JPH09159412A - Positioning method - Google Patents
Positioning methodInfo
- Publication number
- JPH09159412A JPH09159412A JP7344976A JP34497695A JPH09159412A JP H09159412 A JPH09159412 A JP H09159412A JP 7344976 A JP7344976 A JP 7344976A JP 34497695 A JP34497695 A JP 34497695A JP H09159412 A JPH09159412 A JP H09159412A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- detection point
- detection
- detected
- patterns
- Prior art date
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- Pending
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/06179—Corner adaptations, i.e. disposition of the bonding areas at the corners of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Image Processing (AREA)
- Wire Bonding (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は位置決め方法に関
し、特に半導体チツプ上の電極とリード端子とをワイヤ
で結線するワイヤボンデイング処理で用いて好適なもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning method, and is particularly suitable for use in a wire bonding process for connecting an electrode on a semiconductor chip and a lead terminal with a wire.
【０００２】[0002]
【従来の技術】従来におけるワイヤボンデイング装置に
おいては、多種多様のチツプサイズに対応できるように
するため、ワイヤボンデイング動作の前に先だつて、半
導体チツプの基準位置（検出点）をワイヤボンデイング
装置に教え込むようになされている。これを図５に示す
従来の半導体チツプを用いて説明する。例えば図５に示
す半導体チツプモデルの場合、半導体チツプ１の四隅の
うち対角位置に位置する２つの角部に検出用のパツド
２、３を設け、その一角を検出点として画像認識装置を
通してワイヤボンデイング装置に教え込むようになされ
ていた。2. Description of the Related Art In a conventional wire bonding apparatus, in order to cope with various chip sizes, a reference position (detection point) of a semiconductor chip is taught to the wire bonding apparatus prior to a wire bonding operation. It is done like this. This will be described with reference to the conventional semiconductor chip shown in FIG. For example, in the case of the semiconductor chip model shown in FIG. 5, detection pads 2 and 3 are provided at two corners of the four corners of the semiconductor chip 1 which are located at diagonal positions, and one of the corners is used as a detection point for wire bonding through an image recognition device. It was designed to teach the device.
【０００３】[0003]
【発明が解決しようとする課題】ただし半導体チツプ１
上にはこれら検出用のパツド２、３の他に多数のパツド
４が存在するため前述の検出点を決めるには人の目で識
別するしか方法がなかつた。However, the semiconductor chip 1
Since there are a number of pads 4 in addition to these detection pads 2 and 3, the only way to determine the above-mentioned detection points is to identify them with human eyes.
【０００４】本発明は以上の点を考慮してなされたもの
で、これら検出点の入力を自動化し効率良く作業を進め
ることができる位置決め方法を実現しようとするもので
ある。The present invention has been made in consideration of the above points, and it is an object of the present invention to realize a positioning method in which the input of these detection points is automated and the work can be efficiently advanced.
【０００５】[0005]
【課題を解決するための手段】かかる課題を解決するた
め本発明においては、被ボンデイング体に設けられた複
数個の第１ボンデイング部と、上記第１ボンデイング部
に対応する複数個の第２ボンデイング部とをワイヤで結
線するワイヤボンデイング装置における位置決め方法に
おいて、被ボンデイング体の撮像画面中から周囲のパタ
ーンとは異なる特異な形状の検出点パターンを画像処理
により検出し、当該検出された複数個の検出点パターン
それぞれの位置と向きの関係から検出されたパターンが
真に検出点パターンに該当するか否かを判定するように
する。このように画像処理によつて求められた各検出点
パターンの向きから相互間の関係を判別してパターンが
真に検出点パターンか否か判定するようにしたことによ
り、ユーザがパターンを指定しなくても自己判定が可能
になる。In order to solve the above problems, according to the present invention, a plurality of first bonding portions provided on a body to be bonded and a plurality of second bonding portions corresponding to the first bonding portions. In a positioning method in a wire bonding apparatus for connecting a part to a wire with a wire, a detection point pattern having a unique shape different from a surrounding pattern is detected by image processing in an imaging screen of a body to be bonded, and a plurality of the detected plural patterns are detected. It is determined whether or not the detected pattern truly corresponds to the detection point pattern based on the relationship between the position and the direction of each detection point pattern. In this way, the relationship between the detection point patterns obtained by the image processing is discriminated from each other to determine whether or not the patterns are truly detection point patterns. Even without it, self-determination is possible.
