JPH10339740A - Probe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe device which can make a printed circuit board common in spite of a change in the pattern wiring design of contact probe corresponding to the electrode arrangement or the like of object to be measured. SOLUTION: Pattern wiring 3 of contact probe 16 is composed of wiring 3E for power source, wiring 3G for ground and wiring 3S for signal transmission at least and substrate side pattern wiring 31 of substrate 30 for wiring is composed of wiring 31E for substrate side power source, wiring 31G for substrate side ground and wiring 31S for substrate side signal transmission at least. Then, the wiring 31E for substrate side power source is provided on this substrate 30 for wiring so as to be extended in a direction crossing the pattern wiring 3 of contact probe 16, the wiring 31G for substrate side ground is provided almost parallelly with the wiring 31E for substrate side power source, and the wiring 3S for substrate side signal transmission is provided along with the arranging direction of the pattern wiring 3 of contact probe 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used as a probe pin, a socket pin, or the like, and is incorporated in a probe card, a test socket, or the like, and contacts each terminal of a semiconductor IC chip, a liquid crystal device, or the like to perform an electrical test. The present invention relates to a probe device for performing the above.

[0002]

2. Description of the Related Art In general, a contact pin is used to conduct an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). In recent years, as the integration and miniaturization of IC chips and the like have increased, the pitch of contact pads, which are electrodes, has been reduced, and the pitch of contact pins has been required to be narrower. However, with a tungsten needle contact probe used as a contact pin, it has been difficult to cope with a multi-pin narrow pitch due to the limitation of the diameter of the tungsten needle.

On the other hand, for example, Japanese Patent Publication No. 7-820
Japanese Patent Publication No. 27 proposes a technique in which a plurality of pattern wirings are formed on a resin film, and the tips of these pattern wirings are arranged so as to protrude from the resin film and serve as contact pins. In this technology example, by using the tip of a plurality of pattern wiring as a contact pin,
This aims to reduce the pitch of the pins and to eliminate the need for a large number of complicated components.

As shown in FIG. 16, a conventional contact probe 1 has a Ni
(Nickel) or Ni alloy, and has a structure in which a pattern wiring 3 is attached.
The tip of the pattern wiring 3 protrudes from the end of the pattern wiring 3 to form a contact pin 3a. Reference numeral 4 denotes an alignment hole described later.

[0005] For example, Japanese Patent Application Laid-Open No. 6-324081 proposes a probe device (probe card) using the above-mentioned contact probe (flexible substrate in the publication) having a contact pin at the tip of a pattern wiring. In this probe device, matching is applied to a difference in pin pitch between an IC chip or the like and a tester, and the probe device is suitable for a probe test of an IC chip or the like having a narrow pin pitch.

Next, a configuration of the above-mentioned conventional probe device 11 by incorporating the above-mentioned conventional contact probe 1 into a mechanical part 10 will be described with reference to FIGS.

FIG. 17 shows that the contact probe 1 is
FIG. 18 is a diagram illustrating a C probe cut out into a predetermined shape, and FIG. 18 is a cross-sectional view taken along line CC of FIG. 17. FIG.
As shown in FIG. 7 and FIG. 18, the resin film 2 of the contact probe 1 is provided with a hole 9 for fixing the contact probe 1, and a signal obtained from the pattern wiring 3 is transferred to a printed board 15 (FIG. 19). Window 19 is provided for communication to the user.

The mechanical part 10 includes a mounting base 12, a top clamp 13, and a bottom clamp 14. First, the top clamp 13 is mounted on the printed circuit board 15, and then the mounting base 12 to which the contact probe 1 is mounted is mounted on the top clamp 13 by screwing a bolt 17 into a bolt hole 17a (see FIG. 20). Then, by holding down the contact probe 1 with the bottom clamp 14, the pattern wiring 3 is maintained in a constant inclined state, and the pattern wiring 3 is pressed against the IC chip.

FIG. 20 shows the probe device 11 after the assembly is completed.
Is shown. FIG. 21 is a sectional view taken along line EE of FIG. As shown in FIG. 21, the tip of the pattern wiring 3 is in contact with the IC chip I by the mounting base 12. The mounting base 12 is provided with a positioning pin 18 for adjusting the position of the contact probe 1. By inserting the positioning pin 18 into the positioning hole 4 of the contact probe 1,
The pattern wiring 3 and the IC chip I can be accurately positioned.

A window 19 provided in the contact probe 1
The elastic body 20 of the bottom clamp 14 is pressed against the pattern wiring 3 of the portion of FIG. 4 to bring the pattern wiring 3 of the window 19 into contact with the electrode 21 of the printed circuit board 15, and the signal obtained from the pattern wiring 3 is printed. Through the electrodes 21.

[0011]

However, the above-mentioned conventional contact probe 1 and the probe device 11 using the same have the following problems. FIG.
As shown in FIG. 7, the pattern wiring 3 includes a power supply wiring 3E and a ground wiring 3 in addition to the signal transmission wiring 3S.
There are three types of G. Therefore, the layout of the electrodes 21 of the printed circuit board 15 that makes the pattern wiring 3 of the window portion 19 contact must be designed in accordance with the layout of the three types of pattern wiring 3. That is, the various pattern wirings 3S, 3E, and 3G are formed in parallel on the plane of the resin film 2, and the various pattern wirings 3S, 3E, and 3G exposed at the window 19 are pressed by the bottom clamp 14 and printed. Since the electrodes 21 are in contact with the fifteen electrodes 21, the pad arrangement of the electrodes 21 of the printed circuit board 15 is restricted by the arrangement of the three types of pattern wirings 3S, 3E, and 3G, and there is no degree of freedom. Therefore, when the design of the pattern wiring 3 of the contact probe 1 is changed in accordance with the electrode arrangement of the IC chip I, the pad arrangement of the electrodes 21 of the printed circuit board 15 must be changed at the same time, which increases costs. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and is intended to provide a common printed circuit board regardless of a change in the design of the pattern wiring of a contact probe in accordance with the arrangement of electrodes of an object to be measured. It is an object of the present invention to provide a probe device that can perform the above.

