JPH10106932A - Substrate coating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To properly maintain preliminary discharge and the atmosphere of solution in spite of integrally formed type by a method in which a standby pot is composed of a liquid exhaust hole, which is interconnected to channel solution flow down space, and a solution storage part, and a chemical solution flows out to a liquid exhaust hole from a solvent storage part together with a solvent. SOLUTION: The tip 10c of a chemical solution feeding nozzle 10 is inserted into the inserting hole 21 of a stand-by pot 20. Chemical solution flow down space 23, where the chemical solution preliminary discharged from the chemical solution feeding nozzle 10 located on the stand-by position is formed on the lower part of the inserting hole 21. The air exhaust hole 24, which is formed on the position separated sideways from the chemical solution flow down space 23, is interconnected to the chemical solution flow down space 23. Below the chemical solution flow down space 23, a solution storing part 26, to be used to store the solution fed from a solution feeding part 25, is formed. On the bottom part 26a of the solution storing part 26, a 24a is formed in such a manner that it is going up incliningly toward the liquid exhaust hole 24, and as a result, preliminary discharged chemical solution can be effectively discharged together with the solution to the liquid exhaust hole 24.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a substrate for an optical disk (hereinafter simply referred to as a substrate), and the like. Glass, silica-based film forming material) This is related to a substrate coating apparatus that supplies a chemical such as a liquid, a photoresist liquid, and a polyimide resin to form a coating film, and in particular, stores the tip of a chemical supply nozzle that supplies a chemical. Regarding the waiting pot.

[0002]

2. Description of the Related Art As a conventional substrate coating apparatus of this type, there is one which supplies a chemical solution to a substrate to form a film on the surface thereof. This apparatus is configured to be movable, for example, over a substrate supporting portion that supports the substrate in a horizontal posture, a chemical solution supply position above the substrate supported by the substrate supporting portion, and a standby position that is laterally separated from the substrate. And a standby pot that is disposed at the standby position and stores the distal end of the nozzle in the insertion port when the chemical supply nozzle moves to the standby position.

In the above-described apparatus, unevenness in application due to fluctuations in the viscosity of the chemical stored in the vicinity of the distal end due to fluctuations in the atmosphere at the distal end of the chemical supply nozzle, and chemicals stored in the vicinity of the distal end There is a possibility that ejection failure due to solidification or fluctuation of viscosity may occur. Therefore, in order to prevent such a problem, the following is generally performed.

[0004] 1) A chemical solution stored at the tip of a chemical solution supply nozzle is previously discharged in a standby pot (a so-called dummy dispense; hereinafter, referred to as a preliminary discharge). 2) A solvent atmosphere is formed in the standby pot. ) Cleaning the tip of the chemical solution supply nozzle in the standby pot Of the above-mentioned countermeasures, 3) generally requires the provision of a cleaning means and is mechanically complicated.
And 2) are taken simultaneously. In order to simultaneously perform the measures 1) and 2), for example,
The following methods are available. A) Standby pots are separately provided for preliminary discharge and for solvent atmosphere. B) The standby pot is integrally formed for the preliminary discharge and the solvent atmosphere.

[0005]

However, the prior art having such a structure has the following problems. That is, in the method A), when performing the preliminary discharge, the liquid is moved to the preliminary discharge standby pot, and in other cases, the standby is performed in the solvent atmosphere standby pot.
Preliminary ejection can be appropriately performed, and fluctuation of the viscosity of the chemical solution can be prevented. On the other hand, since the stand-by pot is formed as a separate body, spatial waste occurs in the apparatus, and furthermore, in order to perform pre-discharge, the leading end of the chemical solution supply nozzle is transferred from the solvent atmosphere standby pot to the pre-discharge standby pot. Therefore, there is a problem that the movement control of the chemical solution supply nozzle becomes complicated.

In the method B), the movement control of the chemical liquid supply nozzle as in the method A) is not necessary, but a drain port for discharging the chemical liquid preliminary discharged into the standby pot is provided. Due to the necessity of providing such a container, the inside of the standby pot cannot be maintained at an appropriate solvent atmosphere. Therefore, the above-mentioned problems cannot be completely solved.

The present invention has been made in view of such circumstances, and by devising the structure of a standby pot, it is possible to appropriately perform preliminary discharge and maintain a solvent atmosphere while being an integral type. It is an object of the present invention to provide a substrate coating apparatus capable of preventing coating unevenness and ejection failure.

