-22 | 2008-05-27 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US7397532B2 (en) | 2003-04-10 | 2008-07-08 | Nikon Corporation | Run-off path to collect liquid for an immersion lithography apparatus |
JP2008160155A (ja) * | 2003-05-13 | 2008-07-10 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US7403261B2 (en) | 2004-12-15 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7405805B2 (en) | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411657B2 (en) | 2004-11-17 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411650B2 (en) | 2003-06-19 | 2008-08-12 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US7411654B2 (en) | 2005-04-05 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411658B2 (en) | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7414699B2 (en) | 2004-11-12 | 2008-08-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
US7423720B2 (en) | 2004-11-12 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7428038B2 (en) | 2005-02-28 | 2008-09-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US7433015B2 (en) | 2003-10-15 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433016B2 (en) | 2005-05-03 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433019B2 (en) | 2003-07-09 | 2008-10-07 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7443482B2 (en) | 2003-04-11 | 2008-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
US7446850B2 (en) | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7450217B2 (en) | 2005-01-12 | 2008-11-11 | Asml Netherlands B.V. | Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby |
CN100433253C (zh) * | 2003-02-26 | 2008-11-12 | 株式会社尼康 | 曝光装置以及器件制造方法 |
US7456929B2 (en) | 2004-10-15 | 2008-11-25 | Nikon Corporation | Exposure apparatus and device manufacturing method |
CN100444315C (zh) * | 2002-12-10 | 2008-12-17 | 株式会社尼康 | 曝光装置以及器件制造方法 |
US7468779B2 (en) | 2005-06-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7474379B2 (en) | 2005-06-28 | 2009-01-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR100877217B1 (ko) * | 2004-12-27 | 2009-01-07 | 토쿄오오카코교 가부시기가이샤 | 레지스트 보호막 형성용 재료 및 이것을 이용한 레지스트패턴 형성 방법 |
US7486381B2 (en) | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN100459036C (zh) * | 2003-06-19 | 2009-02-04 | 株式会社尼康 | 曝光装置及器件制造方法 |
US7491661B2 (en) | 2004-12-28 | 2009-02-17 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
KR100887202B1 (ko) * | 2004-04-27 | 2009-03-06 | 도오꾜오까고오교 가부시끼가이샤 | 액침 노광 프로세스용 레지스트 보호막 형성용 재료, 및 이보호막을 이용한 레지스트 패턴 형성 방법 |
US7522261B2 (en) | 2004-09-24 | 2009-04-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7522259B2 (en) | 2003-04-11 | 2009-04-21 | Nikon Corporation | Cleanup method for optics in immersion lithography |
US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7535644B2 (en) | 2005-08-12 | 2009-05-19 | Asml Netherlands B.V. | Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7545481B2 (en) | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7557900B2 (en) | 2004-02-10 | 2009-07-07 | Nikon Corporation | Exposure apparatus, device manufacturing method, maintenance method, and exposure method |
US7580111B2 (en) | 2004-05-21 | 2009-08-25 | Jsr Corporation | Liquid for immersion exposure and immersion exposure method |
US7583357B2 (en) | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN101526759A (zh) * | 2003-09-29 | 2009-09-09 | 株式会社尼康 | 曝光装置 |
US7589818B2 (en) | 2003-12-23 | 2009-09-15 | Asml Netherlands B.V. | Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus |
US7633073B2 (en) | 2005-11-23 | 2009-12-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR100933538B1 (ko) * | 2006-08-30 | 2009-12-23 | 후지쯔 가부시끼가이샤 | 레지스트 커버막 형성 재료, 레지스트 패턴의 형성 방법,전자 디바이스 및 그 제조 방법 |
US7649611B2 (en) | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7652746B2 (en) | 2005-06-21 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7656501B2 (en) | 2005-11-16 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus |
US7684010B2 (en) | 2005-03-09 | 2010-03-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing |
KR100952174B1 (ko) * | 2004-07-30 | 2010-04-09 | 토쿄오오카코교 가부시기가이샤 | 레지스트 보호막 형성용 재료 및 이것을 이용한 레지스트패턴 형성방법 |
US7697110B2 (en) | 2004-01-26 | 2010-04-13 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7697111B2 (en) | 2003-08-26 | 2010-04-13 | Nikon Corporation | Optical element and exposure apparatus |
US7705962B2 (en) | 2005-01-14 | 2010-04-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7705968B2 (en) | 2005-03-18 | 2010-04-27 | Nikon Corporation | Plate member, substrate holding device, exposure apparatus and method, and device manufacturing method |
JP2010098328A (ja) * | 2003-09-29 | 2010-04-30 | Nikon Corp | 露光装置及び露光方法並びにデバイス製造方法 |
US7733459B2 (en) | 2003-08-29 | 2010-06-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7738074B2 (en) | 2003-07-16 | 2010-06-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2010141355A (ja) * | 2003-12-03 | 2010-06-24 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
US7751027B2 (en) | 2005-06-21 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2010153933A (ja) * | 2010-04-05 | 2010-07-08 | Nikon Corp | 露光装置及びデバイス製造方法 |
KR100972129B1 (ko) * | 2004-02-20 | 2010-07-23 | 후지필름 가부시키가이샤 | 액침 노광용 레지스트 조성물 및 그것을 사용한패턴형성방법 |
US7771918B2 (en) | 2004-06-09 | 2010-08-10 | Panasonic Corporation | Semiconductor manufacturing apparatus and pattern formation method |
US7773195B2 (en) | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
US7781142B2 (en) | 2004-09-30 | 2010-08-24 | Jsr Corporation | Copolymer and top coating composition |
US7791709B2 (en) | 2006-12-08 | 2010-09-07 | Asml Netherlands B.V. | Substrate support and lithographic process |
US7804574B2 (en) | 2003-05-30 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using acidic liquid |
US7804576B2 (en) | 2004-12-06 | 2010-09-28 | Nikon Corporation | Maintenance method, maintenance device, exposure apparatus, and device manufacturing method |
US7803516B2 (en) | 2005-11-21 | 2010-09-28 | Nikon Corporation | Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus |
US7804577B2 (en) | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
US7812926B2 (en) | 2005-08-31 | 2010-10-12 | Nikon Corporation | Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice |
US7817245B2 (en) | 2003-09-29 | 2010-10-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7834974B2 (en) | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7839485B2 (en) | 2006-01-19 | 2010-11-23 | Nikon Corporation | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
US7839483B2 (en) | 2005-12-28 | 2010-11-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a control system |
US7852456B2 (en) | 2004-10-13 | 2010-12-14 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US7864292B2 (en) | 2005-11-16 | 2011-01-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7872730B2 (en) | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
US7876418B2 (en) | 2002-12-10 | 2011-01-25 | Nikon Corporation | Optical element and projection exposure apparatus based on use of the optical element |
US7894040B2 (en) | 2004-10-05 | 2011-02-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2011071535A (ja) * | 2006-05-22 | 2011-04-07 | Asml Netherlands Bv | リソグラフィ装置およびリソグラフィ装置洗浄方法 |
US7924416B2 (en) | 2005-06-22 | 2011-04-12 | Nikon Corporation | Measurement apparatus, exposure apparatus, and device manufacturing method |
US7932996B2 (en) | 2003-10-28 | 2011-04-26 | Nikon Corporation | Exposure apparatus, exposure method, and device fabrication method |
US7948604B2 (en) | 2002-12-10 | 2011-05-24 | Nikon Corporation | Exposure apparatus and method for producing device |
US7951523B2 (en) | 2004-07-30 | 2011-05-31 | Tokyo Ohka Kogyo Co., Ltd. | Material for forming resist protective film and method for forming resist pattern using same |
US7973910B2 (en) | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
US8013975B2 (en) | 2006-12-01 | 2011-09-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8023100B2 (en) | 2004-02-20 | 2011-09-20 | Nikon Corporation | Exposure apparatus, supply method and recovery method, exposure method, and device producing method |
US8035800B2 (en) | 2006-03-13 | 2011-10-11 | Nikon Corporation | Exposure apparatus, maintenance method, exposure method, and method for producing device |
US8035799B2 (en) | 2004-12-09 | 2011-10-11 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
US8035797B2 (en) | 2003-09-26 | 2011-10-11 | Nikon Corporation | Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method |
US8040489B2 (en) | 2004-10-26 | 2011-10-18 | Nikon Corporation | Substrate processing method, exposure apparatus, and method for producing device by immersing substrate in second liquid before immersion exposure through first liquid |
US8040490B2 (en) | 2006-12-01 | 2011-10-18 | Nikon Corporation | Liquid immersion exposure apparatus, exposure method, and method for producing device |
US8045135B2 (en) | 2006-11-22 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus with a fluid combining unit and related device manufacturing method |
US8045134B2 (en) | 2006-03-13 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus, control system and device manufacturing method |
US8054445B2 (en) | 2005-08-16 | 2011-11-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8054465B2 (en) | 2004-11-18 | 2011-11-08 | Nikon Corporation | Position measurement method |
US8064044B2 (en) | 2004-01-05 | 2011-11-22 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
US8064039B2 (en) | 2005-04-25 | 2011-11-22 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8070145B2 (en) | 2005-08-26 | 2011-12-06 | Nikon Corporation | Holding unit, assembly system, sputtering unit, and processing method and processing unit |
US8076053B2 (en) | 2005-10-27 | 2011-12-13 | Jsr Corporation | Upper layer-forming composition and photoresist patterning method |
US8089608B2 (en) | 2005-04-18 | 2012-01-03 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8102512B2 (en) | 2004-09-17 | 2012-01-24 | Nikon Corporation | Substrate holding device, exposure apparatus, and device manufacturing method |
US8111374B2 (en) | 2005-09-09 | 2012-02-07 | Nikon Corporation | Analysis method, exposure method, and device manufacturing method |
US20120038894A1 (en) * | 2004-08-03 | 2012-02-16 | Taiwan Semiconductor Manufacturing Company, Ltd | Lens Cleaning Module |
US8134681B2 (en) | 2006-02-17 | 2012-03-13 | Nikon Corporation | Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium |
US8164736B2 (en) | 2007-05-29 | 2012-04-24 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US8179517B2 (en) | 2005-06-30 | 2012-05-15 | Nikon Corporation | Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method |
US8189168B2 (en) | 2007-05-28 | 2012-05-29 | Nikon Corporation | Exposure apparatus, device production method, cleaning apparatus, cleaning method, and exposure method |
US8208123B2 (en) | 2003-08-29 | 2012-06-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8208124B2 (en) | 2003-08-29 | 2012-06-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8208119B2 (en) | 2004-02-04 | 2012-06-26 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8237915B2 (en) | 2002-12-10 | 2012-08-07 | Carl Zeiss Smt Gmbh | Method for improving an optical imaging property of a projection objective of a microlithographic projection exposure apparatus |
US8236467B2 (en) | 2005-04-28 | 2012-08-07 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8253921B2 (en) | 2003-09-03 | 2012-08-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US8294873B2 (en) | 2004-11-11 | 2012-10-23 | Nikon Corporation | Exposure method, device manufacturing method, and substrate |
US8325326B2 (en) | 2004-06-07 | 2012-12-04 | Nikon Corporation | Stage unit, exposure apparatus, and exposure method |
US8330939B2 (en) | 2004-11-01 | 2012-12-11 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with a liquid recovery port provided on at least one of a first stage and second stage |
US8368870B2 (en) | 2004-06-21 | 2013-02-05 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8373843B2 (en) | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8411271B2 (en) | 2005-12-28 | 2013-04-02 | Nikon Corporation | Pattern forming method, pattern forming apparatus, and device manufacturing method |
US8477283B2 (en) | 2006-05-10 | 2013-07-02 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8482716B2 (en) | 2004-06-10 | 2013-07-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8488099B2 (en) | 2004-04-19 | 2013-07-16 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8508713B2 (en) | 2004-06-10 | 2013-08-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8507189B2 (en) | 2006-09-27 | 2013-08-13 | Jsr Corporation | Upper layer film forming composition and method of forming photoresist pattern |
US20130271945A1 (en) | 2004-02-06 | 2013-10-17 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
US8570484B2 (en) | 2006-08-30 | 2013-10-29 | Nikon Corporation | Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid |
CN103383528A (zh) * | 2003-04-10 | 2013-11-06 | 株式会社尼康 | 包括用于沉浸光刻装置的真空清除的环境系统 |
US8580480B2 (en) | 2010-07-27 | 2013-11-12 | Jsr Corporation | Radiation-sensitive resin composition, method for forming resist pattern, polymer and compound |
US8634053B2 (en) | 2006-12-07 | 2014-01-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI424464B (zh) * | 2003-08-29 | 2014-01-21 | 尼康股份有限公司 | A liquid recovery device, an exposure device, an exposure method, and an element manufacturing method |
