JPH1098275A - Circuit board module and electronic equipment having circuit board module enclosed therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a number of electronic components at a high density on a component side by providing a protective cover entirely covering the plurality of electronic components on the electronic component side of a circuit board. SOLUTION: In a board body 12 of a memory board 11 on which a plurality of tape carrier package TCP components 13 are mounted, a protective cover 24 for entirely covering the plurality of TCP components 13 is provided on the component side for the TCP components 13. Since the protective cover 24 entirely covers the plurality of TCP components 13 on the board body 12, a protective cover fixing area which was provided conventionally around the mounting portion for the TCP components 13 on the board body 12 become unnecessary. Therefore, since the area of dead space on the component side for the TCP components 13 on the board body 12 can be reduced, it is advantageous to mount a number of electronic components on the component side for the TCP components 13 in high density manner. Also, a plurality of reinforcing ribs 25, integrally formed on the protective cover 24, increase the mechanical strength of the protective cover 24 itself and prevent increases in height and weight of the entire body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board module incorporated in an electronic device such as a personal computer and an electronic device incorporating the circuit board module.

[0002]

2. Description of the Related Art In general, various kinds of circuit boards are built in electronic equipment such as a personal computer. Then, as shown in FIGS. 8 and 9, a TCP (T) such as an MPU or an ASIC is mounted on the printed circuit board 1 as this circuit board module.
A configuration in which electronic components such as ape Carrer Package 2 are mounted has been developed.

The TCP component 2 has a flexible resin film 3 and a semiconductor chip 4 supported by the resin film 3.
Are provided. Here, a large number of conductive leads 5 are formed on the resin film 3. These leads 5
Are drawn out from the outer peripheral edge of the resin film 3 and are soldered to the connection pads 6 on the circuit board 1.

In this type of TCP component 2, the semiconductor chip 4 is not molded with resin, and the semiconductor chip 4 is exposed to the outside. Therefore, T
Since the mechanical strength of the CP component 2 is lower than that of a PGA (pin grid array) component, conventionally, as shown in FIGS. 8 and 9, a cap-shaped protective cover 7 is provided on the mounting portion of the TCP component 2 on the circuit board 1. Is attached to protect the single TCP component 2 from external stress.

The conventional protective cover 7 is individually fixed to the circuit board 1 with an adhesive or a screw with respect to the TCP component 2 mounted on the circuit board 1. Here, the fixing portion 8 of the outer frame of the protective cover 7 is fixed to the circuit board 1 so as to surround the connection between the lead 5 of the TCP component 2 and the connection pad 6 from outside. Therefore, this protective cover 7
Is designed to integrally cover not only the TCP component 2 but also a connecting portion between the TCP component 2 and the circuit board 1.

[0006]

However, in the above-mentioned prior art, since the protective cover 7 is individually provided for each TCP component 2 mounted on the circuit board 1, the mounting of the TCP component 2 on the circuit board 1 is performed. It is necessary to provide a dedicated area 9 for mounting and fixing the protective cover 7 around the mounting part of the TCP component 2 as shown by a dashed line in FIG. Therefore, in particular, a plurality of TCs
When the P component 2 is mounted, a dead space irrelevant to the mounting of the electronic component on the mounting surface of the TCP component 2 and the wiring between the electronic components increases, so that the design constraint of the circuit board 1 increases, There is a problem in mounting a large number of electronic components on the mounting surface of the TCP component 2 at high density.

The present invention has been made in view of the above circumstances, and has as its object to reduce the dead space on a circuit board on which a plurality of electronic components are mounted, and to provide a large number of electronic component mounting surfaces. It is an object of the present invention to provide a circuit board module that is advantageous in mounting electronic components at a high density, and an electronic device incorporating the circuit board module.

[0008]

According to a first aspect of the present invention, there is provided a circuit board module having a plurality of electronic components mounted on a circuit board, wherein the plurality of electronic components are provided on a side of the circuit board on which the electronic components are mounted. A circuit board module comprising a protective cover for covering the whole. With the above configuration, the entirety of the plurality of electronic components is covered with the protective cover on the mounting surface side of the electronic component on the circuit board, so that the protection cover for fixing the protective cover conventionally provided around the mounting portion of the electronic component on the circuit board is provided. The area is not required, and the area of the dead space on the mounting surface of the electronic component is reduced.

