JPH09263082A - Manufacture of ic module, manufacture of ic card, and ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an IC card and an IC module contained in the IC card at a low cost by reinforcing. SOLUTION: An LSI mounted part by a TAB system is constituted wherein a TAB tape in which a substrate 2 (125μm thick polyimide) and a wiring pattern 1 with a conductor (25μm thick copper foil/tin plating) are bonded, is provided, and further an LSI 15 (250μm thick) is electrically connected to the wiring pattern 1 via a bump 4 (18μm thick). Further the LSI mounted part is sealed with a sealer 3 consisting of a thermosetting resin as protection for a surface of the LSI 5. Herein, a stainless foil (SUS foil) 6 of 20μm thickness is bonded to a rear face of the LSI 5 of the LSI mounted part as a reinforcing sheet. Thereby, bending strength of the LSI mounted part becomes about two times, and strength of an IC module is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module, a method for manufacturing the IC module and a method for manufacturing an IC card having the IC module therein.

[0002]

2. Description of the Related Art Conventionally, in the case of reinforcing a thin device having an IC module in which an integrated circuit is mounted, especially a contact type IC card or a non-contact type IC card, the card is put in a card case for reinforcement. Has become. Also,
In some cases, a metal plate may be placed on the surface of the card to make it hard, or a metal may be placed on the outer periphery of the card to prevent the card from bending and reinforce the card.

[0003]

However, according to the reinforcing method with the card case as described above, there is a problem that the card case itself becomes thick and it is difficult to carry, and it is necessary to take out the card from the case each time it is used. However, there is a problem that it is very inconvenient to handle.

Further, in the case of the reinforcing method of disposing a metal plate on the surface of the card, when it is applied to a non-contact type IC card such as a wireless card, there is a problem that wireless communication is disabled due to the influence of the metal plate. It was

Therefore, the present invention has been made in view of the above circumstances, and an IC card and an IC module incorporated in the IC card can be reinforced and manufactured at low cost without impairing the card function. IC card and I
It is an object to provide a method for manufacturing a C module.

[0006]

In order to solve the above problems, a method of manufacturing an IC module according to the present invention is a method of manufacturing an IC module in which an IC module on which an integrated circuit is mounted is reinforced and manufactured. After mounting on the substrate, a reinforcing plate is arranged on at least one surface of the mounting portion.

Thus, in the IC module, after mounting the integrated circuit, the reinforcing plate is arranged on at least one surface of the mounting portion for reinforcement.

The method of manufacturing an IC module according to the present invention is a method of manufacturing an IC module in which an IC module on which an integrated circuit is mounted is reinforced, and a reinforcing plate is bonded to one surface of the integrated circuit before mounting. The method is characterized in that the IC module is reinforced and manufactured by a step and a step of mounting an integrated circuit to which a reinforcing plate is adhered by the step on a substrate.

Thus, the IC module is reinforced by bonding the reinforcing plate to one surface of the integrated circuit before mounting the integrated circuit.

Further, in order to solve the above-mentioned problems, in the method of manufacturing an IC card according to the present invention, the mounting portion of the integrated circuit is reinforced by a reinforcing plate to form an IC module, and the reinforced IC module is filled in a predetermined manner. It is characterized in that an IC card is manufactured by forming a card using a resin and a card base material.

Thus, the IC card is reinforced by converting the IC module whose mounting portion is reinforced into a card.

In the method of manufacturing an IC card according to the present invention, an IC module in which an integrated circuit is mounted is filled with a filling resin, and a predetermined card base material is laminated on the filling portion to form a card. In the method for manufacturing an IC card, the reinforcing plate is arranged at a portion corresponding to the mounting portion of the integrated circuit between the filling portion and the card base material for reinforcement, and the IC card is manufactured. It is characterized by

Thus, the IC card is reinforced by arranging the reinforcing plate at a portion corresponding to the mounting portion of the integrated circuit between the filling portion and the card base material at the stage of making the IC module into a card. It

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments show one aspect of the present invention, and do not limit the present invention and can be arbitrarily modified within the scope of the present invention.

