JPH11121274A - Manufacture of laminated ceramic capacitor array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve extremely low rate of the occurrence of defective solder flow and the satisfactory productivity by vertically laminating the laminating capacitors for constituting a laminated ceramic capacitor array, so that the outer electrode part forms the protruding pattern and to sandwich a stripe- shaped ceramic green sheet. SOLUTION: Ceramic green sheets and the layers of inner electrodes 2 are laminated alternately by a specified number, pressurized and pushed, and a laminate 4a is manufactured. Then, on the laminate 4a, a stripe-shaped ceramic green sheet 5 is laminated one by one at the part other than the upper parts of both ends, where the inner electrodes 2 of the green chip are exposed after cutting. A laminate 4b formed similarly is pressurized and pushed on the laminated body. Then, these processes are repeated, the laminates 4c and 4d are manufactured and a laminate 4 is obtained. Thereafter, the laminate is cut and the green chip is manufactured. Then, this is sintered, and an outer electrode is formed at one protruding part of the sintered body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic capacitor array.

[0002]

2. Description of the Related Art A method of manufacturing a conventional multilayer ceramic capacitor array will be described below. FIG. 4 shows a conventional multilayer ceramic capacitor array. In FIG. 4, 1 is a dielectric ceramic, 2 is an internal electrode, 3
Is an external electrode.

First, a ceramic green sheet composed of a dielectric ceramic material powder and an organic binder component and Pd
And two layers of internal electrodes containing metal powder of Ni or the like are alternately laminated in a predetermined number and pressure-bonded to produce a laminate. Next, the multilayer body is cut into a predetermined number of multilayer ceramic capacitors to obtain a green chip of a multilayer ceramic capacitor array. Next, the obtained green chip is fired to obtain a sintered body of the multilayer ceramic capacitor array. next,
External electrodes 3 are respectively formed on individual multilayer ceramic capacitors in the sintered body to obtain a multilayer ceramic capacitor array shown in FIG. As another external electrode forming method, a slit is formed between the multilayer ceramic capacitors in the multilayer ceramic capacitor array sintered body by dicing or the like, and a portion where the external electrodes are formed is made convex. Next, a method of forming an external electrode 3 on the convex portion to obtain a multilayer ceramic capacitor array has been proposed.

[0004]

Since the external electrodes 3 of the multilayer ceramic capacitor array shown in FIG. 4 are formed on the same plane, there is a problem that a plating flow at the time of forming the external electrodes and a solder flow at the time of mounting occur. was there. Also, in order to solve this problem, slits were formed by dicing or the like between the multilayer ceramic capacitors in the multilayer ceramic capacitor array sintered body, but for each multilayer ceramic capacitor array, a plurality of parts must be machined. Instead, productivity was extremely low.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a multilayer ceramic capacitor array having a very low occurrence rate of plating flow and solder flow failure with high productivity.

[0006]

In order to achieve this object, the present invention provides a first step of manufacturing a multilayer body of a multilayer ceramic capacitor by alternately stacking a predetermined number of ceramic green sheets and internal electrode layers; A second step of laminating at least one or more ceramic green sheets on a portion of the laminate after the first step other than a portion where the internal electrode is exposed after cutting into a green chip; and On the obtained laminate, a third step of alternately stacking a predetermined number of ceramic green sheets and internal electrode layers to produce a laminate of a multilayer ceramic capacitor, and cutting the laminate after the third step A fourth step of obtaining a green chip, a fifth step of sintering the green chip after the fourth step to obtain a sintered body, and externally attaching a convex portion of the sintered body after the fifth step. Electrodes With the method of production of a multilayer ceramic capacitor array comprising a sixth step of forming, it is to achieve the intended purpose.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, the individual multilayer ceramic capacitors constituting the multilayer ceramic capacitor array are vertically stacked, and the portions forming the external electrodes are made convex. By laminating the striped ceramic green sheets between the multilayer ceramic capacitors so that the multilayer ceramic capacitors can be electrically isolated from each other, it is possible to provide a multilayer ceramic capacitor array that is electrically independent with good productivity and at low cost. Things.

