JPH0878589A - Boiling/cooling device - Google Patents

Abstract

PURPOSE: To provide a boiling/cooling device of a structure, wherein heat, which is generated from a heating unit like a power device and the like, is effectively dissipated to the atmosphere and the cooling performance of the heating unit is superior. CONSTITUTION: A power pack 16 having a built-in power device 22 and the like is mounted on the outer surface of a cooling tank 13 with a refrigerant 12 encapsulated therein, a heat dissipation part 14 consisting of a hollow cylindrical body is made to communicate to the upper part of the tank 13 and a cooling fan 23 is installed on this heat dissipation part 14. The part 14 is provided at a position deviated from directly over the power pack 16, cooling wind, which is generated by the fan 23, passes through the periphery of the pack 16, is made to pass through the part 14 and the periphery of the pack 16 and the part 14 are simultaneously cooled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for cooling a heating element such as a power element such as an IGBT which constitutes a power control device such as a general-purpose inverter, and is vaporized by the heat generated from the heating element. The present invention relates to a boiling cooling device that cools a liquefied refrigerant in a heat radiating section to liquefy it.

[0002]

2. Description of the Related Art For example, in a general-purpose inverter for variably controlling the rotation speed of an industrial motor, an IGBT (Ins) which is a main device constituting this inverter circuit is used.
integrated-gate bipolar trans
power devices such as istors) are used. Since this type of power element generates a large amount of heat during its operation, for example, it generates about 2.2 KW of heat with a control power of 45 KW, so a cooling device for such a power element is used. Is configured to be attached.

As a cooling device for a power element which generates such a large amount of heat, for example, a boiling cooling device as disclosed in JP-A-5-243438 has been proposed.
This boiling cooling device, a power pack incorporating a heating element such as a power element is attached to a cooling tank containing a refrigerant so that the refrigerant is evaporated and vaporized by the heat generated by the heating element. is there. A heat radiating portion is provided in the upper part of the cooling tank, and a heat radiating fin is provided for this heat radiating portion, so that the heat radiating fin efficiently exchanges heat with the atmosphere. Therefore, the refrigerant vaporized in the cooling tank rises and reaches the heat radiating portion, where it is cooled and condensed, that is, liquefied. Then, the liquefied refrigerant is returned to the cooling tank and heated by the heating element. In this way, the heating element is cooled.

[0004]

By the way, recently, the performance of the power element has increased, and along with this, the amount of heat generated by the power element also tends to increase. For such heat generation effect,
There is a problem in that the cooling performance is insufficient if the heat of the refrigerant is simply radiated from the heat radiating portion through the heat radiating fins as in the above structure.

Therefore, in the boiling cooling device described in the above publication, a cooling fan is provided in the heat radiating portion, and the cooling air generated by the cooling fan is forcibly blow-cooled to the heat radiating portion. With this, the heat of the surfaces of the heat radiating portion and the heat radiating fins is forcibly taken away, so that the heat radiation performance is improved, the condensation action of the refrigerant is promoted, and the overall cooling efficiency is improved.

However, the cooling fan forcibly blows and cools only the heat radiating portion, and such a blowing and cooling action still does not provide sufficient cooling capacity, so that the heat of the heating element is effectively removed. It may not be possible to lower it.

The present invention has been made in view of the above circumstances. A first object of the present invention is to evaporate heat generated by a heating element into the atmosphere efficiently and improve cooling efficiency. Is to provide.

A second object of the present invention is to provide a boiling cooling device which is small in size and compact in size, and which can efficiently dissipate heat generated by a heating element into the atmosphere. It is a thing.

[0009]

According to a first aspect of the present invention, there is provided a boiling cooling device for cooling a heating element, wherein the heating element to be cooled is mounted on one surface or both surfaces, and the heating element is internally provided. A vertical cooling tank containing a refrigerant that is vaporized by the generated heat; one opening surface is sealed, the other opening surface is communicated with the cooling tank, and at least a part of the heating element side or the heating element And a cooling fan provided in the heat radiating portion and guiding cooling air to the heat radiating portion;

A second aspect of the present invention is the boiling cooling apparatus according to the first aspect, wherein the cooling fan guides cooling air to the heat radiating portion and the heat generating body at the same time. A third aspect of the present invention is the boiling cooling device according to the first or second aspect, wherein the cooling fan guides cooling air to the heat radiating portion and the vertical cooling tank at the same time.