[0013]

The present invention has the following features to attain the object mentioned above. That is, in the probe device according to claim 1, a plurality of pattern wirings are formed on the film surface, and each tip of these pattern wirings is arranged in a protruding state from the leading end of the film to be a contact pin, and A wiring board having a plurality of board-side pattern wirings connected to the middle or rear end side of the pattern wiring of the contact probe in a contact state, respectively, wherein the pattern wiring of the contact probe is It is composed of at least a power supply wiring, a grounding wiring, and a signal transmission wiring,
The board-side pattern wiring of the wiring board is connected to at least the board-side power supply wiring connected to the power supply wiring, the board-side grounding wiring connected to the grounding wiring, and the signal transmission wiring. And the substrate-side power supply wiring is provided on the wiring substrate so as to extend in a direction intersecting with the pattern wiring of the contact probe, and the substrate-side grounding is provided. The wiring is provided substantially in parallel with the substrate-side power supply wiring on the wiring substrate, and the substrate-side signal transmission wiring is provided along the arrangement direction of the pattern wiring of the contact probe on the wiring substrate. Technology is adopted.

In this probe device, in the wiring board, the substrate-side power supply wiring is provided so as to extend in a direction intersecting the pattern wiring of the contact probe, and the substrate-side grounding wiring is provided in the wiring board. Provided substantially parallel to the board-side power supply wiring, the board-side signal transmission wiring,
Since the contact probes are provided along the arrangement direction of the pattern wiring, all the wirings of the pattern wiring may be formed at any of the three positions of the substrate-side pattern wiring, regardless of where they are formed on the film surface. The connection is also possible. Therefore, it is not necessary to change the arrangement of the electrodes (board-side pattern wiring) of the wiring substrate even when the design of various pattern wirings of the contact probe is changed according to the electrode arrangement of the measurement object. Thereby, the wiring substrate can be shared.

According to a second aspect of the present invention, in the probe device according to the first aspect, the pattern wiring of the contact probe is arranged so as to protrude from a rear end of the film and is connected to the substrate-side pattern wiring. The power supply wiring, the grounding wiring, and the signal transmission wiring of the pattern wiring are respectively connected to the board-side power supply wiring, the board-side grounding wiring, and the board-side signal. According to the respective positions of the board-side power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring in the wiring board so that the wiring can reach the position of the transmission wiring, The amounts of protrusion from the ends are set, and at least a part of the board-side power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring To be connected respectively, wherein the power line of the contact probe, techniques insulating mask is applied to prevent contact with other than the ground wiring and the signal transmission wiring is adopted.

In this probe device, the amount of protrusion of the pattern wiring of the contact probe from the rear end of the film is changed for each type, and when the contact probe is incorporated in the wiring substrate to constitute the probe device, Each pattern wiring is set to a length that can reach the various pattern wirings on the substrate side to be connected, and the various pattern wirings on the substrate side are prevented from contacting other than the various pattern wirings to be connected. Since the insulating mask is provided, a short circuit is prevented and an appropriate connection between the two can be secured. In this case, when the design of the contact probe pattern wiring is changed, at the time of the design change, the lengths of the various pattern wirings are changed according to the type, and the positions of the insulating masks applied to the various board-side pattern wirings are changed. Since it is only necessary to change the wiring pattern, there is no need to change the design of the substrate-side pattern wiring, and in that sense, the wiring substrate can be shared. Here, specific examples of the insulating mask include a peelable adhesive, a polyimide tape, a resist, and the like.

According to a third aspect of the present invention, in the probe device of the first aspect, the pattern wiring of the contact probe is arranged so as to protrude from a rear end of the film and is connected to the substrate-side pattern wiring. The power supply wiring, the grounding wiring, and the signal transmission wiring of the pattern wiring are respectively connected to the board-side power supply wiring, the board-side grounding wiring, and the board-side signal. According to the respective positions of the board-side power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring in the wiring board so that the wiring can reach the position of the transmission wiring, An amount of protrusion from an end is set, and at least one of each connection portion of the pattern wiring of the contact probe or each of the substrate-side pattern wirings , The respective connecting portions, techniques bump into contact only with each connected thereto to the substrate-side pattern wiring is formed is employed.

In this probe device, a bump is formed on each connection portion of the pattern wiring of the contact probe or on each substrate-side pattern wiring, and the bumps are brought into contact with each other. A contact state can be obtained. Therefore, it is possible to connect each connection portion of the contact probe only to the board-side pattern wiring to which each connection is to be made.

According to a fourth aspect of the present invention, in the probe device according to the first aspect, the power supply wiring, the grounding wiring, and the signal transmission wiring of the contact probe are respectively connected to the substrate side. A technique is employed in which the power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring are connected only by wire bonding so as to be in contact with each other.

In this probe device, various pattern wirings of the contact probe and various substrate-side wiring pattern wirings are connected by wire bonding, and the wires are arranged above wirings other than the substrate-side pattern wirings to be connected. , Can be in a non-contact state with the wiring. For this reason, the power supply wiring, the grounding wiring, and the signal transmission wiring of the contact probe can be brought into contact only with the substrate-side power supply wiring, the substrate-side grounding wiring, and the substrate-side signal transmission wiring to be connected, respectively. it can.

