JPH0992939A - Current protective element module and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a current protective element module excellent in dimensional precision and reliability, by arranging a plurality of current protective elements which are metal layers having a specific thickness, in the interior of a curved surface formed by hollowing out the side surfaces of retaining base material and covering base material in half-cylindrical types. SOLUTION: A hole 160 is formed in a both-sided metal foil clad laminate 120 whose one side metal foil is 3-8μm in thickness, and plating resist is formed excepting a part turning to an electrode 140. Plating 180 is performed in a necessary thickness, and plating resist is exfoliated. Etching resist for forming a current protective element 150 is formed on a metal foil 110 surface. The metal foil 110 exposed from the etching resist is etched off, so that its part of a hole 170, is divided into curved surfaces of the hole 170 hollowed out in two half-cylindrical types. By cutting out the current protective element in such a manner that current protective element wiring parts are arranged in parallel and forms a unified body, a current protective element module capable of improving reliability can be realized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a current protection element module in which a plurality of current protection elements are arranged in parallel and integrated, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Current protection devices are used for overcurrent protection of electronic equipment. Such an element is generally called a fuse, but with the diversification of electronic devices, a current protection element having characteristics different from those of conventional fuses has been developed. For the overcurrent protection device, an electronic switch using a thyristor or a transistor can be used in addition to the above current protection element. However, in such a case, since the number of circuit components increases and the power consumed by the protection circuit also increases, miniaturization and low power consumption are required such as in battery-operated portable devices. It was not always suitable for some uses.

Therefore, as disclosed in JP-A-60-143544, silver or silver-palladium is used for the first layer, the nickel layer is used for the second layer, and the third layer is used for the ceramic substrate.
It is known that three layers of conductive layers of solder or tin are formed on the layers to improve the fusing characteristics during soldering. This publication also discloses that the surface of the conductive layer is coated with a nonflammable (flame retardant) resin such as a silicone resin. However, a ceramic substrate provided with a current protection element (fuse) has a small thermal resistance of the ceramic substrate, and as disclosed in the above-mentioned JP-A-60-143544, a nonflammable (flame retardant) resin. Even if the current protection element is covered with, the heat dissipation is high, and there is a problem in that the current value for fusing often varies depending on the ambient temperature.

In order to solve the problem of the ceramic substrate, there is a method of using an organic resin insulating substrate. However, when the resin of the substrate is an epoxy resin, a phenol resin, a polyimide resin or the like, there is a problem of smoking or burning. Therefore,
Japanese Patent Laid-Open No. 5-166454 discloses that the use of a fluorine resin, which is one of the organic resins having high heat resistance, for the insulating substrate can lower the thermal conductivity as compared with ceramics and improve the fusing accuracy of the fuse. Has been done.
This publication also discloses that the surface of the fuse wiring is covered with a silicone resin (rubber).

[0005]

The current protection element wiring portion is formed by printing or plating as disclosed in Japanese Patent Laid-Open No. 63-141233. (Fuse) formation accuracy,
In particular, it is difficult to control the thickness, and the variation in the resistance value of the current protection element wiring part is 30% including that between lots.
It was difficult to keep it within.

Further, as disclosed in Japanese Patent Laid-Open No. 5-166454, when a thin metal layer is formed by plating and wiring is formed by etching, the fusing property is excellent, but in order to keep the plating thickness uniform. However, it is necessary to strictly control the plating conditions and the like, and even in such a case, some variation in the plating thickness cannot be avoided due to changes in the composition of the plating bath over time and other conditions. For this reason,
There is a problem that it is difficult to keep the variation in resistance value within 30%, including between lots.

In addition to the above problems, Japanese Patent Laid-Open No. 5-16
As shown in Japanese Patent No. 6454, when a thin metal layer is formed by plating and wiring is formed by etching, a thermal cycle test, which is an accelerated test for confirming long-term connection reliability, is obtained although it has excellent fusing characteristics. By doing so, the stress resulting from the difference in the coefficient of thermal expansion between the insulating substrate and the metal foil causes a break in the metal foil and the electrode part in a relatively small number of cycles, or the resistance value increases significantly even if it does not result in a break. There were challenges.