(First Embodiment) First, a first embodiment of the present invention will be described.

In this embodiment, for example, a method of reinforcing and manufacturing an IC module applied to a non-contact type IC card will be described.

The IC module described in this embodiment is
The mounting portion has an integrated circuit (hereinafter referred to as “LSI”) and a chip capacitor (not shown), and an antenna coil (not shown) is electrically connected to the mounting portion by soldering to form a wireless module. It is made. Also,
This IC module is built in a card having a thickness of 0.76 mm and applied to a non-contact type IC card, for example.

FIGS. 1 and 2 are for explaining a method of reinforcing and manufacturing an IC module when an LSI is mounted by a TAB method. In these figures, only the mounting portion of the LSI is shown. 1 shows the LSI mounting portion before the reinforcement, and FIG. 2 shows the LSI mounting portion after the reinforcement.

As shown in FIG. 1, L according to the TAB method is used.
The SI mounting part is a wiring pattern 1 (copper foil / tin plating, 25 μm) made of a substrate 2 (polyimide 125 μm thick) and a conductor.
Thickness) and a TAB tape bonded to each other, and an LSI 5 (250 μm thick) is electrically connected to the wiring pattern 1 via bumps 4 (18 μm thick). Further, the LSI mounting portion is sealed with a sealant 3 made of a thermosetting resin to protect the surface of the LSI 5.

In such a mounted state, the LSI 5
Since the back surface of the LSI is exposed, the mounting portion of the LSI 5 is vulnerable to mechanical stress.

Therefore, in the present invention, as shown in FIG. 2, a stainless steel foil (SUS foil) 6 having a thickness of 20 μm is bonded to the back surface of the LSI 5 as a reinforcing plate. As a result, the bending strength of the LSI mounting portion is approximately doubled. In addition, SUS foil 6 and LS
For I5 adhesion, a thermosetting adhesive is used.

Bonding of the reinforcing plate to the back surface of the LSI 5 is as follows.
It may be performed after mounting the LSI 5 as described above, or
LSI5 in the bare chip state before I5 is mounted
The SUS foil 6 may be directly adhered to the back surface of the.

FIG. 3 shows a method for manufacturing an IC module by directly adhering and reinforcing the SUS foil 6 to the back surface of the LSI 5 in a bare chip state before the LSI 5 is mounted.

In this manufacturing method, the first transfer sheet 10a is formed by transferring a plurality of LSIs 5 in the wafer shape 11 as they are.
And the second transfer sheet 10b on which the SUS foil 6 has been transferred corresponding to the plurality of LSIs 5 are overlapped and pressed, and further adhered with a thermosetting adhesive, and then the adhered sheets are separated. The LSI 5 is then separated into individual units.
Note that, as the above-mentioned both transfer sheets, for example, a weakly viscous silicon sheet or the like is used.

In this manufacturing method, the plurality of LSIs 5 transferred onto the first transfer sheet 10a are the LSs formed on the wafer by the dicing process.
Although it is cut into a size of I5, the LSI 5 cut into individual shapes at the time of transfer is transferred so as not to collapse from the wafer shape 11.

On the other hand, the SUS foil 6 transferred to the second transfer sheet 10b is formed into a shape slightly smaller than the LSI 5 by etching.
Corresponding to the above, the individual disposing places of the SUS foil 6 are arranged at the same position as the LSI 5.

4 and 5 show a reinforcing portion of the LSI 5 reinforced by this manufacturing method. As shown in these figures, the SUS foil 6 is, for example, a rectangular SUS foil 6a slightly smaller than the LSI 5 or a circular SUS foil 6b.
Is bonded to the LSI 5.

According to such a manufacturing method, it is not necessary to reinforce each mounting portion after mounting the LSI 5, and a large number of LSIs 5 can be reinforced at one time to be manufactured, which is efficient.
In the above, the SUS foil 6 is added to the LSI 5 after the dicing process.
However, the adhesive reinforcement may be performed before the dicing step.