According to a second aspect of the present invention, the protective cover is disposed between each of the mounted components mounted on the circuit board, and a plurality of reinforcing ribs that are in contact only with the circuit board are integrally formed. The circuit board module according to claim 1, wherein: With the above configuration, the mechanical strength of the protective cover itself is increased by a plurality of reinforcing ribs integrally formed on the protective cover, and each reinforcing rib disposed between each mounted component mounted on the circuit board is connected to the circuit board. By making contact, the protective cover is less likely to be crushed to the circuit board side, further increasing the mechanical strength of the protective cover.Furthermore, by arranging a plurality of ribs in places other than the mounting parts mounting area, external stress is directly , Is prevented from reaching the mounted components. Further, by forming a plurality of reinforcing ribs integrally with the protective cover, the cost of parts can be reduced.

According to a third aspect of the present invention, the protective cover is provided with a reinforcing rib for contacting a resin molded part having mechanical strength against external stress among the mounted parts mounted on the circuit board. 2. The method according to claim 1, wherein
Or a circuit board module according to item 2. With the above configuration, the reinforcing rib of the protective cover is brought into contact with a resin molded component having mechanical strength against external stress, so that the protective cover can be used even when the mounted components are densely arranged on the circuit board. The reinforcing rib can be provided.

According to a fourth aspect of the present invention, the protective cover is formed by selectively performing an insulating process on a surface of a metal plate, a frame ground for grounding is formed on a conductive portion, and the circuit ground is formed on the frame ground. The circuit board module according to any one of claims 1 to 3, wherein a connection portion connected to a frame ground on an electronic device side into which the body of the board module is incorporated is formed. With the above configuration, by connecting the frame ground of the protective cover to the frame ground of the electronic device in which the main body of the circuit board module is incorporated, the internal potential difference between the protective cover and the electronic device is eliminated, and the circuit board module due to static electricity is removed. In addition to preventing the destruction of the device, it also functions as a shield so that electromagnetic waves do not leak outside. Also,
By insulating the portions other than the ground connection portion, a short circuit between the power supply and the ground is prevented.

According to a fifth aspect of the present invention, the circuit board has pads for fixing the protective cover formed on the mounting surface side of the electronic component, and the protective cover is fixed to the fixing pads of the circuit board in a conductive state. The circuit board module according to any one of claims 1 to 4, wherein the circuit board module includes a fixing unit. According to the above configuration, conduction between the fixing pad of the circuit board and the fixing means of the protective cover prevents the circuit board module from being damaged by static electricity and malfunctioning due to electromagnetic waves received from the outside. Further, the electromagnetic wave generated from the circuit board module has a shielding function so as not to leak outside.

According to a sixth aspect of the present invention, the circuit board has a plurality of notches formed on at least two right and left sides of an outer peripheral portion of the board, and the protective cover has a plurality of fixing claws engaged with the notches of the circuit board. The circuit board module according to any one of claims 1 to 5, further comprising: With the above configuration, the protective cover is firmly fixed by engaging the plurality of fixing claws of the protective cover with the plurality of cutouts of the circuit board, thereby preventing the protective cover from shifting due to external stress. .

According to a seventh aspect of the present invention, there is provided the circuit board module according to the sixth aspect, wherein the fixing claws of the protective cover are arranged at right and left non-target positions. With the above configuration, by disposing the fixing claws of the protective cover at the left and right non-target positions, reverse mounting of the protective cover to the circuit board is prevented, and damage to the electronic components is prevented.

According to an eighth aspect of the present invention, the protective cover has a relief opening formed at a position corresponding to a mounted component other than the electronic component mounted on the circuit board. A circuit board module according to claim 1.

According to the above configuration, a mounted component other than the electronic component mounted on the circuit board, which is taller than the electronic component and does not need to be protected by the protective cover, can be mounted through the opening of the protective cover. The escape prevents the protective cover of the electronic component from having a complicated shape.