According to a fourth aspect of the present invention, the cooling fan guides the cooling air to the heat radiating portion and the circuit parts provided in the vicinity of the heat generating body at the same time. The boiling cooling device according to any one of 1.

A fifth aspect of the present invention is the boiling cooling apparatus according to any one of the first to fourth aspects, wherein a heat radiation fin is attached to an outer surface of the heat radiation portion.

According to a sixth aspect of the present invention, the heat radiating portion is formed by arranging a plurality of hollow members arranged at a predetermined interval, and the space formed between the plurality of hollow members and the heating element. Alternatively, a ventilation passage is formed by the vertical cooling tank or a space around the circuit component, and the cooling fan blows cooling air to the ventilation passage. The boiling cooling device according to any one of 1.

According to a seventh aspect of the present invention, the boil cooling system according to the sixth aspect is characterized in that the heat radiating portion is provided with a ventilation control plate for facilitating the cooling air flowing through the ventilation passage to the heating element. It is a device.

According to an eighth aspect of the present invention, the cooling tank has a heating element mounting plane on which the heating element is mounted, and at least a part of the heat radiating portion is inclined toward the heating element side. The boiling cooling device according to claim 1, wherein an angle formed by the heating element mounting plane is greater than 0 degree and 90 degrees or less.

According to a ninth aspect of the present invention, the cooling tank has a heating element mounting flat surface on which the heating element is mounted, and the heat dissipation portion has a cooling fan mounting flat surface on which the cooling fan is mounted. The boiling cooling device according to claim 1, wherein an angle between the flat surface and the cooling fan mounting flat surface is greater than 0 degree and 90 degrees or less.

According to a tenth aspect of the present invention, the heating element has a heating element that emits heat, and a pack that holds the heating element and fixes the heating element. The heating element is the same as the heating element. The boiling according to claim 1, wherein the heat is transferred to the cooling tank through the pack to be cooled, and the cooling air generated by the cooling fan is blown to the pack to be cooled. It is a cooling device.

According to an eleventh aspect of the present invention, the cooling fan is
Cooling air that has passed around the heating element or the vertical cooling tank or circuit components is sucked into a space formed between a plurality of hollow members in the heat radiating portion and discharged from these spaces. The boiling cooling device according to claim 6, wherein

According to a twelfth aspect of the invention, there is provided the boiling cooling device according to the first aspect, wherein the cooling tank has a flat shape. The invention of claim 13 is the boiling cooling apparatus according to claim 1, wherein the cooling tank is formed by bonding a plurality of thin-walled members to each other at their joints.

According to a fourteenth aspect of the present invention, the joint portion has at least a fixing region where the heating element is mechanically fixed, and the fixing region is such that the thin wall member is brought into close contact with the wall surfaces of the opposing cooling tanks. The boil cooling device according to claim 13, wherein the boil cooling device is formed by laminating.

According to a fifteenth aspect of the present invention, the joint portion including the fixing region of the thin member forming the cooling tank is formed in a concave or convex shape with respect to a region other than the joint portion, and includes the fixing region. 15. The boiling cooling device according to claim 14, wherein the thin members facing each other at the joining portion are joined by brazing.

According to a sixteenth aspect of the present invention, a through hole is formed in the fixing region of the joint portion, a fastening member is inserted into the through hole, and the heating element is attached to the cooling tank by the fastening member. The boiling cooling device according to claim 14 or 15.

[0023]

According to the invention of claim 1, the heat generated in the heating element is transferred to the refrigerant through the cooling tank, the refrigerant is vaporized and rises, reaches the heat radiating portion, and reaches the atmosphere at the heat radiating portion. Heat exchange takes place. In this case, the cooling fan provided in the heat radiating section forcibly blows air to the heat radiating section for cooling, so that the refrigerant vapor is effectively cooled and condensed in this heat radiating section. This liquefied refrigerant is returned to the cooling tank again and is heated by receiving heat generated from the heating element. Therefore, the heat of the heating element is released to the atmosphere through the heat radiating portion by vaporization and condensation of the refrigerant, and the heat radiating portion is forcibly cooled by the cooling fan, so that the cooling performance is improved.