(Second Embodiment) Next, a method of manufacturing an IC module when the LSI 5 is mounted by the wire bonding method will be described.

6 and 7 are for explaining a method of manufacturing an IC module when the LSI 5 is mounted by the wire bonding method, and only the mounting portion of the LSI 5 is shown in these drawings. 6 shows the LSI mounting portion before the reinforcement, and FIG. 7 shows the LSI mounting portion after the reinforcement.

As shown in FIG. 6, in the LSI mounting portion by the wire bonding method, the wiring pattern 1 is formed on the substrate 2, and further the LSI 5 electrically connects the wiring pattern 1 to the wiring pattern 1 via the gold wire 7. Connected and configured. Further, the surface of the LSI 5 is sealed with a sealant 3 made of a thermosetting resin for protection.

In the mounting state shown in FIG. 6, the LS
The I5 mount is vulnerable to mechanical stress.

Therefore, in the present invention, as shown in FIG. 7, in a state where the LSI 5 is mounted, the SUS foil 6 is adhered to the front surface side of the mounting portion of the LSI 5 for reinforcement to manufacture an IC module. In this way, the reinforcement of the mounting portion is effective not only on the back surface of the LSI but also on the front surface side of the LSI 5. Also in this case, the LS is used as in the case of the TAB method.
The I intensity is approximately doubled.

(Third Embodiment) In the case of the wire bonding method, it is also possible to manufacture the IC module by reinforcing the mounting portion using the wiring pattern of the substrate.

8 and 9 are explanatory views for explaining a method of manufacturing an IC module by reinforcing the wiring pattern of the substrate.

In the example shown in FIG. 8, the surface of the substrate 2 (LS
A solid pattern (reinforcing pattern) 1a having a slightly larger area than the LSI 5 is arranged at a position overlapping the LSI 5 on the I mounting surface side to reinforce the mounting portion.

Further, in the example shown in FIG. 7, the reinforcing pattern 9 having an area slightly larger than the sealing area by the sealing agent 3 is arranged at a position overlapping the LSI 5 on the back surface of the substrate 2 (the surface opposite to the LSI mounting surface). And the mounting part is reinforced. 8 and 9
Both examples of L
The mechanical strength of the SI mounting part is improved.

According to the first to third embodiments described in detail above, since the LSI mounting portion is reinforced at the manufacturing stage of the IC module, the mechanical strength of the IC module is improved, and the IC card after being made into a card is improved. Strength is also improved. At this time, L
Since only the SI mounting portion is reinforced, it can be implemented at low cost, and there is no concern that wireless communication will be hindered as in the case where a metal plate is arranged over the entire conventional card.

It should be noted that the effect of the reinforcement of the mounting portions in the first to third embodiments is naturally increased not only by one side but also by both sides.

For example, as shown in FIG. 10, when the LSI 5 is mounted by the TAB method, the SUS foil 6 is adhered to the back surface of the LSI 5 and the SUS foil 6 is applied from above the sealant 3 on the front surface side of the mounting portion. You may make it adhere | attach simultaneously. As a result, the reinforcing effect is further increased.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described.

In this embodiment, an IC card manufacturing method for reinforcing and manufacturing a non-contact type IC card containing an IC module will be described.

FIG. 11 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC card at the stage of making an IC module into a card by a stacking method.

As shown in FIG. 11A, the LSI 5
When the IC module 15 on which is mounted is formed into a card by a stacking method, first, the first filling resin 14 made of, for example, an ultraviolet curable resin is first applied to the IC module 15.
Stepwise filling and curing are performed to form a substantially flat sheet state.

Next, as shown in FIG. 11 (b), a front sheet (P as a card base material which becomes the front and back outer shapes of the card).
A flat sheet that has been filled and cured in the first step is sandwiched between an ET sheet) 12 and a back sheet (PET sheet) 13, and a second filling resin 16 made of, for example, a thermosetting resin is poured into the gap. , Both sheets are cured by heat and pressure to be integrated. Finally, the IC card is molded by cutting at a predetermined cutting position 17.