According to a fifth aspect of the present invention, in the probe device of the first aspect, the contact probe is such that a pattern wiring exposed from an opening formed in the film is a connection part to the substrate-side pattern wiring. The opening of the film constituting the connection portion, the power supply wiring, the grounding wiring and the signal transmission wiring, respectively, the substrate side power supply wiring, to be connected,
A technique formed at a position that is in contact with only the board-side ground wiring and the board-side signal transmission wiring is employed.

In this probe device, when changing the design of the pattern wiring of the contact probe, it is only necessary to change the position of the opening formed in the film, and it is not necessary to make any changes to the wiring substrate. In this case, with respect to the formation of the opening in the film, after forming a contact probe having no opening once, the film at an appropriate position is burned off using a means capable of fine processing such as a laser, so that it can be post-processed. An opening may be formed in the opening.

In the probe device according to a sixth aspect of the present invention, in the probe device according to the first aspect, the surface of the contact probe on which the pattern wiring is formed is the same as the substrate-side pattern wiring in the wiring substrate. The pattern wiring of the contact probe is provided in the film surface without protruding from a rear end of the film, and a connection portion connected to the substrate-side pattern wiring is provided without protruding from a rear end of the film. The power supply wiring, the grounding wiring, and the signal transmission wiring of the pattern wiring are each configured such that the connection portion is formed of the substrate-side power supply wiring, the substrate-side grounding wiring, and the substrate-side signal transmission wiring. The substrate-side power supply wiring, the substrate-side grounding wiring, and the substrate-side wiring in the wiring substrate so as to reach each position. In accordance with the respective positions of the signal transmission wires, the lengths are respectively set, and the board-side power supply wires, the board-side grounding wires, and at least a portion of the board signal transmission wires are connected to each other. Should,
A technique is employed in which an insulating mask for preventing contact of the contact probe with other than the power supply wiring, the grounding wiring, and the signal transmission wiring is applied.

In this probe device, since the pattern wiring of the contact probe does not protrude from the rear end of the film and the entire length of the pattern wiring is protected by the film, the handling is easier than in the case of protruding.

According to a seventh aspect of the present invention, in the probe device according to any one of the first to sixth aspects, a technique is employed in which a metal film is directly attached to a film of the contact probe. You.

In this probe device, the film is:
For example, even if it is a resin film or the like which easily absorbs moisture and stretches, since the metal film is directly attached to the film, the metal film suppresses the elongation of the film. Further, the metal film can be used as a ground, whereby
It becomes possible to design impedance matching up to the vicinity of the tip of the contact probe, and it is possible to prevent adverse effects due to reflected noise even when performing a test in a high frequency range.

That is, if the characteristic impedance between the substrate wiring side and the contact pin does not match in the middle of a transmission line from a tester called a prober, reflected noise occurs. In this case, the longer the transmission lines having different characteristic impedances, the longer the transmission noise. There is a problem that reflection noise is large.
Reflected noise causes signal distortion, and tends to cause malfunction at higher frequencies. In the present contact probe, by using the metal film as the ground, the characteristic impedance can be matched to the substrate wiring side up to the vicinity of the contact pin tip, and malfunction due to reflected noise can be suppressed. .

[0028] In the probe device according to the eighth aspect, in the probe device according to the seventh aspect, a technique is employed in which a second film is directly attached to the metal film.

In this probe device, since the second film is directly attached to the metal film, when the wiring substrate is disposed above the metal film, the wiring pattern on the substrate side of the wiring substrate is formed. Since the wiring and other wiring do not directly contact the metal film, a short circuit can be prevented. In addition, if the metal film is merely attached on the film and the metal film is exposed, the oxidation proceeds in the air because the metal film is exposed. To prevent its oxidation.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a probe device according to the present invention will be described with reference to FIGS.

The main difference between the probe apparatus of the present embodiment and the conventional example is the configuration of the contact probe and the printed circuit board. Therefore, the contact probe and the printed circuit board will be described in detail below, and the detailed description of the same configuration as that of the related art will be omitted.

As shown in FIG. 1, the contact probe 16 of this embodiment has a structure in which a pattern wiring 3 made of metal is attached to one surface of a polyimide resin film 2 (film). The distal end of the pattern wiring 3 protrudes from the distal end of the pattern wiring 3 to form a contact pin 3a. In the present embodiment, unlike the conventional example, the pattern wiring 3 is arranged so as to protrude from the rear end 2b of the resin film 2 and is connected to a printed board (wiring board) 30 described later. Connection part) 3
b.

The pattern wiring 3 is composed of three types of power supply wiring 3E, grounding wiring 3G, and signal transmission wiring 3S. The connection pin 3Sb of the signal transmission wiring 3S is formed the longest, and then the ground wiring 3S is formed. The connection pin 3Gb of the wiring 3G is long, and the connection pin 3Eb of the power supply wiring 3E is shortest.

Next, with reference to FIG. 2, the steps of manufacturing the contact probe 16 will be described in the order of steps. [Base metal layer forming step (first metal layer forming step)]
First, as shown in FIG. 2A, a base metal layer (first metal layer) 6 is formed on a supporting metal plate 5 made of stainless steel by Cu (copper) plating.

[Pattern Forming Step] After a photoresist layer 7 is formed on the base metal layer 6, as shown in FIG. 2B, a predetermined pattern is formed on the photoresist layer 7 by photolithography. A photomask 8 is applied and exposed, and as shown in FIG.
Is developed to remove the portion to be the pattern wiring 3 and form an opening 7a in the remaining photoresist layer (mask) 7.

