JPH10135640A - Structure of printed wiring board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the degree of freedom in designing and make the structure suitable for high density mounting of electronic components by concentrating at one place signal patterns for connecting one layer to the other layers. SOLUTION: A cutout 5a is formed in an outside through hole 5. In an upper layer, a signal pattern 3 is so located inside the outside through hole 5 that it may be connected to an inside through hole 4. Signal patterns for connecting one layer to the other layers can be collected at one place in an upper layer, and therefore, the degree of freedom in designing can be increased and the structure of a printed wiring board can be made suitable for high density mounting of electronic components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a printed wiring board used for electronic equipment and the like and a method of manufacturing the same, and more particularly, to a method useful for connecting signal patterns of each layer of a multilayer printed wiring board. is there.

[0002]

2. Description of the Related Art In general, connection of signal patterns of each layer of a multilayer printed wiring board is performed by plating through holes.
The plating connects the signal patterns between the layers. Conventionally, a plurality of through holes are provided in accordance with the connection between the signal patterns. For example, when a printed wiring board is provided with four signal patterns, the four layers are called a, b, c, and d layers from above, and the signal pattern of the c layer is connected to the signal pattern of the b layer, and When the signal pattern of the d-layer and the signal pattern of the b-layer were connected and the signal pattern of the c-layer and the signal pattern of the d-layer were not connected, plated through holes for connecting the respective signal patterns were separately provided. That is, a plated through hole that connects the signal pattern of the c layer and the signal pattern of the b layer and a plated through hole that connects the signal pattern of the d layer and the signal pattern of the b layer are separately provided.

[0003]

However, in the above-described conventional printed wiring board structure, when signal patterns are separately connected to the same layer from a plurality of layers, through holes are separately formed by the number of connections. Therefore, the signal pattern for connecting to each through-hole must be lengthened, and the area required for connecting to the through-hole of the printed wiring board increases, and There is a problem that is not suitable for improving the mounting density of electronic components.

[0004]

SUMMARY OF THE INVENTION Accordingly, the present invention provides a method of manufacturing a semiconductor device comprising the steps of: alternately laminating conductor layers having a wiring pattern and insulating layers;
In the structure of a printed wiring board in which an arbitrary signal pattern of an arbitrary conductor layer is connected by through-hole plating, three through-holes are formed in plated outer through-holes for connecting from one layer to two layers. Placing an inner through-hole plated for connecting to the two layers from the layer of the, the notch is provided in a part of the two layers of the outer through-hole,
A wire was connected from the notch to the two layers of the inner through hole. The second layer may be a surface layer of a printed wiring board. Further, an insulating layer may be superimposed on the two layers so that the two layers are intermediate layers of the printed wiring board.

On the other hand, in the above-mentioned printed wiring board, one through hole is formed in a conductor substrate on both sides in which conductors are laminated on both sides of an insulator, and plating is performed. Forming a signal pattern to be connected to the hole plating, filling the one through-hole with an insulator, sequentially laminating a conductor substrate having a conductor laminated on both sides or one side of the insulator on both sides of the both-side conductor substrate. A multilayer board is formed, a hole is formed in the multilayer board so that the one through-hole plating is exposed, a part of the hole is masked, the mask is plated, and then the mask is removed. After forming a part of the outside through hole cut out, filling the outside through hole with an insulator, making a hole penetrating this outside through hole, plating the hole and making it an inside through hole, And to form a signal pattern to connect the signal pattern to the inner through-hole from the notches in the Kisotogawa through hole. After forming a signal pattern so as to connect a signal pattern from the cutout of the outer through hole to the inner through hole, an insulating layer and a conductor layer are further laminated to form a multilayer printed wiring board. Is also good.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a sectional view of a main part, FIG. 2 is a perspective view of a main part, and FIG. 3 is a plan view of a main part. The printed wiring board 1 has four layers M1 to M4 with signal patterns 3 formed between the insulating resins 2 and on the front and back surfaces. In addition,
Even in the case of other than four layers, the layers can be appropriately laminated. Also,
Here, a case where a plated inner through-hole and a plated outer through-hole connecting the layers M2 and M3 and the layer M1 are formed so as to connect the layer M1 and the layer M4 is formed. Is assumed.

The positional relationship between the inner through hole 4 and the outer through hole 5 is as follows. That is, as shown in FIGS. 2 and 3, the outer through hole 5 is provided with a notch 5a, and in the layer M1, the signal pattern 3 is routed from the notch 5a to the inside of the outer through hole 5 to form an inner through hole. It is arranged so as to be connected to the hole 4. In the layer M1, a signal pattern for connection wiring to another layer can be concentrated at one place, so that the degree of design freedom is increased and a structure suitable for high-density mounting of electronic components can be achieved. .

