JPH10284892A - Method for correcting component mounting data in electronic component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting data correcting method for enhancing the mounting accuracy of a component mounter which mounts an electronic component on a printed board according to a component mounting data. SOLUTION: A printed board is divided into a plurality of areas and a component insertion data (component mounting data) is prepared. At the same time, a recognition point, i.e., an insertion hole, on the printed board being recognized as a reference position at the time of production of a mounting board is determined previously for each area and the reference position data of each insertion hole is stored in a memory 8 (S1, 2). Position of the insertion hole is recognized for each area at the time of production of the mounting board (S5) and a correction amount is operated for each area based on the shift of the recognition position data from the reference position data (S6). Finally, the component insertion data is corrected for each area using the correction amount (S10).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for correcting component mounting data in an electronic component mounting machine that produces a mounting board by mounting an electronic component at a predetermined position on a printed circuit board in accordance with component mounting data. In particular, it is a kind of electronic component mounting machine, and is suitable for a method of correcting component insertion data in an electronic component insertion machine that inserts a leaded electronic component into an insertion hole of a printed circuit board in accordance with component insertion data.

[0002]

2. Description of the Related Art In recent years, in the field of electronic component mounting, as printed circuit boards have become smaller, higher precision mounting has been desired. In order to meet such a demand, various methods of correcting component mounting data in an electronic component mounting machine have been proposed.

FIG. 3 is a perspective view showing a schematic configuration of a general electronic component mounting machine (electronic component insertion machine), and FIG. 4 is a block diagram showing a system configuration thereof. As shown in FIG. 3, this general electronic component mounting machine mainly includes a head unit 1, a component supply unit 2, an XY table 3, a recognition camera 4, a recognition unit 5, and a main controller unit 6. The inner head unit 1 takes out an electronic component from the component supply unit 2 and mounts it on a printed board, thereby producing a so-called mounting board (printed board after mounting the electronic component). At this time, the XY table 3 fixes the printed board, and positions the printed board below the head unit 1 or below the recognition camera 4 according to the component mounting data. The recognition unit 5 recognizes the mounting position of the printed board from the image captured by the recognition camera 4 and transfers the recognition data to the main controller unit 6. Furthermore, the main controller unit 6
As shown in FIG. 4, the main controller unit 6 is composed of an arithmetic unit 7, a storage unit 8, and an input / output unit 9. The main controller unit 6 has been transferred to improve the mounting accuracy in the electronic component mounting machine. The component mounting data is corrected based on the recognition data, and the XY table 3 is moved according to the corrected component mounting data, thereby positioning the printed circuit board. As a method of correcting the component mounting data, for example, the following methods are available.

(Conventional Example 1) FIG. 5 shows that a recognition mark is provided in advance on a printed circuit board or at two locations on a diagonal line of a mounting position, and reference position data of each recognition mark is taught to produce a mounting board. In this case, the position of each recognition mark is recognized to correct the entire printed circuit board and the mounting position.

Referring to FIGS. 3 to 5, before production of a mounting board, two recognition marks on a diagonal line of a printed board are determined in advance, and reference position data of each recognition mark is taught (step S301). Subsequently, in the production of the mounting board, when the printed board is transported to the XY table 3 (Step S302), the recognition mark determined in Step S301 is positioned below the recognition camera 4 (Step S303). Then, the recognition unit 5 recognizes the positions of the two recognition marks positioned below the recognition camera 4 from the image captured by the recognition camera 4, and transfers the recognition position data to the main controller unit 6 (step S304). .

The main controller unit 6 compares the recognition position data recognized in step S304 with the reference position data by the arithmetic unit 7, calculates the amount of deviation between the two data, and stores it in the storage device 8 (step S3). S30
5). These steps S303 to S305
Is performed on the two recognition marks to obtain this 2
One recognition mark is recognized (step S306).