According to a ninth aspect of the present invention, there is provided an electronic apparatus having a circuit board module storage portion for housing a circuit board module having a plurality of electronic components mounted on the circuit board, wherein the mounting surface of the electronic component on the circuit board is provided. An electronic device incorporating a circuit board module, wherein a protective cover for covering the entirety of the plurality of electronic components is provided on a side.
With the above configuration, the entirety of the plurality of electronic components is covered with the protective cover on the mounting surface side of the electronic component on the circuit board, so that the protection cover for fixing the protective cover conventionally provided around the mounting portion of the electronic component on the circuit board is provided. The area is not required, and the area of the dead space on the mounting surface of the electronic component is reduced.

According to a tenth aspect of the present invention, the protective cover is disposed between each of the mounted components mounted on the circuit board, and a plurality of reinforcing ribs that are in contact only with the circuit board are integrally formed. An electronic device incorporating the circuit board module according to claim 9. With the above configuration, the mechanical strength of the protective cover itself is increased by a plurality of reinforcing ribs integrally formed on the protective cover, and each reinforcing rib disposed between each mounted component mounted on the circuit board is connected to the circuit board. By making contact, the protective cover is less likely to be crushed to the circuit board side, further increasing the mechanical strength of the protective cover.Furthermore, by arranging a plurality of ribs in places other than the mounting parts mounting area, external stress is directly , Is prevented from reaching the mounted components. Further, by forming a plurality of reinforcing ribs integrally with the protective cover, the cost of parts can be reduced.

According to an eleventh aspect of the present invention, the protective cover is provided with a reinforcing rib for abutting a resin molded part having mechanical strength against external stress among the mounted parts mounted on the circuit board. An electronic device incorporating the circuit board module according to claim 9. With the above configuration, the reinforcing rib of the protective cover is brought into contact with a resin molded component having mechanical strength against external stress, so that the protective cover can be used even when the mounted components are densely arranged on the circuit board. The reinforcing rib can be provided.

According to a twelfth aspect of the present invention, the protective cover is formed by selectively performing an insulating treatment on a surface of a metal plate, a grounding frame ground is formed in a conductive portion, and the circuit ground is formed on the frame ground. An electronic device having a built-in circuit board module according to any one of claims 9 to 11, wherein a connection portion connected to a frame ground of the electronic device on which the body of the substrate module is incorporated is formed. It is. With the above configuration, by connecting the frame ground of the protective cover to the frame ground of the electronic device in which the main body of the circuit board module is incorporated, the internal potential difference between the protective cover and the electronic device is eliminated, and the circuit board module due to static electricity is removed. In addition to preventing the destruction of the device, it also functions as a shield so that electromagnetic waves do not leak outside. In addition, by insulating the portion other than the ground connection portion, a short circuit between the power supply and the ground is prevented.

According to a thirteenth aspect of the present invention, the circuit board has pads for fixing the protective cover formed on the mounting surface side of the electronic component, and the protective cover is fixed to the fixing pads of the circuit board in a conductive state. An electronic device having a circuit board module according to any one of claims 9 to 12, wherein the electronic device has a fixing means. According to the above configuration, conduction between the fixing pad of the circuit board and the fixing means of the protective cover prevents the circuit board module from being damaged by static electricity and malfunctioning due to electromagnetic waves received from the outside. Further, the electromagnetic wave generated from the circuit board module has a shielding function so as not to leak outside.

According to a fourteenth aspect of the present invention, the circuit board has a plurality of cutouts formed on at least two right and left sides of an outer peripheral portion of the board, and the protective cover has a plurality of fixed claws engaged with the cutouts of the circuit board. An electronic device incorporating the circuit board module according to any one of claims 9 to 13, characterized by comprising: With the above configuration, the protective cover is firmly fixed by engaging the plurality of fixing claws of the protective cover with the plurality of cutouts of the circuit board, thereby preventing the protective cover from shifting due to external stress. .