According to the invention of claim 2, the cooling fan comprises:
Since the heat-dissipating portion is forcedly blown together with the heat-generating body at the same time, a part of the heat generated in the heat-generating body is directly exchanged with the cooling air, so that the heat of the heat-generating body is
There are two paths, one is a path through which the refrigerant is vaporized and condensed to be released into the atmosphere through the heat radiating portion, and the other is a path through which air is blown around the heating element and is directly released into the atmosphere.

In this case, the cooling fan provided in the heat dissipation portion is
Since the structure is such that air is blown to the heat radiating portion and the heat generating body at the same time, the cooling efficiency is high and the configuration is simple even though the number of cooling fans is small.

According to the invention of claim 3, the cooling fan comprises:
Since the cooling unit is forcedly blown at the same time as the heat radiating unit, the heat of the heating element is released to the atmosphere through the heat radiating unit due to the vaporization and condensation of the refrigerant, and the air flowing directly around the cooling tank is directly exposed to the atmosphere. There are two types of paths to be discharged to, and the cooling performance is improved.

According to the invention of claim 4, the cooling fan comprises:
Since the air is forcedly blown to the heat radiating unit and the circuit components at the same time, the heat of the heating element is released to the atmosphere through the heat radiating unit by the vaporization and condensation of the refrigerant, and the air blown around the circuit components directly blows air to the atmosphere. There are two types of paths to be discharged to, and the cooling performance is improved.

According to the invention of claim 5, since the radiation fins are attached to the outer surface of the radiation portion, the radiation area of the radiation portion is increased, and the heat exchange performance of the radiation portion is improved. According to the sixth aspect of the invention, since the heat radiating portion is composed of a plurality of hollow members, the heat radiating area is large, the area that the cooling air hits is also large, and the cooling performance of the cooling portion is high. Further, since the cooling air passing through the heat radiating portion branches and flows in the space formed between the plurality of hollow members, this shunting effect facilitates the flow around the heating element, the cooling tank, or the circuit component, and the heating element or the cooling element is cooled. High-temperature air around the tank or circuit parts can be efficiently discharged.

According to the seventh aspect of the present invention, since the air flow control plate controls the direction of the flow of the cooling air to facilitate the air flow to the heating element or the cooling tank or the circuit component, the heating element is effectively air-cooled. You can

According to the inventions of claims 8 and 9,
Since at least a part of the heat radiating portion is inclined with respect to the heating element mounting plane, or the heating element mounting plane and the cooling fan mounting plane are inclined, the space around the heat radiating portion and the space around the heating element are It is possible to form the ventilation passage constituted by and without being greatly bent, the flow resistance of the cooling air is reduced, and the cooling air can be efficiently flowed.

According to the tenth aspect of the present invention, since the heating element is housed in the pack, the heating element is mechanically protected, and the temperature of the heating element is transferred from the pack to the cooling tank and the cooling air flowing outside. Suppress the rise.

According to the eleventh aspect of the present invention, the cooling air generated by the heat radiating fan passes around the heat generating element or the vertical cooling tank or the circuit component and passes through the heat radiating portion. The mold cooling tank or the circuit components are air-cooled at the cold stage of the cooling air, so that good air cooling is achieved.

According to the twelfth aspect of the invention, since the cooling tank has a flat shape, the capacity of the cooling tank can be made small, and the heat transmitted from the heating element can be received by the flat surface, and a small amount. The heat transfer efficiency with respect to the refrigerant can be increased.

According to the thirteenth aspect of the invention, since the cooling tank is formed by laminating thin members at their respective joints, the manufacturing is easier than the case of manufacturing by cutting or die casting, and mass production is possible. It is suitable and can reduce the weight. Moreover, since a thin member is used, it can be formed in a small size.