US8638422B2 (en) | 2005-03-18 | 2014-01-28 | Nikon Corporation | Exposure method, exposure apparatus, method for producing device, and method for evaluating exposure apparatus |
US8654308B2 (en) | 2004-07-12 | 2014-02-18 | Nikon Corporation | Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device |
US8675174B2 (en) | 2004-09-17 | 2014-03-18 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP2014056255A (ja) * | 2013-10-28 | 2014-03-27 | Nikon Corp | 投影光学系、露光装置及び露光方法 |
US8698998B2 (en) | 2004-06-21 | 2014-04-15 | Nikon Corporation | Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device |
US8705008B2 (en) | 2004-06-09 | 2014-04-22 | Nikon Corporation | Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate |
US8717533B2 (en) | 2004-06-10 | 2014-05-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8721803B2 (en) | 2006-12-05 | 2014-05-13 | Nikon Corporation | Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method |
US8780326B2 (en) | 2005-09-09 | 2014-07-15 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8797502B2 (en) | 2003-09-29 | 2014-08-05 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device with electricity removal device by adding additive to liquid |
KR101441777B1 (ko) * | 2004-03-25 | 2014-09-22 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
US8860922B2 (en) | 2003-10-28 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8859188B2 (en) | 2005-02-10 | 2014-10-14 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US8860923B2 (en) | 2003-10-28 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8891053B2 (en) | 2008-09-10 | 2014-11-18 | Asml Netherlands B.V. | Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method |
US8896813B2 (en) | 2003-10-22 | 2014-11-25 | Nikon Corporation | Exposure apparatus, exposure method, method for manufacturing device |
US8902401B2 (en) | 2006-05-09 | 2014-12-02 | Carl Zeiss Smt Gmbh | Optical imaging device with thermal attenuation |
EP2818929A1 (en) * | 2003-05-23 | 2014-12-31 | Nikon Corporation | Exposure method, exposure apparatus, and methods for producing a device |
US8928856B2 (en) | 2003-10-31 | 2015-01-06 | Nikon Corporation | Exposure apparatus and device fabrication method |
US8937704B2 (en) | 2003-07-31 | 2015-01-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a resistivity sensor |
US8937710B2 (en) | 2006-08-31 | 2015-01-20 | Nikon Corporation | Exposure method and apparatus compensating measuring error of encoder due to grating section and displacement of movable body in Z direction |
US8941811B2 (en) | 2004-12-20 | 2015-01-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8947629B2 (en) | 2007-05-04 | 2015-02-03 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
US8947637B2 (en) | 2003-08-29 | 2015-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8964163B2 (en) | 2003-07-28 | 2015-02-24 | Asml Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method with a projection system having a part movable relative to another part |
KR101505756B1 (ko) * | 2004-06-10 | 2015-03-26 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법, 및 디바이스 제조 방법 |
US9013672B2 (en) | 2007-05-04 | 2015-04-21 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
KR101523180B1 (ko) * | 2003-09-03 | 2015-05-26 | 가부시키가이샤 니콘 | 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법 |
US9081295B2 (en) | 2003-05-06 | 2015-07-14 | Nikon Corporation | Catadioptric projection optical system, exposure apparatus, and exposure method |
JP2015132843A (ja) * | 2015-03-02 | 2015-07-23 | 株式会社ニコン | 投影光学系、露光装置、露光方法、およびデバイス製造方法 |
KR101539877B1 (ko) * | 2004-02-02 | 2015-07-28 | 가부시키가이샤 니콘 | 스테이지 구동 방법 및 스테이지 장치, 노광 장치, 그리고 디바이스 제조 방법 |
US9097992B2 (en) | 2004-08-19 | 2015-08-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9104117B2 (en) | 2004-07-07 | 2015-08-11 | Bob Streefkerk | Lithographic apparatus having a liquid detection system |
US9134622B2 (en) | 2003-11-14 | 2015-09-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9207543B2 (en) | 2004-04-14 | 2015-12-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a groove to collect liquid |
US9224632B2 (en) | 2004-12-15 | 2015-12-29 | Nikon Corporation | Substrate holding apparatus, exposure apparatus, and device fabricating method |
US9239524B2 (en) | 2005-03-30 | 2016-01-19 | Nikon Corporation | Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region |
US9250537B2 (en) | 2004-07-12 | 2016-02-02 | Nikon Corporation | Immersion exposure apparatus and method with detection of liquid on members of the apparatus |
US9256136B2 (en) | 2010-04-22 | 2016-02-09 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply |
US9261789B2 (en) | 2010-05-18 | 2016-02-16 | Jsr Corporation | Liquid immersion lithography upper-layer film-forming composition and photoresist pattern-forming method |
US9329060B2 (en) | 2006-02-21 | 2016-05-03 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
US9341954B2 (en) | 2007-10-24 | 2016-05-17 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
US9377698B2 (en) | 2006-09-01 | 2016-06-28 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
JP2016136273A (ja) * | 2016-03-07 | 2016-07-28 | 株式会社ニコン | 投影光学系、露光装置、露光方法、およびデバイス製造方法 |
US9423698B2 (en) | 2003-10-28 | 2016-08-23 | Nikon Corporation | Illumination optical apparatus and projection exposure apparatus |
US9429495B2 (en) | 2004-06-04 | 2016-08-30 | Carl Zeiss Smt Gmbh | System for measuring the image quality of an optical imaging system |
US9436095B2 (en) | 2004-01-20 | 2016-09-06 | Carl Zeiss Smt Gmbh | Exposure apparatus and measuring device for a projection lens |
US9477158B2 (en) | 2006-04-14 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9500943B2 (en) | 2003-05-06 | 2016-11-22 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9500960B2 (en) | 2003-04-11 | 2016-11-22 | Nikon Corporation | Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine |
US9507270B2 (en) | 2004-06-16 | 2016-11-29 | Asml Netherlands B.V. | Vacuum system for immersion photolithography |
US9623436B2 (en) | 2004-05-18 | 2017-04-18 | Asml Netherlands B.V. | Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets |
US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
US9645505B2 (en) | 2004-06-09 | 2017-05-09 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with measuring device to measure specific resistance of liquid |
US9678332B2 (en) | 2007-11-06 | 2017-06-13 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
US9678437B2 (en) | 2003-04-09 | 2017-06-13 | Nikon Corporation | Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction |
US9690214B2 (en) | 2006-02-21 | 2017-06-27 | Nikon Corporation | Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method |
US9746781B2 (en) | 2005-01-31 | 2017-08-29 | Nikon Corporation | Exposure apparatus and method for producing device |
US9798245B2 (en) | 2003-12-15 | 2017-10-24 | Nikon Corporation | Exposure apparatus, and exposure method, with recovery device to recover liquid leaked from between substrate and member |
US9857697B2 (en) | 2006-02-21 | 2018-01-02 | Nikon Corporation | Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method |
JP2018010303A (ja) * | 2017-08-03 | 2018-01-18 | 株式会社ニコン | 露光装置およびデバイス製造方法 |
US9874822B2 (en) | 2006-09-01 | 2018-01-23 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US9885872B2 (en) | 2003-11-20 | 2018-02-06 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light |
US9891539B2 (en) | 2005-05-12 | 2018-02-13 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9939739B2 (en) | 2003-05-23 | 2018-04-10 | Nikon Corporation | Exposure apparatus and method for producing device |
US9958792B2 (en) | 2006-08-31 | 2018-05-01 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US9977352B2 (en) | 2003-07-09 | 2018-05-22 | Nikon Corporation | Exposure apparatus and device manufacturing method |
USRE46933E1 (en) | 2005-04-08 | 2018-07-03 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US10061207B2 (en) | 2005-12-02 | 2018-08-28 | Asml Netherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
US10067428B2 (en) | 2006-08-31 | 2018-09-04 | Nikon Corporation | Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method |
US10082739B2 (en) | 2003-05-28 | 2018-09-25 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US10101666B2 (en) | 2007-10-12 | 2018-10-16 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and device manufacturing method |
US10151983B2 (en) | 2004-02-03 | 2018-12-11 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US10209623B2 (en) | 2003-10-09 | 2019-02-19 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP2019082711A (ja) * | 2019-01-15 | 2019-05-30 | 株式会社ニコン | 投影光学系、露光装置、露光方法、及びデバイス製造方法 |
JP2019091057A (ja) * | 2019-01-15 | 2019-06-13 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11187991B2 (en) | 2008-05-28 | 2021-11-30 | Asml Netherlands B.V. | Lithographic apparatus and a method of operating the apparatus |
-
1997
- 1997-12-11 JP JP9341445A patent/JPH11176727A/ja not_active Withdrawn
Cited By (805)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9366972B2 (en) | 2002-11-12 | 2016-06-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9097987B2 (en) | 2002-11-12 | 2015-08-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10191389B2 (en) | 2002-11-12 | 2019-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9091940B2 (en) | 2002-11-12 | 2015-07-28 | Asml Netherlands B.V. | Lithographic apparatus and method involving a fluid inlet and a fluid outlet |
US7932999B2 (en) | 2002-11-12 | 2011-04-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10261428B2 (en) | 2002-11-12 | 2019-04-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US6952253B2 (en) | 2002-11-12 | 2005-10-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9588442B2 (en) | 2002-11-12 | 2017-03-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7482611B2 (en) | 2002-11-12 | 2009-01-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007142460A (ja) * | 2002-11-12 | 2007-06-07 | Asml Netherlands Bv | リソグラフィ投影装置 |
US10620545B2 (en) | 2002-11-12 | 2020-04-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7224436B2 (en) | 2002-11-12 | 2007-05-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2010135857A (ja) * | 2002-11-12 | 2010-06-17 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US7199858B2 (en) | 2002-11-12 | 2007-04-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8344341B2 (en) | 2002-11-12 | 2013-01-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7193232B2 (en) | 2002-11-12 | 2007-03-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method with substrate measurement not through liquid |
US10222706B2 (en) | 2002-11-12 | 2019-03-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9740107B2 (en) | 2002-11-12 | 2017-08-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9360765B2 (en) | 2002-11-12 | 2016-06-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7795603B2 (en) | 2002-11-12 | 2010-09-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9195153B2 (en) | 2002-11-12 | 2015-11-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8446568B2 (en) | 2002-11-12 | 2013-05-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9057967B2 (en) | 2002-11-12 | 2015-06-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7081943B2 (en) | 2002-11-12 | 2006-07-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10788755B2 (en) | 2002-11-12 | 2020-09-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7075616B2 (en) | 2002-11-12 | 2006-07-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10962891B2 (en) | 2002-11-12 | 2021-03-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG121822A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1420300A3 (en) * | 2002-11-12 | 2005-08-10 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4567013B2 (ja) * | 2002-11-12 | 2010-10-20 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ投影装置 |
US9885965B2 (en) | 2002-11-12 | 2018-02-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7009682B2 (en) | 2002-11-18 | 2006-03-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7119881B2 (en) | 2002-11-18 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7359030B2 (en) | 2002-11-29 | 2008-04-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN100444315C (zh) * | 2002-12-10 | 2008-12-17 | 株式会社尼康 | 曝光装置以及器件制造方法 |
JP2004207711A (ja) * | 2002-12-10 | 2004-07-22 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
US8237915B2 (en) | 2002-12-10 | 2012-08-07 | Carl Zeiss Smt Gmbh | Method for improving an optical imaging property of a projection objective of a microlithographic projection exposure apparatus |
US8767173B2 (en) | 2002-12-10 | 2014-07-01 | Nikon Corporation | Optical element and projection exposure apparatus based on use of the optical element |
CN100446179C (zh) * | 2002-12-10 | 2008-12-24 | 株式会社尼康 | 曝光设备和器件制造法 |
WO2004053955A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
US7948604B2 (en) | 2002-12-10 | 2011-05-24 | Nikon Corporation | Exposure apparatus and method for producing device |
US7242455B2 (en) * | 2002-12-10 | 2007-07-10 | Nikon Corporation | Exposure apparatus and method for producing device |
US7466392B2 (en) | 2002-12-10 | 2008-12-16 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US7460207B2 (en) | 2002-12-10 | 2008-12-02 | Nikon Corporation | Exposure apparatus and method for producing device |
US7505111B2 (en) | 2002-12-10 | 2009-03-17 | Nikon Corporation | Exposure apparatus and device manufacturing method |