According to a fifteenth aspect of the present invention, there is provided the electronic device with the built-in circuit board module according to the fourteenth aspect, wherein the fixing claws of the protective cover are arranged at right and left non-symmetric positions. With the above configuration, by disposing the fixing claws of the protective cover at the left and right non-target positions, reverse mounting of the protective cover to the circuit board is prevented, and damage to the electronic components is prevented.

According to a sixteenth aspect of the present invention, the protective cover has a release opening formed at a position corresponding to a mounted component other than the electronic component mounted on the circuit board. An electronic device incorporating the circuit board module according to any one of claims 9 to 13. With the above configuration, a mounted component other than the electronic component mounted on the circuit board, which is taller than the electronic component and does not need to be protected by the protective cover, is allowed to escape from the opening of the protective cover by releasing the mounted component. This is to prevent the protective cover for the electronic component from having a complicated shape.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows an expansion memory board 11 which is a circuit board module mounted in, for example, a book-type portable computer.

On the memory board 11, a plurality of TCP parts 13, a plurality of resin-molded electronic parts 14, a plurality of chip parts 15 such as resistors and capacitors, a connector 16 are implemented.

As shown in FIG. 2, the TCP component 13 is provided with a carrier 17 made of a flexible resin film, for example, a polyimide film, and a semiconductor chip 18 supported by the carrier 17. Further, a large number of leads 19 made of copper foil are formed on the carrier 17.

One end of a lead 19 is bonded to an outer peripheral portion of the semiconductor chip 18. The connection between the semiconductor chip 18 and each lead 19 is covered with a potting resin. Further, the tip of each lead 19 is led out from the edge of the carrier 17. The tips of the leads 17 are soldered to the connection pads 20 of the substrate body 12.

As shown in FIG. 2, a semiconductor chip 18 is mounted on the mounting portion of the TCP
An opening 21 larger than the planar shape of the semiconductor chip 18 is formed. The semiconductor chip 18 is arranged to face the opening 21 of the substrate body 12.

The TCP mounted on the substrate body 12
The electronic component 14 and the chip component 15, which are other mounting components other than the component 13, have a higher height dimension than the TCP component 13. Further, the connector 16 is arranged at a position biased toward one end of the board main body 12.

In the left and right sides of the outer peripheral portion of the substrate body 12, a plurality of, in this embodiment, two
Are formed. Further, screw insertion holes 23 are formed between the notches 22 on both sides.

The TCP component 1 in the board body 12
On the mounting surface side of No. 3, a protective cover 24 that covers the entire plurality of TCP components 13 is provided. This protective cover 24
Is formed by a metal flat plate having substantially the same size as the substrate body 12 of the memory substrate 11.

Further, a plurality of reinforcing ribs 25 for increasing the mechanical strength of the protective cover 24 are provided on the plate surface of the protective cover 24.
Are integrally formed. Here, the reinforcing ribs 25 are integrally formed on the plate surface of the protective cover 24 by drawing a flat metal plate into a protruding shape as shown in FIG.

On the left and right sides of the protective cover 24, a plurality of fixing claws 26 of the same number as the cutouts 22 of the substrate body 12 are cut and raised in a substantially L shape. These fixing claws 26 are arranged at positions corresponding to the notches 22 of the substrate body 12.

Then, as shown in FIG.
With the fixed claws 26 inserted into the cutouts 22 of the substrate body 12, the distal ends of the fixed claws 26 are bent at substantially right angles to the back surface side of the substrate body 12 to engage with each other, whereby the protective cover 24 is engaged. Are fixed to the substrate main body 12.

Further, in a state where the protective cover 24 is fixed to the substrate main body 12, the reinforcing ribs 25 of the protective cover 24 are arranged between the respective mounted components mounted on the substrate main body 12. Further, the tip of each reinforcing rib 25 is in contact with the surface of the substrate main body 12, so that the protective cover 24 is hardly crushed toward the substrate main body 12, thereby further increasing the mechanical strength of the protective cover 24.

On the plate surface of the protective cover 24, the electronic component 14, the chip component 15, and the connector 16, which are other mounted components whose height is higher than the TCP component 13 mounted on the substrate body 12, are brought into contact. A plurality of openings 27 to escape
8, 29 are formed respectively.