According to the fourteenth aspect of the present invention, the cooling tank is attached in such a manner that the wall surfaces of the joint portions of the thin members facing each other are adhered to each other in the fixing region where the heating element is fixed. Not only is there more strength,
There is no concern about deformation even if the load of the heating element is applied.
Moreover, since the wall surface of the joint portion is in close contact with this fixing region, the airtightness is improved.

According to the fifteenth aspect of the invention, since the joints of the thin members forming the cooling tank are formed to be concave or convex with respect to the portions other than the joints, these joints are joined by brazing. By doing so, a space for accommodating the refrigerant can be formed between the thin members, and the cooling tank can be formed with a small number of parts. Further, since the joint portion is formed to be concave or convex with respect to the portion other than the joint portion, the mechanical strength is improved.

According to the sixteenth aspect of the present invention, since the through hole is formed in the fixing region of the joint portion and the heating element is fixed to the cooling tank by the fastening member in the through hole, the fixing region is formed by laminating thin members. Therefore, even if the through hole is formed, the refrigerant inside the cooling tank does not leak. Further, even if a load is applied to the through hole, the thin members are attached to each other so that they are not deformed or damaged.

[0038]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the first embodiment shown in FIGS. FIG. 1 shows a state in which the boiling cooling device 10 is set to be housed inside a control box 11, and the boiling cooling device 10 has a cooling tank 13 in which a coolant 12 made of, for example, water or fluorocarbon is enclosed. It is composed of a heat radiating portion 14 which communicates with the upper end of the cooling tank 13.

The cooling tank 13 is made of, for example, a thin metal such as aluminum or a copper plate, or a synthetic resin, and is set in an appropriately depressurized state in order to lower the boiling point. The cooling tank 13 is attached to the wall surface 111 on the back surface of the control box 11. In this case, the cooling tank 13 is formed flat so that it does not largely project from the wall surface 111.

FIG. 2 shows a sectional structure of the cooling tank 13 and the heat radiating portion 14. The heat radiating portion 14 is formed by a plurality of flat cross-sections made of, for example, a metal plate having good thermal conductivity such as a copper plate. , Hollow cylinders 141, 142, ..., These hollow cylinders 141, 142, ... Are arranged in parallel at a predetermined interval and set up on the cooling tank 13. Here, these hollow cylindrical bodies 141, 14
2, ... The upper ends of each are closed, and the lower ends are opened so as to communicate with the inside of the cooling tank 13. In the hollow cylinders 141, 142, ... Set in this way, spaces 145, 146 are secured between the respective side surfaces, especially between them, and these spaces 145, 146 ,. Radiating fin 15 made of a corrugated metal plate
Are attached by brazing, and louvers (not shown) are formed on the radiation fins 151, 152 ,.

A heating element mounting plane 130 is formed on one side wall of the cooling tank 13, for example, a side wall opposite to the mounting surface of the control box 11 with respect to the wall surface 111, in other words, a side surface facing the front door 112 of the control box 11. And
The power pack 16 accommodating the heating element is attached to the heating element mounting plane 130. The power pack 16 is made of a material having excellent thermal conductivity such as metal and is sealed by an O-ring (not shown).
1, 172, the heating element mounting plane 130 of the cooling tank 13
Attached to. The power pack 16 includes a heat dissipation plate 18 made of copper or the like having good thermal conductivity,
The heat radiating plate 18 is provided so as to face the opening 19 formed in the heating element mounting plane 130 of the cooling tank 13, and is hermetically mounted so as to close the opening 19 with bolts 171 and 172 as fastening members. Therefore, the heat sink 18
Are directly contacted with the refrigerant 12.

For the heat sink 18, for example, AlN
An insulating substrate 21 made of an insulating material having good thermal conductivity such as
DBC (Direct bo
nding cupper) 21 is adhered to this DBC
A power semiconductor element 2 such as an IGBT which is a heating element
2 is attached.

Hollow cylindrical body 14 constituting the heat dissipation portion 14
, And the cooling tank 13 are airtightly joined by brazing, welding, or the like, and at least a part of the heat radiating portion 14 is connected to the cooling tank 13 by the power pack 16 as shown in FIG. It is offset to the side and overhangs above the power pack 16. In this embodiment, the heat radiating portion 14 forms an angle θ on the power pack 16 side with respect to the cooling tank 13.
The inclination angle θ is set to be larger than 0 degree and not larger than 90 degrees.
Therefore, the heat dissipation portion 14 is inclined at an inclination angle θ with respect to the heating element mounting plane 130 of the cooling tank 13. This inclination angle θ is in the range of more than 0 degree and 90 degrees or less.