WO2004053954A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
US7589820B2 (en) | 2002-12-10 | 2009-09-15 | Nikon Corporation | Exposure apparatus and method for producing device |
US7446851B2 (en) | 2002-12-10 | 2008-11-04 | Nikon Corporation | Exposure apparatus and device manufacturing method |
WO2004053956A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及び露光方法、デバイス製造方法 |
WO2004053958A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
US7589821B2 (en) | 2002-12-10 | 2009-09-15 | Nikon Corporation | Exposure apparatus and device manufacturing method |
WO2004053953A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
US7515246B2 (en) | 2002-12-10 | 2009-04-07 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US7876418B2 (en) | 2002-12-10 | 2011-01-25 | Nikon Corporation | Optical element and projection exposure apparatus based on use of the optical element |
JP2009105471A (ja) * | 2002-12-10 | 2009-05-14 | Nikon Corp | 露光装置、及びデバイス製造方法 |
US7436487B2 (en) | 2002-12-10 | 2008-10-14 | Nikon Corporation | Exposure apparatus and method for producing device |
JP2009105472A (ja) * | 2002-12-10 | 2009-05-14 | Nikon Corp | 真空システム、液浸露光装置及び露光方法、デバイス製造方法 |
US7639343B2 (en) | 2002-12-10 | 2009-12-29 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7436486B2 (en) | 2002-12-10 | 2008-10-14 | Nikon Corporation | Exposure apparatus and device manufacturing method |
JP2005101488A (ja) * | 2002-12-10 | 2005-04-14 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
US7379158B2 (en) | 2002-12-10 | 2008-05-27 | Nikon Corporation | Exposure apparatus and method for producing device |
WO2004053957A1 (ja) * | 2002-12-10 | 2004-06-24 | Nikon Corporation | 面位置検出装置、露光方法、及びデバイス製造方法 |
WO2004068242A1 (ja) * | 2003-01-31 | 2004-08-12 | Tokyo Ohka Kogyo Co., Ltd. | レジスト組成物 |
US8198004B2 (en) | 2003-01-31 | 2012-06-12 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition |
KR100743416B1 (ko) | 2003-01-31 | 2007-07-30 | 도오꾜오까고오교 가부시끼가이샤 | 레지스트 조성물 |
US7541138B2 (en) | 2003-01-31 | 2009-06-02 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition |
US7527909B2 (en) | 2003-01-31 | 2009-05-05 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition |
US7501220B2 (en) | 2003-01-31 | 2009-03-10 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition |
WO2004077158A1 (ja) * | 2003-02-25 | 2004-09-10 | Tokyo Ohka Kogyo Co., Ltd. | ホトレジスト組成物およびレジストパターンの形成方法 |
CN100433253C (zh) * | 2003-02-26 | 2008-11-12 | 株式会社尼康 | 曝光装置以及器件制造方法 |
WO2004086468A1 (ja) * | 2003-02-26 | 2004-10-07 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法 |
JP2015121825A (ja) * | 2003-02-26 | 2015-07-02 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
JP2017068287A (ja) * | 2003-02-26 | 2017-04-06 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
US7535550B2 (en) | 2003-02-26 | 2009-05-19 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP4604452B2 (ja) * | 2003-02-26 | 2011-01-05 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
KR20150052334A (ko) * | 2003-02-26 | 2015-05-13 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
JP2018106206A (ja) * | 2003-02-26 | 2018-07-05 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
JP4640516B2 (ja) * | 2003-02-26 | 2011-03-02 | 株式会社ニコン | 露光装置、及びデバイス製造方法 |
JP2010028127A (ja) * | 2003-02-26 | 2010-02-04 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
US7453550B2 (en) | 2003-02-26 | 2008-11-18 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP2014112716A (ja) * | 2003-02-26 | 2014-06-19 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
JP2009302596A (ja) * | 2003-02-26 | 2009-12-24 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
JP2011023765A (ja) * | 2003-02-26 | 2011-02-03 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
JP2004259966A (ja) * | 2003-02-26 | 2004-09-16 | Nikon Corp | 露光装置及びデバイス製造方法 |
US7268854B2 (en) | 2003-02-26 | 2007-09-11 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US7542128B2 (en) | 2003-02-26 | 2009-06-02 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP2009147386A (ja) * | 2003-02-26 | 2009-07-02 | Nikon Corp | 露光装置、及びデバイス製造方法 |
US9766555B2 (en) | 2003-02-26 | 2017-09-19 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP2014112741A (ja) * | 2003-02-26 | 2014-06-19 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
JP2016075963A (ja) * | 2003-02-26 | 2016-05-12 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
KR101288767B1 (ko) * | 2003-02-26 | 2013-07-23 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
US10180632B2 (en) | 2003-02-26 | 2019-01-15 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP2012129565A (ja) * | 2003-02-26 | 2012-07-05 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
WO2004079453A1 (ja) * | 2003-03-04 | 2004-09-16 | Tokyo Ohka Kogyo Co., Ltd. | 液浸露光プロセス用レジスト材料および該レジスト材料を用いたレジストパターン形成方法 |
WO2004086470A1 (ja) * | 2003-03-25 | 2004-10-07 | Nikon Corporation | 露光装置及びデバイス製造方法 |
JP2011044736A (ja) * | 2003-03-25 | 2011-03-03 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP2012080148A (ja) * | 2003-03-25 | 2012-04-19 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP2009158977A (ja) * | 2003-03-25 | 2009-07-16 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP2014030061A (ja) * | 2003-03-25 | 2014-02-13 | Nikon Corp | 露光装置及びデバイス製造方法 |
US7264918B2 (en) | 2003-03-28 | 2007-09-04 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition for liquid immersion exposure process and method of forming resist pattern therewith |
WO2004088429A1 (ja) * | 2003-03-28 | 2004-10-14 | Tokyo Ohka Kogyo Co. Ltd. | 液浸露光プロセス用レジスト組成物および該レジスト組成物を用いたレジストパターン形成方法 |
KR100751737B1 (ko) | 2003-03-28 | 2007-08-24 | 도오꾜오까고오교 가부시끼가이샤 | 액침 노광 프로세스용 레지스트 조성물 및 그 레지스트조성물을 사용한 레지스트 패턴 형성방법 |
US8797500B2 (en) | 2003-04-09 | 2014-08-05 | Nikon Corporation | Immersion lithography fluid control system changing flow velocity of gas outlets based on motion of a surface |
US9885959B2 (en) | 2003-04-09 | 2018-02-06 | Nikon Corporation | Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator |
US9618852B2 (en) | 2003-04-09 | 2017-04-11 | Nikon Corporation | Immersion lithography fluid control system regulating flow velocity of gas based on position of gas outlets |
US9678437B2 (en) | 2003-04-09 | 2017-06-13 | Nikon Corporation | Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction |
US7339650B2 (en) | 2003-04-09 | 2008-03-04 | Nikon Corporation | Immersion lithography fluid control system that applies force to confine the immersion liquid |
US8497973B2 (en) | 2003-04-09 | 2013-07-30 | Nikon Corporation | Immersion lithography fluid control system regulating gas velocity based on contact angle |
US7397532B2 (en) | 2003-04-10 | 2008-07-08 | Nikon Corporation | Run-off path to collect liquid for an immersion lithography apparatus |
US9977350B2 (en) | 2003-04-10 | 2018-05-22 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US8243253B2 (en) | 2003-04-10 | 2012-08-14 | Nikon Corporation | Lyophobic run-off path to collect liquid for an immersion lithography apparatus |
US9910370B2 (en) | 2003-04-10 | 2018-03-06 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
JP2014007412A (ja) * | 2003-04-10 | 2014-01-16 | Nikon Corp | 液浸リソグラフィ装置用の減圧排出を含む環境システム |
US7345742B2 (en) | 2003-04-10 | 2008-03-18 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
US9632427B2 (en) | 2003-04-10 | 2017-04-25 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
US9658537B2 (en) | 2003-04-10 | 2017-05-23 | Nikon Corporation | Environmental system including vacuum scavenge for an immersion lithography apparatus |
CN103383528A (zh) * | 2003-04-10 | 2013-11-06 | 株式会社尼康 | 包括用于沉浸光刻装置的真空清除的环境系统 |
US10185222B2 (en) | 2003-04-11 | 2019-01-22 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
US7443482B2 (en) | 2003-04-11 | 2008-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
US8085381B2 (en) * | 2003-04-11 | 2011-12-27 | Nikon Corporation | Cleanup method for optics in immersion lithography using sonic device |
US9958786B2 (en) | 2003-04-11 | 2018-05-01 | Nikon Corporation | Cleanup method for optics in immersion lithography using object on wafer holder in place of wafer |
US7522259B2 (en) | 2003-04-11 | 2009-04-21 | Nikon Corporation | Cleanup method for optics in immersion lithography |
US9946163B2 (en) | 2003-04-11 | 2018-04-17 | Nikon Corporation | Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine |
US9500960B2 (en) | 2003-04-11 | 2016-11-22 | Nikon Corporation | Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine |
US9785057B2 (en) | 2003-04-11 | 2017-10-10 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
JP2006523958A (ja) * | 2003-04-17 | 2006-10-19 | 株式会社ニコン | 液浸リソグラフィで使用するためのオートフォーカス素子の光学的構造 |
EP1614000A4 (en) * | 2003-04-17 | 2007-05-09 | Nikon Corp | OPTICAL ARRANGEMENT OF AUTO FOCUS ELEMENTS FOR USE WITH IMMERSION SLITHOGRAPHY |
US8018657B2 (en) | 2003-04-17 | 2011-09-13 | Nikon Corporation | Optical arrangement of autofocus elements for use with immersion lithography |
EP1614000A2 (en) * | 2003-04-17 | 2006-01-11 | Nikon Corporation | Optical arrangement of autofocus elements for use with immersion lithography |
US10156792B2 (en) | 2003-05-06 | 2018-12-18 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9846366B2 (en) | 2003-05-06 | 2017-12-19 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9933705B2 (en) | 2003-05-06 | 2018-04-03 | Nikon Corporation | Reduction projection optical system, exposure apparatus, and exposure method |
US9500943B2 (en) | 2003-05-06 | 2016-11-22 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9081295B2 (en) | 2003-05-06 | 2015-07-14 | Nikon Corporation | Catadioptric projection optical system, exposure apparatus, and exposure method |
US9086635B2 (en) | 2003-05-06 | 2015-07-21 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US9606443B2 (en) | 2003-05-06 | 2017-03-28 | Nikon Corporation | Reducing immersion projection optical system |
JP2008160155A (ja) * | 2003-05-13 | 2008-07-10 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US8964164B2 (en) | 2003-05-13 | 2015-02-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9798246B2 (en) | 2003-05-13 | 2017-10-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP2270599A1 (en) * | 2003-05-13 | 2011-01-05 | ASML Netherlands BV | Lithographic apparatus |
EP1477856A1 (en) * | 2003-05-13 | 2004-11-17 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9477160B2 (en) | 2003-05-13 | 2016-10-25 | Asml Netherland B.V. | Lithographic apparatus and device manufacturing method |
US10466595B2 (en) | 2003-05-13 | 2019-11-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP2282233A1 (en) * | 2003-05-13 | 2011-02-09 | ASML Netherlands BV | Lithographic apparatus |
EP1624481A1 (en) * | 2003-05-15 | 2006-02-08 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
EP1624481A4 (en) * | 2003-05-15 | 2008-01-30 | Nikon Corp | EXPOSURE DEVICE AND METHOD FOR MANUFACTURING COMPONENTS |
WO2004102646A1 (ja) | 2003-05-15 | 2004-11-25 | Nikon Corporation | 露光装置及びデバイス製造方法 |
EP2818929A1 (en) * | 2003-05-23 | 2014-12-31 | Nikon Corporation | Exposure method, exposure apparatus, and methods for producing a device |
US9933708B2 (en) | 2003-05-23 | 2018-04-03 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US9977336B2 (en) | 2003-05-23 | 2018-05-22 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US9939739B2 (en) | 2003-05-23 | 2018-04-10 | Nikon Corporation | Exposure apparatus and method for producing device |
US10082739B2 (en) | 2003-05-28 | 2018-09-25 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US7804574B2 (en) | 2003-05-30 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using acidic liquid |
US7808611B2 (en) | 2003-05-30 | 2010-10-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using acidic liquid |
JP4558762B2 (ja) * | 2003-06-09 | 2010-10-06 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びデバイス製造方法 |
US10180629B2 (en) | 2003-06-09 | 2019-01-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1486828A3 (en) * | 2003-06-09 | 2005-08-10 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2010161421A (ja) * | 2003-06-09 | 2010-07-22 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
US9081299B2 (en) | 2003-06-09 | 2015-07-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving removal of liquid entering a gap |
US10678139B2 (en) | 2003-06-09 | 2020-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9152058B2 (en) | 2003-06-09 | 2015-10-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a member and a fluid opening |
JP2007235179A (ja) * | 2003-06-09 | 2007-09-13 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
US9541843B2 (en) | 2003-06-09 | 2017-01-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a sensor detecting a radiation beam through liquid |
US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1486827A2 (en) * | 2003-06-11 | 2004-12-15 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1486827A3 (en) * | 2003-06-11 | 2005-03-09 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9964858B2 (en) | 2003-06-11 | 2018-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9110389B2 (en) | 2003-06-11 | 2015-08-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI607292B (zh) * | 2003-06-13 | 2017-12-01 | Nikon Corp | Exposure device, exposure method, and device manufacturing method |
WO2004112108A1 (ja) * | 2003-06-13 | 2004-12-23 | Nikon Corporation | 露光方法、基板ステージ、露光装置、及びデバイス製造方法 |
US9846371B2 (en) | 2003-06-13 | 2017-12-19 | Nikon Corporation | Exposure method, substrate stage, exposure apparatus, and device manufacturing method |