In the present embodiment, the photoresist layer 7 is formed of a negative photoresist, but a desired opening 7a is formed by employing a positive photoresist.
May be formed. In the present embodiment,
The photoresist layer 7 corresponds to a “mask”. However, the “mask” refers to the photoresist layer 7 of the present embodiment.
However, the present invention is not limited to the method in which the opening 7a is formed through the exposure and development steps using the photomask 8 as described above. For example, a film or the like in which a hole is formed in advance in a portion to be plated (that is, a film formed in advance in a state indicated by reference numeral 7 in FIG. 2C) may be used. In the present invention, when such a film or the like is used as a “mask”, the pattern forming step in the present embodiment is unnecessary.

[Plating Step] Then, FIG.
As shown in FIG. 2, after the Ni or Ni alloy layer N serving as the pattern wiring 3 is formed in the opening 7a by electrolytic plating, the photoresist layer 7 is removed as shown in FIG.

[Film Adhering Step] Next, FIG.
As shown in FIG. 1, on the Ni or Ni alloy layer, the front end of the pattern wiring 3 shown in FIG. 1, that is, the portion that becomes the contact pin 3a and the rear end of the pattern wiring 3, that is, the connection The resin film 2 is bonded to the portion other than the portion serving as the pin 3b with the adhesive 2a.
This resin film 2 is a two-layer tape in which a metal film (copper foil) 500 is integrally provided on a polyimide resin PI. Before this film attaching step, the metal film 500 of the two-layer tape is subjected to copper etching using a photoengraving technique to form a ground plane. The polyimide resin PI of the tape is adhered to the Ni or Ni alloy layer via the adhesive 2a. The metal film 500 may be made of Ni, Ni alloy or the like in addition to the copper foil.

[Separation Step] Then, as shown in FIG. 2 (g), after the portion consisting of the resin film 2, the pattern wiring 3 and the base metal layer 6 is separated from the supporting metal plate 5, Cu etching is performed. After that, only the pattern wiring 3 is adhered to the resin film 2.

[Gold Coating Step] Then, as shown in FIG.
Plating is applied to form an Au layer AU on the surface. At this time, the Au layer AU is formed on the entire surface of the contact pins 3a protruding from the resin film 2 over the entire circumference.

Through the above steps, a contact probe 16 in which the pattern wiring 3 is adhered to the resin film 2 as shown in FIG. 1 is manufactured.

Next, the structure of the printed circuit board 30 to which the contact probe 16 is connected will be described with reference to FIGS.
This will be described with reference to FIG.

FIG. 3 is a sectional view showing the probe device of the present embodiment, and is a diagram corresponding to FIG. 21 in the conventional example. 3, the bottom clamp indicated by reference numeral 14 in FIG. 21 is omitted. FIG. 4 is a diagram showing the printed circuit board 30 as viewed from the direction of the arrow X (downward) in FIG. 3 (the contact probe 16 and the mounting base 12 are not shown).

As shown in FIG. 4, the printed circuit board 30
A plurality of substrate-side pattern wirings 31 connected to the pattern wiring 3 of the contact probe 16 in a contact state are provided. The board-side pattern wiring 31 is connected to the board-side power supply wiring 31E connected to the power supply wiring 3E, the board-side grounding wiring 31G connected to the grounding wiring 3G, and the signal transmission wiring 3S. And a substrate-side signal transmission wiring (pad) 31S.

The printed circuit board 30 is formed in a disk shape as in the above-mentioned conventional example, and has a square hole 36 at the center thereof in which the mounting base 12 can be disposed. The board-side power supply wiring 31E is provided in a square frame (ring) shape outside the hole 36 in the printed circuit board 30, and the board-side grounding wiring 31G is further provided in a square frame shape outside thereof. Have been. The plurality of board-side signal transmission pads 31S are arranged outside the board-side grounding wiring 31G along the frame thereof.

FIG. 5 is an enlarged view showing a connection state between various connection pins 3b and various substrate-side pattern wirings 31. As shown in FIG.
The power supply wiring 3E and the grounding wiring 3G of the pattern wiring 3
And the signal transmission wiring 3S are connected to the respective connection portions 3E.
b, 3Gb, and 3Sb so that the resin film 2 can reach the respective positions of the substrate-side power supply wiring 31E, the substrate-side grounding wiring 31G, and the substrate-side signal transmission pad 31S. The amount of protrusion from the rear end 2b is set. That is, the signal transmission wiring 3S connected to the board-side signal transmission pad 31S farthest from the edge of the hole 36 is formed the longest, and then the ground wiring 3G and the power supply wiring 3E are formed in this order. I have.

In the printed circuit board 30, an insulating mask 33 made of a releasable adhesive is applied to a part of the substrate-side power supply wiring 31E and a part of the substrate-side grounding wiring 31G.
The insulating mask 33 is provided on the substrate-side power supply line 31E at the place where the grounding line 3G is disposed on the printed circuit board 30, so that the grounding line 3G and the substrate-side power supply line 31E are not short-circuited. Has been. Similarly,
At the position where the signal transmission wiring 3S is arranged, an insulating mask 33 is applied on the substrate-side power supply wiring 31E and the substrate-side grounding wiring 31G, and the signal transmission wiring 3S and the substrate-side power supply wiring 31E and the substrate The side ground wire 31G is not short-circuited.

