JPH0992573A - Composite electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite electronic part which can be enhanced in mounting density on a circuit, board and easily manufactured. SOLUTION: A laminated ceramic capacitor 1 is laid on a laminated ceramic capacitor 2, the terminal electrodes 1a and 1b of the laminated ceramic capacitor 1 are connected to the terminal electrodes 3 and 5 of a lead frame by soldering, and the terminal electrodes 2a and 2b of the laminated capacitor 2 are connected to the terminal electrodes 4 and 6 of the lead frame.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component in which a plurality of electronic components are stacked in multiple stages.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and high performance of electronic equipment, further miniaturization of electronic parts constituting the electronic equipment has been required. To meet this demand, single electronic components such as miniaturized large-capacity laminated ceramic capacitors, composite electronic components that combine individual electronic components with different shapes, dielectrics and ferrite beads that compose capacitors There has been proposed a composite electronic component or the like in which magnetic bodies constituting the above are laminated.

[0003]

However, when a miniaturized single electronic component is mounted on a circuit board, a large number of electronic components having different characteristics are generally mounted. In that case, the entire circuit board is mounted. There is a problem that the area becomes large. On the other hand, when a composite electronic component is mounted on a circuit board, the characteristics of a plurality of electronic components can be obtained simultaneously or in a composite manner on the circuit board depending on how the terminal electrodes of the composite electronic component are connected. However, a composite electronic component in which electronic components having different shapes are combined with each other tends to have a complicated structure, which makes manufacturing technology difficult to mass-produce and tends to cause a relatively high price. In addition, in a composite electronic component in which a dielectric substance and a magnetic substance are laminated,
When a dielectric material and a magnetic material are laminated and fired at the same time, there is a manufacturing difficulty such as cracking due to a difference in contraction rate between the dielectric material and the magnetic material.

In view of the above circumstances, it is an object of the present invention to provide a composite electronic component which has a high mounting density on a circuit board and is easy to manufacture.

[0005]

MEANS TO SOLVE THE PROBLEMS A composite electronic component of the present invention which achieves the above object is: (1) A plurality of flat plate-shaped electrons having electrodes at both ends, which are stacked in such a manner that their electrodes are not in contact with each other. Component (2) Extends over the electrodes of the plurality of electronic components at both ends of each of the plurality of stacked electronic components, and connects with terminals of any one of the plurality of electronic components different from each other. A plurality of lead frame terminals electrically connected to each other are provided.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. The present invention is not limited to the description of this embodiment. 1 is a perspective view of a composite electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the composite electronic component shown in FIG. 1, and FIG. 3 is a view showing a joint portion in the composite electronic component shown in FIG. Is.

The composite electronic parts shown in FIGS. 1 and 2 have outer dimensions of 5.7 mm × 5.0 mm (5750 type), and the temperature characteristics of capacitance are JIS standard EJ characteristics (-25 to +8).
ΔC / C (capacity change rate) is +20 to −55 at 5 ° C.
%), A rated voltage of 25 V, a nominal electrostatic capacity of 10 μF, and an external dimension of 5.7 mm × 5.0.
mm (5750 type), JIS temperature characteristics of capacitance
Standard RB characteristics (ΔC / C is within ± 15% at -55 to + 125 ° C), rated voltage 50V, nominal capacitance 1μF
And the monolithic porcelain capacitor 2 are stacked in two stages.

Terminal electrodes 1a and 1b are formed on both ends of the laminated ceramic capacitor 1 in the longitudinal direction, and terminal electrodes 2a and 2 are formed on both ends of the laminated ceramic capacitor 2 in the longitudinal direction.
b is formed. Part of the terminal electrodes 1a and 1b of the laminated ceramic capacitor 1 and the lead frame terminals 3 and 5 are soldered with high temperature solder 7 (melting point 295 ° C.). In addition, the terminal electrodes 2a and 2b of the laminated ceramic capacitor 2
And a part of the lead frame terminal electrodes 4 and 6 are soldered with high temperature solder 7. Each of these lead frame terminal electrodes 3, 4, 5, 6 has a thickness of 0.1 mm,
It is a terminal electrode in which a copper base material having a width of 2.0 mm is surface-treated by solder plating.

Further, as shown in FIGS. 2 and 3, part of the terminal electrodes 1a and 1b of the laminated ceramic capacitor 1 other than the soldered part and the lead frame terminal electrode 4,
6 and 6 are joined by an insulating adhesive 8 (silicon resin). In addition, the terminal electrodes 2a and 2b of the laminated ceramic capacitor 2
A part other than the soldered part and the lead frame terminals 3 and 5 are joined by an insulating adhesive 8. In addition, as shown in FIG.
The lower surface and the upper surface of No. 2 are joined with an insulating adhesive 8.