Next, a method for manufacturing a printed wiring board according to the present embodiment will be described. FIG. 4 is a flowchart of a manufacturing process,
5 and 6 are explanatory diagrams of the manufacturing process. S1: As shown in (1) of FIG. 5, a base material having a conductor layer 7 laminated on both sides of a resin layer 6 is manufactured. S2: As shown in (2) of FIG. 5, holes 8 are formed in the base material. S3: Hereinafter, as shown in (3) of FIG. 5, plating 9 is applied to the hole 8 up to S6. S4: A resist is applied to the conductor layer 7 to form a signal pattern. S5: The conductor layer 7 is etched to form a signal pattern (not shown). S6: The resist is removed, and as shown in FIG.
It has a structure in which a signal pattern (not shown) and plating 9 are formed. S7: As shown in (4) of FIG. 5, a resin 10 is filled in the hole 8 provided with the plating 9. S8: As shown in FIG. 5 (5), insulating layers 11 and 12 made of resin or the like and conductive layers 13 and 14 are laminated on the conductive layer 7. In this case, for example, lamination is performed via a prepreg. This prepreg is made by impregnating glass fiber or the like with a resin of the same type or a different type as the material of the insulating layer. S9: As shown in (6) of FIG. 5, a hole 15 penetrating the insulating layers 6, 11, 12 is formed so that the inner wall of the plating 9 is exposed. S10: As shown in (7) of FIG. 5, a mask 1 is formed on a part of the hole 15 of the insulating layer 6 and the inner wall of the hole 15 of the insulating layer 12.
Mask 6 S11: Plating 17 is applied to the inner wall of the hole 15 as shown in FIG. S12: As shown in FIG. 6 (9), the mask 16 on the inner wall of the hole 15 is removed, and the plating 17 is left. The plating 17 at this time becomes the outer through hole 5. S13: As shown in (10) of FIG.
Fill 8. S14: As shown in FIG. 6 (11), holes 19 are formed in the resin 18 so as to penetrate the insulating layers 6, 11, and 12 so that the resin 17 does not appear. S15: As shown in FIG. 6 (12), the holes 19 are plated to form the inner through holes 4 and the conductor layer 1
A signal pattern is formed by applying resist and etching to the substrates 3 and 14 to manufacture the printed wiring board 1 of the present embodiment. After that, an insulating layer and a conductor layer may be further laminated to form a multilayer printed wiring board.

According to the above-described embodiment, since a signal pattern for connecting from the other layer to the same layer can be concentrated at one place, the degree of freedom in design is increased, and the mounting density of electronic components is increased. The effect that a suitable structure can be obtained is obtained.

[0010]

As described above, according to the present invention, the signal pattern for connecting from the other layer to the same layer can be concentrated at one place, so that the degree of freedom of design is increased and the mounting of electronic parts is achieved. The effect that can be set as the structure suitable for high density of this is obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an embodiment.

FIG. 2 is a perspective view of a main part of the embodiment.

FIG. 3 is a plan view of a main part of the embodiment.

FIG. 4 is a flowchart of a manufacturing process according to the embodiment;

FIG. 5 is an explanatory diagram of a manufacturing process according to the embodiment.

FIG. 6 is an explanatory diagram of a manufacturing process according to the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Insulating resin 3 Signal pattern 4 Inside through hole 5 Outside through hole

Claims (5)

[Claims] 1. A printed wiring board structure in which conductive layers and insulating layers on which a wiring pattern is formed are alternately laminated, and an arbitrary signal pattern on an arbitrary conductive layer is connected by through-hole plating. A plated inner through hole for connecting the third layer to the second layer is disposed in the outer through hole plated for connecting the second layer to the second layer, and a second through hole for the outer through hole is provided. Wherein a notch is provided in a part of the layer and a wiring is connected to the second layer of the inner through hole from the notch. 2. The structure of a printed wiring board according to claim 1, wherein the second layer is a surface layer of the printed wiring board. 3. The structure of a printed wiring board according to claim 1, wherein an insulating layer is superposed on the two layers so that the two layers are intermediate layers of the printed wiring board. 4. The printed wiring board according to claim 1, wherein one through-hole is formed and plated on both side conductor bases having conductors laminated on both sides of an insulator. Forming a signal pattern to be connected to through-hole plating on each surface, filling the one through-hole with an insulator, and laminating a conductor on both sides or one side of the insulator on both sides of the conductor base on both sides A multilayer board is formed by sequentially laminating, and a hole is formed in the multilayer board so that the one through-hole plating is exposed, a part of the hole is masked, and the hole is plated. Remove and form an outer through hole with a part of the plating cut out, fill this outer through hole with an insulator, make a hole through this outer through hole, apply plating to the hole, Through Ho And then, the manufacturing method of the printed wiring board, characterized in that so as to form a signal pattern to connect the signal pattern to the inner through-hole from the notches of the outer through-hole. 5. The method of manufacturing a printed wiring board according to claim 4, further comprising: forming a signal pattern so as to connect the signal pattern from the cutout of the outer through hole to the inner through hole; A method for manufacturing a printed wiring board, comprising laminating a conductive layer to form a multilayer printed wiring board.