As shown in FIGS. 4 and 5, in the probe device, in the printed circuit board 30, the board-side power supply wiring 31 E extends in a direction perpendicular to the pattern wiring 3 of the contact probe 16. The board-side grounding wire 31G is provided substantially in parallel with the board-side power supply wire 31E, and the board-side signal transmission pad 31S is provided along the direction in which the pattern wires 3 of the contact probe 16 are arranged. Are provided. Therefore, all types of wirings 3E, 3E,
G, 3S may be formed at any position on the surface of the resin film 2, that is, regardless of the design, three types 31E, 31G,
It is possible to connect to any of the 31S.

Therefore, depending on the electrode arrangement of the semiconductor chip I (see FIG. 21) and the like, the contact probe 16
It is not necessary to change the arrangement of the board-side pattern wiring 31 of the printed circuit board 30 even when changing the design of the various pattern wirings 3E, 3G, and 3S. This allows
The printed circuit board 30 can be shared.

That is, in the present embodiment, the pattern wiring 3 of the contact probe 16 has the type 3S, 3E,
The amount of protrusion from the rear end 2b of the resin film 2 is changed every 3G, and the contact probe 16
When the probe device is configured by being incorporated in the device, the length of each of the pattern wirings 3E, 3G, and 3S is set so as to reach the various substrate-side pattern wirings 31E, 31G, and 31S to be connected, and Since the various substrate-side pattern wirings 31E, 31G, and 31S are provided with an insulating mask 33 for preventing contact with other than the various pattern wirings 3E, 3G, and 3S to be connected, a short circuit is prevented and the wiring between them is prevented. An appropriate connection can be secured.

In this case, when the design of the pattern wiring 3 of the contact probe 16 is changed, when the design is changed, the various pattern wirings 3 are changed according to the type.
It is only necessary to change the lengths (projection amounts) of E, 3G, and 3S and to change the position (shape) of the insulating mask 33 applied to the various substrate-side pattern wirings 31E, 31G, and 31S.
It is not required to change the design of the board-side pattern wirings 31E, 31G, and 31S, and the printed board 30 can be shared in that sense. In the present embodiment, in the printed circuit board 30, the board-side power supply wiring 31E is provided so as to extend in a direction orthogonal to the pattern wiring 3 of the contact probe 16, but in the present invention, the wiring That is, they need not intersect at right angles. That is, irrespective of the design (formation position) of the various pattern wirings 3, the board-side power supply is extended in the extending direction of the pattern wirings 3 so that each pattern wiring 3 can be connected to the substrate-side power supply wiring 31 </ b> E. The direction in which the wires 31E cross is sufficient.

As shown in FIG. 6, in the contact probe 16, the metal film 500 is provided up to the vicinity of the contact pin 3a.
The protrusion amount L from the tip of the metal film 500 is set to 5 mm or less. The metal film 500 can be used as a ground, thereby enabling impedance matching to be performed near the tip of the probe device, and preventing adverse effects due to reflected noise even when performing a test in a high frequency range. .

The resin film 2 (polyimide resin P)
The metal film 500 attached to I) has the following advantages. That is, when there is no metal film 500, since the resin film 2 is made of a polyimide resin, it absorbs moisture and elongates, and as shown in FIG. 7, the interval t between the contact pins 3a, 3a changes. There was something. Therefore, there is a problem that the contact pin 3a cannot contact a predetermined position of the electrode pad, and an accurate electrical test cannot be performed. In the present embodiment, the metal film 500 is adhered to the resin film 2 so that the change in the interval t is reduced even when the humidity changes, so that the contact pin 3a can be reliably brought into contact with a predetermined position of the electrode pad. Has become.

It should be noted that a second resin film may be directly attached to the metal film 500. Accordingly, an effect is obtained that the contact probe 16 serves as a cushioning material against tightening when the contact probe 16 is incorporated as a probe device.

Next, a second embodiment will be described with reference to FIG.

The present embodiment differs from the first embodiment in that the board-side pattern wiring 31 of the printed circuit board 30 is provided.
Is that bumps B are formed at the end portions of the connection pins 3Eb, 3Gb, and 3Sb of the contact probe 16 instead of applying the insulating mask 33 to the contact probe 16.

That is, in the first embodiment, the board-side pattern wiring 31 should be connected so that only the connection pins 3b and the board-side pattern wiring 31 other than those to be connected do not contact each other. Insulation mask 3 in places that are not
However, in this embodiment, on the contrary, bumps B are formed at locations where the connection pins 3b are to be connected,
This is intended to avoid contact between the connection pins 3b where no bump B is formed.

In this embodiment, the printed circuit board 30
In the configuration of FIG. 2, the point that there is no insulating mask 33 and the connection pins 3
The configuration b is different from the first embodiment only in that the bump B is formed, and therefore, the description of the other configurations is omitted.

In this embodiment, the bump B is formed at the tip of each connection pin 3b.
Similar effects can be obtained even if bumps are formed at locations where the respective substrate-side pattern wirings 31 are to be connected.

In the probe device of the present embodiment, bumps B are formed on the connection portions 3b of the pattern wiring 3 of the contact probe 16 or on the substrate-side pattern wiring 31, and at the positions of the bumps B, the substrate-side pattern wiring 31 is formed. Alternatively, since the connection pins 3b are brought into contact with each other, it is possible to obtain a non-contact state where the bumps B are not formed. Therefore, each connecting portion 3b of the contact probe 16 is
It is possible to connect only to the substrate side pattern wiring 31 to which each is to be connected.

Next, a third embodiment will be described with reference to FIG.

The present embodiment is characterized in that connection is made by wire bonding instead of the insulating mask 33 in the first embodiment and the bump B in the second embodiment.

In this embodiment, as in the first and second embodiments, the amount of protrusion of each connection pin 3b from the rear end 2b of the resin film 2 is determined by the amount of each substrate-side pattern wiring 31 to be connected. There is no need to change each according to the position of
The length of each connection pin 3b may be constant. In this case, the length of each connection pin 3b is set to be shorter than the position of the board-side power supply wiring 31E closest to the contact probe 16.