When the recognition of the two recognition marks is completed, the respective deviation amounts calculated in step S305 are retrieved from the storage device 8, and the arithmetic unit 7 corrects the entire printed circuit board and corrects each mounting position based on the inclination of the printed circuit board. The amount and the inclination correction amount are calculated and stored in the storage device 8. When the reference position data of the two recognition marks on the diagonal line of the mounting position is taught, the arithmetic unit 7 calculates the correction amount of the mounting position and the correction amount of the inclination of the mounting position corresponding to the recognition mark. Is stored in the storage device 8 (step S
307).

Next, in order to start production from the first mounting position of the printed circuit board, the main controller unit 6
Extracts the component mounting data stored in the storage device 8 and the correction amount corresponding to the mounting position stored in step S306. The extracted correction amount is added to the component mounting data by the arithmetic unit 7. A positioning command is issued to the XY table 3 via the input / output device 9 in accordance with the component mounting data to which the correction amount has been added (step S30).
8). Then, the XY table 3 positions the printed circuit board in accordance with the positioning command of the main controller unit 6, and the head unit 1 mounts the electronic components (step S309). These steps S308 and S309 are executed for all mounting positions (step S310). When mounting is completed for all mounting positions on the printed circuit board, the process returns to step S302 if there is production of the next printed circuit board. If there is no production of the next printed circuit board, the process ends (step S31).
1).

(Conventional Example 2) FIG. 6 shows a method for correcting component mounting data in an electronic component mounting machine different from the above-mentioned Conventional Example 1. In this method, at the time of production of a mounting board, only the first mounting position (first mounting point, for example, the first insertion point in the case of an electronic component insertion machine) of the component mounting data is recognized (steps S401 to S403). The entire printed circuit board is corrected based on the recognition position data (steps S404 to S408). Other points are the same as in the above-mentioned conventional example 1.

(Conventional Example 3) FIG. 7 shows a method for correcting component mounting data in an electronic component mounting machine which is still different from the above-mentioned conventional example 1. In this method, before the mounting board is produced, all mounting positions of the printed circuit board (for example, all insertion points in the case of an electronic component insertion machine) are recognized, and a correction amount is obtained based on the recognized position data. (Step S
501 to step S506), the mounting position is corrected using this correction amount during production of the mounting board (step S50).
7 to Step S510). Other points are the same as in the above-mentioned conventional example 1.

[0011]

The method for correcting component mounting data in an electronic component mounting machine as in the above-described conventional example has the following problems.

(1) In the case of Conventional Examples 1 and 2, accurate correction can be made only when errors are all uniformly generated at the mounting positions on the printed circuit board due to the transfer of the printed circuit board or the like. . However, in the printed circuit board, different errors often occur in each area unit at the mounting position, and in such a case, the methods of the conventional examples 1 and 2 cannot correct accurately. For this reason, the mounting accuracy of the electronic component mounter decreases.

In the case of Conventional Examples 1 and 2, only the first recognition position of the recognition mark or the component mounting data (or the second recognition position in addition thereto) is recognized, and the correction amount is calculated based on the recognition position data. Therefore, the area to which the first recognition position or the like belongs can be corrected accurately, but the other areas cannot be corrected accurately, and the mounting accuracy of the electronic component mounter also decreases from this point.

(2) In the case of Conventional Example 3, although the printed circuit board can be accurately positioned, recognition, calculation, data storage, and the like must be performed for every mounting position before production of the mounted board. Therefore, the productivity of the electronic component mounting machine is significantly reduced.

(3) According to the specifications of the electronic component mounting machine, an electronic component that simultaneously produces a plurality of mounting substrates by simultaneously mounting electronic components by regarding a set of a plurality of printed substrates as “one printed substrate”. In the case of a component mounter, a set of a plurality of printed boards is regarded as “one printed board”, and the component mounting data is corrected in units of “one printed board”. Therefore, in the above-described conventional examples 1, 2, and 3, when an error occurs due to a transfer deviation between the printed circuit boards, the error cannot be accurately corrected, and the mounting accuracy of the electronic component mounter decreases. I do.