【０００６】[0006]
【発明の実施の形態】以下図面について、本発明の一実
施例を詳述する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.
【０００７】（１）装置構成 図１にワイヤボンデイング装置の全体構成を示す。なお
ワイヤボンデイング装置１１はボンデイングステージ１
２の上面において２つのボンデイング点間をボンデイン
グする。ここでは半導体チツプ１３のパツドとリード端
子１４とをボンデイングする。これら２つのボンデイン
グ点間を接続するワイヤ１５はボンデイングステージ１
２の上方から所定の位置に供給され、ボンデイングへツ
ド１６の超音波振動源からボンデイングアーム１７を介
して伝達される超音波振動エネルギーによつて金属圧接
されるようになされている。(1) Device Configuration FIG. 1 shows the overall configuration of the wire bonding device. The wire bonding device 11 is the bonding stage 1
Bond between the two bonding points on the upper surface of 2. Here, the pad of the semiconductor chip 13 and the lead terminal 14 are bonded. The wire 15 connecting between these two bonding points is the bonding stage 1
2 is supplied to a predetermined position from above, and metal is pressure-welded by ultrasonic vibration energy transmitted from the ultrasonic vibration source of the bonding head 16 through the bonding arm 17.
【０００８】なおボンデイングヘツド１６はＸＹステー
ジ１８によつて水平面内を自由に移動できるようになさ
れ、ワイヤ１５をボンデイング点の上方位置に正確に移
動できるようになされている。ところでこのワイヤ１５
の位置決めにはボンデイング点の位置が予め正確に認識
されていることが必要となる。これにはボンデイングス
テージ１２の上面を撮像する撮像カメラ１９が用いられ
る。The bonding head 16 can be freely moved in a horizontal plane by an XY stage 18, and the wire 15 can be accurately moved to a position above the bonding point. By the way, this wire 15
The position of the bonding point needs to be accurately recognized in advance. An image pickup camera 19 for picking up an image of the upper surface of the bonding stage 12 is used for this.
【０００９】撮像カメラ１９で撮像されたリードフレー
ム及び半導体チツプの拡大像は画像処理部２０に取り込
まれ、基準位置となる特徴点が画像認識処理により検出
される。ボンデイング機構制御部２１はこの画像処理部
２０の検出結果を基に、ボンデイング対象であるボンデ
イング点の基準位置を特定し、当該基準位置を基にＸＹ
テーブル制御部２２にＸＹテーブル１８の駆動指令を出
すようになされている。The enlarged images of the lead frame and the semiconductor chip taken by the image pickup camera 19 are taken into the image processing section 20, and the characteristic point as the reference position is detected by the image recognition processing. The bonding mechanism control unit 21 identifies the reference position of the bonding point, which is the bonding target, based on the detection result of the image processing unit 20, and XY is determined based on the reference position.
A command for driving the XY table 18 is issued to the table control unit 22.
【００１０】（２）検出用パターン 図２にワイヤボンデイング点を与える基準位置（検出
点）の自動検出を実現するために設けた新たな検出用パ
ターンを示す。なおこの図は半導体チツプの四隅のうち
検出用パターンが設けられている隅部の拡大構成を表し
ている。この例の特徴の一つは、基準位置（検出点）を
与えるパツド１３Ａに一部アルミ箔がはぎとられてシリ
コン地肌１３Ｂが表面から露出するようにして周囲のパ
ツド１３Ｃと画像認識処理に供するパターンとを違えた
点である。またもう一つの特徴は、同じくリード１４Ｂ
上に検出用の穴１５、１６を設けて周囲のリード１４Ａ
と画像認識処理に供するパターンとを違えた点である。
これら２つの検出用パターンにより、画像処理部２０は
各基準位置である検出点を画像認識で容易に検出できる
ようになつている。(2) Detection Pattern FIG. 2 shows a new detection pattern provided to realize automatic detection of a reference position (detection point) that gives a wire bonding point. This figure shows an enlarged structure of the corner of the four corners of the semiconductor chip where the detection pattern is provided. One of the features of this example is that the pad 13A that gives the reference position (detection point) is partially stripped of the aluminum foil so that the silicon background 13B is exposed from the surface and the pattern used for the image recognition processing with the surrounding pad 13C. Is the difference. Another feature is the same lead 14B.