According to a second aspect of the present invention, when the individual multilayer ceramic capacitors constituting the multilayer ceramic capacitor array are sequentially stacked in the vertical direction, the multilayer ceramic capacitors are decomposed by heating on a previously manufactured multilayer body. By forming the disappearing organic substances and ceramic green sheets alternately in a stripe shape and flattening the surface of the laminate,
Further, when a ceramic green sheet and an internal electrode layer are laminated thereon, it is for facilitating pressure bonding.

According to a third aspect of the present invention, there is provided a ceramic material, internal electrode overlapping area, number of internal electrode layers, and a distance between internal electrodes of individual multilayer ceramic capacitors constituting a multilayer ceramic capacitor array vertically stacked. By changing at least one of the distances, a multilayer ceramic capacitor array having various electric characteristics can be easily provided.

(First Embodiment) A method for manufacturing a multilayer ceramic capacitor array according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a quadruple multilayer ceramic capacitor array obtained by the manufacturing method of the present invention. FIG. 2 shows a laminated body of a quadruple multilayer ceramic capacitor array obtained by the manufacturing method of the present invention. In FIG. 1, 1 is a dielectric ceramic,
2 is an internal electrode and 3 is an external electrode. In FIG. 2, reference numeral 4 denotes a multilayer body of the multilayer ceramic capacitor array, 4a,
Reference numerals 4b, 4c and 4d denote multilayer bodies of the multilayer ceramic capacitors constituting the multilayer ceramic capacitor array.
Reference numeral 5 denotes a stripe-shaped ceramic green sheet.

First, a predetermined number of ceramic green sheets composed of a barium titanate-based dielectric ceramic material and an organic binder component, and a dry coating film of a Pd paste serving as two internal electrodes formed by screen printing are alternately laminated and added. The laminate 4a was produced by compression bonding (first step). Next, a stripe-shaped ceramic green sheet 5 having a width of 1.4 mm and a thickness of 0.3 mm is arranged on the laminated body 4 a so as to be arranged at portions except on both end surfaces where the internal electrodes 2 of the green chip are exposed after cutting. One sheet was laminated (second step).
Next, on the laminate, a laminate 4 produced in the same manner as above.
b was pressed under pressure (third step). Next, the second and third steps were repeated for two cycles to produce laminates 4c and 4d to obtain a laminate 4 of a 4.0 mm-high four-layer ceramic capacitor array. Next, this was cut into 2.0 mm, 1.0 mm, and 4.0 mm in length, width, and height, respectively, to produce a green chip of a quadruple multilayer ceramic capacitor array having a convex external electrode formation portion (fourth). Process). Next, the green chip was fired at 1300 ° C. in the air to obtain a sintered body (fifth step). Next, an external electrode paste containing Ag as a main component was applied all at once to one of the convex portions of the sintered body, and then dried. Similarly, the external electrode paste was applied to the other side, dried and baked in the atmosphere to form the external electrode 3 (sixth step) to obtain the four-layer ceramic capacitor array of FIG.

In this embodiment, the multilayer ceramic capacitor constituting the multilayer ceramic capacitor array has two types of B and F characteristics for the temperature characteristics of the ceramic material and 0.20 and 0.3 for the overlapping area of the internal electrodes.
4 types of 0, 0.40 and 0.50 mm ² , internal electrode 2
The number of effective layers sandwiched between the layers is four types of 1, 4, 8 and 12 layers, and the distance between the internal electrodes 2 is 7, 13, 2
A quadruple multilayer ceramic capacitor array was produced by combining each of the particles with 0 and 25 μm. The results of comparing the plating flow and the solder flow defect occurrence rate of the quadruple multilayer ceramic capacitor array obtained in this embodiment with the conventional product of FIG. 4 in which the external electrodes 3 are formed on the same plane (Table 1).
Shown in

[0013]

[Table 1]

As is evident from the results shown in Table 1, the multilayer ceramic capacitor array obtained by the manufacturing method of the present embodiment has reduced plating flow and solder flow failure as compared with the conventional product.