JP2013016839A (ja) * | 2003-06-13 | 2013-01-24 | Nikon Corp | 基板ステージ、露光装置、及びデバイス製造方法 |
JP2012248892A (ja) * | 2003-06-13 | 2012-12-13 | Nikon Corp | 基板ステージ、露光装置、及びデバイス製造方法 |
JP2010010703A (ja) * | 2003-06-13 | 2010-01-14 | Nikon Corp | 基板ステージ、露光装置、及びデバイス製造方法 |
US9810995B2 (en) | 2003-06-19 | 2017-11-07 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US10191388B2 (en) | 2003-06-19 | 2019-01-29 | Nikon Corporation | Exposure apparatus, and device manufacturing method |
US9551943B2 (en) | 2003-06-19 | 2017-01-24 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7411650B2 (en) | 2003-06-19 | 2008-08-12 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US10007188B2 (en) | 2003-06-19 | 2018-06-26 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US9709899B2 (en) | 2003-06-19 | 2017-07-18 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
CN100459036C (zh) * | 2003-06-19 | 2009-02-04 | 株式会社尼康 | 曝光装置及器件制造方法 |
US9715178B2 (en) | 2003-06-19 | 2017-07-25 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US7119874B2 (en) | 2003-06-27 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7012673B2 (en) | 2003-06-27 | 2006-03-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
USRE42741E1 (en) | 2003-06-27 | 2011-09-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7110087B2 (en) | 2003-06-30 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7038760B2 (en) | 2003-06-30 | 2006-05-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1494074A1 (en) * | 2003-06-30 | 2005-01-05 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9977352B2 (en) | 2003-07-09 | 2018-05-22 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7433019B2 (en) | 2003-07-09 | 2008-10-07 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US9383655B2 (en) | 2003-07-16 | 2016-07-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7738074B2 (en) | 2003-07-16 | 2010-06-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9733575B2 (en) | 2003-07-16 | 2017-08-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8913223B2 (en) | 2003-07-16 | 2014-12-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10656538B2 (en) | 2003-07-16 | 2020-05-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10151989B2 (en) | 2003-07-16 | 2018-12-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8823920B2 (en) | 2003-07-16 | 2014-09-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8711323B2 (en) | 2003-07-16 | 2014-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10146143B2 (en) | 2003-07-24 | 2018-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9594308B2 (en) | 2003-07-24 | 2017-03-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10444644B2 (en) | 2003-07-24 | 2019-10-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9804509B2 (en) | 2003-07-24 | 2017-10-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7184122B2 (en) | 2003-07-24 | 2007-02-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006528835A (ja) * | 2003-07-24 | 2006-12-21 | カール・ツアイス・エスエムテイ・アーゲー | マイクロリソグラフィ投影露光装置および浸漬液体を浸漬空間へ導入する方法 |
US7557901B2 (en) | 2003-07-24 | 2009-07-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9213247B2 (en) | 2003-07-24 | 2015-12-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8711333B2 (en) | 2003-07-24 | 2014-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10303066B2 (en) | 2003-07-28 | 2019-05-28 | Asml Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
US7175968B2 (en) | 2003-07-28 | 2007-02-13 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a substrate |
WO2005010962A1 (ja) * | 2003-07-28 | 2005-02-03 | Nikon Corporation | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
JP2010118690A (ja) * | 2003-07-28 | 2010-05-27 | Nikon Corp | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
US10185232B2 (en) | 2003-07-28 | 2019-01-22 | Nikon Corporation | Exposure apparatus, method for producing device, and method for controlling exposure apparatus |
JP2010109392A (ja) * | 2003-07-28 | 2010-05-13 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP2010109393A (ja) * | 2003-07-28 | 2010-05-13 | Nikon Corp | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
US9760026B2 (en) | 2003-07-28 | 2017-09-12 | Nikon Corporation | Exposure apparatus, method for producing device, and method for controlling exposure apparatus |
TWI633581B (zh) * | 2003-07-28 | 2018-08-21 | 尼康股份有限公司 | Exposure apparatus and exposure method, and component manufacturing method |
US8964163B2 (en) | 2003-07-28 | 2015-02-24 | Asml Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method with a projection system having a part movable relative to another part |
JP2005268742A (ja) * | 2003-07-28 | 2005-09-29 | Nikon Corp | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
US9639006B2 (en) | 2003-07-28 | 2017-05-02 | Asml Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
JP2010118689A (ja) * | 2003-07-28 | 2010-05-27 | Nikon Corp | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
JP2012151493A (ja) * | 2003-07-28 | 2012-08-09 | Nikon Corp | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
JP2007005830A (ja) * | 2003-07-28 | 2007-01-11 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
US9285686B2 (en) | 2003-07-31 | 2016-03-15 | Asml Netherlands B.V. | Lithographic apparatus involving an immersion liquid supply system with an aperture |
US8937704B2 (en) | 2003-07-31 | 2015-01-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a resistivity sensor |
JP2017068277A (ja) * | 2003-08-21 | 2017-04-06 | 株式会社ニコン | 露光装置、デバイス製造方法、及び露光方法 |
JP2018049295A (ja) * | 2003-08-21 | 2018-03-29 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
JP2009081479A (ja) * | 2003-08-21 | 2009-04-16 | Nikon Corp | 露光方法、及びデバイス製造方法 |
KR101259095B1 (ko) * | 2003-08-21 | 2013-04-30 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
JP4524670B2 (ja) * | 2003-08-21 | 2010-08-18 | 株式会社ニコン | 露光装置、及びデバイス製造方法 |
KR101239632B1 (ko) * | 2003-08-21 | 2013-03-11 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
JPWO2005020299A1 (ja) * | 2003-08-21 | 2006-10-19 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
KR101381563B1 (ko) * | 2003-08-21 | 2014-04-04 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
JP2016048384A (ja) * | 2003-08-21 | 2016-04-07 | 株式会社ニコン | 露光装置、デバイス製造方法、及び露光方法 |
KR101288632B1 (ko) * | 2003-08-21 | 2013-07-22 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
US8064037B2 (en) | 2003-08-21 | 2011-11-22 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with no liquid recovery during exposure |
KR101475995B1 (ko) * | 2003-08-21 | 2014-12-23 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
JP2014103408A (ja) * | 2003-08-21 | 2014-06-05 | Nikon Corp | 露光装置、デバイス製造方法、及び露光方法 |
US10209622B2 (en) | 2003-08-21 | 2019-02-19 | Nikon Corporation | Exposure method and device manufacturing method having lower scanning speed to expose peripheral shot area |
JP2015029160A (ja) * | 2003-08-21 | 2015-02-12 | 株式会社ニコン | 露光装置、デバイス製造方法、及び露光方法 |
JP2009290222A (ja) * | 2003-08-21 | 2009-12-10 | Nikon Corp | 露光装置、露光方法、及びデバイス製造方法 |
US10203608B2 (en) | 2003-08-21 | 2019-02-12 | Nikon Corporation | Exposure apparatus and device manufacturing method having lower scanning speed to expose peripheral shot area |
WO2005020299A1 (ja) * | 2003-08-21 | 2005-03-03 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法 |
JP2011109147A (ja) * | 2003-08-21 | 2011-06-02 | Nikon Corp | 露光方法、及びデバイス製造方法 |
US7697111B2 (en) | 2003-08-26 | 2010-04-13 | Nikon Corporation | Optical element and exposure apparatus |
US10175584B2 (en) | 2003-08-26 | 2019-01-08 | Nikon Corporation | Optical element and exposure apparatus |
US8208124B2 (en) | 2003-08-29 | 2012-06-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007504646A (ja) * | 2003-08-29 | 2007-03-01 | 東京エレクトロン株式会社 | 基板を乾燥させる方法とシステム。 |
US9316919B2 (en) | 2003-08-29 | 2016-04-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10025204B2 (en) | 2003-08-29 | 2018-07-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7733459B2 (en) | 2003-08-29 | 2010-06-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8804097B2 (en) | 2003-08-29 | 2014-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8947637B2 (en) | 2003-08-29 | 2015-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9581914B2 (en) | 2003-08-29 | 2017-02-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8953144B2 (en) | 2003-08-29 | 2015-02-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9568841B2 (en) | 2003-08-29 | 2017-02-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9025127B2 (en) | 2003-08-29 | 2015-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9606448B2 (en) | 2003-08-29 | 2017-03-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10146142B2 (en) | 2003-08-29 | 2018-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8208123B2 (en) | 2003-08-29 | 2012-06-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11003096B2 (en) | 2003-08-29 | 2021-05-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10514618B2 (en) | 2003-08-29 | 2019-12-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI424464B (zh) * | 2003-08-29 | 2014-01-21 | 尼康股份有限公司 | A liquid recovery device, an exposure device, an exposure method, and an element manufacturing method |
US8253921B2 (en) | 2003-09-03 | 2012-08-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
KR101523180B1 (ko) * | 2003-09-03 | 2015-05-26 | 가부시키가이샤 니콘 | 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법 |
US9817319B2 (en) | 2003-09-03 | 2017-11-14 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
US10203610B2 (en) | 2003-09-03 | 2019-02-12 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
US8035797B2 (en) | 2003-09-26 | 2011-10-11 | Nikon Corporation | Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method |
US8724076B2 (en) | 2003-09-26 | 2014-05-13 | Nikon Corporation | Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method |
JP2010098328A (ja) * | 2003-09-29 | 2010-04-30 | Nikon Corp | 露光装置及び露光方法並びにデバイス製造方法 |
CN101526759A (zh) * | 2003-09-29 | 2009-09-09 | 株式会社尼康 | 曝光装置 |
US8797502B2 (en) | 2003-09-29 | 2014-08-05 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device with electricity removal device by adding additive to liquid |
KR101421398B1 (ko) * | 2003-09-29 | 2014-07-18 | 가부시키가이샤 니콘 | 노광장치, 노광방법 및 디바이스 제조방법 |
TWI610342B (zh) * | 2003-09-29 | 2018-01-01 | 曝光裝置及曝光方法、以及元件製造方法 | |
KR101441840B1 (ko) * | 2003-09-29 | 2014-11-04 | 가부시키가이샤 니콘 | 노광장치, 노광방법 및 디바이스 제조방법 |
US8400615B2 (en) | 2003-09-29 | 2013-03-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7158211B2 (en) | 2003-09-29 | 2007-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7817245B2 (en) | 2003-09-29 | 2010-10-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7193681B2 (en) | 2003-09-29 | 2007-03-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101498437B1 (ko) * | 2003-09-29 | 2015-03-03 | 가부시키가이샤 니콘 | 노광장치, 노광방법 및 디바이스 제조방법 |
US10025194B2 (en) | 2003-09-29 | 2018-07-17 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
WO2005031799A3 (ja) * | 2003-09-29 | 2005-06-23 | Nippon Kogaku Kk | 露光装置、露光方法及びデバイス製造方法 |
JP2005116571A (ja) * | 2003-10-02 | 2005-04-28 | Nikon Corp | 露光装置及びデバイス製造方法 |
US10209623B2 (en) | 2003-10-09 | 2019-02-19 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP4482594B2 (ja) * | 2003-10-15 | 2010-06-16 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置およびデバイス製造方法 |
US7961293B2 (en) | 2003-10-15 | 2011-06-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8174674B2 (en) | 2003-10-15 | 2012-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7352435B2 (en) | 2003-10-15 | 2008-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2008199061A (ja) * | 2003-10-15 | 2008-08-28 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US9285685B2 (en) | 2003-10-15 | 2016-03-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8570486B2 (en) | 2003-10-15 | 2013-10-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433015B2 (en) | 2003-10-15 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8711330B2 (en) | 2003-10-15 | 2014-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9581913B2 (en) | 2003-10-22 | 2017-02-28 | Nikon Corporation | Exposure apparatus, exposure method, method for manufacturing device |
US9829807B2 (en) | 2003-10-22 | 2017-11-28 | Nikon Corporation | Exposure apparatus, exposure method, method for manufacturing device |
US8896813B2 (en) | 2003-10-22 | 2014-11-25 | Nikon Corporation | Exposure apparatus, exposure method, method for manufacturing device |
US9182679B2 (en) | 2003-10-28 | 2015-11-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9482962B2 (en) | 2003-10-28 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10527955B2 (en) | 2003-10-28 | 2020-01-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9760014B2 (en) | 2003-10-28 | 2017-09-12 | Nikon Corporation | Illumination optical apparatus and projection exposure apparatus |
US10248034B2 (en) | 2003-10-28 | 2019-04-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8272544B2 (en) | 2003-10-28 | 2012-09-25 | Nikon Corporation | Exposure apparatus, exposure method, and device fabrication method |
US9423698B2 (en) | 2003-10-28 | 2016-08-23 | Nikon Corporation | Illumination optical apparatus and projection exposure apparatus |
US7932996B2 (en) | 2003-10-28 | 2011-04-26 | Nikon Corporation | Exposure apparatus, exposure method, and device fabrication method |