In this probe device, the various connecting portions 3Sb, 3Eb, 3Gb of the contact probe 16 and the various substrate-side wiring pattern wirings 31E, 31G, 31S are connected by wire bonding, and the wire W is connected to the substrate to be connected. It is arranged above the wiring other than the side pattern wirings 31E and 31G, and can be brought into a non-contact state with the wirings 31E and 31G. Accordingly, the power supply wiring 3E, the grounding wiring 3G, and the signal transmission wiring 3S of the contact probe 16 are connected to the substrate-side power supply wiring 31E, the substrate-side grounding wiring 31G, and the substrate-side signal transmission wiring, respectively. It can be brought into contact only with 31S.

Next, a fourth embodiment will be described with reference to FIG.

In this embodiment, unlike the first to third embodiments, there is no need to project the pattern wiring 3 from the rear end 2b of the resin film 2 as the connection pin 3b. Instead, in the present embodiment, an opening K is formed in the resin film 2, and each pattern wiring 3 is formed through the opening K.
E, 3G, and 3S are partially exposed to form connection portions for the substrate-side pattern wirings 31E, 31G, and 31S.

According to the above configuration, in the first to third embodiments, the formation position of each board-side pattern wiring 31 on the printed board 30 is the rear end 2 b of the resin film 2 of the contact probe 16. Although not shown in the figure (see FIG. 5), in the present embodiment, although not shown, it is a position overlapping the resin film 2. The opening K of the resin film 2 constituting the connection portion
Is a position where the power supply wiring 3E, the grounding wiring 3G, and the signal transmission wiring 3S are to be connected, respectively, and only contact the substrate-side power supply wiring, the substrate-side grounding wiring, and the substrate-side signal transmission pad. Is formed.

In this probe device, when the design of the pattern wiring 3 of the contact probe 16 is changed, it is only necessary to change the position of the opening K formed in the resin film 2, and no modification is made to the printed circuit board. No need.
In this case, when forming the opening for the resin film 2, the contact probe 16 is formed once using the resin film 2 having no opening, and then the contact probe 16 is formed at an appropriate position using a means capable of fine processing such as laser. The opening K may be formed ex post facto by burning off the resin film 2.

Next, referring to FIG. 11 to FIG.
An embodiment will be described.

The contact probe 16 of the present embodiment is
The mechanical parts are different from the mechanical parts in the first to fourth embodiments shown in FIGS.

That is, as shown in FIGS. 11 to 13, the mechanical part of the present embodiment has an inclined surface 23a for receiving a portion near the contact pin 3a of the contact probe 16 at the front, and the printed circuit board 24 at the rear. Support 2 having horizontal mounting surface 23b
3, a first clamper 26 for attaching the contact probe 16 superimposed on the inclined surface 23a of the support 23 via an insulating sheet 29 to the support 23 by bolts 25, and a bolt on the rear side of the contact probe 16 2
Second clamper 28 attached to support 23 by 7
And so on. The second clamper 28 is provided with an O-ring 28a, which presses the resin film 2 of the contact probe 16 to securely contact the pattern wiring 3 with the board-side pattern wiring 31 on the printed board 24. I have.

FIG. 14 shows the printed circuit board 24, on the upper surface of which a substrate-side pattern wiring 31 similar to that of the first to fourth embodiments is provided. That is, the board-side power supply wiring 31E is provided in a square frame (ring) shape, and the board-side grounding wiring 31G is further provided outside in a square frame shape. The plurality of board-side signal transmission pads 31S are arranged outside the board-side ground wire 31G along the frame.

In the present embodiment, as shown in FIG. 11, the substrate side pattern wiring 31 of the printed circuit board 24 and the pattern wiring 3 of the contact probe 16 are opposed to each other. It is not necessary to project the pattern wiring 3 from the rear end 2b of the resin film 2 unlike the embodiment. That is, FIG.
3 is a view in which a part of the resin film 2 is cut away, and as shown in the figure, various pattern wirings 3E, 3G, 3S do not protrude from the rear end 2b of the resin film 2, and The length of each is changed above and provided,
In accordance with the respective positions, the connection portions 3Eb, 3Gb, and 3Sb can reach the respective positions of the board-side power supply wiring 31E, the board-side grounding wiring 31G, and the board-side signal transmission pad 31S. Length is set.

Here, in the printed circuit board 24, a peelable insulating mask 33 is applied to predetermined portions of the substrate-side power supply wiring 31E and the substrate-side grounding wiring 31G to prevent a short circuit at a portion other than a portion to be connected. This is the same as in the first embodiment.

In the present embodiment, it is not necessary to project the various pattern wirings 3E, 3G, and 3S from the rear end 2b of the resin film 2, and the pattern wirings 3E, 3G, and 3S are protected by the resin film 2. Easy.

In the above embodiment, the contact probe 1 is applied to a probe device which is a probe card for measuring an IC chip. However, the contact probe 1 may be applied to another measuring jig or the like. For example, the present invention may be applied to a probe card for LCD measurement or an IC chip test socket mounted on an IC chip burn-in test device or the like for holding and protecting the IC chip inside. .