(4) The decrease in mounting accuracy of the electronic components in the conventional examples 1, 2, and 3 is caused by the fact that in the case of an electronic component insertion machine that inserts electronic components with leads into insertion holes of a printed circuit board in accordance with component insertion data. This is particularly problematic because the operation rate is greatly reduced due to the failure to insert components.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a main object of the present invention is to accurately determine the mounting position on a printed circuit board for every area even if a different error occurs for each area. An object of the present invention is to provide a component mounting data correction method for an electronic component mounter, which can improve the mounting accuracy of the electronic component mounter by correcting the component mounting data.

[0018]

In order to achieve the above object, a first aspect of the present invention provides an electronic component mounting method for producing a mounting board by mounting an electronic component at a predetermined position on a printed circuit board in accordance with component mounting data. In a method of correcting component mounting data in a machine, a printed circuit board is divided into a plurality of areas, and recognition points on the printed circuit board to be recognized as reference positions at the time of production of the mounting board are determined in advance for each area, and the reference of each recognition point is determined. The position data is stored in the memory, and during the production of the mounting board, the position of the recognition point on the printed board is recognized for each area, and based on the amount of deviation between the recognized position data and the reference position data, A correction amount is calculated for each area, and the component mounting data is corrected for each area using the correction amount.

According to this method, the printed circuit board is divided into a plurality of areas, and a recognition point on the printed circuit board to be recognized as a reference position at the time of production of the mounting board is predetermined for each area. Data is stored in the memory. Then, during the production of the mounting board, the position of the recognition point on the printed board is recognized for each area, and the correction amount for each area is calculated based on the amount of deviation between the recognized position data and the reference position data. The component mounting data is corrected for each area using the correction amount.

For this reason, even when the mounting position on the printed circuit board has a different error in each area, it is possible to accurately correct the mounting in all the areas, thereby improving the mounting accuracy of the electronic component mounting machine. Can be improved. In addition, since only the predetermined recognition points of each area are recognized as the reference position when the mounted component is produced, a decrease in productivity due to the recognition, calculation, data storage process, and the like can be minimized.

Further, as a method of taking in reference position data of a recognition point on a printed circuit board to be recognized at the time of production of a mounting board, a position of each predetermined recognition point is taught, or The desired mounting position coordinates among the above may be designated as the reference position data of each recognition point. According to the above teaching, correction according to the actual working environment can be performed, and according to the above designation, the work can be simplified.

According to a second aspect of the present invention, there is provided an electronic component mounter for simultaneously producing a plurality of mounting boards by mounting electronic components at predetermined positions on a plurality of printed boards in accordance with the component mounting data. In the correction method, the recognition points on the plurality of printed boards to be recognized as the reference positions during the production of the mounting board are predetermined for each printed board, and the reference position data of each recognized point is stored in the memory, During the production of, the position of the recognition point on the printed circuit board is recognized for each printed circuit board, and a correction amount for each printed circuit board is calculated based on the amount of deviation between the recognized position data and the reference position data. The component mounting data is corrected for each printed circuit board using a correction amount.

According to this method, the recognition points on the plurality of printed boards to be recognized as the reference positions during the production of the mounting board are predetermined for each printed board, and the reference position data of each recognition point is stored in the memory. You. Then, during the production of the mounting board, the position of the recognition point on the printed board is recognized for each printed board, and the correction amount for each printed board is determined based on the amount of deviation between the recognized position data and the reference position data. The component mounting data is corrected for each printed board using the correction amount.

As described above, in the second invention of the present application, each of the printed circuit boards mounted simultaneously is regarded as corresponding to the "each area" of the first invention, and the "first area" of the first invention is used in units of "each area". Therefore, even in the case of an electronic component mounting machine that produces a plurality of mounting boards at the same time, each printed circuit board has a correction amount. In some cases,
Correction can be made accurately. Thereby, the mounting accuracy of the electronic component mounter can be improved.