In the present embodiment, the laminates 4b to 4d that have already been produced are pressed and pressed on the ceramic green sheets 5 in the form of stripes. However, the laminates are formed by alternately laminating the ceramic green sheets and the two internal electrodes. 4b to 4d may be manufactured.

(Second Embodiment) A method for manufacturing a multilayer ceramic capacitor array according to a second embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a quadruple multilayer ceramic capacitor array obtained by the manufacturing method of the present embodiment. FIG. 3 shows a laminated body of a quadruple multilayer ceramic capacitor array obtained by the manufacturing method of the present embodiment. In FIG. 3, reference numeral 4 denotes a multilayer body of the multilayer ceramic capacitor array, 4a, 4b, 4c and 4
"d" is a multilayer body of the multilayer ceramic capacitor constituting the multilayer ceramic capacitor array. Reference numeral 5 denotes a striped ceramic green sheet, and reference numeral 6 denotes a striped organic binder.

First, a predetermined number of ceramic green sheets composed of a barium titanate-based dielectric ceramic material and an organic binder component, and a dry coating film of a Pd paste serving as two internal electrodes formed by screen printing are alternately laminated and added. The laminate 4a was produced by compression bonding (first step). Next, a stripe-shaped ceramic green sheet 5 having a width of 1.4 mm and a thickness of 0.3 mm is arranged on the laminated body 4 a so as to be arranged at portions except on both end surfaces where the internal electrodes 2 of the green chip are exposed after cutting. One sheet was laminated. Next, the laminate 4
A stripe-shaped polyvinyl butyral-based organic binder 6 was formed on the portion of the substrate a where the ceramic green sheet 5 was not formed to flatten the surface of the laminate (second step). Next, a predetermined number of layers of a ceramic green sheet composed of a barium titanate-based dielectric ceramic material and an organic binder component and a dry coating film of a Pd paste serving as two internal electrodes formed by a screen printing method are alternately laminated and pressure-bonded. Thus, a laminate 4b was produced (third step). Next, the second and third steps were repeated for two cycles to produce laminates 4c and 4d, thereby producing a laminate 4 of a 4-layer ceramic capacitor array having a height of 4.0 mm. Next, this is shown in FIG.
Cut by the dashed line, length, width and height are each 2.0m
Green chips of a quadruple multilayer ceramic capacitor array of m, 1.0 mm and 4.0 mm were produced (fourth step). Next, this green chip is placed in air at 1300 ° C.
The organic binder 6 was decomposed and disappeared to obtain a sintered body of a multilayer ceramic capacitor array having a convex external electrode forming portion (fifth step). Next, an external electrode paste containing Ag as a main component was applied all at once to one of the convex portions of the sintered body, and then dried. Similarly, the external electrode paste is applied to the other side, dried and baked in the air to form the external electrode 3.
(Sixth step) to obtain a quadruple multilayer ceramic capacitor array.

In this embodiment, the multilayer ceramic capacitor constituting the multilayer ceramic capacitor array has two types of B and F characteristics for the temperature characteristics of the ceramic material, and the overlapping area of the internal electrodes 2 is 0.20, 0.
Four types of 30, 0.40 and 0.50 mm ² , and the number of effective layers sandwiched between two internal electrodes is 1, 4, 8 and 12
Regarding the four types of layers and the distance between the internal electrodes 2, 7, 13,
By combining them at 20 and 25 μm, a four-layer laminated ceramic capacitor array was produced. Table 2 shows the results of comparing the plating flow and the solder flow defect occurrence rate of the quadruple multilayer ceramic capacitor array obtained in the present embodiment with those of the conventional product having the external electrodes 3 formed on the same plane.

[0019]

[Table 2]

As is evident from the results shown in Table 2, the multilayer ceramic capacitor array obtained by the manufacturing method of the present invention has reduced plating flow and solder flow defects as compared with the conventional product.