Furthermore, since silicone rubber is used to coat the surface of the fuse wiring, the silicone rubber coating is slightly damaged by the high temperature at the time of fusing depending on the conditions of overcurrent energization. There was a problem that smoke might come out.

On the other hand, in recent years, one chip-type current protection element has been mounted in one circuit for the purpose of ensuring the safety of electronic equipment and protecting internal memory information. However, in order to realize a higher packaging density, However, mounting one on one circuit raises a problem that the component mounting cost per electronic device increases.

According to the present invention, there is provided a current protection element module which suppresses heat dissipation, has excellent dimensional accuracy of the current protection element, suppresses smoke generation and ignition, and has excellent long-term reliability even in a large environmental temperature change. It is an object of the present invention to provide a method for manufacturing such a current protection element module simply and economically.

[0011]

The current protection element module of the present invention comprises a support base material, a plurality of current protection elements formed on the surface of the support base material, and a coating base material for insulatingly coating the current protection element. And an electrode provided on the surface of the supporting base material and the surface of the coating base material, which is connected to a metal layer provided on the curved inner surface of the supporting base material and the coating base material, the side surfaces of which are cut out in a substantially semi-cylindrical shape Characterized in that the plurality of current protection elements are arranged in parallel, and each current protection element is a metal layer having a thickness of 3 to 8 μm.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION It is possible to use a coated base material which is hollowed out so as not to come into contact with the current protection element at the location of the current protection element.

The supporting base material and the coating base material may be composed of a fluororesin and a reinforcing material, and the reinforcing material may be selected from glass cloth and glass paper.

As the fluororesin, a fluororesin selected from tetrafluoroethylene-perfluoroalkoxyethylene copolymer, tetrafluoroethylene-ethylene copolymer and polytetrafluoroethylene resin can be used.

The resistance value of this current protection element is 80 to 30.
It is preferably in the range of 0 mΩ. Below 80 mΩ, 30
When it exceeds 0 mΩ,
.

In order to manufacture such a current protection element module, (a) a step of making a hole in a double-sided metal foil-clad laminate having a thickness of the metal foil on one side of 3 to 8 μm, (b)
A step of forming a plating resist except for a portion to be an electrode, (c) a step of plating to a required thickness, (d) a step of peeling the plating resist, (e) the thickness is 3 to
A step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 8 μm, (f) a metal foil having a thickness of 3 to 8 μm exposed from the etching resist,
It is possible to perform the step of removing by etching, and the step (g) of cutting the hole so as to divide it into two semi-cylindrical curved surfaces.

Further, (a1) at least one surface has 1
A first copper layer having a thickness in the range of 0 to 50 μm and 3 to 8 μm
A second copper layer having a thickness in the range of 1 and a metal foil having a nickel or alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers, the second copper layer being in contact with the insulating substrate. Process to make a double-sided metal-clad laminate laminated with
(A2) a step of etching away the first copper layer,
3) a step of forming a hole, (a4) a step of etching and removing the intermediate layer to expose the second copper layer, (b) a step of forming a plating resist except a portion to be an electrode, (c)
A step of plating to a required thickness, a step of (d) removing the plating resist, and (e) an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm. Forming step, (f) etching away the metal foil with a thickness of 3 to 8 μm exposed from the etching resist, (g) at the hole, dividing the hole into two semi-cylindrical curved surfaces It can also be carried out by a step of cutting.

Further, a step of coating the surface of the current protection element with a fluororesin having a thickness in the range of 40 to 200 μm can be used between the steps f and g.

Furthermore, (a5) a step of preparing a double-sided metal foil-clad laminate in which the thickness of the metal foil on one side is 3 to 8 μm, and (b) a plating resist is formed except for portions to be electrodes. Step, (c) plating to a required thickness, (d) stripping the plating resist, (e) forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm. A step of forming an etching resist for
(F) A step of etching and removing the metal foil having a thickness of 3 to 8 μm exposed from the etching resist, and (f1) a prepreg or a resin film and a metal foil are laid on the surface of the circuit board prepared up to the step f. , Heating and pressurizing and laminating and adhering, (f2) opening a hole, (f3) plating the inside of the hole and the entire surface, (f4) for forming a current protection element on the surface of the metal foil Forming an etching resist of step (f5), removing the metal foil exposed from the etching resist by etching,
(G) A step of cutting the hole so as to divide it into two semi-cylindrical curved surfaces is also possible.