[0077]

According to the probe device of the first aspect,
In the wiring substrate, the substrate-side power supply line is provided so as to extend in a direction crossing the pattern wiring of the contact probe, and the substrate-side grounding line is substantially parallel to the substrate-side power supply line. The substrate-side signal transmission wiring is provided along the direction in which the pattern wiring of the contact probe is arranged, so that all the wirings of the pattern wiring are formed at any positions on the film surface. In any case, it can be connected to any of the three types of substrate-side pattern wiring. Therefore, even when changing the design of various pattern wiring of the contact probe according to the electrode arrangement of the measurement object,
There is no need to change the arrangement of the electrodes (board-side pattern wiring) on the wiring board. As a result, the wiring substrate can be shared, and the cost can be reduced.

According to the probe device of the second aspect, the amount of protrusion of the pattern wiring of the contact probe from the rear end of the film is changed for each type, and the contact probe is incorporated into the wiring substrate and the probe device is mounted. When each is configured, each of the pattern wirings is set to a length that can reach the various substrate-side pattern wirings to be connected, and the various substrate-side pattern wirings have a length other than the various pattern wirings to be connected. Since an insulating mask for preventing contact with the semiconductor device is provided, a short circuit is prevented and an appropriate connection between the two can be ensured. In this case, when the design of the contact probe pattern wiring is changed, at the time of the design change, the lengths of the various pattern wirings are changed according to the type, and the positions of the insulating masks applied to the various board-side pattern wirings are changed. Since it is only necessary to change the wiring pattern, there is no need to change the design of the substrate-side pattern wiring, and in that sense, the wiring substrate can be shared.

According to the third aspect of the present invention, a bump is formed at each connection portion of the pattern wiring of the contact probe or at each substrate side pattern wiring, and the bump is formed to be in a contact state at the bump. It is possible to obtain a non-contact state at a part that is not in contact. Therefore, it is possible to connect each connection portion of the contact probe only to the board-side pattern wiring to which each connection is to be made.

According to the probe device of the fourth aspect, the various pattern wirings of the contact probe and the various substrate-side wiring pattern wirings are connected by wire bonding, and the wires are wires other than the substrate-side pattern wirings to be connected. , And can be in a non-contact state with the wiring. For this reason, the power supply wiring, the grounding wiring, and the signal transmission wiring of the contact probe can be brought into contact only with the substrate-side power supply wiring, the substrate-side grounding wiring, and the substrate-side signal transmission wiring to be connected, respectively. it can.

According to the probe device of the fifth aspect, in the contact probe, the pattern wiring exposed from the opening formed in the film is a connection part to the substrate-side pattern wiring, and constitutes the connection part. The opening of the film is provided with the substrate-side power supply line, the substrate-side grounding line, and the substrate-side signal transmission line to which the power supply line, the grounding line, and the signal transmission line are to be connected respectively. Since it is formed only at the position where it contacts only the wiring, it is only necessary to change the position of the opening formed in the film when changing the design of the pattern wiring of the contact probe. The effect that there is no need is obtained.

According to the probe device of the sixth aspect, the pattern wiring of the contact probe may be formed in the film surface without protruding from the rear end of the film, by a connecting portion connected to the substrate-side pattern wiring. The power supply wiring, the grounding wiring, and the signal transmission wiring of the pattern wiring are provided such that the connection portions are respectively the substrate-side power supply wiring, the substrate-side grounding wiring, and the substrate-side signal transmission wiring. The length is set according to the respective positions of the board-side power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring in the wiring board so as to reach the respective positions. Therefore, the pattern wiring of the contact probe is protected by the film over the entire length, and handling is easier than in the case where the pattern wiring is projected.

According to the probe device of the present invention, even if the film is, for example, a resin film which easily expands by absorbing moisture, a metal film is provided directly on the film. Therefore, the elongation of the film is suppressed by the metal film. Further, the metal film can be used as a ground,
This makes it possible to design impedance matching up to the vicinity of the tip of the contact probe, thereby preventing adverse effects due to reflected noise even when performing a test in a high frequency range.

According to the probe device of the eighth aspect, since the second film is provided directly on the metal film, when the wiring board is disposed above the metal film, the wiring is Since the pattern wiring on the substrate side of the application substrate and other wiring do not directly contact the metal film, a short circuit can be prevented. In addition, if the metal film is merely attached on the film and the metal film is exposed, the oxidation proceeds in the air because the metal film is exposed. To prevent its oxidation.

[Brief description of the drawings]

FIG. 1 is a rear view showing a contact probe constituting a first embodiment of a probe device according to the present invention.

FIG. 2 is a cross-sectional view of a main part showing a method of manufacturing the contact probe constituting the first embodiment of the probe device according to the present invention in the order of steps.

FIG. 3 is a sectional view of the first embodiment of the probe device according to the present invention, from which a bottom clamp is omitted.

FIG. 4 is a rear view showing a printed circuit board that constitutes the first embodiment of the probe device according to the present invention.

FIG. 5 is an enlarged rear view showing a connection state between a contact probe and a printed circuit board in the first embodiment of the probe device according to the present invention.

FIG. 6 is a sectional view taken along line CC of FIG. 1;

FIG. 7 is a front view for explaining a metal film of a contact probe in the first embodiment of the probe device according to the present invention.

FIG. 8 is an enlarged perspective view from the back showing a connection state between a contact probe and a printed circuit board in a second embodiment of the probe device according to the present invention.

FIG. 9 is an enlarged perspective view showing a connection state between a contact probe and a printed board in a third embodiment of the probe device according to the present invention, as viewed from the back.

FIG. 10 is a rear view showing a contact probe constituting a fourth embodiment of the probe device according to the present invention.

FIG. 11 is a side view showing a fifth embodiment of the probe device according to the present invention.

FIG. 12 is an enlarged perspective view showing a central portion of a fifth embodiment of the probe device according to the present invention.

FIG. 13 is an exploded perspective view showing a fifth embodiment of the probe device according to the present invention.