Cards are formed through the above steps. In this step, the SUS foil 6 is adhered to at least one of the front and back sheets 12 and 13 in advance to reinforce the IC card. Can be performed (adhered to the front sheet 12 side in FIG. 11). Further, the SUS foil 6 is adhered to a portion corresponding to the LSI mounting portion, so that the SU is attached to the LSI mounting portion after being made into a card.
Since the S foil 6 is arranged, the strength of the LSI mounting portion is improved.

In the above, the SUS foil 6 is covered with the front sheet 12.
Was adhered to the sheet, but without adhering this SUS foil 6 to the sheet,
Similar effects can be obtained by simply sandwiching them between the layers.
Further, the SUS foil 6 may be arranged on the LSI mounting portion before the first-stage filling / curing with the filling resin 14.

In this case, as shown in FIG. 12, in order to prevent the SUS foil 6 arranged in the mounting portion from being washed away by the filling resin 14 when filling the filling resin 14,
It is preferable that the shape of the US foil 6 is partially matched with the shape of the LSI mounting portion and is locked to the mounting portion. As a result, the SUS foil 6 is surely arranged in the LSI mounting portion and a reinforcing effect is obtained.

According to this embodiment described in detail above, in the IC card having the IC module built therein, the portion corresponding to the LSI mounting portion of the IC module is reinforced,
The strength of the IC card is improved. Further, at this time, since only the portion corresponding to the LSI mounting portion is reinforced, it can be implemented at low cost, and there is no fear that wireless communication will be hindered as in the case of disposing a metal plate over the entire conventional card.

[0050]

According to the present invention described in detail above, since the mounting portion of the integrated circuit in the IC module is reinforced after mounting or before mounting, the mechanical strength of the mounting portion of the integrated circuit is improved and the integrated circuit It can prevent cracking.

Further, since the IC card is reinforced by making the IC module whose mounting portion is reinforced into a card, the mechanical strength of the IC card is improved and the crack of the integrated circuit can be prevented. Further, at this time, since only the mounting portion is reinforced, it can be carried out at a lower cost than the conventional metal reinforcement is applied to the entire surface of the card, and the card function such as wireless communication of the non-contact type IC card is hindered. Nothing.

[Brief description of drawings]

FIG. 1 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when an LSI is mounted by a TAB method.

FIG. 2 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when an LSI is mounted by a TAB method.

FIG. 3 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when the LSI is directly reinforced before mounting.

FIG. 4 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when the LSI is directly reinforced before mounting.

FIG. 5 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when an LSI is directly reinforced before mounting.

FIG. 6 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when an LSI is mounted by a wire bonding method.

FIG. 7 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when an LSI is mounted by a wire bonding method.

FIG. 8 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when an LSI is mounted by a wire bonding method.

FIG. 9 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC module when an LSI is mounted by a wire bonding method.

FIG. 10 is an explanatory diagram for explaining a method for reinforcing and manufacturing an IC module when the mounting portion is reinforced not only on one side but also on both sides.

FIG. 11 is an explanatory diagram for explaining a method for manufacturing by reinforcing an IC card and an IC module at the stage of making a card.

FIG. 12 is an explanatory diagram for explaining a method of reinforcing and manufacturing an IC card and an IC module at the stage of making a card.