(A1) 10-5 on at least one surface
A first copper layer having a thickness in the range of 0 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or an alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having the above with a second copper layer in contact with the insulating substrate to produce a double-sided metal-clad laminate, (a2)
Etching away the first copper layer, (a4) etching away the intermediate layer to expose the second copper layer,
(B) a step of forming a plating resist except for a portion to be an electrode, (c) a step of plating to a required thickness,
(D) a step of removing the plating resist, (e) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f)
The metal foil having a thickness of 3 to 8 μm exposed from the etching resist is removed by etching. (F1) A prepreg or resin film and a metal foil are superposed on the surface of the circuit board prepared by step f and heated. Step of pressing and laminating and adhering, step (f2) of opening a hole, step (f3) of plating the inside of the hole and the entire surface, (f4) etching resist for forming a current protection element on the surface of the metal foil Forming the metal foil, (f5) etching away the metal foil exposed from the etching resist, and (g) cutting the hole into two semi-cylindrical curved surfaces at the hole. Is also possible.

(A1) 10-5 on at least one surface
A first copper layer having a thickness in the range of 0 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or an alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having the above with a second copper layer in contact with the insulating substrate to produce a double-sided metal-clad laminate, (a2)
Etching away the first copper layer, (a4) etching away the intermediate layer to expose the second copper layer,
(E) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f) 3 to 8 μ exposed from the etching resist
a step of etching away a metal foil having a thickness of m, (f
1) A step of laminating a prepreg or a resin film and a metal foil on the surface of the circuit board prepared up to the step f, laminating and adhering them by heating and pressing, (f2) a step of forming a hole,
(F3) A step of plating the inside of the hole and the entire surface,
4) A step of forming an etching resist for forming a current protection element on the surface of the metal foil, (f5) a step of etching away the metal foil exposed from the etching resist, (g) at the hole, the hole Can also be divided into two semi-cylindrical curved surfaces.

After the step g, a step of supplying a constant amount of current to the current protection element for a constant time can be performed.

(A) A step of making a hole in a double-sided metal foil-clad laminate, in which the thickness of the metal foil on one side is 3 to 8 μm,
(B) a step of forming a plating resist except for a portion to be an electrode, (c) a step of plating to a required thickness,
(D) a step of removing the plating resist, (e) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f)
A step of etching away the metal foil having a thickness of 3 to 8 μm exposed from the etching resist, (f6) a step of separately producing an insulating coated base material having a hole at the position of the current protection element, (f7) step f A step of stacking an insulating coating base material and a single-sided metal-clad laminate on the surface of the circuit board prepared up to, and heating and pressurizing to laminate-bond, (f8) a step of making a hole in the laminate-bonded material, ( f9) a step of plating the inner wall and the entire surface of the hole, (f10) a step of forming an etching resist on the surface and removing metal exposed from the etching resist, and (g) at the hole, the hole is divided into two parts. It is also possible by a step of cutting into curved surfaces that are hollowed out in a semi-cylindrical shape.

(A1) 10-5 on at least one surface
A first copper layer having a thickness in the range of 0 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or an alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having the above with a second copper layer in contact with the insulating substrate to produce a double-sided metal-clad laminate, (a2)
Etching away the first copper layer, (a4) etching away the intermediate layer to expose the second copper layer,
(B) a step of forming a plating resist except for a portion to be an electrode, (c) a step of plating to a required thickness,
(D) a step of removing the plating resist, (e) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f)
A step of etching away the metal foil having a thickness of 3 to 8 μm exposed from the etching resist, (f6) a step of separately producing an insulating coated base material having a hole at the position of the current protection element, (f7) step f A step of stacking an insulating coating base material and a single-sided metal-clad laminate on the surface of the circuit board prepared up to, and heating and pressurizing to laminate-bond, (f8) a step of making a hole in the laminate-bonded material, ( f9) a step of plating the inner wall and the entire surface of the hole, (f10) a step of forming an etching resist on the surface and removing metal exposed from the etching resist, and (g) at the hole, the hole is divided into two parts. It is also possible by a step of cutting into curved surfaces that are hollowed out in a semi-cylindrical shape.