In this embodiment, since the heat dissipation portion 14 is inclined toward the power pack 16 side, a gap is formed between the heat dissipation portion 14 and the rear wall surface 111 of the control box 11.

A cooling fan mounting plane 140 is formed on the front surface of the heat radiating portion 14, and the cooling fan mounting plane 14 is formed.
At 0, a cooling fan, for example, an axial fan 23 is attached. The axial fan 23 forcibly blows cooling air. In this case, since the cooling fan mounting plane 171 is inclined with respect to the heating element mounting plane 130 of the cooling tank 13 with the inclination angle θ set to a range of more than 0 degree and 90 degrees or less, the axial fan 23 is inclined. Is also inclined with respect to the heating element mounting plane 130 of the cooling tank 13. Such an axial fan 23
When air is operated, air is taken in from the space surrounding the cooling tank 13 and the power pack 16 located therebelow, and this air is pressurized to cause hollow cylinders 141, 142, ...
The air is blown toward the spaces 145, 146 formed therebetween, so that the cooling air is taken in from the front surface of the heat dissipation portion 14,
The heat is radiated from the back surface of the heat radiating portion 14 to the gap between the rear wall surface 111 of the control box 11. The forced airflow generated by the operation of the axial fan 23 is the cooling tank 13
And an air flow that flows from the space around the power pack 16 to the rear surface of the heat dissipation portion 14 through the spaces 145, 146 formed between the hollow cylindrical bodies 141, 142, ... This air flow constitutes a ventilation passage 25 as indicated by an arrow.

The air discharged into the gap between the rear surface of the heat radiating portion 14 and the rear wall surface 111 of the control box 11 is discharged to the outside from the exhaust window 113 by the exhaust fan 114 provided on the ceiling of the control box 11. It is like this.

In the boiling cooling apparatus having the above-mentioned structure, when the power semiconductor element 22 is set in the operating state and generates heat, this heat is transferred to the heat dissipation plate 18 via the DBC 21 and the insulating substrate 20, and this heat dissipation is performed. Heat is transferred to the refrigerant 12 that is in direct contact with the plate 18. The refrigerant 12 is boiled and vaporized by being heated. At this time, highly efficient heat transfer due to boiling is performed between the refrigerant 12 and the heat dissipation surface 181 of the heat dissipation plate 18.

In this way, the heat dissipation surface 181 of the heat dissipation plate 18
In, the refrigerant 12 changes from a liquid state to a vapor, and the boiled vaporized refrigerant is located above the heat dissipation portion 14
.. of the hollow cylindrical bodies 141, 142, .., and circulates in the hollow cylindrical bodies 141, 142 ,. During the circulation in the hollow cylinders 141, 142, ..., Steam comes into contact with the inner surface of the hollow cylinders 141, 142, ... Emits heat. Hollow cylindrical bodies 141, 14
2, ... Receives heat from the boiling steam and transfers this heat to the radiation fins 151, 152.
Heat is exchanged with the outside air through 2, ... At this time, the hollow cylindrical body 14 is blown by the air blow from the axial fan 23.
Outer surfaces of 1, 142, ... And heat radiation fins 151, 15
The surfaces of 2 ... Are forcibly cooled, so that the cooling effect of the refrigerant is enhanced.

In this case, the axial fan 23 forcibly blows the heat radiating portion 14 as described above, and introduces air from the space around the cooling tank 13 and the power pack 16 located in the lower portion to introduce the air into the heat radiating portion 14. Hollow cylindrical bodies 141, 142, ...
Since the air is blown into the spaces 145, 146 formed therebetween, this air flow constitutes the air blowing passage 25 indicated by the arrow, and therefore, a part of the cooling tank 13 and the periphery of the power pack 16 are forcibly air-cooled.