FIGS. 3 and 4A and 4B show an example of a built-in state in which the extension memory board 11 of this embodiment is built in a book-type portable computer 31. FIG.

FIG. 3 shows the back side of a book-type portable computer 31. As shown in FIG. The computer 31 includes a rectangular box-shaped housing 32 and a flat panel display unit 33 supported by the housing 32.

The housing 32 is provided with a lower housing 34 and an upper housing 35. The lower end of the display unit 33 is rotatably supported by a display support 36 projecting upward from the rear end of the upper housing 35 via a hinge mechanism (not shown).

Further, an expansion space 37 for accommodating the expansion memory board 11 is formed inside the housing 32 as shown in FIG. This expansion space 37
Is disposed between the bottom wall 34 a of the lower housing 34 and the first circuit board 38 disposed inside the housing 32.

The bottom wall 34a of the lower housing 34 is provided with a board insertion port 39 for inserting and removing the memory board 11 in the expansion space 37. Furthermore, this bottom wall 3
A substantially flat rectangular plate-shaped bottom cover 40 for closing the substrate insertion opening 39 is detachably attached to 4a.

One end of the bottom cover 40 has a pair of screw insertion holes 41a and 41b, and a pair of locking pieces 42 is provided at an end opposite to the screw insertion holes 41a and 41b.
a, 42b.

A support portion 43 for receiving the peripheral edge of the bottom cover 40 is formed at the opening edge of the board insertion port 39.
The support portion 43 has screw insertion holes 41 a and 4
1b, a pair of screw holes 44a, 44b,
And a conductive piece 45 made of metal in contact with.

Therefore, the bottom cover 40 is provided with the locking pieces 42a, 4
2b hooked on the opening edge of the board insertion port 39,
The periphery is superimposed on the support portion 43 of the board insertion port 39. The bottom cover 40 has a screw insertion hole 41
The screws 46 are inserted into the bottom wall 34a by inserting the screws 46 into the holes 41a and 41b, respectively, and screwing the tips of the screws 46 into the screw holes 44a and 44b of the lower housing 34.

A stacking connector 47 is arranged on the back surface of the first circuit board 38 facing the extension space 37. The stacking connector 47 is fitted to the connector 16 of the memory board 11, and the fitting electrically connects the first circuit board 38 to the memory board 11.

As shown in FIG. 4A, the extension space 3
7 includes a pair of bosses 48 supporting the memory substrate 11.
a and 48b are arranged. These bosses 48a,
Reference numeral 48b is formed integrally with the support portion 43 of the board insertion port 39.

The bosses 48a and 48b are formed with screw holes 49a and 49b for attaching a memory board. Then, the memory board 11 is attached to the bosses 48a and 48b.
In the state where the intermediate portions of the bosses 48a and 48b are overlapped, the memory board 11 is
9b is detachably screwed.

The bosses 48a and 48b are integrally connected via a bridge 51. Further, a conductive piece 52 made of metal is attached to the bridge portion 51 as shown in FIGS. This conductive piece 5
2 is connected to a pair of contact portions 53a and 53b that cover the lower surfaces of the boss portions 48a and 48b.

Further, on the upper surface of the memory substrate 11, FIG.
As shown in (B), the contact portions 5 of the bosses 48a, 48b
A ground wiring layer 54 facing 3a and 53b is formed. Then, the memory board 11 is connected to the bosses 48a, 4a.
8b, the ground wiring layer 54 of the memory substrate 11 is connected to the contact portions 53a, 53 of the bosses 48a, 48b.
b, and the memory substrate 11 is grounded to the housing 32 by this contact.

Therefore, according to the memory board 11 of the present embodiment having the above configuration, the following effects can be obtained. That is, the plurality of TCP components 13 are mounted on the mounting surface side of the TCP
A protective cover 24 for covering the entire component 13 is provided, and the protective cover 24 covers the whole of the plurality of TCP components 13 on the board main body 12. , A separately provided area 9 for fixing the protective cover (see FIG. 8)
Can be eliminated. Therefore, the area of the dead space on the mounting surface of the TCP component 13 in the substrate body 12 can be reduced, which is advantageous in mounting a large number of electronic components on the mounting surface of the TCP component 13 at high density.