According to a third aspect of the present invention, there is provided a method of correcting component insertion data in an electronic component insertion machine for producing a mounting board by inserting a leaded electronic component into a predetermined position of a printed circuit board in accordance with component insertion data. The substrate is divided into a plurality of areas, insertion holes to be recognized as reference points on the printed circuit board to be recognized as reference positions during production of the mounting board are determined in advance for each area, and reference position data of each of the insertion holes is stored in a memory. In the meantime, at the time of production of the mounting board, the position of the insertion hole serving as the recognition point on the printed board is recognized for each area, and based on the amount of deviation between the recognized position data and the reference position data, each area is recognized. Calculate the correction amount,
The component insertion data is corrected for each area using the correction amount.

According to this method, the printed circuit board is divided into a plurality of areas, and an insertion hole serving as a recognition point on the printed circuit board to be recognized as a reference position at the time of production of the mounting board is predetermined for each area. The reference position data of the insertion hole is stored in the memory. Then, at the time of production of the mounting board, the position of the insertion hole serving as a recognition point on the printed board is recognized for each area, and correction for each area is performed based on the amount of deviation between the recognized position data and the reference position data. The amount is calculated, and the component insertion data is corrected for each area using the correction amount.

[0027] Therefore, even when a different error occurs in each area at the insertion position on the printed circuit board, it is possible to correct accurately for every area, thereby improving the insertion accuracy of the electronic component insertion machine. Since it is possible to improve the operation rate, it is possible to prevent a decrease in the operation rate due to a component insertion failure, which is a problem particularly in an electronic component insertion machine. In addition, since only the insertion hole serving as a recognition point of each predetermined area is recognized as a reference position at the time of production of the mounting board, the recognition,
It is also possible to minimize a decrease in productivity in a calculation, data storage step, or the like.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention. The following embodiments are examples in which the present invention is embodied, and do not limit the technical scope of the present invention.

(Embodiment 1) Embodiment 1 is shown in FIG. 1 and is a kind of an electronic component mounting machine as shown in FIGS. 3 and 4, wherein an electronic component with leads is inserted into a printed circuit board. An example of an electronic component insertion machine that inserts holes into holes according to component insertion data is shown. Since the electronic component insertion machine and the system configuration itself are basically as described above, detailed description thereof is omitted here.

As shown in FIGS. 1, 3 and 4, in the method for correcting component insertion data in the electronic component insertion machine according to the first embodiment, first, a so-called mounting board (printed board after mounting electronic components) is used. As a pre-production setup, the printed circuit board is divided into a plurality of areas and component insertion data (component mounting data) is created (step S).
1).

In step S1, if the design of the printed circuit board is divided into a plurality of areas in advance, component insertion data is created according to the design. In addition, it is also possible to further divide the area divided in advance into a plurality of areas in the design of the printed circuit board into a plurality of areas and create component insertion data.

For each area thus divided, an insertion hole to be used as a recognition point of the printed circuit board to be recognized as a reference position in the production of the mounting board is determined in advance, and the reference position data of each insertion hole is stored in a storage device (memory). 8 (step S2).

As a method of taking in the reference position data of each insertion hole serving as a recognition point, for example, a worker manually operates a pendant (not shown) to actually operate the head unit 1 so that a predetermined recognition point is obtained. By direct teaching that teaches the position of each insertion hole. Alternatively, for example, the operator may specify in advance the desired mounting position coordinates of the component insertion data as the reference position data of each insertion hole serving as a recognition point. According to the teachings described above, it is possible to correct not only the deformation of the printed circuit board but also the deflection or torsion of the head unit 1 itself, a change in the ambient temperature, and the like according to the actual working environment. On the other hand, according to the above designation, generally troublesome on-site work is eliminated, and the work can be simplified.