Therefore, the heat generated in the power pack 16 is radiated to the atmosphere through the heat radiating portion 14 by the vaporization and condensation of the refrigerant, and the heat radiated to the atmosphere through the air flow around the power pack 16. There are two paths, and thus the cooling performance is improved.

As shown in FIG. 1, at least a part of the heat dissipating section 14 is provided with respect to the power pack 1 with respect to the cooling tank 13.
Since it is deviated to the 6 side and is overhung above the power pack 16, from the space around the power pack 16 to the spaces 145, 146 formed between the hollow cylindrical bodies 141, 142, ... Air passage 25 that connects to
Becomes a straight line or a curved path close to a straight line, and the air blowing path 25 does not become a greatly bent path, so the air blowing resistance is reduced.

In this embodiment, since the heat radiating portion 14 is inclined toward the power pack 16 side with respect to the cooling tank 13 at an inclination angle θ of more than 0 degrees and 90 degrees or less, the suction port of the axial fan 23 is powered by the power. It becomes easier to orient toward the pack 16, the gently curved airflow passage 25 is formed, a smooth airflow is generated, and the airflow efficiency is improved.

Further, the cooling fan mounting plane 171 is larger than 0 degree with respect to the heating element mounting plane 130 of the cooling tank 13 by 9 degrees.
Since the inclination angle is in the range of 0 degrees or less, this also makes it easier to direct the suction port of the axial fan 23 toward the cooling tank 13 and the power pack 16 side, and also in this respect, the blower passage 25 that produces a smooth air flow is formed. can do. Due to this, one axial fan 23 can effectively cool, and the cooling performance can be improved with a simple structure.

Further, in the control box 11 of the embodiment configured as described above, the mounting direction of the power pack 16 with respect to the cooling tank 13 is set so that the external wiring portion thereof faces the front door 112 side of the control box 11. Because
The maintenance and inspection can be easily performed by opening the front door 112.

Then, the hollow cylindrical body 1 constituting the heat dissipation portion 14
, 41, 142 are set to be inclined with respect to the cooling tank 13, a clearance is formed between the heat radiating portion 14 and the rear wall surface 111 of the control box 11, so that the cooling axial flow. When the cooling air is blown by the fan 23, the ventilation resistance is effectively suppressed by the clearance between the hollow cylindrical bodies 141, 142, ... And the wall surface 111 of the control box 11, and it is necessary without reducing the air flow rate. Heat dissipation characteristics can be obtained.

Further, with such a structure, the cooling tank 13 and the heat radiating portion 14 can be made relatively thin, so that it is possible to reduce the dimension in the depth direction of the entire cooling structure. It can be easily stored in the control box 11 having a limited internal volume.

Therefore, such a boiling cooling device is
It becomes possible to easily set and store in a casing having a limited volume such as the control box 11, and also to effectively set a circulation path for cooling air. For example, a power inverter equipped with a cooling mechanism can be downsized and simplified. Can be configured.

In the boiling cooling device constructed as described above, the cooling tank 13 can be made thin, and it is easy to construct it so as to expand in the lateral direction. Therefore, in the second embodiment shown in FIG. As described above, a plurality of, for example, three power packs 16 are arranged side by side on the entire surface of the cooling tank 13.
It is also possible to arrange 1 to 163 side by side. in this case,
Also in the heat radiating section 14, the number of hollow cylinders 141, 142, ... Can be increased to increase the heat radiating performance corresponding to the width of the cooling tank 13. In this case, a plurality of cooling fans 231 and 232 are used. You may.

In the above embodiment, the heat radiating portion 14 is set to be tilted by a predetermined angle θ, but the tilt angle of the heat radiating portion 14 is further increased so that it is tilted as in the third embodiment shown in FIG. It can also be set in a horizontal state where the angle θ is 90 °. In this case, the cooling axial fan 23 is installed on the back side of the heat radiating portion 14. In this way, the axial fan 23 sucks air from the lower side of the heat radiating portion 14, so that the air around the cooling tank 13 and the power pack 16 attached to the cooling tank 13 is sucked upward and the heat radiating portion is sucked up. It is sent to the back surface side of the heat dissipation part 14 through the spaces 145, 146 formed between the 14 hollow cylindrical bodies 141, 142, .... Therefore, the ventilation passage 25 that connects the space around the cooling tank 13 and the power pack 16 and the heat radiating portion 14 is formed in a straight line, the ventilation resistance is reduced, and the amount of ventilation can be increased. Therefore, the heat dissipation performance is improved and the cooling efficiency is improved.