FIG. 14 is a plan view showing a printed circuit board that constitutes a fifth embodiment of the probe device according to the present invention.

FIG. 15 is an enlarged plan view showing a connection state between a contact probe and a printed circuit board in a fifth embodiment of the probe device according to the present invention.

FIG. 16 is an enlarged perspective view of a main part showing a conventional contact probe.

FIG. 17 is a rear view showing a conventional contact probe.

18 is a sectional view taken along line CC of FIG. 17;

FIG. 19 is an exploded perspective view showing an example of a conventional probe device.

FIG. 20 is a perspective view of an essential part showing an example of a conventional probe device.

FIG. 21 is a sectional view taken along line EE of FIG. 20;

[Explanation of symbols]

 Reference Signs List 2 film (resin film) 2b rear end 3 pattern wiring 3a contact pin 3b connection part (connection pin) 3E power supply wiring 3G grounding wiring 3S signal transmission wiring 16 contact probe 30 wiring substrate (printed substrate) 31 substrate side Pattern wiring 31E Substrate-side power supply wiring 31G Substrate-side grounding wiring 31S Substrate-side signal transmission wiring (pad) 33 Insulation mask 500 Metal film B Bump K Opening W Wire

Claims (8)

[Claims] 1. A contact probe, wherein a plurality of pattern wirings are formed on a film surface, and the tips of the pattern wirings are arranged so as to protrude from the leading end of the film to be contact pins, and the pattern of the contact probe is provided. A probe device comprising: a wiring substrate having a plurality of substrate-side pattern wirings connected to the middle or rear end of the wiring in a contact state, wherein the pattern wiring of the contact probe is at least a power supply wiring and a ground. And a signal transmission line, wherein the substrate side pattern wiring of the wiring substrate is at least a substrate side power supply line connected to the power supply line, and a substrate side ground connected to the grounding line. And a board-side signal transmission wire connected to the signal transmission wire, wherein the board-side power supply wire is provided. The wiring substrate is provided so as to extend in a direction intersecting the pattern wiring of the contact probe. The substrate-side grounding wiring is substantially parallel to the substrate-side power supply wiring in the wiring substrate. The probe device, wherein the board-side signal transmission wiring is provided on the wiring board along an arrangement direction of the pattern wiring of the contact probe. 2. The probe device according to claim 1, wherein the pattern wiring of the contact probe is a connecting portion that is arranged to protrude from a rear end of the film and is connected to the substrate-side pattern wiring. The power supply wiring of the pattern wiring, the grounding wiring and the signal transmission wiring, the respective connection portion,
The board-side power supply wiring, the board-side grounding wiring, and the board in the wiring board so as to reach respective positions of the board-side power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring. The amount of protrusion from the rear end of the film is set in accordance with the position of each of the side signal transmission wires, and the board side power supply wire, the board side grounding wire, and the board signal transmission wire At least a part thereof is provided with an insulating mask for preventing contact of the contact probe with other than the power supply wiring, the grounding wiring, and the signal transmission wiring to be connected to each other. Probe device. 3. The probe device according to claim 1, wherein the pattern wiring of the contact probe is a connecting portion that is arranged to protrude from a rear end of the film and is connected to the substrate-side pattern wiring. The power supply wiring of the pattern wiring, the grounding wiring and the signal transmission wiring, the respective connection portion,
The board-side power supply wiring, the board-side grounding wiring, and the board in the wiring board so as to reach respective positions of the board-side power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring. The amount of protrusion from the rear end of the film is set in accordance with the position of each of the side signal transmission wirings, and at least one of the connection portions of the contact probe pattern wiring or the substrate side pattern wiring. The probe device according to claim 1, wherein a bump is formed so that each of the connection portions is in contact only with each of the substrate-side pattern wirings to be connected. 4. The probe device according to claim 1, wherein the power supply wiring, the grounding wiring, and the signal transmission wiring of the contact probe are respectively connected to the substrate-side power supply wiring and the substrate-side wiring. A probe device, wherein the probe device is connected by wire bonding so as to be in contact only with the ground wiring and the substrate-side signal transmission wiring. 5. The probe device according to claim 1, wherein in the contact probe, a pattern wiring exposed from an opening formed in the film is a connection part to the substrate-side pattern wiring, and constitutes the connection part. The opening of the film is provided with the substrate-side power supply line, the substrate-side grounding line, and the substrate-side signal transmission line to which the power supply line, the grounding line, and the signal transmission line are to be connected respectively. A probe device formed at a position where the probe device only contacts the probe device. 6. The probe device according to claim 1, wherein in the contact probe, a surface of the film on which the pattern wiring is formed faces a surface of the wiring substrate on which the substrate-side pattern wiring is formed. The pattern wiring of the contact probe is provided with a connection portion connected to the substrate-side pattern wiring in the film surface without protruding from a rear end of the film, The power supply wiring, the grounding wiring and the signal transmission wiring, the connection portion,
The board-side power supply wiring, the board-side grounding wiring, and the board in the wiring board so as to reach respective positions of the board-side power supply wiring, the board-side grounding wiring, and the board-side signal transmission wiring. The lengths are respectively set according to the respective positions of the side signal transmission lines, and are respectively connected to at least a part of the substrate side power line, the substrate side grounding line, and the substrate signal transmission line. A probe device, wherein an insulating mask for preventing contact of the contact probe with other than the power supply wiring, the grounding wiring, and the signal transmission wiring is applied. 7. The probe device according to claim 1, wherein a metal film is directly attached to the contact probe film. 8. The probe device according to claim 7, wherein a second film is provided directly on the metal film.