[0008]

The present invention has the following configuration in order to achieve the above object. In other words, the substrate coating apparatus according to claim 1 includes a substrate supporting unit that supports the substrate in a horizontal posture, a chemical supply position above the substrate supported by the substrate supporting unit, and a standby position that is laterally separated from the substrate. And a standby pot disposed at the standby position and configured to store the distal end of the nozzle in the insertion slot when the chemical supply nozzle moves to the standby position. In the substrate coating apparatus, the standby pot is used to store a chemical liquid flowing down space in which a chemical liquid pre-discharged from a chemical liquid supply nozzle housed in the insertion port flows down, a drain port communicating with the chemical liquid flowing down space, and a solvent. And a solvent storage section that shuts off the chemical liquid flow-down space and the drain port, and the chemical liquid discharged by the preliminary discharge flows out of the solvent storage section to the drain port together with the solvent from the solvent storage section. And it is characterized in that it is configured to so that.

Further, the substrate coating apparatus according to claim 2 is
2. The substrate coating apparatus according to claim 1, wherein the standby pot includes a position adjusting means for adjusting a position of the insertion port in a height direction.

[0010]

The operation of the first aspect of the invention is as follows. When supplying a chemical solution to the substrate supported by the substrate support means, the chemical solution supply nozzle is moved to a chemical solution supply position located above the nozzle. If there is a certain time interval before the next supply of the chemical, move the chemical supply nozzle to prevent the chemical stored at the tip from drying out, and wait for the tip. Store it in the insertion slot of the pot. In the standby pot, a chemical liquid flowing down space in which the pre-discharged chemical liquid flows down is formed, and a drain port communicating with this space is formed. Furthermore, since the above-mentioned chemical solution flowing space and the above-mentioned drain port are shut off by the solvent stored in the solvent storage part, the formed solvent atmosphere is not disturbed by the drain port, and The atmosphere in the chemical solution flowing space can be maintained at an appropriate atmosphere by the solvent in the solvent storage section. Further, before supplying a chemical solution to the substrate, first, a preliminary discharge for discharging a certain amount of the chemical solution from the chemical solution supply nozzle is performed. A certain amount of the chemical liquid discharged by this flows into the solvent reservoir through the chemical liquid flow-down space, but the pre-discharged chemical liquid is configured to flow out to the drain with the solvent. Preliminary discharge can be appropriately performed without the chemical solution remaining in the chemical solution flowing space or the solvent storage section.

According to the second aspect of the present invention, since the insertion port of the standby pot is provided with the position adjusting means for adjusting the position in the height direction, when the chemical solution supply nozzle is moved to the standby position. The distance between the liquid supply nozzle and the insertion port can be adjusted. Therefore, the degree of opening of the chemical solution flowing space can be adjusted. Depending on the chemical, there is a case where a problem occurs in that the viscosity of the chemical decreases due to absorption of the solvent in the solvent atmosphere. However, by adjusting the above interval, a suitable solvent atmosphere corresponding to the chemical can be obtained.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a longitudinal sectional view showing a schematic configuration of a substrate coating apparatus according to the embodiment.
FIG. 3 is an enlarged vertical sectional view of a standby pot.

In the drawing, reference numeral 1 denotes a suction type spin chuck corresponding to the substrate supporting means of the present invention. The suction-type spin chuck 1 is formed in a substantially circular shape in plan view, and sucks the lower surface of the substrate W and holds the substrate W in a horizontal posture. A rotation shaft 3 connected to a motor (not shown) is linked to the lower surface rotation center, and rotates the motor to rotate the substrate W in a horizontal plane. Around the suction type spin chuck 1, a substrate W
A scatter prevention cup 5 is provided for preventing the chemical solution supplied to the hopper from scattering around. This scattering prevention cup 5 has a lower cup 6 having a ring-shaped drainage zone 6a formed at the bottom and an upper cup 7 having an opening 7a formed at the upper part and fitted to the upper inner peripheral surface of the lower cup 6. It is composed of Drainage zone 6 scattered around substrate W
The chemical solution stored in a is discharged from a drain 6b formed at a part thereof. The suction spin chuck 1 and the scattering prevention cup 5 described above are relatively moved up and down by a lifting mechanism (not shown) when the substrate W is transferred. By moving these up and down relatively, the suction type spin chuck 1 projects upward through the opening 7a of the scattering prevention cup 5 (two-dot chain line in the figure).