Next, in the production of the mounting board, when the printed board is transported to the XY table 3 (step S).
3) The position of the insertion hole, which is the recognition point of the printed circuit board determined in step S2, is positioned below the recognition camera 4 (step S4). The recognition unit 5 recognizes, from the image captured by the recognition camera 4, the position of the insertion hole serving as the recognition point of the printed circuit board positioned below the recognition camera 4, and transfers the recognition position data to the main controller unit 6 ( Step S5).

The main controller unit 6 uses the arithmetic unit 7 to recognize the insertion hole recognition position data as the recognition point of the printed circuit board recognized in step S5 and the insertion hole as the recognition point of the printed circuit board stored in advance. Is compared with the reference position data, and the amount of deviation between both data is calculated and stored in the storage device 8 (step S6). These steps S4
Steps S6 to S6 are performed on the insertion holes that are the recognition points of all the printed circuit boards determined in step S2, thereby recognizing those insertion holes (step S7).

When the recognition has been completed for all the insertion holes serving as the recognition points of the printed circuit boards, all of the deviation amount data calculated in step S6 is taken out of the storage device 8 and is divided by the arithmetic unit 7 into the divided data. The amount of correction for the entire area, the amount of correction for each mounting position based on the inclination of the area, and the amount of inclination correction are calculated and stored in the storage device 8 (Step S).
8). These steps S4 to S8 are executed for all the areas divided in step S1 (step S9).

Next, in order to start production from the first mounting position of the first divided area of the printed circuit board, the main controller unit 6 stores the component mounting data stored in the storage device 8 and the above-described step S8. In addition, a correction amount corresponding to the divided area and the mounting position is extracted. The extracted correction amount is added to the component insertion data by the arithmetic unit.

Here, as a necessary calculation method, since both the component insertion data and the correction amount are adjusted to the same level in each area unit, complicated addition calculation is not performed between the two, and practically simple addition is performed. Operation is sufficient. However, an interpolation calculation may be used to further improve the calculation accuracy. The main controller unit 6 sends X through the input / output device 9 in accordance with the component insertion data in which
A positioning command is issued to the Y table 3 (step S1
0).

The XY table 3 positions the printed circuit board in accordance with the positioning command of the main controller unit 6, and the head unit 1 mounts electronic components (step S11). These steps S10 and S11 are executed for all divided areas and mounting positions (step S12). When the mounting is completed for all the mounting positions of the printed circuit board, the process returns to the step S3 if the next printed circuit board is to be produced.
If there is no production of the next printed circuit board, the process ends (step S13).

As described above, the first embodiment has a correction amount for each of the divided areas of the printed circuit board. Therefore, when the mounting position of the printed circuit board has a different error for each area. In addition, accurate correction can be made for every area, which enables high-precision mounting in the electronic component insertion machine. Reduction can be effectively prevented.

Further, since only the insertion holes serving as the recognition points of the predetermined areas are recognized as the reference positions during the production of the printed circuit board, the reduction in productivity in the recognition, calculation, data storage steps, etc. is minimized. Can be suppressed.

Furthermore, if the positions of the insertion holes which are the recognition points of the printed circuit board which are recognized in advance as the reference position during the production of the mounting board are the diagonal positions (two places) of each area,
Even if there is a deviation due to a different inclination for each area,
The mounting position in the area can be evenly corrected. Therefore, in this case, in the electronic component insertion machine,
Even more accurate mounting can be realized.

(Embodiment 2) In Embodiment 1 described above,
Although one printed circuit board is divided into a plurality of areas, in an electronic component insertion machine that simultaneously produces a plurality of mounted boards, a set of a plurality of printed boards is regarded as equivalent to the one printed board, In addition, each printed circuit board can be regarded as corresponding to each of the above-mentioned areas. The second embodiment has been made focusing on such an idea.

That is, the component insertion data correction method in the electronic component insertion machine according to the second embodiment is a method applicable to an electronic component insertion machine that simultaneously produces a plurality of mounting boards, The set of boards is regarded as equivalent to “one printed board”, and each printed board is regarded as equivalent to “each area” obtained by dividing the “single printed board”, and the “each area” is considered. The same various processes as in the first embodiment are performed for each of the printed circuit boards regarded as "." The other points are the same as those in the first embodiment.