[Explanation of symbols]

 1 Wiring pattern 2 Substrate 3 Sealant 5 LSI 6 SUS foil (reinforcing plate)

Claims (12)

[Claims] 1. A method for manufacturing an IC module for reinforcing an IC module on which an integrated circuit is mounted for manufacturing, comprising mounting a reinforcing plate on at least one surface of a mounting portion after mounting the integrated circuit on a substrate. A method for manufacturing a characteristic IC module. 2. A method of manufacturing an IC module for reinforcing an IC module on which an integrated circuit is mounted, the method comprising: bonding a reinforcing plate to one surface of the integrated circuit before mounting; and bonding the reinforcing plate by this step. And a step of mounting the integrated circuit on a substrate. The method for manufacturing an IC module is characterized in that the IC module is reinforced and manufactured. 3. A method of manufacturing an IC module for reinforcing and manufacturing an IC module on which an integrated circuit is mounted, comprising:
Transferring the plurality of reinforcing plates onto the second transfer sheet corresponding to the plurality of wafer-shaped integrated circuits, the first transfer sheet and the second transfer sheet A step of adhering sheets to integrate a plurality of integrated circuits and a plurality of reinforcing plates transferred onto both sheets; and a plurality of integrated circuits and a plurality of reinforcing plates integrated by this step from the both sheets. Characterized in that the IC module is reinforced and manufactured by the steps of separating and separating into a single integrated circuit, and mounting the single integrated circuit formed by this step on a predetermined substrate. IC module manufacturing method. 4. A method of manufacturing an IC module for reinforcing an IC module on which an integrated circuit is mounted, wherein a reinforcing pattern for reinforcing the integrated circuit is provided on a mounting surface side of a wiring board on which the integrated circuit is mounted. Characterized in that the IC module is reinforced and manufactured by including a step of forming the wiring pattern of the wiring board and a step of disposing and mounting the integrated circuit on the reinforcing pattern formed by this step. IC module manufacturing method. 5. A method of manufacturing an IC module for reinforcing an IC module on which an integrated circuit is mounted, wherein a reinforcing pattern for reinforcing the integrated circuit is provided on a back surface side of a wiring board on which the integrated circuit is mounted. The IC module is reinforced by having a step of forming the wiring pattern of the wiring board and a step of disposing and mounting the integrated circuit at a position on the mounting surface side corresponding to the reinforcing pattern formed by this step. A method for manufacturing an IC module, which is characterized by manufacturing. 6. An IC card is manufactured by reinforcing a mounting portion of an integrated circuit with a reinforcing plate to form an IC module, and converting the reinforced IC module into a card using a predetermined filling resin and a card base material. A method of manufacturing an IC card, comprising: 7. An IC card manufacturing method for manufacturing an IC card in which a filling resin is filled in an IC module having an integrated circuit mounted thereon, and a predetermined card base material is laminated in the filling portion to form a card. Reinforce by placing a reinforcing plate in the portion corresponding to the mounting portion of the integrated circuit between the filling portion and the card substrate,
A method of manufacturing an IC card, which comprises manufacturing the IC card. 8. A portion corresponding to a mounting portion of the integrated circuit between the filling portion and the card base by adhering the reinforcing plate to the card base in advance before stacking the card base. The method of manufacturing an IC card according to claim 7, wherein the IC card is reinforced. 9. An IC card manufacturing method for manufacturing an IC card in which a filling resin is filled in an IC module having an integrated circuit mounted thereon, and a predetermined card base material is laminated in the filling portion to form a card. A step of placing a reinforcing plate that engages with the mounting portion of the integrated circuit before filling the filling resin; and a step of placing the reinforcing plate in this step and then filling the filling resin into the IC module. A method of manufacturing an IC card, comprising: 10. An IC module on which an integrated circuit is mounted, wherein after mounting the integrated circuit on a substrate, a reinforcing plate is arranged on at least one surface of the mounting portion.
module. 11. An IC module on which an integrated circuit is mounted, comprising: a reinforcing plate bonded to one surface of the integrated circuit before mounting; and a substrate on which the integrated circuit bonded to the reinforcing plate is mounted. Characteristic IC module. 12. In an IC module on which an integrated circuit is mounted, a board having a reinforcing pattern for reinforcing the integrated circuit formed on the back surface side of the wiring board on which the integrated circuit is mounted, and the board corresponding to the reinforcing pattern. An integrated circuit arranged at a position on the mounting surface side.