A chemical solution is supplied to the upper surface of the substrate W from a chemical solution supply nozzle 10 connected to a chemical solution supply mechanism (not shown). The chemical solution supply nozzle 10 includes a rigid arm 10a formed of a member having rigidity, and a tube-shaped tip 10c that is attached to project downward from an arm tip 10b directed downward. I have. The distal end portion 10c is for discharging a chemical supplied from a chemical supply mechanism (not shown). Chemical supply nozzle 10
Is a chemical supply position for supplying a chemical to the substrate W above the rotation center of the substrate W (a position indicated by a dotted line in the figure).
And an upper standby position (position indicated by a two-dot chain line in the figure) further above the chemical liquid supply position and a standby position (position indicated by a solid line in the figure) laterally away from the substrate W. It is configured to move by a mechanism.

The chemical supply nozzle 10 at the standby position has its tip 10 c accommodated in the insertion port 21 of the standby pot 20. The insertion hole 21 has a female screw 2
1a is formed, and a height adjusting screw 22 having a hollow portion 22a is attached to this portion. The height adjusting screw 22 corresponds to a position adjusting means in the present invention, and by rotating the height adjusting screw 22,
The distance between the arm tip 10 b of the chemical supply nozzle 10 and the upper end of the height adjustment screw 22 is adjusted.

Below the above-mentioned insertion port 21, there is formed a chemical solution flowing space 23 into which the chemical solution preliminarily discharged from the chemical solution supply nozzle 10 at the standby position flows. A drain port 24 for discharging the pre-discharged chemical and solvent is formed at a position laterally away from the chemical flow space 23. The drain port 24 communicates with the chemical solution flowing space 23 and is also connected to the drain tank 24a. A solvent storage section 26 for storing the solvent supplied from the solvent supply section 25 is formed below the chemical solution flow-down space 23. The bottom part 26a of the solvent storage part 26 is
It is formed in an inclined shape that rises toward 4. If the shape of the bottom 26a of the solvent storage section 26 is inclined,
As will be described later, the pre-discharged chemical can be efficiently discharged to the drain port 24 together with the solvent. The top 26b of the inclined bottom 26a keeps the amount of the solvent stored in the solvent storage 26 constant. In addition, the chemical solution flowing space 23
Is formed so as to be located below the top 26b of the solvent storage section 26. Therefore, the chemical solution flowing space 23 has its lower end 23a positioned below the liquid level of the solvent stored in the solvent storing part 26, and the chemical solution flowing space 23 and the drain port 24 are shut off by the solvent. Will be.

Since the volume of the solvent that can be stored in the solvent storage section 26 is known in advance, the amount of the solvent that can be stored is supplied from the solvent supply section 25, and the solvent is constantly stored as shown in FIG. The portion 26 is filled with a solvent.
Therefore, the outside atmosphere flows in from the drain port 24 and the solvent atmosphere formed in the chemical solution flowing space 23 is maintained without being disturbed.

Next, the operation of the above-described substrate coating apparatus will be described with reference to FIGS. It is assumed that the substrate W has already been sucked and held by the suction-type spin chuck 1 and accommodated in the scattering prevention cup 5.

As shown in FIG. 3, the tip 10c of the chemical supply nozzle 10 at the standby position has the height adjusting screw 2
2 through the hollow portion 22a and the insertion port 21 of the standby pot 20.
Is housed inside. As described above, the chemical solution flow-down space 23 is cut off from the liquid discharge port 24 by the solvent stored in the solvent storage part 26 and is maintained in the solvent atmosphere. It is possible to prevent the viscosity of the chemical solution staying inside from fluctuating or solidifying.

Depending on the type of the chemical solution, if the solvent concentration in the solvent atmosphere is excessive, there is a disadvantage that the solvent is absorbed and the viscosity is reduced.
By turning 2 to adjust the degree of opening of the chemical solution flowing space 23, the solvent concentration of the solvent atmosphere formed in the chemical solution flowing space 23 can be adjusted. This makes it possible to finely adjust the solvent atmosphere according to the type of chemical solution,
An appropriate solvent atmosphere can be created according to the type of chemical solution. Therefore, various types of chemicals can be used without being restricted by the type of the chemical used for the substrate coating apparatus. When the chemical liquid is an SOG liquid, it is very easy to solidify. It is preferable to set the degree of opening to be small.