The mechanical strength of the protective cover 24 itself can be increased by the plurality of reinforcing ribs 25 formed integrally with the protective cover 24. Therefore, the protective cover 2
4 can be made relatively thin, so that the height dimension and weight of the entire memory substrate 11 can be prevented from becoming extremely large.

Further, the plurality of reinforcing ribs 25 of the protective cover 24 were arranged between the mounted components mounted on the board main body 12, and the tip of each reinforcing rib 25 was brought into contact with the surface of the board main body 12. In addition, the protective cover 24 can be hardly crushed toward the substrate body 12, and the mechanical strength of the protective cover 24 can be further increased.

The plurality of reinforcing ribs 2 of the protective cover 24
By arranging 5 at a place other than the place where each of the mounted components mounted on the board main body 12 is mounted, it is possible to prevent external stress from directly affecting the mounted components on the board main body 12. Further, by forming the plurality of reinforcing ribs 25 integrally with the protective cover 24, the component cost of the protective cover 24 can be reduced.

Further, two notches 22 are formed on both right and left sides of the outer peripheral portion of the substrate body 12 so that the protective cover 24 is formed.
Are fixed to the notches 22 of the board body 12 so that the protection cover 24 is firmly fixed to the board body 12 to prevent the protection cover 24 from shifting due to external stress. Can be prevented.

The board body 1 is attached to the plate surface of the protective cover 24.
A plurality of openings 27, 28, which escape from contact with the electronic component 14, the chip component 15, and the connector 16 which are other mounted components having a height dimension higher than the TCP component 13 mounted on the second component 2.
29 are formed, the TCP component 13 is a mounting component other than the TCP component 13 mounted on the substrate body 12.
A mounted component that is taller and does not need to be protected by the protective cover 24 can escape from the openings 27, 28, and 29 of the protective cover 24. Therefore, TC
The protective cover 24 of the P component 13 does not need to have a complicated shape.

The present invention is not limited to the above embodiment. For example, the fixing claw 26 of the protective cover 24
Are disposed at the left and right non-target positions, so that the substrate body 12
The protective cover 24 can be prevented from being reversely assembled, and the TCP component 13 can be prevented from being damaged. Further, by contacting the reinforcing rib 25 of the protective cover 24 with the ground wiring layer 54 on the upper surface of the memory substrate 11, the protective cover 24 can function as a part of the ground wiring.

FIG. 5 shows a first modification of the protective cover 24 of the memory board 11 of the above embodiment. In this modification, the protective cover 24 is provided with a reinforcing rib 61 whose height is lower than the reinforcing rib 25 of the above-described embodiment. The reinforcing rib 61 is configured to contact the chip part 15 which is a resin molded part having mechanical strength.

Therefore, according to the protective cover 24 of the present modification, the mounted components are arranged at high density on the substrate main body 12 of the memory substrate 11, and from the protective cover 24 toward the substrate main body 12 as in the above embodiment. Even when the reinforcing ribs 25 abutting on the substrate main body 12 cannot be protruded, the mechanical strength of the protective cover 24 can be increased by the reinforcing ribs 61 abutting on the chip component 15.

FIGS. 6A and 6B show a second modification of the protective cover 24 of the memory board 11 of the above embodiment. In this modification, an L-shaped reinforcing rib 71 cut and raised inside the protective cover 24 and bent into a substantially L-shape is provided instead of the protruding reinforcing rib 25 of the above embodiment. Also in this case, the same effect as the protrusion-shaped reinforcing rib 25 of the above embodiment can be obtained.