(A1) 10-5 on at least one surface
A first copper layer having a thickness in the range of 0 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or an alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having the above with a second copper layer in contact with the insulating substrate to produce a double-sided metal-clad laminate, (a2)
Etching away the first copper layer, (a4) etching away the intermediate layer to expose the second copper layer,
(E) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f) 3 to 8 μ exposed from the etching resist
a step of etching away a metal foil having a thickness of m, (f
6) Separately, a step of producing an insulating coated base material having a hole at the position of the current protection element, and (f7) an insulating coated base material and a single-sided metal-clad laminate on the surface of the circuit board produced up to step f. ,
Steps of stacking, heating and pressurizing and laminating and adhering, (f8) forming a hole in this laminated and adhered, (f9) plating the inner wall of the hole and the entire surface, (f10) forming an etching resist on the surface It is also possible to perform a step of etching away the metal exposed from the etching resist, and a step (g) of dividing the hole into two semi-cylindrical curved surfaces.

It is possible to use an insulating coating substrate in which only the thickness of 5 to 30 μm of the surface of the insulating coating substrate having a hole at the position of the current protection element is formed of a resin material having a low softening point. Among the materials, a resin material having a low softening point with a thickness of 5 to 30 μm on the surface is a copolymer of ethylene and tetrafluoroethylene, and a material of the other portion is a polytetrafluoroethylene resin is used. It is preferable.

[0027]

【Example】

Example 1 An ultrathin copper foil having a thickness of 5 μm was formed on one surface and the other surface,
A copper-clad laminate was produced by laminating copper foil having a thickness of 18 μm [shown in FIG. 3 (a)]. ]. A homemade glass cloth reinforced polytetrafluoroethylene resin prepreg was used as the base material of this laminate, and an ultra-thin copper foil of 5 μm and a normal 18
Put copper foil of μm on top of each other and press under the conditions of temperature 380
It was prepared at a temperature of 90 ° C. for 90 minutes under a pressure of 20 kgf / cm ² . By forming an etching resist on the surface of the ultra-thin copper foil of this laminated plate and chemically etching the portion exposed from the etching resist using a cupric chloride solution, the pattern of the current protection element is removed. Was formed. The pattern is a shape in which a plurality of current protection elements are arranged in series in the horizontal direction with electrodes sandwiched therebetween, and a continuous array of one row is arranged in parallel in the vertical direction [FIG.
(B). ]. Separately, after completely etching the copper foil of the double-sided copper-clad laminate made of homemade glass cloth reinforced polytetrafluoroethylene resin on both sides, Aflex film which is a copolymer of tetrafluoroethylene and ethylene on both sides of this ( Asahi Glass Co., Ltd., product name) with a thickness of 12 μm and copper foil are laminated, and the press conditions are temperature 280 ° C., time 30 minutes, pressure 20 kgf / c.
Thermocompression bonding was performed at m ² [shown in FIG. 3 (c). ]. A hole for forming voids (hole diameter: 1.2 mm) was drilled in the thermocompression bonded product [shown in FIG. 3 (d)]. ], The copper foils on both sides are removed by etching, and a perforated insulating coating material [Fig.
(E). ] The laminated plate prepared in advance and having the current protection element shown in FIG. 3 (b), the perforated insulating coating material, and the laminated plate made of polytetrafluoroethylene resin with copper foil on one surface are laminated and added. Bonding was performed by heating under pressure [shown in FIG. ]. To this laminated adhesive,
As shown in (g), a hole is formed, plating with a thickness of 15 μm is performed, and then an etching resist is formed as shown in FIG. 3 (h), and the copper exposed from the etching resist is removed by etching. Then, the electrode part was formed (hereinafter referred to as the subtract method) [shown in FIG. 3 (i)]. ].