In this state, a chemical solution supply mechanism (not shown) supplies a certain amount of the chemical solution, and discharges the chemical solution from the tip 10 c of the chemical solution supply nozzle 10. By this operation (so-called dummy dispensing), the chemical solution S staying in the distal end portion 10c of the chemical solution supply nozzle 10 is discharged to the chemical solution flowing space 23 (dotted line in the figure). The discharged chemical solution S flows down in the chemical solution flowing space 23 and mixes with the solvent stored in the solvent storage unit 26. As a result, the solvent in the increased volume and a part of the chemical solution S dissolved in the solvent flow into the drain port 24 over the top 26 b of the solvent storage section 26.

Almost simultaneously with or immediately after the preliminary discharge, a fixed amount of solvent is supplied from the solvent supply unit 25 to the solvent storage unit 26. Then, as shown by the dotted line in FIG. 4, the chemical solution S staying in the vicinity of the lower end portion 23a of the chemical solution flow-down space 23 is drawn in by the flow of the solvent going up the inclined surface of the bottom portion 26a and is involved. The liquid is discharged to the liquid outlet 24 over the top 26b. Therefore, the pre-discharged chemical solution S stays and accumulates in the standby pot 20 and dries,
In addition to preventing inconvenience such as generation of particles, it is also possible to prevent inconvenience such as overflow of the chemical solution due to clogging of the path from the drain port 24 to the drain tank 24a.

It is to be noted that a sensor for detecting the solvent flowing into the drain port 24 by the preliminary discharge is provided, and a predetermined amount of the solvent is supplied from the solvent supply unit 25 when the sensor operates. Good. Instead of supplying a fixed flow rate of the solvent after performing the preliminary ejection, a fixed amount of the solvent may always be supplied from the solvent supply unit 25 regardless of the operation.

After completing the preliminary ejection in this manner, the chemical supply nozzle 10 moves to the chemical supply position indicated by the dotted line in FIG. 1 through the upper standby position indicated by the two-dot chain line in FIG. A predetermined amount of the chemical is supplied to the substrate W from the position. Since the chemical solution supply nozzle 10 is on standby in an appropriate solvent atmosphere as described above, it is possible to prevent solidification of the chemical solution in the distal end portion 10c and occurrence of a discharge failure, and to reliably perform the coating process on the substrate W. It can be performed. Then, the substrate W is rotated at a high speed for a predetermined time at a predetermined rotation speed, and a coating film having a constant thickness is formed on the surface thereof. Since the chemical liquid supplied to the substrate W has a normal viscosity after the preliminary discharge in the standby pot 20 as described above, it is possible to prevent the coating film from being unevenly coated.

As described above, the chemical liquid flow-down space 23 into which the pre-discharged chemical liquid flows and the liquid discharge port 24 are connected to the solvent storage section 2.
6 is blocked by the solvent stored in the solvent atmosphere, despite the fact that the solvent atmosphere and the preliminary ejection pot are integrally formed, the solvent atmosphere in the chemical solution flowing space 23 in which the tip 10c is stored. Can be appropriately maintained. Further, the chemical liquid S that has flowed into the solvent storage section 26 through the chemical liquid flow-down space 23 by the preliminary discharge is configured to flow out to the drain port 24 together with the solvent in the solvent storage section 26. Predischarge can be appropriately performed without staying in the chemical solution flow-down space 23 and the solvent storage section 26. Therefore, the preliminary ejection and the holding of the solvent atmosphere can be appropriately performed even though the standby pot 20 is an integrated pot for the preliminary ejection and the solvent atmosphere. As a result, the tip 10 of the chemical solution supply nozzle 10
It is possible to prevent solidification and fluctuation in viscosity of the chemical solution stored in c, thereby preventing application unevenness and ejection failure.

In the above embodiment, the standby pot 20
Although a height adjusting screw 22 is attached to the insertion opening 21 of the above, a solvent atmosphere can be set according to the chemical solution, but the height adjusting screw 22 is not necessarily provided. For example, when the chemical concentration of the solvent atmosphere is not easily affected or when only one kind of chemical solution is used, the standby pot 20 having only the insertion port 21 can be formed, or a suitable solvent atmosphere can be formed for the chemical solution. Waiting pot 2 to be open
0 may be formed.