US8860922B2 (en) | 2003-10-28 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8797506B2 (en) | 2003-10-28 | 2014-08-05 | Nikon Corporation | Exposure apparatus, exposure method, and device fabrication method |
US8860923B2 (en) | 2003-10-28 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10048597B2 (en) | 2003-10-31 | 2018-08-14 | Nikon Corporation | Exposure apparatus and device fabrication method |
US9829801B2 (en) | 2003-10-31 | 2017-11-28 | Nikon Corporation | Exposure apparatus and device fabrication method |
US8928856B2 (en) | 2003-10-31 | 2015-01-06 | Nikon Corporation | Exposure apparatus and device fabrication method |
US9563133B2 (en) | 2003-10-31 | 2017-02-07 | Nikon Corporation | Exposure apparatus and device fabrication method |
JP2005159322A (ja) * | 2003-10-31 | 2005-06-16 | Nikon Corp | 定盤、ステージ装置及び露光装置並びに露光方法 |
US9134622B2 (en) | 2003-11-14 | 2015-09-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9952515B2 (en) | 2003-11-14 | 2018-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10345712B2 (en) | 2003-11-14 | 2019-07-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10281632B2 (en) | 2003-11-20 | 2019-05-07 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction |
US9885872B2 (en) | 2003-11-20 | 2018-02-06 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light |
US8472006B2 (en) | 2003-11-24 | 2013-06-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7545481B2 (en) | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2010141355A (ja) * | 2003-12-03 | 2010-06-24 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
JP2005191557A (ja) * | 2003-12-03 | 2005-07-14 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
WO2005055296A1 (ja) * | 2003-12-03 | 2005-06-16 | Nikon Corporation | 露光装置、露光方法及びデバイス製造方法、並びに光学部品 |
JP4513534B2 (ja) * | 2003-12-03 | 2010-07-28 | 株式会社ニコン | 露光装置及び露光方法、デバイス製造方法 |
JP2012142610A (ja) * | 2003-12-03 | 2012-07-26 | Nikon Corp | 露光装置及び露光方法、デバイス製造方法 |
US10088760B2 (en) | 2003-12-03 | 2018-10-02 | Nikon Corporation | Exposure apparatus, exposure method, method for producing device, and optical part |
US9798245B2 (en) | 2003-12-15 | 2017-10-24 | Nikon Corporation | Exposure apparatus, and exposure method, with recovery device to recover liquid leaked from between substrate and member |
JPWO2005057635A1 (ja) * | 2003-12-15 | 2007-07-05 | 株式会社ニコン | 投影露光装置及びステージ装置、並びに露光方法 |
KR101111363B1 (ko) | 2003-12-15 | 2012-04-12 | 가부시키가이샤 니콘 | 투영노광장치 및 스테이지 장치, 그리고 노광방법 |
WO2005057635A1 (ja) * | 2003-12-15 | 2005-06-23 | Nikon Corporation | 投影露光装置及びステージ装置、並びに露光方法 |
JP2010161411A (ja) * | 2003-12-15 | 2010-07-22 | Nikon Corp | 投影露光装置及びステージ装置、並びに露光方法 |
WO2005062351A1 (en) * | 2003-12-19 | 2005-07-07 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
US7292309B2 (en) | 2003-12-19 | 2007-11-06 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
US9465301B2 (en) | 2003-12-23 | 2016-10-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007515798A (ja) * | 2003-12-23 | 2007-06-14 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びデバイス製造方法 |
US7589818B2 (en) | 2003-12-23 | 2009-09-15 | Asml Netherlands B.V. | Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus |
US10768538B2 (en) | 2003-12-23 | 2020-09-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9684250B2 (en) | 2003-12-23 | 2017-06-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10613447B2 (en) | 2003-12-23 | 2020-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9817321B2 (en) | 2003-12-23 | 2017-11-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8064044B2 (en) | 2004-01-05 | 2011-11-22 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
US9910369B2 (en) | 2004-01-05 | 2018-03-06 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
US9588436B2 (en) | 2004-01-05 | 2017-03-07 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
EP2315078A1 (en) | 2004-01-15 | 2011-04-27 | JSR Corporation | Upper layer film forming composition for liquid immersion and method of forming photoresist pattern |
KR101041285B1 (ko) | 2004-01-15 | 2011-06-14 | 제이에스알 가부시끼가이샤 | 액침용 상층막 형성 조성물 및 포토레지스트 패턴 형성방법 |
US9182674B2 (en) | 2004-01-15 | 2015-11-10 | Jsr Corporation | Immersion upper layer film forming composition and method of forming photoresist pattern |
US8247165B2 (en) | 2004-01-15 | 2012-08-21 | Jsr Corporation | Upper layer film forming composition for liquid immersion and method of forming photoresist pattern |
WO2005069076A1 (ja) * | 2004-01-15 | 2005-07-28 | Jsr Corporation | 液浸用上層膜形成組成物およびフォトレジストパターン形成方法 |
US9436095B2 (en) | 2004-01-20 | 2016-09-06 | Carl Zeiss Smt Gmbh | Exposure apparatus and measuring device for a projection lens |
US10345710B2 (en) | 2004-01-20 | 2019-07-09 | Carl Zeiss Smt Gmbh | Microlithographic projection exposure apparatus and measuring device for a projection lens |
US7697110B2 (en) | 2004-01-26 | 2010-04-13 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8330934B2 (en) | 2004-01-26 | 2012-12-11 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US9684248B2 (en) | 2004-02-02 | 2017-06-20 | Nikon Corporation | Lithographic apparatus having substrate table and sensor table to measure a patterned beam |
US9665016B2 (en) | 2004-02-02 | 2017-05-30 | Nikon Corporation | Lithographic apparatus and method having substrate table and sensor table to hold immersion liquid |
US9632431B2 (en) | 2004-02-02 | 2017-04-25 | Nikon Corporation | Lithographic apparatus and method having substrate and sensor tables |
US10007196B2 (en) | 2004-02-02 | 2018-06-26 | Nikon Corporation | Lithographic apparatus and method having substrate and sensor tables |
US10139737B2 (en) | 2004-02-02 | 2018-11-27 | Nikon Corporation | Lithographic apparatus and method having substrate and sensor tables |
KR101539877B1 (ko) * | 2004-02-02 | 2015-07-28 | 가부시키가이샤 니콘 | 스테이지 구동 방법 및 스테이지 장치, 노광 장치, 그리고 디바이스 제조 방법 |
US10151983B2 (en) | 2004-02-03 | 2018-12-11 | Nikon Corporation | Exposure apparatus and device manufacturing method |
JP2007520893A (ja) * | 2004-02-03 | 2007-07-26 | ロチェスター インスティテュート オブ テクノロジー | 流体を使用したフォトリソグラフィ法及びそのシステム |
US10048602B2 (en) | 2004-02-04 | 2018-08-14 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8605252B2 (en) | 2004-02-04 | 2013-12-10 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
WO2005076325A1 (ja) * | 2004-02-04 | 2005-08-18 | Nikon Corporation | 露光装置及び方法、位置制御方法並びにデバイス製造方法 |
US8208119B2 (en) | 2004-02-04 | 2012-06-26 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US10007194B2 (en) | 2004-02-06 | 2018-06-26 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
US10234770B2 (en) | 2004-02-06 | 2019-03-19 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
US20130271945A1 (en) | 2004-02-06 | 2013-10-17 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
US10241417B2 (en) | 2004-02-06 | 2019-03-26 | Nikon Corporation | Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method |
USRE42849E1 (en) | 2004-02-09 | 2011-10-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7050146B2 (en) | 2004-02-09 | 2006-05-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8115902B2 (en) | 2004-02-10 | 2012-02-14 | Nikon Corporation | Exposure apparatus, device manufacturing method, maintenance method, and exposure method |
US7557900B2 (en) | 2004-02-10 | 2009-07-07 | Nikon Corporation | Exposure apparatus, device manufacturing method, maintenance method, and exposure method |
JP4513590B2 (ja) * | 2004-02-19 | 2010-07-28 | 株式会社ニコン | 光学部品及び露光装置 |
JP2005268759A (ja) * | 2004-02-19 | 2005-09-29 | Nikon Corp | 光学部品及び露光装置 |
KR100972129B1 (ko) * | 2004-02-20 | 2010-07-23 | 후지필름 가부시키가이샤 | 액침 노광용 레지스트 조성물 및 그것을 사용한패턴형성방법 |
US8023100B2 (en) | 2004-02-20 | 2011-09-20 | Nikon Corporation | Exposure apparatus, supply method and recovery method, exposure method, and device producing method |
JP2005234458A (ja) * | 2004-02-23 | 2005-09-02 | Nikon Corp | 顕微鏡観察装置 |
JP4569123B2 (ja) * | 2004-02-23 | 2010-10-27 | 株式会社ニコン | 顕微鏡観察装置 |
WO2005085954A1 (ja) * | 2004-03-05 | 2005-09-15 | Tokyo Ohka Kogyo Co., Ltd. | 液浸露光用ポジ型レジスト組成物およびレジストパターンの形成方法 |
US10126661B2 (en) | 2004-03-25 | 2018-11-13 | Nikon Corporation | Exposure apparatus and device fabrication method |
KR101504445B1 (ko) * | 2004-03-25 | 2015-03-19 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
KR101441777B1 (ko) * | 2004-03-25 | 2014-09-22 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
US7180574B2 (en) | 2004-03-29 | 2007-02-20 | Canon Kabushiki Kaisha | Exposure apparatus and method |
US7034917B2 (en) | 2004-04-01 | 2006-04-25 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
US7227619B2 (en) | 2004-04-01 | 2007-06-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7295283B2 (en) | 2004-04-02 | 2007-11-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10234768B2 (en) | 2004-04-14 | 2019-03-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9207543B2 (en) | 2004-04-14 | 2015-12-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a groove to collect liquid |
US9989861B2 (en) | 2004-04-14 | 2018-06-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9829799B2 (en) | 2004-04-14 | 2017-11-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10705432B2 (en) | 2004-04-14 | 2020-07-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9568840B2 (en) | 2004-04-14 | 2017-02-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9599907B2 (en) | 2004-04-19 | 2017-03-21 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8488099B2 (en) | 2004-04-19 | 2013-07-16 | Nikon Corporation | Exposure apparatus and device manufacturing method |
KR100887202B1 (ko) * | 2004-04-27 | 2009-03-06 | 도오꾜오까고오교 가부시끼가이샤 | 액침 노광 프로세스용 레지스트 보호막 형성용 재료, 및 이보호막을 이용한 레지스트 패턴 형성 방법 |
WO2005106930A1 (ja) * | 2004-04-27 | 2005-11-10 | Nikon Corporation | 露光方法、露光装置及びデバイス製造方法 |
US7846637B2 (en) | 2004-04-27 | 2010-12-07 | Tokyo Ohka Kogyo Co., Ltd. | Material for forming resist protective film for use in liquid immersion lithography process and method for forming resist pattern using the protective film |
US7652751B2 (en) | 2004-05-03 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7379159B2 (en) | 2004-05-03 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10761438B2 (en) | 2004-05-18 | 2020-09-01 | Asml Netherlands B.V. | Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets |
US9623436B2 (en) | 2004-05-18 | 2017-04-18 | Asml Netherlands B.V. | Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets |
US7580111B2 (en) | 2004-05-21 | 2009-08-25 | Jsr Corporation | Liquid for immersion exposure and immersion exposure method |
US7486381B2 (en) | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2005347617A (ja) * | 2004-06-04 | 2005-12-15 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP4517341B2 (ja) * | 2004-06-04 | 2010-08-04 | 株式会社ニコン | 露光装置、ノズル部材、及びデバイス製造方法 |
US9429495B2 (en) | 2004-06-04 | 2016-08-30 | Carl Zeiss Smt Gmbh | System for measuring the image quality of an optical imaging system |
US8325326B2 (en) | 2004-06-07 | 2012-12-04 | Nikon Corporation | Stage unit, exposure apparatus, and exposure method |
US7771918B2 (en) | 2004-06-09 | 2010-08-10 | Panasonic Corporation | Semiconductor manufacturing apparatus and pattern formation method |
US9645505B2 (en) | 2004-06-09 | 2017-05-09 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with measuring device to measure specific resistance of liquid |
US8705008B2 (en) | 2004-06-09 | 2014-04-22 | Nikon Corporation | Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate |
US10203614B2 (en) | 2004-06-10 | 2019-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8508713B2 (en) | 2004-06-10 | 2013-08-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US9529273B2 (en) | 2004-06-10 | 2016-12-27 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US9134621B2 (en) | 2004-06-10 | 2015-09-15 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US9411247B2 (en) | 2004-06-10 | 2016-08-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8482716B2 (en) | 2004-06-10 | 2013-07-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
EP3067749A3 (en) * | 2004-06-10 | 2016-11-16 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8717533B2 (en) | 2004-06-10 | 2014-05-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
KR101505756B1 (ko) * | 2004-06-10 | 2015-03-26 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법, 및 디바이스 제조 방법 |
US8373843B2 (en) | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
EP3067750A3 (en) * | 2004-06-10 | 2017-03-15 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US9778580B2 (en) | 2004-06-10 | 2017-10-03 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US10168624B2 (en) | 2004-06-16 | 2019-01-01 | Asml Netherlands B.V. | Vacuum system for immersion photolithography |
US9507270B2 (en) | 2004-06-16 | 2016-11-29 | Asml Netherlands B.V. | Vacuum system for immersion photolithography |
US9857699B2 (en) | 2004-06-16 | 2018-01-02 | Asml Netherlands B.V. | Vacuum system for immersion photolithography |
US8368870B2 (en) | 2004-06-21 | 2013-02-05 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8698998B2 (en) | 2004-06-21 | 2014-04-15 | Nikon Corporation | Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device |
US8810767B2 (en) | 2004-06-21 | 2014-08-19 | Nikon Corporation | Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device |
US9904182B2 (en) | 2004-06-21 | 2018-02-27 | Nikon Corporation | Exposure apparatus |
US9470984B2 (en) | 2004-06-21 | 2016-10-18 | Nikon Corporation | Exposure apparatus |
US9104117B2 (en) | 2004-07-07 | 2015-08-11 | Bob Streefkerk | Lithographic apparatus having a liquid detection system |