The holes 15 and 16 for detection are provided on the upper side and lead 14A around
And the pattern used for the image recognition processing is different.
With these two detection patterns, the image processing unit 20 can easily detect the detection points that are the reference positions by image recognition.
【００１１】（３）判別処理 続いて画像処理部２０における判別処理の内容を説明す
る。ここで画像処理部２０はこれら検出用パターンを周
囲のパツド１３Ｃと区別するため２つの検出用パターン
の重心間距離を算出する。この自動判別の様子を図３及
び図４を用いて説明する。なお図３は本例に係る半導体
チツプ１３のモデルを表している。なお半導体チツプ１
３上に形成された検出用パターンについての処理もリー
ド１４Ａについての処理も同様の処理がなされるため、
ここでは半導体チツプ１３上に形成された検出用パター
ンを例に説明する。(3) Discrimination Processing Next, the contents of the discrimination processing in the image processing unit 20 will be described. Here, the image processing unit 20 calculates the distance between the centers of gravity of the two detection patterns in order to distinguish these detection patterns from the surrounding pads 13C. The state of this automatic determination will be described with reference to FIGS. 3 and 4. 3 shows a model of the semiconductor chip 13 according to this example. Semiconductor chip 1
Since the processing for the detection pattern formed on 3 and the processing for the lead 14A are the same,
Here, the detection pattern formed on the semiconductor chip 13 will be described as an example.
【００１２】図４を用いて説明する。画像処理部２０は
撮像カメラ１９によつて撮像された画像の中から検出用
パターンと思われるパターンを検出し、各パターンの重
心位置１３ＡＧ１、１３ＢＧ１、１３ＡＧ２、１３ＢＧ
２を求める。このように各パターンの重心位置が求めら
れると、各パターンごとに各重心を結ぶベクトルＶ１、
Ｖ２を求める。This will be described with reference to FIG. The image processing unit 20 detects a pattern considered to be a detection pattern from the image captured by the imaging camera 19, and detects the center of gravity of each pattern 13AG1, 13BG1, 13AG2, 13BG.
Ask for 2. When the barycentric position of each pattern is obtained in this way, a vector V1 connecting the barycentric points for each pattern,
Find V2.
【００１３】ただしベクトルの向きが一致するようにす
る。このためこの例では、右上隅のパターンについて
は、穴１３Ｂの重心位置１３ＢＧ１を起点とし、パツド
１３Ａの重心位置１３ＡＧ１を矢の先とするようにベク
トルＶ１を定める。一方、左下隅のパターンについて
は、パツド１３Ａの重心位置１３ＡＧ１を起点とし、穴
１３Ｂの重心位置１３ＢＧ２を矢の先とするようにベク
トルＶ２を定める。またこれら２つの検出用パターンの
重心位置のうち最外周に位置する重心位置１３ＡＧ２及
び１３ＡＧ１について、重心位置１３ＡＧ２を起点と
し、重心位置１３ＡＧ１を矢の先とするようにベクトル
Ｖ３を定める。However, the directions of the vectors should match. Therefore, in this example, for the pattern in the upper right corner, the vector V1 is determined so that the center of gravity position 13BG1 of the hole 13B is the starting point and the center of gravity position 13AG1 of the pad 13A is the tip of the arrow. On the other hand, for the pattern at the lower left corner, the vector V2 is determined so that the center of gravity position 13AG1 of the pad 13A is the starting point and the center of gravity position 13BG2 of the hole 13B is the tip of the arrow. Regarding the center of gravity positions 13AG2 and 13AG1 located at the outermost circumference among the center of gravity positions of these two detection patterns, the vector V3 is determined so that the center of gravity position 13AG2 is the starting point and the center of gravity position 13AG1 is the tip of the arrow.