FIG. 7A shows a third modification of the protective cover 24 of the memory board 11 of the above embodiment. In this modification, the fixing claws 26 projecting from the left and right sides of the protective cover 24 as in the above-described embodiment are attached to the substrate body 1.
2, an L-shaped cut-and-raised portion 81 which is cut and raised inside the protective cover 24 and bent into a substantially L-shape is provided in place of the configuration in which the cut-and-raised portion 81 is engaged with the cutout portion 22 on the outer peripheral portion.
Is fixed to the surface of the substrate main body 12 of the memory substrate 11 by means such as bonding or soldering. Also in this case, it is needless to say that the same effects as those of the above embodiment can be obtained. Further, in the present modification, there is no need to provide the notch 22 on the outer peripheral portion of the substrate
Can be simplified.

Further, a cut-and-raised portion 82 which is cut and raised upward is provided on the upper surface of the protective cover 24 of this modified example. The cut-and-raised portion 82 is configured to function as a terminal for making contact with a frame ground of an electronic device or another unit to which the memory board 11 of the above embodiment is assembled.

With the above configuration, the protective cover 24 and the electronic device are connected to the frame ground of the electronic device to which the memory board 11 of the above-described embodiment is assembled via the cut-and-raised portion 82 of the frame ground of the protective cover 24. In addition to eliminating the internal potential difference between the side and the side, the memory substrate 11 can be prevented from being destroyed by static electricity, and can also perform a shielding function so that electromagnetic waves do not leak to the outside.

As shown in FIG. 7 (B), the surface of the metal plate 83 of the protective cover 24 is selectively subjected to an insulating treatment to form an insulating layer 84, and a frame ground for grounding is formed in the conductive portion. Configuration. In this case, a conductive pad 85 for fixing the protective cover 24 is provided on the mounting surface side of the TCP component 13 on the substrate body 12 of the memory substrate 11.
The pad 85 is connected to the ground wiring layer 54 on the upper surface of the memory substrate 11 and the protective cover 24 is formed.
The raised portion 81 is fixed to the fixing pad 85 on the substrate body 12.
It may be configured to be fixed in a conductive state by a fixing means such as a metal material such as solder or a conductive resin.

The short circuit between the power supply and the ground can be prevented by forming the insulating layer 84 on the surface of the metal plate 83 of the protective cover 24 and insulating the portion other than the ground connection portion.

Further, conduction between the fixing pad 85 of the substrate main body 12 of the memory substrate 11 and the cut-and-raised portion 81 of the protective cover 24 is established by fixing means such as soldering.
Destruction of the memory substrate 11 due to static electricity and malfunction due to electromagnetic waves received from the outside can be prevented. In addition, a shield function can be performed so that electromagnetic waves generated from the memory substrate 11 do not leak to the outside. It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0067]

According to the present invention, a dead space on a circuit board on which a plurality of electronic components such as TCP components are mounted can be reduced, and a large number of electronic components can be densely mounted on the mounting surface of the electronic components. This is advantageous for mounting.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a memory board and a protective cover thereof according to an embodiment of the present invention.

FIG. 2 is an exemplary longitudinal sectional view showing a state where a protective cover is attached to the memory board according to the embodiment;

FIG. 3 is an exemplary exploded perspective view showing a state in which the memory board and the bottom cover of the embodiment are removed from a housing of the computer;

FIG. 4A is a longitudinal sectional view showing a structure of a mounting portion of a memory board and a bottom cover of the embodiment to a computer housing, and FIG. 4B is an enlarged view of a Y part in FIG. 4A; FIG.

FIG. 5 shows a first example of the protective cover of the memory board of the embodiment.
The longitudinal section of the important section showing the modification of.

FIG. 6A is a perspective view of a main part showing a second modification of the protection cover for the memory board of the embodiment, and FIG. 6B is a longitudinal section of a main part of the second modification of the protection cover; FIG.

FIG. 7 is a third view of the protective cover of the memory board of the embodiment.
The perspective view of the principal part which shows the modification of.

FIG. 8 shows a TCP mounted on a conventional circuit board module.
FIG. 3 is a perspective view showing components and a protective cover thereof.

FIG. 9 shows a TCP mounted on a conventional circuit board module.
FIG. 3 is a vertical cross-sectional view showing a mounted state of parts and a protective cover thereof.