In the second embodiment, as shown in FIG.
First, component insertion data (component mounting data) is created, and an insertion hole to be a recognition point on the printed circuit board to be recognized as a reference position at the time of production of the mounting board is predetermined for each printed circuit board. The position data is stored in the memory (steps S101 to S10
2).

Next, at the time of production of the mounting board, the position of the insertion hole, which is a recognition point on the printed board previously determined, is recognized for each printed board (steps S103 to S103).
105), a correction amount for each printed circuit board is calculated based on the deviation amount between the recognized position data and the reference position data (steps S106 to S109), and the component insertion data is calculated for each printed circuit board using the correction amount. Correction is performed (steps S110 to S113).

Therefore, in the second embodiment, a set of a plurality of printed circuit boards is regarded as equivalent to one printed circuit board, and each printed circuit board regarded as equivalent to a divided area constituting the printed circuit board is considered. Since each has a correction amount, it is possible to correct accurately even if there is an error due to a transfer deviation between the printed circuit boards, thereby realizing high-precision mounting in the electronic component insertion machine.

Further, if the positions of the insertion holes which are the recognition points of the printed circuit board which are recognized in advance as the reference position in the production of the mounting board are the diagonal positions (two places) of each printed circuit board, Even if there is a deviation due to a different inclination, the insertion position in the printed circuit board can be evenly corrected. Therefore, as described above, highly accurate mounting can be realized.

Further, each printed circuit board may be further divided and processed for each area. In this case, the same operation and effects as those of the first embodiment are obtained, and the precision of the electronic component insertion machine is further improved. Implementation can be realized.

Although the first and second embodiments relate to a method for correcting component insertion data in an electronic component insertion machine, this method can be applied to other types of electronic component mounting apparatuses. . For example, the present invention can be similarly applied to an electronic component mounting machine for mounting a chip component at a predetermined position on a printed circuit board in accordance with component mounting data. In this case, an appropriate recognition mark may be provided on the printed circuit board as a recognition point and recognized, or a corner portion of the printed circuit board may be recognized.

A series of steps in the first and second embodiments is embodied by, for example, an executable program built in a memory (not shown) in the main controller unit 6. However, there is no problem if some or all of them are replaced with hardware.

[0052]

As is clear from the above description, according to the present invention, the following effects can be obtained.

(1) Since each of the divided areas of the printed circuit board has a correction amount, even if the mounting position on the printed circuit board has a different error for each area, it is accurate for every area. Can be corrected to
Thereby, the mounting accuracy of the electronic component mounter can be improved. Also, since only the recognition points of each predetermined area are recognized as the reference positions when the mounted components are produced,
It is possible to minimize a decrease in productivity due to a recognition, calculation, data storage step, and the like.

Furthermore, if a predetermined recognition point is taught as a method of taking in reference position data of a recognition point on a printed circuit board to be recognized as a reference position during production of a mounting board, actual work can be performed. Correction according to the environment becomes possible. On the other hand, if the desired mounting position coordinates of the component mounting data are specified in advance as the reference data of each recognition point, the operation can be simplified.

(2) Even in the case of an electronic component mounting machine that simultaneously produces a plurality of mounting boards by mounting electronic components at predetermined positions on a plurality of printed boards according to component mounting data, By regarding the set as equivalent to “one printed circuit board” and assuming each printed circuit board as equivalent to “each area” and performing the same processing as described above in units of “each area”, A correction amount is provided for each printed circuit board, and therefore, even when there is an error due to a conveyance deviation or the like between the printed circuit boards, accurate correction can be performed. Thereby, the mounting accuracy of the electronic component mounter can be improved.