US10338478B2 (en) | 2004-07-07 | 2019-07-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10739684B2 (en) | 2004-07-07 | 2020-08-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9250537B2 (en) | 2004-07-12 | 2016-02-02 | Nikon Corporation | Immersion exposure apparatus and method with detection of liquid on members of the apparatus |
US8654308B2 (en) | 2004-07-12 | 2014-02-18 | Nikon Corporation | Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device |
US7161663B2 (en) | 2004-07-22 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus |
US7879529B2 (en) | 2004-07-30 | 2011-02-01 | Tokyo Ohka Kogyo Co., Ltd. | Material for formation of resist protection film and method of forming resist pattern therewith |
US7951523B2 (en) | 2004-07-30 | 2011-05-31 | Tokyo Ohka Kogyo Co., Ltd. | Material for forming resist protective film and method for forming resist pattern using same |
KR100952174B1 (ko) * | 2004-07-30 | 2010-04-09 | 토쿄오오카코교 가부시기가이샤 | 레지스트 보호막 형성용 재료 및 이것을 이용한 레지스트패턴 형성방법 |
US20120038894A1 (en) * | 2004-08-03 | 2012-02-16 | Taiwan Semiconductor Manufacturing Company, Ltd | Lens Cleaning Module |
US10254663B2 (en) | 2004-08-13 | 2019-04-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a heater |
US11378893B2 (en) | 2004-08-13 | 2022-07-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a heater |
US9268242B2 (en) | 2004-08-13 | 2016-02-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a heater and a temperature sensor |
US7304715B2 (en) | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10838310B2 (en) | 2004-08-13 | 2020-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a heater |
US9188880B2 (en) | 2004-08-13 | 2015-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a heater |
US7804575B2 (en) | 2004-08-13 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method having liquid evaporation control |
US9097992B2 (en) | 2004-08-19 | 2015-08-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10705439B2 (en) | 2004-08-19 | 2020-07-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9507278B2 (en) | 2004-08-19 | 2016-11-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9746788B2 (en) | 2004-08-19 | 2017-08-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9904185B2 (en) | 2004-08-19 | 2018-02-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9488923B2 (en) | 2004-08-19 | 2016-11-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10599054B2 (en) | 2004-08-19 | 2020-03-24 | Asml Holding N.V. | Lithographic apparatus and device manufacturing method |
US10331047B2 (en) | 2004-08-19 | 2019-06-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8675174B2 (en) | 2004-09-17 | 2014-03-18 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US9958785B2 (en) | 2004-09-17 | 2018-05-01 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8102512B2 (en) | 2004-09-17 | 2012-01-24 | Nikon Corporation | Substrate holding device, exposure apparatus, and device manufacturing method |
US9341959B2 (en) | 2004-09-17 | 2016-05-17 | Nikon Corporation | Substrate holding device, exposure apparatus, and device manufacturing method |
US7133114B2 (en) | 2004-09-20 | 2006-11-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7808614B2 (en) | 2004-09-24 | 2010-10-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8427629B2 (en) | 2004-09-24 | 2013-04-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7522261B2 (en) | 2004-09-24 | 2009-04-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7355674B2 (en) | 2004-09-28 | 2008-04-08 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and computer program product |
US8068210B2 (en) | 2004-09-28 | 2011-11-29 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and computer program product |
EP2468780A1 (en) | 2004-09-30 | 2012-06-27 | JSR Corporation | Copolymer and top coating composition |
US8580482B2 (en) | 2004-09-30 | 2013-11-12 | Jsr Corporation | Copolymer and top coating composition |
EP2277929A1 (en) | 2004-09-30 | 2011-01-26 | JSR Corporation | Copolymer and top coating composition |
US7781142B2 (en) | 2004-09-30 | 2010-08-24 | Jsr Corporation | Copolymer and top coating composition |
US8755027B2 (en) | 2004-10-05 | 2014-06-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving fluid mixing and control of the physical property of a fluid |
US8027026B2 (en) | 2004-10-05 | 2011-09-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7894040B2 (en) | 2004-10-05 | 2011-02-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7209213B2 (en) | 2004-10-07 | 2007-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006190971A (ja) * | 2004-10-13 | 2006-07-20 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
US7852456B2 (en) | 2004-10-13 | 2010-12-14 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8456609B2 (en) | 2004-10-15 | 2013-06-04 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7456929B2 (en) | 2004-10-15 | 2008-11-25 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US9436097B2 (en) | 2004-10-18 | 2016-09-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7119876B2 (en) | 2004-10-18 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8004652B2 (en) | 2004-10-18 | 2011-08-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10248033B2 (en) | 2004-10-18 | 2019-04-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7379155B2 (en) | 2004-10-18 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8934082B2 (en) | 2004-10-18 | 2015-01-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9753380B2 (en) | 2004-10-18 | 2017-09-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2006043597A1 (ja) * | 2004-10-19 | 2006-04-27 | Jsr Corporation | 感放射線性樹脂組成物 |
JP2008517473A (ja) * | 2004-10-22 | 2008-05-22 | カール・ツアイス・エスエムテイ・アーゲー | マイクロリソグラフィ用の投影露光装置 |
US8941808B2 (en) | 2004-10-26 | 2015-01-27 | Nikon Corporation | Immersion lithographic apparatus rinsing outer contour of substrate with immersion space |
US8040489B2 (en) | 2004-10-26 | 2011-10-18 | Nikon Corporation | Substrate processing method, exposure apparatus, and method for producing device by immersing substrate in second liquid before immersion exposure through first liquid |
US8330939B2 (en) | 2004-11-01 | 2012-12-11 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with a liquid recovery port provided on at least one of a first stage and second stage |
US9709900B2 (en) | 2004-11-01 | 2017-07-18 | Nikon Corporation | Exposure apparatus and device fabricating method |
US8922754B2 (en) | 2004-11-01 | 2014-12-30 | Nikon Corporation | Immersion exposure apparatus and device fabricating method with two substrate stages and metrology station |
US8294873B2 (en) | 2004-11-11 | 2012-10-23 | Nikon Corporation | Exposure method, device manufacturing method, and substrate |
US8817231B2 (en) | 2004-11-12 | 2014-08-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
JP2011211235A (ja) * | 2004-11-12 | 2011-10-20 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US10274832B2 (en) | 2004-11-12 | 2019-04-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US9964861B2 (en) | 2004-11-12 | 2018-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US9261797B2 (en) | 2004-11-12 | 2016-02-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US9798247B2 (en) | 2004-11-12 | 2017-10-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US7251013B2 (en) | 2004-11-12 | 2007-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10620546B2 (en) | 2004-11-12 | 2020-04-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a liquid confinement structure |
US7710537B2 (en) | 2004-11-12 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7852457B2 (en) | 2004-11-12 | 2010-12-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2009044196A (ja) * | 2004-11-12 | 2009-02-26 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US7423720B2 (en) | 2004-11-12 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7583357B2 (en) | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9645507B2 (en) | 2004-11-12 | 2017-05-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7414699B2 (en) | 2004-11-12 | 2008-08-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9581916B2 (en) | 2004-11-17 | 2017-02-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9188882B2 (en) | 2004-11-17 | 2015-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411657B2 (en) | 2004-11-17 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7978306B2 (en) | 2004-11-17 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9857692B2 (en) | 2004-11-18 | 2018-01-02 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US8059260B2 (en) * | 2004-11-18 | 2011-11-15 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US10222708B2 (en) | 2004-11-18 | 2019-03-05 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US9223230B2 (en) | 2004-11-18 | 2015-12-29 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US8072578B2 (en) | 2004-11-18 | 2011-12-06 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US9348238B2 (en) | 2004-11-18 | 2016-05-24 | Niko Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US9298108B2 (en) | 2004-11-18 | 2016-03-29 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US8054465B2 (en) | 2004-11-18 | 2011-11-08 | Nikon Corporation | Position measurement method |
US8576379B2 (en) | 2004-11-18 | 2013-11-05 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US9223231B2 (en) | 2004-11-18 | 2015-12-29 | Nikon Corporation | Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method |
US7145630B2 (en) | 2004-11-23 | 2006-12-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7161654B2 (en) | 2004-12-02 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7812924B2 (en) | 2004-12-02 | 2010-10-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7764356B2 (en) | 2004-12-03 | 2010-07-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7446850B2 (en) | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8891055B2 (en) | 2004-12-06 | 2014-11-18 | Nikon Corporation | Maintenance method, maintenance device, exposure apparatus, and device manufacturing method |
US7804576B2 (en) | 2004-12-06 | 2010-09-28 | Nikon Corporation | Maintenance method, maintenance device, exposure apparatus, and device manufacturing method |
US8456608B2 (en) | 2004-12-06 | 2013-06-04 | Nikon Corporation | Maintenance method, maintenance device, exposure apparatus, and device manufacturing method |
US7196770B2 (en) | 2004-12-07 | 2007-03-27 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
US7248334B2 (en) | 2004-12-07 | 2007-07-24 | Asml Netherlands B.V. | Sensor shield |
US7643127B2 (en) | 2004-12-07 | 2010-01-05 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
US8860926B2 (en) | 2004-12-08 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8115905B2 (en) | 2004-12-08 | 2012-02-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7365827B2 (en) | 2004-12-08 | 2008-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8035799B2 (en) | 2004-12-09 | 2011-10-11 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
US8913224B2 (en) | 2004-12-09 | 2014-12-16 | Nixon Corporation | Exposure apparatus, exposure method, and device producing method |
US10345711B2 (en) | 2004-12-10 | 2019-07-09 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US9740106B2 (en) | 2004-12-10 | 2017-08-22 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US7352440B2 (en) | 2004-12-10 | 2008-04-01 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US9182222B2 (en) | 2004-12-10 | 2015-11-10 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US7751032B2 (en) | 2004-12-15 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7403261B2 (en) | 2004-12-15 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8233135B2 (en) | 2004-12-15 | 2012-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9224632B2 (en) | 2004-12-15 | 2015-12-29 | Nikon Corporation | Substrate holding apparatus, exposure apparatus, and device fabricating method |
US9964860B2 (en) | 2004-12-15 | 2018-05-08 | Nikon Corporation | Substrate holding apparatus, exposure apparatus, and device fabricating method |
US9690206B2 (en) | 2004-12-15 | 2017-06-27 | Nikon Corporation | Substrate holding apparatus, exposure apparatus, and device fabricating method |
US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9703210B2 (en) | 2004-12-20 | 2017-07-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8462312B2 (en) | 2004-12-20 | 2013-06-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8233137B2 (en) | 2004-12-20 | 2012-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9329494B2 (en) | 2004-12-20 | 2016-05-03 | Asml Netherlands B.V. | Lithographic apparatus |
US10509326B2 (en) | 2004-12-20 | 2019-12-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10248035B2 (en) | 2004-12-20 | 2019-04-02 | Asml Netherlands B.V. | Lithographic apparatus |
US9116443B2 (en) | 2004-12-20 | 2015-08-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9417535B2 (en) | 2004-12-20 | 2016-08-16 | Asml Netherlands B.V. | Lithographic apparatus |
US8941811B2 (en) | 2004-12-20 | 2015-01-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9835960B2 (en) | 2004-12-20 | 2017-12-05 | Asml Netherlands B.V. | Lithographic apparatus |
JP2006179902A (ja) * | 2004-12-22 | 2006-07-06 | Asml Netherlands Bv | 超音波距離センサ |
JP4485463B2 (ja) * | 2004-12-22 | 2010-06-23 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置および素子製造方法 |
EP1674939A1 (en) | 2004-12-27 | 2006-06-28 | ASML Netherlands BV | Level sensor, lithographic apparatus and device manufacturing method |