In this embodiment, the laminated body is formed by alternately laminating the ceramic green sheets and the two internal electrodes on the stripe-shaped ceramic green sheets and the organic binder. May be sequentially pressed and pressed.

In the first and second embodiments, the case where four laminated ceramic capacitors are connected is described.
It is effective for other numbers of connections. In addition, although the method of manufacturing the multilayer ceramic capacitor array has been described, the present invention is also effective in manufacturing another multilayer ceramic electronic component array.

[0023]

As described above, according to the method for manufacturing a multilayer ceramic capacitor array of the present invention, a multilayer ceramic capacitor constituting a multilayer ceramic capacitor array is formed by forming stripe-shaped ceramic green sheets so that the external electrode portions have a convex shape. By sandwiching and vertically laminating,
It is possible to produce a multilayer ceramic capacitor array with extremely low generation of plating flow and solder flow and various electric characteristics with high productivity.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of a multilayer ceramic capacitor array of the present invention.

FIG. 2 is a perspective view of the multilayer ceramic capacitor array according to the first embodiment of the present invention.

FIG. 3 is a perspective view of a multilayer ceramic capacitor array according to a second embodiment of the present invention.

FIG. 4 is a partially cutaway perspective view of a conventional multilayer ceramic capacitor array.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 dielectric ceramic 2 internal electrode 3 external electrode 4 multilayer ceramic capacitor array multilayer 4a multilayer ceramic capacitor multilayer constituting multilayer ceramic capacitor array 4b multilayer ceramic capacitor multilayer configuring multilayer ceramic capacitor array 4c multilayer ceramic capacitor Stack of multilayer ceramic capacitors constituting array 4d Stack of multilayer ceramic capacitors constituting multilayer ceramic capacitor array 5 Striped ceramic green sheet 6 Striped organic binder

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Kazumasa Konishi 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] A first step of forming a multilayer body of a multilayer ceramic capacitor by alternately stacking a predetermined number of ceramic green sheets and internal electrode layers, and a step of forming a multilayer chip on the green chip on the multilayer body after the first step. A second step of laminating at least one or more ceramic green sheets on a portion other than a portion where the internal electrodes are exposed after the cutting, and a laminate of the laminated ceramic capacitor in which a predetermined number of the ceramic green sheets and the internal electrode layers are alternately laminated. And a third step of pressing and pressing the ceramic green sheet on the ceramic green sheet of the second step, and a portion where the external electrode is formed by cutting the laminate after the third step into a predetermined shape. A fourth step of obtaining a green chip having a convex shape, a fifth step of firing the green chip after the fourth step to obtain a sintered body, and a step of sintering the sintered body after the fifth step. A method for manufacturing a multilayer ceramic capacitor array, comprising a sixth step of forming an external electrode on a convex portion. 2. A first step in which a predetermined number of ceramic green sheets and internal electrode layers are alternately stacked to form a laminated body of a multilayer ceramic capacitor; and a step of cutting the laminated body obtained in the first step after cutting. A second step of forming an organic substance which decomposes and disappears by heating on both end surfaces where the internal electrodes of the green chip are exposed, and a ceramic green sheet in a portion other than the second step, and the laminate obtained in the second step A third step of alternately stacking a predetermined number of ceramic green sheets and internal electrode layers to form a multilayer ceramic capacitor laminate, and cutting the laminate after the third step into a predetermined shape to form a green body; A fourth step of obtaining a chip; a fifth step of firing the green chip after the fourth step to obtain a sintered body in which a portion where an external electrode is to be formed is convex; A method for manufacturing a multilayer ceramic capacitor array, comprising: a sixth step of forming an external electrode on a convex portion of a sintered body after the step. 3. At least one of the multilayer ceramic capacitors constituting the multilayer ceramic capacitor array has different electrical characteristics due to a difference in at least one of a ceramic material, an internal electrode overlapping area, an internal electrode layer number, and an internal electrode distance. A method for manufacturing a multilayer ceramic capacitor array according to claim 2.