【００１４】そしてこれら３つのベクトルＶ１〜Ｖ３に
ついて、ベクトルＶ１とＶ２、ベクトルＶ２とＶ３、ベ
クトルＶ１とＶ３のなす角θを、次式With respect to these three vectors V1 to V3, the angles θ formed by the vectors V1 and V2, the vectors V2 and V3, and the vectors V1 and V3 are given by
【数１】 によつて求め、各値が規定値以内の場合には検出しよう
としている検出用パターンが見つかつたもの判断する。
なお規定値を越える場合には検出不良が判定されるので
再度、異なる位置について検出用パターンの判定処理が
実行される。このような判定手法を用いることにより、
ボンデイング点を与える基準位置を確実に自動検出する
ことができる。(Equation 1) When each value is within the specified value, it is determined that the detection pattern to be detected is found.
If it exceeds the specified value, the detection failure is determined, and therefore the detection pattern determination process is executed again for different positions. By using such a determination method,
It is possible to reliably and automatically detect the reference position that gives the bonding point.
【００１５】（４）他の実施例 なお上述の実施例においては、半導体チツプ１３の隅部
に設けられる検出用パターンとしてパツド１３Ａ内に正
方形の穴１３Ｂが設けられている場合について述べた
が、本発明はこれに限らず、他の形状、例えばリード側
の検出用パターンと同様に円形の穴が形成されていても
良い。同様に、リード１４Ｂに形成される２つの検出用
パターンとして円形の穴を２つ設ける場合について述べ
たが、本発明はこれに限らず、他の形状、例えば半導体
チツプ側と同様に正方形状であつても良い。(4) Other Embodiments In the above-mentioned embodiments, the case where the square hole 13B is provided in the pad 13A as the detection pattern provided at the corner of the semiconductor chip 13 has been described. The present invention is not limited to this, and other shapes, for example, circular holes may be formed similarly to the lead-side detection pattern. Similarly, the case where two circular holes are provided as the two detection patterns formed on the lead 14B has been described, but the present invention is not limited to this, and another shape, for example, a square shape similar to the semiconductor chip side, is used. You can buy it.
【００１６】また上述の実施例においては、検出用パタ
ーンとして重心を２つもつようなパターンを選定する場
合について述べたが、本発明はこれに限らず、３つ以上
の重心をもつパターンを選定するようにしても良い。さ
らに上述の実施例においては、半導体チツプ１３の対角
位置にある２つの検出用パターンのそれぞれについて得
たベクトルＶ１、Ｖ２と、最外周に位置する２つの重心
を結ぶベクトルＶ３のそれぞれについてなす角θを求め
る場合について述べたが、本発明はこれに限らず、これ
らのうちいずれかについてののみなす角を求めるように
しても良い。Further, in the above-mentioned embodiment, the case of selecting a pattern having two centroids as the detection pattern has been described, but the present invention is not limited to this, and a pattern having three or more centroids is selected. It may be done. Further, in the above-described embodiment, the angles formed by the vectors V1 and V2 obtained for each of the two detection patterns at the diagonal positions of the semiconductor chip 13 and the vector V3 connecting the two center of gravity located at the outermost periphery. Although the case where θ is obtained has been described, the present invention is not limited to this, and an angle formed by only one of these may be obtained.
【００１７】[0017]
【発明の効果】上述のように本発明によれば、ワイヤボ
ンデイング装置における位置決め方法において、被ボン
デイング体の撮像画面中から周囲のパターンとは異なる
特異な形状の検出点パターンを画像処理により検出し、
当該検出された複数個の検出点パターンそれぞれの位置
と向きの関係から検出されたパターンが真に検出点パタ
ーンに該当するか否かを判定するようにしたことによ
り、自動判定を可能にすることができる。As described above, according to the present invention, in the positioning method in the wire bonding apparatus, a detection point pattern having a peculiar shape different from the surrounding pattern is detected by image processing in the image pickup screen of the body to be bonded. ,
Enabling automatic determination by determining whether or not the detected pattern truly corresponds to the detected point pattern from the relationship between the position and orientation of each of the detected plural detected point patterns. You can
【図１】本発明に係る位置決め方法を用いるワイヤボン
デイング装置の全体構成を示すブロツク図である。FIG. 1 is a block diagram showing an overall configuration of a wire bonding apparatus using a positioning method according to the present invention.
【図２】本発明に係る位置決め方法で用いる検出用パタ
ーンの一例を示す略線的平面図である。FIG. 2 is a schematic plan view showing an example of a detection pattern used in the positioning method according to the present invention.
【図３】検出用パターンの全体形状を示す略線的平面図
である。FIG. 3 is a schematic plan view showing the overall shape of a detection pattern.