US8278025B2 (en) | 2004-12-27 | 2012-10-02 | Tokyo Ohka Kogyo Co., Ltd. | Material for forming resist protection films and method for resist pattern formation with the same |
KR100877217B1 (ko) * | 2004-12-27 | 2009-01-07 | 토쿄오오카코교 가부시기가이샤 | 레지스트 보호막 형성용 재료 및 이것을 이용한 레지스트패턴 형성 방법 |
US7763355B2 (en) | 2004-12-28 | 2010-07-27 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
US8013978B2 (en) | 2004-12-28 | 2011-09-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7405805B2 (en) | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7491661B2 (en) | 2004-12-28 | 2009-02-17 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
US8913225B2 (en) | 2004-12-28 | 2014-12-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7148494B2 (en) | 2004-12-29 | 2006-12-12 | Asml Netherlands B.V. | Level sensor, lithographic apparatus and device manufacturing method |
US8354209B2 (en) | 2004-12-30 | 2013-01-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1677156A1 (en) * | 2004-12-30 | 2006-07-05 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
US7670730B2 (en) | 2004-12-30 | 2010-03-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2011018925A (ja) * | 2004-12-30 | 2011-01-27 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
JP2009055068A (ja) * | 2004-12-30 | 2009-03-12 | Asml Netherlands Bv | リソグラフィ装置及びデバイス製造方法 |
US8102507B2 (en) | 2004-12-30 | 2012-01-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7450217B2 (en) | 2005-01-12 | 2008-11-11 | Asml Netherlands B.V. | Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby |
US8542341B2 (en) | 2005-01-12 | 2013-09-24 | Asml Netherlands B.V. | Exposure apparatus |
US8830446B2 (en) | 2005-01-12 | 2014-09-09 | Asml Netherlands B.V. | Exposure apparatus |
US7705962B2 (en) | 2005-01-14 | 2010-04-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9746781B2 (en) | 2005-01-31 | 2017-08-29 | Nikon Corporation | Exposure apparatus and method for producing device |
US9164391B2 (en) | 2005-02-10 | 2015-10-20 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US8859188B2 (en) | 2005-02-10 | 2014-10-14 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US9772565B2 (en) | 2005-02-10 | 2017-09-26 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US9454088B2 (en) | 2005-02-10 | 2016-09-27 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US10712675B2 (en) | 2005-02-10 | 2020-07-14 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US7378025B2 (en) | 2005-02-22 | 2008-05-27 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US7224431B2 (en) | 2005-02-22 | 2007-05-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8246838B2 (en) | 2005-02-22 | 2012-08-21 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US8902404B2 (en) | 2005-02-22 | 2014-12-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7914687B2 (en) | 2005-02-22 | 2011-03-29 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8107053B2 (en) | 2005-02-28 | 2012-01-31 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US8958051B2 (en) | 2005-02-28 | 2015-02-17 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US7428038B2 (en) | 2005-02-28 | 2008-09-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US7324185B2 (en) | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7843551B2 (en) | 2005-03-04 | 2010-11-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10495981B2 (en) | 2005-03-04 | 2019-12-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8514369B2 (en) | 2005-03-04 | 2013-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9477159B2 (en) | 2005-03-04 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10495980B2 (en) | 2005-03-04 | 2019-12-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8390778B2 (en) | 2005-03-09 | 2013-03-05 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing |
US7684010B2 (en) | 2005-03-09 | 2010-03-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing |
US7705968B2 (en) | 2005-03-18 | 2010-04-27 | Nikon Corporation | Plate member, substrate holding device, exposure apparatus and method, and device manufacturing method |
US8638422B2 (en) | 2005-03-18 | 2014-01-28 | Nikon Corporation | Exposure method, exposure apparatus, method for producing device, and method for evaluating exposure apparatus |
US7859644B2 (en) | 2005-03-28 | 2010-12-28 | Asml Netherlands B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
US7330238B2 (en) | 2005-03-28 | 2008-02-12 | Asml Netherlands, B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
US9239524B2 (en) | 2005-03-30 | 2016-01-19 | Nikon Corporation | Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region |
US7411654B2 (en) | 2005-04-05 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9429853B2 (en) | 2005-04-05 | 2016-08-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8976334B2 (en) | 2005-04-05 | 2015-03-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8259287B2 (en) | 2005-04-05 | 2012-09-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10495984B2 (en) | 2005-04-05 | 2019-12-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9857695B2 (en) | 2005-04-05 | 2018-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10209629B2 (en) | 2005-04-05 | 2019-02-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8988651B2 (en) | 2005-04-05 | 2015-03-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
USRE46933E1 (en) | 2005-04-08 | 2018-07-03 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7582881B2 (en) | 2005-04-08 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
USRE47943E1 (en) | 2005-04-08 | 2020-04-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7291850B2 (en) | 2005-04-08 | 2007-11-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8089608B2 (en) | 2005-04-18 | 2012-01-03 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US9618854B2 (en) | 2005-04-25 | 2017-04-11 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US9335639B2 (en) | 2005-04-25 | 2016-05-10 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8064039B2 (en) | 2005-04-25 | 2011-11-22 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8236467B2 (en) | 2005-04-28 | 2012-08-07 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8941812B2 (en) | 2005-04-28 | 2015-01-27 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US9146478B2 (en) | 2005-05-03 | 2015-09-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9229335B2 (en) | 2005-05-03 | 2016-01-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11016394B2 (en) | 2005-05-03 | 2021-05-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10488759B2 (en) | 2005-05-03 | 2019-11-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9606449B2 (en) | 2005-05-03 | 2017-03-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9081300B2 (en) | 2005-05-03 | 2015-07-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7317507B2 (en) | 2005-05-03 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10684554B2 (en) | 2005-05-03 | 2020-06-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9477153B2 (en) | 2005-05-03 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8860924B2 (en) | 2005-05-03 | 2014-10-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10353296B2 (en) | 2005-05-03 | 2019-07-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10451973B2 (en) | 2005-05-03 | 2019-10-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10025196B2 (en) | 2005-05-03 | 2018-07-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433016B2 (en) | 2005-05-03 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9891539B2 (en) | 2005-05-12 | 2018-02-13 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
US7751027B2 (en) | 2005-06-21 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9268236B2 (en) | 2005-06-21 | 2016-02-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method having heat pipe with fluid to cool substrate and/or substrate holder |
US7652746B2 (en) | 2005-06-21 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7924416B2 (en) | 2005-06-22 | 2011-04-12 | Nikon Corporation | Measurement apparatus, exposure apparatus, and device manufacturing method |
US9952514B2 (en) | 2005-06-28 | 2018-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9448494B2 (en) | 2005-06-28 | 2016-09-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7929112B2 (en) | 2005-06-28 | 2011-04-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7468779B2 (en) | 2005-06-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7474379B2 (en) | 2005-06-28 | 2009-01-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7834974B2 (en) | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8120749B2 (en) | 2005-06-28 | 2012-02-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10386725B2 (en) | 2005-06-28 | 2019-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9766556B2 (en) | 2005-06-28 | 2017-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11327404B2 (en) | 2005-06-28 | 2022-05-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9099501B2 (en) | 2005-06-28 | 2015-08-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8687168B2 (en) | 2005-06-28 | 2014-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8848165B2 (en) | 2005-06-28 | 2014-09-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8179517B2 (en) | 2005-06-30 | 2012-05-15 | Nikon Corporation | Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method |
US7535644B2 (en) | 2005-08-12 | 2009-05-19 | Asml Netherlands B.V. | Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby |
US8054445B2 (en) | 2005-08-16 | 2011-11-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8668191B2 (en) | 2005-08-26 | 2014-03-11 | Nikon Corporation | Holding unit, assembly system, sputtering unit, and processing method and processing unit |
US8070145B2 (en) | 2005-08-26 | 2011-12-06 | Nikon Corporation | Holding unit, assembly system, sputtering unit, and processing method and processing unit |
US8724075B2 (en) | 2005-08-31 | 2014-05-13 | Nikon Corporation | Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice |
US7812926B2 (en) | 2005-08-31 | 2010-10-12 | Nikon Corporation | Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice |
US8111374B2 (en) | 2005-09-09 | 2012-02-07 | Nikon Corporation | Analysis method, exposure method, and device manufacturing method |
US8780326B2 (en) | 2005-09-09 | 2014-07-15 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US7411658B2 (en) | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8958054B2 (en) | 2005-10-06 | 2015-02-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8004654B2 (en) | 2005-10-06 | 2011-08-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8435718B2 (en) | 2005-10-27 | 2013-05-07 | Jsr Corporation | Upper layer-forming composition and photoresist patterning method |
US8076053B2 (en) | 2005-10-27 | 2011-12-13 | Jsr Corporation | Upper layer-forming composition and photoresist patterning method |
US7804577B2 (en) | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
US8786823B2 (en) | 2005-11-16 | 2014-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11789369B2 (en) | 2005-11-16 | 2023-10-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10768536B2 (en) | 2005-11-16 | 2020-09-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7864292B2 (en) | 2005-11-16 | 2011-01-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9618853B2 (en) | 2005-11-16 | 2017-04-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11209738B2 (en) | 2005-11-16 | 2021-12-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10126664B2 (en) | 2005-11-16 | 2018-11-13 | Asml Netherlands, B.V. | Lithographic apparatus and device manufacturing method |
US9140996B2 (en) | 2005-11-16 | 2015-09-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8421996B2 (en) | 2005-11-16 | 2013-04-16 | Asml Netherlands B.V. | Lithographic apparatus |
US7656501B2 (en) | 2005-11-16 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus |
US7803516B2 (en) | 2005-11-21 | 2010-09-28 | Nikon Corporation | Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus |
US8138486B2 (en) * | 2005-11-23 | 2012-03-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7928407B2 (en) | 2005-11-23 | 2011-04-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7633073B2 (en) | 2005-11-23 | 2009-12-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7773195B2 (en) | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
US10061207B2 (en) | 2005-12-02 | 2018-08-28 | Asml Netherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
WO2007069640A1 (ja) | 2005-12-14 | 2007-06-21 | Jsr Corporation | 新規化合物および重合体、ならびに樹脂組成物 |
US8273837B2 (en) | 2005-12-14 | 2012-09-25 | Jsr Corporation | Compound, polymer, and resin composition |
US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
US8232540B2 (en) | 2005-12-27 | 2012-07-31 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
US8003968B2 (en) | 2005-12-27 | 2011-08-23 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
US7839483B2 (en) | 2005-12-28 | 2010-11-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a control system |
US8411271B2 (en) | 2005-12-28 | 2013-04-02 | Nikon Corporation | Pattern forming method, pattern forming apparatus, and device manufacturing method |
US8564760B2 (en) | 2005-12-28 | 2013-10-22 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a control system |