Example 2 The same material and the same steps as in Example 1 were used to form a pattern of a current protection element wiring part on one surface of an insulating substrate to prepare a current protection element formed [FIG. 4 (b)]. Show. ]. Separately
A double-sided copper-clad laminate made of homemade glass cloth reinforced polytetrafluoroethylene resin was used to drill a hole with a hole diameter of 1.2 mm, then the copper foil on both sides was removed by etching, and an insulating coating material with holes was used. Obtained [shown in FIG. 4 (c)] ]. An Aflex film, which is a copolymer of tetrafluoroethylene and ethylene, formed on the both sides of the perforated insulating coating material and the perforated insulating coating material, which were formed in advance, Made by Glass Co., Ltd., 1)
A 2 μm-thick one and a polytetrafluoroethylene resin insulating plate with a copper foil on one side are overlaid and the press conditions are temperature 280 ° C., time 30 minutes, pressure 20 kgf / cm.
Thermocompression bonding was performed in step ² [shown in FIG. 4 (d)]. ]. This laminated plate is perforated [shown in FIG. 4 (e)]. ], Plating with a thickness of 15 μm is performed [shown in FIG. 4 (f)]. ], The electrode portion was formed by the subtraction method [shown in FIG. 4 (g)]. ].

Example 3 As shown in FIG. 5A, a first copper layer having a thickness of 15 μm, a second copper layer having a thickness of 5 μm, and an intermediate layer between the two copper layers were used. A metal foil having a nickel-phosphorus alloy layer having a thickness of 0.2 μm was prepared. This metal foil is shown in FIG.
As shown in FIG. 5, a copper-clad laminate was produced by laminating a copper foil of 18 μm on one surface so that the second copper layer is in contact with the other surface and a copper foil of 18 μm on the other surface. The material of the copper-clad laminate and the lamination adhesion conditions are the same as the conditions in the process shown in FIG. Next, the portions other than the portions to be the electrodes of the first copper layer are removed by etching by the subtract method [FIG.
(C)], the intermediate layer was further removed to expose the second copper layer, and then the second copper layer was formed into a plurality of current protection elements by the subtraction method [FIG. ) And (e).] Separately, a substrate in which polytetrafluoroethylene was used as a resin base material and a glass base material was used as a reinforcing material, and a hole was formed in a portion to be a current protection element was manufactured [Fig. 5 (f).] The above-prepared product having the current protection element formed thereon, the insulating coating material having the holes, and tetrafluoroethylene arranged so as to be located on both surfaces of the insulating coating material. Aflex film (trade name, manufactured by Asahi Glass Co., Ltd.), which is a copolymer of ethylene, with a thickness of 12 μm, and an insulating coating material with a single-sided copper foil made of polytetrafluoroethylene resin and glass reinforcement And the insulated cover with holes. The portion of the hole of the material, was laminated and bonded in alignment with the current protection device [FIG 5 (g).]. Press conditions at this time, the temperature 280 ° C., time 3
The pressure was 20 kgf / cm ^{2 for} 0 minutes. A hole for connecting the end faces is made in this laminated adhesive [shown in FIG. 5 (h)]. ], Plating is performed [shown in FIG. 5 (i)]. ] After the inside of the hole for connecting the end faces is made into a conductor, the electrode portion is formed by the subtraction method [shown in FIG. 5 (j)]. ].

The current protection element substrates produced in Examples 1 to 3 were cut so that the three current protection elements were integrated so that the current protection element wiring portions were arranged in parallel and were integrated as shown in FIG. )
The current protection element module shown in was obtained. In this embodiment,
The conductor width of each current protection element was 0.05 mm, and each resistance value was about 180 mΩ. In this embodiment, three current protection elements are arranged side by side, but any number of two or more current protection elements can be arranged in parallel. Further, although the current protection element module in which a plurality of current protection elements of the same kind are arranged is shown as an example, a plurality of different kinds of current protection elements can be arranged. As a result of performing 20 fusing tests each, the resistance value after fusing was 10 megohms or more, and most were at the gigaohm level. No fire or smoke was found in any of the above.