【図４】画像認識の原理説明に供する略線図である。FIG. 4 is a schematic diagram for explaining the principle of image recognition.
【図５】従来の検出用パターン例を示す略線的平面図で
ある。FIG. 5 is a schematic plan view showing an example of a conventional detection pattern.
【符号の説明】 １……半導体チツプ、２、３、４、１３Ａ、１３Ｃ……
パツド、１１……ワイヤボンデイング装置、１２……ボ
ンデイングステージ、１３……半導体チツプ、１３Ｂ、
１４Ｂ……穴、１４Ａ……リード端子、１５……ワイ
ヤ、１６……ボンデイングへツド、１７……ボンデイン
グアーム、１８……ＸＹステージ、１９……撮像カメ
ラ、２０……画像処理部、２１……ボンデイング機構制
御部、２２……ＸＹテーブル制御部。[Explanation of Codes] 1 ... Semiconductor chip 2, 3, 4, 13A, 13C ...
Pad, 11 ... Wire bonding device, 12 ... Bonding stage, 13 ... Semiconductor chip, 13B,
14B ... hole, 14A ... lead terminal, 15 ... wire, 16 ... bonding head, 17 ... bonding arm, 18 ... XY stage, 19 ... imaging camera, 20 ... image processing unit, 21 ... ... Bonding mechanism controller, 22 ... XY table controller.
Claims (3)
１ボンデイング部と、上記第１ボンデイング部に対応す
る複数個の第２ボンデイング部とをワイヤで結線するワ
イヤボンデイング装置における位置決め方法において、 上記被ボンデイング体の撮像画面中から周囲のパターン
とは異なる特異な形状の検出点パターンを画像処理によ
り検出し、当該検出された複数個の検出点パターンそれ
ぞれの位置と当該検出点パターンごとに定まる向きの関
係から検出されたパターンが真に検出点パターンに該当
するか否かを判定することを特徴とする位置決め方法。1. A positioning method in a wire bonding apparatus for connecting a plurality of first bonding portions provided on a body to be bonded and a plurality of second bonding portions corresponding to the first bonding portions with wires. A detection point pattern having a peculiar shape different from the surrounding pattern is detected by image processing in the image pickup screen of the bonded object, and the position of each of the detected plurality of detection point patterns and the detection point pattern are determined. A positioning method characterized by determining whether or not a pattern detected from a relationship of orientations truly corresponds to a detection point pattern.
み合わせ構造でなることを特徴とする請求項１に記載の
位置決め方法。2. The positioning method according to claim 1, wherein the unique shape is a combined structure of a plurality of graphic patterns.
数の重心位置により当該特異な形状を有するパターンに
固有の向きを検出し、複数の検出点パターンのそれぞれ
について得られた各パターンの向きにより上記複数の検
出点パターン相互間の位置関係が所定の位置関係を満た
すか判別することにより、検出されたパターンが真に求
めようとする検出点パターンか否か判別することを特徴
とする請求項２に記載の位置決め方法。3. An orientation unique to a pattern having the unique shape is detected based on a plurality of barycentric positions determined for the plurality of graphic patterns, and the plurality of orientations are obtained based on the orientation of each pattern obtained for each of the plurality of detection point patterns. 3. It is determined whether or not the detected pattern is a detection point pattern that is to be truly obtained by determining whether or not the positional relationship between the detection point patterns described above satisfies the predetermined positional relationship. Positioning method described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7344976A JPH09159412A (en) | 1995-12-06 | 1995-12-06 | Positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7344976A JPH09159412A (en) | 1995-12-06 | 1995-12-06 | Positioning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09159412A true JPH09159412A (en) | 1997-06-20 |
Family
ID=18373438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7344976A Pending JPH09159412A (en) | 1995-12-06 | 1995-12-06 | Positioning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09159412A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102589431A (en) * | 2012-02-07 | 2012-07-18 | 中国地震局地质研究所 | Automatic detection method for accurate positions and directions of multiple strain foils |
-
1995
- 1995-12-06 JP JP7344976A patent/JPH09159412A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102589431A (en) * | 2012-02-07 | 2012-07-18 | 中国地震局地质研究所 | Automatic detection method for accurate positions and directions of multiple strain foils |
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