US10761433B2 (en) | 2005-12-30 | 2020-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8947631B2 (en) | 2005-12-30 | 2015-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8941810B2 (en) | 2005-12-30 | 2015-01-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9436096B2 (en) | 2005-12-30 | 2016-09-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11669021B2 (en) | 2005-12-30 | 2023-06-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8743339B2 (en) | 2005-12-30 | 2014-06-03 | Asml Netherlands | Lithographic apparatus and device manufacturing method |
US9851644B2 (en) | 2005-12-30 | 2017-12-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7649611B2 (en) | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10222711B2 (en) | 2005-12-30 | 2019-03-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US11275316B2 (en) | 2005-12-30 | 2022-03-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10133195B2 (en) | 2006-01-19 | 2018-11-20 | Nikon Corporation | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
US10185228B2 (en) | 2006-01-19 | 2019-01-22 | Nikon Corporation | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
US7839485B2 (en) | 2006-01-19 | 2010-11-23 | Nikon Corporation | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
US10203613B2 (en) | 2006-01-19 | 2019-02-12 | Nikon Corporation | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
US10185227B2 (en) | 2006-01-19 | 2019-01-22 | Nikon Corporation | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method |
US8134681B2 (en) | 2006-02-17 | 2012-03-13 | Nikon Corporation | Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium |
US10409173B2 (en) | 2006-02-21 | 2019-09-10 | Nikon Corporation | Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method |
US9989859B2 (en) | 2006-02-21 | 2018-06-05 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
US10012913B2 (en) | 2006-02-21 | 2018-07-03 | Nikon Corporation | Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method |
US10345121B2 (en) | 2006-02-21 | 2019-07-09 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
US10234773B2 (en) | 2006-02-21 | 2019-03-19 | Nikon Corporation | Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method |
US10139738B2 (en) | 2006-02-21 | 2018-11-27 | Nikon Corporation | Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method |
US10088343B2 (en) | 2006-02-21 | 2018-10-02 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
US10088759B2 (en) | 2006-02-21 | 2018-10-02 | Nikon Corporation | Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method |
US9690214B2 (en) | 2006-02-21 | 2017-06-27 | Nikon Corporation | Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method |
US10132658B2 (en) | 2006-02-21 | 2018-11-20 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
US9857697B2 (en) | 2006-02-21 | 2018-01-02 | Nikon Corporation | Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method |
US9329060B2 (en) | 2006-02-21 | 2016-05-03 | Nikon Corporation | Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method |
US8035800B2 (en) | 2006-03-13 | 2011-10-11 | Nikon Corporation | Exposure apparatus, maintenance method, exposure method, and method for producing device |
US9482967B2 (en) | 2006-03-13 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus, control system and device manufacturing method |
US8045134B2 (en) | 2006-03-13 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus, control system and device manufacturing method |
JP2007266375A (ja) * | 2006-03-29 | 2007-10-11 | Topcon Corp | 液浸光学系と、液浸光学系に用いられる液浸液と、その製造方法 |
US10802410B2 (en) | 2006-04-14 | 2020-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a barrier structure to handle liquid |
US9477158B2 (en) | 2006-04-14 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9810996B2 (en) | 2006-05-09 | 2017-11-07 | Carl Zeiss Smt Gmbh | Optical imaging device with thermal attenuation |
US8902401B2 (en) | 2006-05-09 | 2014-12-02 | Carl Zeiss Smt Gmbh | Optical imaging device with thermal attenuation |
US8477283B2 (en) | 2006-05-10 | 2013-07-02 | Nikon Corporation | Exposure apparatus and device manufacturing method |
JP2011071535A (ja) * | 2006-05-22 | 2011-04-07 | Asml Netherlands Bv | リソグラフィ装置およびリソグラフィ装置洗浄方法 |
JP2008047879A (ja) * | 2006-07-18 | 2008-02-28 | Tokyo Electron Ltd | 高屈折率液体循環システム、パターン形成装置およびパターン形成方法 |
JP2008042004A (ja) * | 2006-08-08 | 2008-02-21 | Tokyo Electron Ltd | パターン形成方法およびパターン形成装置 |
US8198014B2 (en) | 2006-08-30 | 2012-06-12 | Fujitsu Limited | Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the same |
KR100933538B1 (ko) * | 2006-08-30 | 2009-12-23 | 후지쯔 가부시끼가이샤 | 레지스트 커버막 형성 재료, 레지스트 패턴의 형성 방법,전자 디바이스 및 그 제조 방법 |
US8570484B2 (en) | 2006-08-30 | 2013-10-29 | Nikon Corporation | Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid |
US10353301B2 (en) | 2006-08-31 | 2019-07-16 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US10162274B2 (en) | 2006-08-31 | 2018-12-25 | Nikon Corporation | Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method |
US9958792B2 (en) | 2006-08-31 | 2018-05-01 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US10101673B2 (en) | 2006-08-31 | 2018-10-16 | Nikon Corporation | Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method |
US10353302B2 (en) | 2006-08-31 | 2019-07-16 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US8947639B2 (en) | 2006-08-31 | 2015-02-03 | Nikon Corporation | Exposure method and apparatus measuring position of movable body based on information on flatness of encoder grating section |
US9983486B2 (en) | 2006-08-31 | 2018-05-29 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US10073359B2 (en) | 2006-08-31 | 2018-09-11 | Nikon Corporation | Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method |
US8937710B2 (en) | 2006-08-31 | 2015-01-20 | Nikon Corporation | Exposure method and apparatus compensating measuring error of encoder due to grating section and displacement of movable body in Z direction |
US10067428B2 (en) | 2006-08-31 | 2018-09-04 | Nikon Corporation | Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method |
US10338482B2 (en) | 2006-08-31 | 2019-07-02 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US9874822B2 (en) | 2006-09-01 | 2018-01-23 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US9625834B2 (en) | 2006-09-01 | 2017-04-18 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US9971253B2 (en) | 2006-09-01 | 2018-05-15 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US9846374B2 (en) | 2006-09-01 | 2017-12-19 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US9377698B2 (en) | 2006-09-01 | 2016-06-28 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US9760021B2 (en) | 2006-09-01 | 2017-09-12 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US10289012B2 (en) | 2006-09-01 | 2019-05-14 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US10289010B2 (en) | 2006-09-01 | 2019-05-14 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
US10197924B2 (en) | 2006-09-01 | 2019-02-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US9740114B2 (en) | 2006-09-01 | 2017-08-22 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method |
US8743341B2 (en) | 2006-09-15 | 2014-06-03 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
US7872730B2 (en) | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
US8507189B2 (en) | 2006-09-27 | 2013-08-13 | Jsr Corporation | Upper layer film forming composition and method of forming photoresist pattern |
US8895229B2 (en) | 2006-10-13 | 2014-11-25 | Jsr Corporation | Composition for formation of upper layer film, and method for formation of photoresist pattern |
WO2008047678A1 (fr) | 2006-10-13 | 2008-04-24 | Jsr Corporation | Composition pour la formation d'un film de couche supérieure et procédé de formation d'un motif en photorésine |
US8749755B2 (en) | 2006-11-17 | 2014-06-10 | Nikon Corporation | Stage apparatus and exposure apparatus |
US7973910B2 (en) | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
US9330912B2 (en) | 2006-11-22 | 2016-05-03 | Asml Netherlands B.V. | Lithographic apparatus, fluid combining unit and device manufacturing method |
US8045135B2 (en) | 2006-11-22 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus with a fluid combining unit and related device manufacturing method |
US8013975B2 (en) | 2006-12-01 | 2011-09-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8040490B2 (en) | 2006-12-01 | 2011-10-18 | Nikon Corporation | Liquid immersion exposure apparatus, exposure method, and method for producing device |
US8721803B2 (en) | 2006-12-05 | 2014-05-13 | Nikon Corporation | Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method |
US8634053B2 (en) | 2006-12-07 | 2014-01-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10268127B2 (en) | 2006-12-07 | 2019-04-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9645506B2 (en) | 2006-12-07 | 2017-05-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10649349B2 (en) | 2006-12-07 | 2020-05-12 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
US10185231B2 (en) | 2006-12-07 | 2019-01-22 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
US7791709B2 (en) | 2006-12-08 | 2010-09-07 | Asml Netherlands B.V. | Substrate support and lithographic process |
US9013672B2 (en) | 2007-05-04 | 2015-04-21 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
US8947629B2 (en) | 2007-05-04 | 2015-02-03 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
US8189168B2 (en) | 2007-05-28 | 2012-05-29 | Nikon Corporation | Exposure apparatus, device production method, cleaning apparatus, cleaning method, and exposure method |
US8164736B2 (en) | 2007-05-29 | 2012-04-24 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US10101666B2 (en) | 2007-10-12 | 2018-10-16 | Nikon Corporation | Illumination optical apparatus, exposure apparatus, and device manufacturing method |
US9857599B2 (en) | 2007-10-24 | 2018-01-02 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
US9341954B2 (en) | 2007-10-24 | 2016-05-17 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
US9678332B2 (en) | 2007-11-06 | 2017-06-13 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
US12072635B2 (en) | 2008-05-28 | 2024-08-27 | Asml Netherlands B.V. | Lithographic apparatus and a method of operating the apparatus |
US11187991B2 (en) | 2008-05-28 | 2021-11-30 | Asml Netherlands B.V. | Lithographic apparatus and a method of operating the apparatus |
US8891053B2 (en) | 2008-09-10 | 2014-11-18 | Asml Netherlands B.V. | Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method |
JP2010153933A (ja) * | 2010-04-05 | 2010-07-08 | Nikon Corp | 露光装置及びデバイス製造方法 |
US9846372B2 (en) | 2010-04-22 | 2017-12-19 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
US10620544B2 (en) | 2010-04-22 | 2020-04-14 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
US9256136B2 (en) | 2010-04-22 | 2016-02-09 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply |
US10209624B2 (en) | 2010-04-22 | 2019-02-19 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
US9261789B2 (en) | 2010-05-18 | 2016-02-16 | Jsr Corporation | Liquid immersion lithography upper-layer film-forming composition and photoresist pattern-forming method |
US8580480B2 (en) | 2010-07-27 | 2013-11-12 | Jsr Corporation | Radiation-sensitive resin composition, method for forming resist pattern, polymer and compound |
JP2014056255A (ja) * | 2013-10-28 | 2014-03-27 | Nikon Corp | 投影光学系、露光装置及び露光方法 |
JP2015132843A (ja) * | 2015-03-02 | 2015-07-23 | 株式会社ニコン | 投影光学系、露光装置、露光方法、およびデバイス製造方法 |
JP2016136273A (ja) * | 2016-03-07 | 2016-07-28 | 株式会社ニコン | 投影光学系、露光装置、露光方法、およびデバイス製造方法 |
JP2018010303A (ja) * | 2017-08-03 | 2018-01-18 | 株式会社ニコン | 露光装置およびデバイス製造方法 |
JP2019091057A (ja) * | 2019-01-15 | 2019-06-13 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
JP2019082711A (ja) * | 2019-01-15 | 2019-05-30 | 株式会社ニコン | 投影光学系、露光装置、露光方法、及びデバイス製造方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH11176727A (ja) | 投影露光装置 | |
JP4513299B2 (ja) | 露光装置、露光方法、及びデバイス製造方法 | |
JP3634068B2 (ja) | 露光方法及び装置 | |
KR20010020502A (ko) | 투영 노광 장치, 그 장치의 제조 방법, 그 장치를 이용한노광방법 및 그 장치를 사용한 회로 장치의 제조 방법 | |
JP2004301825A (ja) | 面位置検出装置、露光方法、及びデバイス製造方法 | |
US7751028B2 (en) | Exposure apparatus and method | |
JP2009105414A (ja) | 露光方法、及びデバイス製造方法 | |
KR20050122269A (ko) | 액침 리소그래피를 이용하기 위한 오토포커스 소자의광학적 배열 | |
JP2010225940A (ja) | 位置検出装置、露光装置及びデバイス製造方法 | |
US7460210B2 (en) | Auto focus system, auto focus method, and exposure apparatus using the same | |
JPWO2002052620A1 (ja) | 波面収差測定装置、波面収差測定方法、露光装置及びマイクロデバイスの製造方法 | |
JP2006278820A (ja) | 露光方法及び装置 | |
US7382469B2 (en) | Exposure apparatus for manufacturing semiconductor device, method of exposing a layer of photoresist, and method of detecting vibrations and measuring relative position of substrate during an exposure process | |
JP4995250B2 (ja) | 超音波距離センサ | |
JP2005116570A (ja) | 露光装置及びデバイス製造方法 | |
JP2005175177A (ja) | 光学装置及び露光装置 | |
WO1999005710A1 (fr) | Aligneur de projection, procede d'exposition a une projection, procede de nettoyage optique et procede de fabrication de dispositifs a semi-conducteurs | |
KR20090034736A (ko) | 노광장치, 노광 방법 및 디바이스 제조방법 | |
KR100549780B1 (ko) | 정렬 툴, 리소그래피장치, 정렬방법, 디바이스제조방법 및그 제조된 디바이스 | |
JP2008085266A (ja) | 露光方法及び装置、並びにデバイス製造方法 | |
JPH10177950A (ja) | ステージ装置及び投影光学装置 | |
JP2005311198A (ja) | 露光装置、合焦位置検出装置及びそれらの方法、並びにデバイス製造方法 | |
JP2007048857A (ja) | 液浸露光装置および液浸露光方法 | |
US20070103663A1 (en) | Method of determining a focus position for a substrate exposure process and substrate exposure apparatus capable of performing the same | |
JPH10261567A (ja) | 投影露光装置及び投影光学系の光学特性測定方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050301 |