Note that the present invention is not limited to the above configuration, and various modifications can be made. For example, FIG.
As shown in FIG. This waiting pot 2
0 is a concave solvent storage portion 30 below the chemical solution flowing space 23.
The lower end portion 23 a of the chemical solution flowing space 23 is formed so as to protrude below the top portion 30 a of the solvent storage portion 30. The solvent is supplied from the solvent supply unit 25 to the solvent storage unit 30 via the solvent supply path 31 formed on the side surface of the chemical solution flow space 23 and above the top 30a of the solvent storage unit 30. It has become. The height adjusting screw 22 is not attached to the insertion port 21 as in the above-described embodiment, and the height is fixed. On the other hand, an atmosphere adjusting hole 33 is formed on the side surface of the chemical solution flowing space 23 so as to communicate with the surroundings. An adjusting screw 35 for adjusting the aperture ratio is attached to the upper part of the atmosphere adjusting hole 33. This adjustment screw 35
By turning to adjust the opening ratio of the atmosphere adjusting hole 33, the degree of opening of the chemical solution flowing space 23 can be adjusted in the same manner as in the above embodiment.

In the standby pot 20 configured as described above, the chemical solution S, which has been preliminarily discharged and stays below the chemical solution flow-down space 23, is carried on the flow of the solvent flowing from the solvent supply passage 31, and is stored in the solvent storage section. The liquid is discharged to the liquid discharge port 24 beyond the top 30a of the liquid. Therefore, effects similar to those of the above-described embodiment can be obtained.

In the above embodiment, the tip portion 10c of the chemical solution supply nozzle 10 is described as being formed in a tubular shape. However, when the chemical solution is a photoresist solution or a polyimide resin, the tip portion is tapered. It is common to have a shape. Such a tip-shaped chemical supply nozzle 10
It is needless to say that the same effect can be obtained by employing the standby pot 20 having the above-described configuration even in a substrate coating apparatus employing the above.

[0030]

As is apparent from the above description, according to the first aspect of the present invention, the drain port communicating with the chemical solution flowing space is blocked by the solvent stored in the solvent storing section. In addition, the solvent atmosphere in the chemical solution flowing space can be appropriately maintained without disturbing the solvent atmosphere formed in the chemical solution flowing space. In addition, since the chemical liquid that has flowed into the solvent storage section through the chemical liquid flowing space by the preliminary discharge is configured to flow out to the drain port together with the solvent in the solvent storing section, the chemical liquid stays in the chemical liquid flowing space and the solvent storing section. Pre-discharge can be performed appropriately without performing. Therefore, the preliminary ejection and the holding of the solvent atmosphere can be appropriately performed. As a result, it is possible to prevent solidification and fluctuation in viscosity of the chemical solution stored at the tip of the chemical solution supply nozzle, thereby preventing application unevenness and ejection failure.

According to the second aspect of the present invention, by adjusting the distance between the insertion port of the standby pot and the chemical solution supply nozzle, it is possible to adjust the solvent atmosphere in the chemical solution flowing space. The solvent atmosphere can be set according to the chemical solution. Therefore, there is no restriction on the chemical used,
Various chemical solutions can be used.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a schematic configuration of a substrate coating apparatus according to an embodiment.

FIG. 2 is a vertical sectional view of a standby pot.

FIG. 3 is a diagram provided for explanation of operation.

FIG. 4 is a diagram for explaining the operation.

FIG. 5 is a longitudinal sectional view showing a modification of the standby pot.

[Explanation of symbols]

 W ... Substrate S ... Chemical liquid 1 ... Suction spin chuck (substrate support means) 5 ... Scatter prevention cup 6 ... Lower cup 7 ... Upper cup 10 ... Chemical liquid supply nozzle 10a ... Rigid arm 10b ... Arm tip 10c ... Tip 20 ... Stand-by pot 21 ... Insertion port 22 ... Height adjusting screw (position adjusting means) 23 ... Chemical solution flowing space 24 ... Drainage port 26 ... Solvent storage section

Claims (2)

[Claims] 1. A substrate supporting means for supporting a substrate in a horizontal posture, a chemical solution supply position above the substrate supported by the substrate supporting means, and a standby position separated laterally from the substrate. A substrate coating apparatus comprising: a chemical solution supply nozzle; and a standby pot disposed at the standby position, and when the chemical solution supply nozzle moves to the standby position, storing a distal end portion thereof in an insertion port. A chemical liquid flowing down space in which the chemical liquid preliminarily discharged from the chemical liquid supply nozzle housed in the insertion port flows down, a liquid discharging port communicating with the chemical liquid flowing down space, a solvent storing the chemical liquid flowing down space and the drainage space. A liquid storage section that shuts off the liquid port, and the liquid medicine discharged by the preliminary discharge is configured to flow from the solvent storage section to the drain port together with the solvent. Substrate coating device according to claim. 2. The substrate coating apparatus according to claim 1, wherein said standby pot includes a position adjusting means for adjusting a position of said insertion port in a height direction.