FIG. 4 is a plan view showing an example of a land pattern for mounting on the circuit board of the composite electronic component shown in FIG. The lead frame terminal electrodes 3 and 5 electrically connected to the multilayer ceramic capacitor 1 are soldered to the land patterns a and c shown in FIG. 4, and the land patterns b and d are electrically connected to the multilayer ceramic capacitor 2. The connected lead frame terminal electrodes 4 and 6 are soldered.

Here, five composite electronic parts described above were manufactured and mounted on a circuit board, and the characteristics of these composite electronic parts were examined. The results are shown in Table 1.

[0012]

[Table 1]

As is clear from Table 1, the characteristics of the laminated ceramic capacitor 1 between the land patterns a and c and the characteristics of the laminated ceramic capacitor 2 between the land patterns b and d were obtained at the same time. Further, by connecting the land pattern a and the land pattern b and connecting the land pattern c and the land pattern d, the laminated ceramic capacitors 1 connected in parallel between the land patterns a and b and the land patterns c and d. , 2 are obtained. Further, by connecting the land pattern c and the land pattern b, the characteristics of the laminated ceramic capacitors 1 and 2 connected in series can be obtained between the land pattern a and the land pattern d.

As described above, in the composite electronic component of this embodiment, the required characteristics of the laminated ceramic capacitors 1 and 2 can be obtained simultaneously or in combination from the lead frame terminal electrodes 3, 4, 5, and 6. . Also, the outer dimensions are 5.7 mm.
The composite electronic component of the present embodiment can be mounted in the same mounting area as when mounting a × 5.0 mm (5750 type) laminated ceramic capacitor alone.

In this embodiment, the silicon resin is used as the insulating adhesive 8. However, the insulating adhesive 8 is not limited to silicon resin, and an insulating plate such as a ceramic plate is used instead of the insulating adhesive 8. You may. Further, in the present embodiment, two laminated ceramic capacitors having different characteristics are used, but the present invention is not limited to two and is not limited to the laminated ceramic capacitor, and has a terminal electrode other than the laminated ceramic capacitor. It can be applied to other electronic components such as capacitors, resistors, coils, diodes, and ICs.

In this way, a plurality of electronic components having the terminal electrodes are stacked, and the plurality of electronic components are extended at both ends of the stacked electronic components so as to extend over the electrodes of the plurality of electronic components. Of the different ones of the electronic components, the plurality of lead-claim terminals electrically connected to the terminals are provided, and the surface-mountable single composite electronic component has the characteristics of the plurality of electronic components at the same time. Alternatively, it can be obtained as a composite and can be mounted on a circuit board with high density, and it is difficult to mass-produce by combining electronic components of different shapes with each other in the conventional technology, and the shrinkage rate when stacking a dielectric and a magnetic material. There is no problem such as the occurrence of cracks due to the difference in the above, and the manufacturing is easy.

[0017]

As described above, in the composite electronic component of the present invention, (1) since a plurality of electronic components having the required characteristics are stacked, it is easy to manufacture and one component is used for each component. The characteristics of the electronic components can be obtained simultaneously, or the combined characteristics of each electronic component can be obtained.

(2) The mounting density of the circuit board is increased. (3) Since the number of components on the circuit board is reduced, the manufacturing time of the circuit board can be shortened and the mounting cost can be reduced. (4) Since the lead frame terminal electrode is used in the solder joint portion with the circuit board, it has excellent heat resistance, thermal shock resistance, and board bending resistance during soldering.

[Brief description of drawings]

FIG. 1 is a perspective view of a composite electronic component according to an embodiment of the present invention.

FIG. 2 is a sectional view of the composite electronic component shown in FIG.

FIG. 3 is a diagram showing a joint portion in the composite electronic component shown in FIG.

FIG. 4 is a plan view showing an example of a land pattern for mounting on the circuit board of the composite electronic component shown in FIG.

[Explanation of symbols]

 1, 2 laminated ceramic capacitors 1a, 1b, 2a, 2b terminal electrodes 3, 4, 5, 6 lead frame terminal electrodes 7 high temperature solder 8 insulating adhesive

Claims (1)

[Claims] 1. A plurality of flat plate-shaped electronic components having electrodes at both ends, the electrodes being stacked in a non-contact state with each other, and the plurality of electronic components at each of the ends of the stacked electronic components. A plurality of lead frame terminals electrically connected to terminals of any one of the plurality of electronic components different from each other, Electronic components.