(3) When the present invention is applied to an electronic component insertion machine for producing a mounting board by inserting an electronic component with a lead into a predetermined position on a printed circuit board in accordance with component insertion data, each area is inserted at the insertion position on the printed circuit board. In the case where a different error occurs, the correction can be accurately performed for every area, thereby improving the insertion accuracy of the electronic component insertion machine. It is possible to prevent a decrease in the operation rate due to a failed component insertion. In addition, since only the insertion holes serving as the recognition points of the predetermined areas are recognized as the reference positions during the production of the mounting board, the reduction in productivity in the recognition, calculation, data storage process, and the like can be minimized. it can.

[Brief description of the drawings]

FIG. 1 is a flowchart showing a schematic procedure of a component insertion data correction method in an electronic component insertion machine according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing a schematic procedure of a component insertion data correction method in the electronic component insertion machine according to the second embodiment of the present invention.

FIG. 3 is an external perspective view showing the entire configuration of a general electronic component mounting machine.

FIG. 4 is a block diagram illustrating a system configuration of a general electronic component mounter.

FIG. 5 is a flowchart showing a schematic procedure of a component mounting data correction method in an electronic component mounting machine according to Conventional Example 1.

FIG. 6 is a flowchart showing a schematic procedure of a component mounting data correction method in an electronic component mounting machine according to Conventional Example 2.

FIG. 7 is a flowchart showing a schematic procedure of a component mounting data correction method in an electronic component mounting machine according to Conventional Example 3.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head unit 2 Component supply unit 3 XY table 4 Recognition camera 5 Recognition unit 6 Main controller unit 7 Computing device 8 Storage device 9 Input / output device

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yokoyama Dai 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] 1. A method for correcting a component mounting data in an electronic component mounting machine for producing a mounting board by mounting an electronic component at a predetermined position on a printed circuit board in accordance with the component mounting data. Then, a recognition point on the printed circuit board to be recognized as a reference position at the time of production of the mounting board is predetermined for each area, and reference position data of each recognition point is stored in a memory. The position of the above recognition point is recognized for each area, a correction amount for each area is calculated based on a deviation amount between the recognized position data and the reference position data, and the component mounting data is calculated using the correction amount. The method of correcting component mounting data in an electronic component mounting machine, wherein the correction is performed for each area. 2. The component mounting in the electronic component mounting machine according to claim 1, wherein a reference position data of each recognition point is obtained by teaching a position of each predetermined recognition point before production of the mounting board. Data correction method. 3. The component mounting data in the electronic component mounting machine according to claim 1, wherein a desired mounting position coordinate of the component mounting data is specified as reference position data of each recognition point before the production of the mounting board. Correction method. 4. A method of correcting component mounting data in an electronic component mounting machine that simultaneously produces a plurality of mounting boards by mounting electronic components at predetermined positions on a plurality of printed boards according to component mounting data, respectively. Recognition points on a plurality of printed circuit boards to be recognized as reference positions at the time of production of a mounting board are predetermined for each printed circuit board,
The reference position data of each recognition point is stored in a memory, and the position of the recognition point on the printed circuit board is recognized for each printed circuit board during production of the mounting board. A correction amount for each printed circuit board is calculated based on the deviation amount, and the component mounting data is corrected for each printed circuit board using the correction amount. Correction method. 5. Inserting a leaded electronic component into a predetermined position on a printed circuit board in accordance with component insertion data,
In the method of correcting component insertion data in an electronic component insertion machine that produces mounting boards, the printed circuit board is divided into multiple areas, and insertion holes that serve as recognition points on the printed circuit board that are recognized as reference positions during production of the mounting board are created. Predetermined for each area, the reference position data of each of the insertion holes is stored in a memory, and at the time of production of a mounting board, the position of the insertion hole to be a recognition point on the printed board is recognized for each area, A correction amount for each area is calculated based on a deviation amount between the recognition position data and the reference position data, and the component insertion data is corrected for each area using the correction amount. A method for correcting component insertion data in an electronic component insertion machine.