[0031]

As described above, the current protection element module according to the present invention is excellent in suppression of ignition and smoke, can be fused even at a low current, and has a structurally long-term reliability. In addition to being able to improve, it is only necessary to mount one current protection element module in which the necessary current protection elements are integrated in the electronic device, so that the mounting cost can be reduced.

[Brief description of drawings]

FIG. 1A is an external perspective view showing an embodiment of the present invention, and FIGS. 1B and 1C are cross-sectional views taken along the line AA.

FIG. 2 (a) is an external perspective view showing another embodiment of the present invention, and FIG. 2 (b) is a sectional view taken along line AA.

3 (a) to (f) are views for explaining each step of one embodiment of the present invention, and (a) and (c) to (f) are cross-sectional views, respectively. b) is a plan view.

4 (a) to (g) are views for explaining respective steps of another embodiment of the present invention, and (a) and (c) to (g) are sectional views, (B) is a plan view.

5 (a) to 5 (j) are views for explaining respective steps of still another embodiment of the present invention, and FIGS.
(D) and (f) to (j) are cross-sectional views, and (e)
Is a plan view.

6A is an external perspective view showing a conventional example, FIG.
(B) (c) is the AA sectional view.

FIG. 7 (a) is an external perspective view showing another conventional example, and FIG. 7 (b) is an AA sectional view thereof.

[Explanation of symbols]

110. Ultra-thin copper foil 120. Base material 130. Copper foil 140. Electrode part 150. Current protection element 121. Base material 122. Resin material having a low softening point 123. Base material 130. Resin layer 160. Hole 161. Void 170. Hole 180. Plating 190. Electrode part 210. Composite metal foil 211. First copper layer 212. Middle layer 213. Second copper layer 220. Base material 230. Copper foil 240. Electrode part 250. Current protection element 260. Hole 221. Resin material having a low softening point 222. Substrate 270. Hole 280. Plating 290. Electrode part

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Fumio Suzuki, 1500 Ogawa, Shimodate, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate factory (72) Kuji Kobori, 1500, Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Factory (72) Inventor Kosuke Takada 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Factory

Claims (17)