[Explanation of symbols]

 Reference Signs List 11 memory board (circuit board module) 12 board body (circuit board) 13 TCP component (electronic component) 14 electronic component (mounting component) 15 chip component (mounting component) 24 protective cover

Claims (16)

[Claims] 1. A circuit board module having a plurality of electronic components mounted on a circuit board, wherein a protective cover for covering the entirety of the plurality of electronic components is provided on a side of the circuit board on which the electronic components are mounted. A circuit board module characterized by the following. 2. The method according to claim 1, wherein the protective cover is disposed between each of the mounted components mounted on the circuit board, and is formed integrally with a plurality of reinforcing ribs that contact only the circuit board. The circuit board module according to claim 1. 3. The protective cover according to claim 1, wherein the protective cover includes a reinforcing rib for abutting a resin molded component having mechanical strength against external stress among the mounted components mounted on the circuit board. The circuit board module according to claim 1 or 2, wherein 4. The protective cover is formed by selectively performing an insulating process on a surface of a metal plate, a frame ground for grounding is formed in a conductive portion, and a main body of the circuit board module is formed on the frame ground. The circuit board module according to any one of claims 1 to 3, wherein a connection portion connected to a frame ground of an electronic device to be incorporated is formed. 5. The circuit board has a pad for fixing the protective cover formed on the mounting surface side of the electronic component, and the protective cover has fixing means fixed to the pad for fixing the circuit board in a conductive state. The circuit board module according to any one of claims 1 to 4, wherein the circuit board module is provided. 6. The circuit board has a plurality of cutouts formed on at least two left and right sides of the outer peripheral portion of the board, and the protective cover has a plurality of fixing claws engaged with the cutouts of the circuit board. 2. The method according to claim 1, wherein
6. The circuit board module according to any one of claims 1 to 5. 7. The circuit board module according to claim 6, wherein the plurality of fixing claws of the protection cover are arranged at left and right non-target positions. 8. The protection cover according to claim 1, wherein an opening for release is formed at a position corresponding to a mounted component other than the electronic component mounted on the circuit board. 6. The circuit board module according to any one of 5. 9. An electronic device having a circuit board module storage section containing a circuit board module having a plurality of electronic components mounted on a circuit board, wherein the plurality of electronic components are mounted on a mounting surface side of the electronic component on the circuit board. An electronic device incorporating a circuit board module, wherein a protective cover for covering the entire electronic component is provided. 10. The protection cover according to claim 1, wherein the protection cover is disposed between each of the mounted components mounted on the circuit board, and a plurality of reinforcing ribs that come into contact only with the circuit board are integrally formed. An electronic device incorporating the circuit board module according to claim 9. 11. The protective cover according to claim 1, further comprising a reinforcing rib for abutting on a resin molded part having mechanical strength against external stress among the mounted parts mounted on the circuit board. An electronic device incorporating the circuit board module according to claim 9. 12. The protective cover is formed by selectively performing an insulating process on a surface of a metal plate, a grounding frame ground is formed in a conductive portion, and a main body of the circuit board module is mounted on the frame ground. 2. A connection part connected to a frame ground of an electronic device to be incorporated is formed.
An electronic device incorporating the circuit board module according to any one of the preceding claims. 13. The circuit board has pads for fixing the protection cover formed on the mounting surface side of the electronic component, and the protection cover includes fixing means fixed to the fixing pads of the circuit board in a conductive state. An electronic device incorporating the circuit board module according to claim 9. 14. The circuit board according to claim 1, wherein a plurality of cutouts are formed in an outer peripheral portion of the board, and the protective cover has a fixing claw that engages with the cutout in the circuit board. 9 or 1
3. An electronic device incorporating the circuit board module according to any one of 3. 15. The method according to claim 14, wherein the engagement portion between the cutout portion of the circuit board and the fixing claw of the protective cover is disposed at a position not symmetrical to the left and right with respect to the circuit board. Electronic equipment incorporating the circuit board module described in the above. 16. The protection cover according to claim 9, wherein an opening for release is formed at a position corresponding to a mounted component other than the electronic component mounted on the circuit board. 13. An electronic device incorporating the circuit board module according to any one of 13.