[Claims] 1. A support base material, a plurality of current protection elements formed on the surface of the support base material, a coating base material for insulatingly coating the current protection elements, a surface of the support base material and a surface of the coating base material. A plurality of current protection elements, each of which is composed of an electrode connected to a metal layer provided on an inner surface of a curved surface obtained by hollowing out side surfaces of a supporting base material and a coating base material in a substantially semi-cylindrical shape, Are arranged in parallel, and each current protection element is a metal layer having a thickness of 3 to 8 μm. 2. The current protection element module according to claim 1, wherein the coating base material is hollowed out at the location of the current protection element so as not to contact the current protection element. 3. The supporting substrate and the coating substrate are composed of a fluororesin and a reinforcing material, and the reinforcing material is selected from glass cloth and glass paper. Current protection device module. 4. The fluororesin is tetrafluoroethylene-
The current protection according to any one of claims 1 to 3, which is a fluororesin selected from a perfluoroalkoxyethylene copolymer, a tetrafluoroethylene-ethylene copolymer, and a polytetrafluoroethylene resin. Element module. 5. The resistance value of the current protection element is 80 to 300 m.
The current protection element module according to claim 1, wherein the current protection element module is in the range of Ω. 6. (a) A step of making a hole in a double-sided metal foil-clad laminate, wherein the thickness of the metal foil on one side is 3 to 8 μm,
(B) a step of forming a plating resist except for a portion to be an electrode, (c) a step of plating to a required thickness,
(D) a step of removing the plating resist, (e) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f)
It has a step of etching and removing a metal foil having a thickness of 3 to 8 μm exposed from the etching resist, and a step of (g) dividing the hole into two semi-cylindrical curved surfaces. A method of manufacturing a current protection element module, comprising: 7. (a1) 10-5 on at least one surface
A first copper layer having a thickness in the range of 0 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or an alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having: a second copper layer so that the second copper layer is in contact with the insulating substrate to produce a double-sided metal-clad laminate, (a2) a step of etching away the first copper layer, (a3) a hole A step of opening, (a4) a step of etching away the intermediate layer to expose the second copper layer, (b) a step of forming a plating resist except for a portion to be an electrode, (c) a required thickness , A step of plating, (d) a step of peeling the plating resist, (e) a thickness of 3 to
A step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 8 μm, (f) a metal foil having a thickness of 3 to 8 μm exposed from the etching resist,
A method for producing a current protection element module, comprising: a step of removing by etching; and (g) a step of cutting the hole so as to divide it into two semi-cylindrical curved surfaces. 8. The method according to claim 6, further comprising a step of coating the surface of the current protection element with a fluororesin having a thickness in the range of 40 to 200 μm between step f and step g. A method for manufacturing the current protection element module according to 1. 9. (a5) The thickness of the metal foil on one side is 3 to 8 μm.
A step of preparing a double-sided metal foil-clad laminate, (b)
A step of forming a plating resist except for a portion to be an electrode, (c) a step of plating to a required thickness, (d) a step of peeling the plating resist, (e) the thickness is 3 to
A step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 8 μm, (f) a metal foil having a thickness of 3 to 8 μm exposed from the etching resist,
A step of removing by etching, (f1) a prepreg or a resin film on the surface of the circuit board prepared up to the step f,
A process of laminating a metal foil, heating and pressurizing and laminating and adhering it,
(F2) a step of forming a hole, (f3) a step of plating the inside of the hole and the entire surface, (f4) a step of forming an etching resist for forming a current protection element on the surface of the metal foil, (f5 ) A current characterized by having a step of etching away the metal foil exposed from the etching resist, and (g) cutting the hole into two semi-cylindrical curved surfaces at the hole. Protective element module manufacturing method. 10. (a1) 10 to 10 on at least one surface
A first copper layer having a thickness in the range of 50 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or an alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having: a second copper layer so that the second copper layer is in contact with the insulating substrate to produce a double-sided metal-clad laminate, (a
2) a step of etching away the first copper layer, (a4)
A step of etching away the intermediate layer to expose the second copper layer, (b) a step of forming a plating resist excluding a portion to be an electrode, (c) a step of plating to a required thickness, ( d) a step of removing the plating resist, (e) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm,
(F) A step of etching and removing the metal foil having a thickness of 3 to 8 μm exposed from the etching resist, and (f1) a prepreg or a resin film and a metal foil are laid on the surface of the circuit board prepared up to the step f. , Heating and pressurizing and laminating and adhering, (f2) opening a hole, (f3) plating the inside of the hole and the entire surface, (f4) for forming a current protection element on the surface of the metal foil Forming an etching resist of step (f5), removing the metal foil exposed from the etching resist by etching,
(G) at the hole, a step of cutting the hole so as to divide the hole into two semi-cylindrical curved surfaces, and a method of manufacturing a current protection element module. 11. (a1) 10 to 10 on at least one surface
A first copper layer having a thickness in the range of 50 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or an alloy layer thereof having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having: a second copper layer so that the second copper layer is in contact with the insulating substrate to produce a double-sided metal-clad laminate, (a
2) a step of etching away the first copper layer, (a4)
Etching the intermediate layer to expose the second copper layer, (e) forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, f) 3 to 3 exposed from the etching resist
Etching away a metal foil having a thickness of 8 μm,
(F1) A step of laminating a prepreg or a resin film and a metal foil on the surface of the circuit board prepared up to the step f, and laminating and adhering by heating and pressing, (f2) a step of making a hole, (f3) the inside of the hole And the step of plating the entire surface,
(F4) a step of forming an etching resist for forming a current protection element on the surface of the metal foil, (f5) a step of etching away the metal foil exposed from the etching resist, and (g) at the hole. A method of manufacturing a current protection element module, comprising a step of cutting the hole into two curved surfaces that are hollowed out into a semi-cylindrical shape. 12. The method for manufacturing a current protection element module according to claim 6, further comprising a step of passing a constant amount of current through the current protection element for a predetermined time after step g. Law. 13. (a) The thickness of the metal foil on one side is 3 to 8 μm.
The process of making holes in the double-sided metal foil-clad laminate,
(B) a step of forming a plating resist except for a portion to be an electrode, (c) a step of plating to a required thickness,
(D) a step of removing the plating resist, (e) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f)
A step of etching away the metal foil having a thickness of 3 to 8 μm exposed from the etching resist, (f6) a step of separately producing an insulating coated base material having a hole at the position of the current protection element, (f7) step f A step of stacking an insulating coating base material and a single-sided metal-clad laminate on the surface of the circuit board prepared up to, and heating and pressurizing to laminate-bond, (f8) a step of making a hole in the laminate-bonded material, ( f9) a step of plating the inner wall and the entire surface of the hole, (f10) a step of forming an etching resist on the surface and removing metal exposed from the etching resist, and (g) at the hole, the hole is divided into two parts. A method of manufacturing a current protection element module, comprising a step of cutting into curved surfaces that are hollowed out in a semi-cylindrical shape. 14. (a1) 10 to 10 on at least one surface
A first copper layer having a thickness in the range of 50 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or its alloy layer having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having the above with a second copper layer in contact with an insulating substrate to produce a double-sided metal-clad laminate, (a2) a step of etching away the first copper layer, (a4) an intermediate layer To remove the second copper layer by etching to remove the second copper layer, (b) a step of forming a plating resist excluding a portion to be an electrode, (c) a step of plating to a required thickness, (d) A step of removing the plating resist, (e) a step of forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f) a step of exposing the etching resist from 3 to 3
Etching away a metal foil having a thickness of 8 μm,
(F6) Separately, a step of producing an insulating coating base material having a hole at the position of the current protection element, (f7) an insulating coating base material and a single-sided metal-clad laminate on the surface of the circuit board produced up to step f. And (f8) a step of forming a hole in this laminated and bonded product, (f9) a step of plating the inner wall of the hole and the entire surface, and (f10) an etching resist on the surface. And removing the metal exposed from the etching resist by etching, (g)
The method for manufacturing a chip-type current protection element module according to claim 7, further comprising a step of dividing the hole into two curved surfaces that are hollowed out into two semi-cylindrical shapes. 15. (a1) 10 to 10 on at least one surface
A first copper layer having a thickness in the range of 50 μm, a second copper layer having a thickness in the range of 3 to 8 μm, and nickel or its alloy layer having a thickness of 1 μm or less as an intermediate layer between the two copper layers. A step of laminating a metal foil having the above with a second copper layer in contact with an insulating substrate to produce a double-sided metal-clad laminate, (a2) a step of etching away the first copper layer, (a4) an intermediate layer Removing the second copper layer by etching, and (e) forming an etching resist for forming a current protection element on the surface of the metal foil having a thickness of 3 to 8 μm, (f) A step of etching away the metal foil having a thickness of 3 to 8 μm exposed from the etching resist, (f6) a step of separately producing an insulating coated base material having a hole at the position of the current protection element, (f7) step f Insulation coating on the surface of the circuit board manufactured up to And wood, and a single-sided metal-clad laminate, stacked, laminating adhesive by heating and pressing,
(F8) A step of making a hole in this laminated and adhered product,
(F9) A step of plating the inner wall of the hole and the entire surface, (f1
0) A step of forming an etching resist on the surface and etching away the metal exposed from the etching resist, and (g) a step of cutting the hole into two semi-cylindrical curved surfaces. 8. The method for manufacturing a chip-type current protection element module according to claim 7, further comprising: 16. A resin material having a low softening point is formed only in a thickness of 5 to 30 μm on the surface of the insulating coating base material having a hole at the position of the current protection element.
17. The method for manufacturing a current protection element module according to any one of items 1 to 16. 17. Of the insulating coated substrate, 5-30 μm of the surface
The resin material having a low softening point of m in thickness is a copolymer of ethylene and tetrafluoroethylene, and the material of the other portion is a polytetrafluoroethylene resin. Current protection device module manufacturing method.