Further, in the IGBT which is often used as the power pack 16, it is necessary to install an electric circuit component such as a capacitor close to the power pack 16 in terms of electric circuit. Therefore, as shown in FIG. 4, if a circuit component 900 such as a condenser is installed in the flow of the air passage 25, such a circuit component 90 can be obtained.
The heat generation of 0 can be efficiently cooled.

FIGS. 5 to 9 show a fourth embodiment. The fourth embodiment shows an example in which the structure of the third embodiment shown in FIG. 4 is further embodied. . The fourth embodiment will be described. In FIGS. 6 and 7, the cooling tank 13 to which the power pack 16 as a heating element is attached and the heat radiating portion 14 are communicated with each other via the joining member 200. The cooling tank 13, the heat radiating portion 14, and the joining member 200 are hermetically joined by welding or brazing. The joining member 200 is provided with a large number of ribs 201 for reinforcement.

The cooling tank 13 is formed by brazing thin-walled structural members 210 and 211, which are press-molded products. These thin component members 210 and 211 are formed of a metal plate having excellent thermal conductivity such as aluminum or aluminum alloy. The thin metal components 210 and 211 have a symmetrical shape,
Areas indicated by diagonal lines in FIG. 5 are formed inwardly with respect to the other areas as viewed from the front, as shown in FIG. That is, a pair of thin metal component members 210,
Except for the portion communicating with the heat dissipation portion 14, 211 has a recess formed in the peripheral edge, and also has recesses formed at two locations along the left-right direction in the front view of FIG.

These recesses form the joint portion 220, and when the pair of thin-walled metal component members 210 and 211 are opposed to each other, these recesses are in close contact with each other. These contact surfaces are hermetically joined by welding or brazing. That is,
The hatched area in FIG. 5 is the joint 220.

The area excluding the joint 220 is
In the front view of FIG. 5, it projects to the front side, and inside thereof, a space for containing the refrigerant, that is, a cooling tank 13 is formed. In the case of this embodiment, the space for accommodating the refrigerant is divided in the left-right direction in the front view of FIG. A space accommodating these refrigerants communicates with the heat radiating portion 14 through the joining member 200 through the upper end thereof.

The surface of the cooling tank 13 on which the business trip is carried out is a heating element mounting plane 130.
The power pack 16 accommodating the IGTB module is closely attached to 0. The power pack 16 has four corners fixed to the cooling tank 13 by bolts 171, 172, ... As fastening members. These bolts 171, 1
72 are inserted into through holes 230 formed so as to penetrate the joint 220, and are fastened to the joint 220 by tightening nuts 175. That is, the joint portion 220 is a portion where the thin-walled constituent members 210 and 211 are overlapped with each other, and the through hole 230 is formed in this overlapping portion.
And the bolts 171, 172 ...
The power pack 16 is fixed via the. As a result, the load of the power pack 16 is supported by the overlapping portions of the thin-walled structural members 210 and 211. Therefore, the joint portion 220 constitutes the fixing area of the present invention.

As shown in FIG. 9, the heat radiating portion 14 is made up of a large number of flat cylindrical cross sections 141, 14 made of a metal plate having good thermal conductivity such as a copper or aluminum plate.
2, a large number of these hollow cylindrical bodies 14 having a flat cross section
.. are laid down in the lateral direction, and an interval 146 ... Continuing in the vertical direction is formed between the hollow cylindrical bodies 141, 142 ,. These hollow cylinders 141,
One end of 142, ... Is connected to the joining member 200, and the other end is airtightly closed by a closing member 202.

Inside each of the hollow cylinders 141, 142, ...
5, the heat of the vaporized refrigerant is easily transmitted to the walls of the hollow cylindrical bodies 141, 142, .... .. formed by corrugated fins, etc. are attached by brazing to the spaces 146 ... Formed between the hollow cylindrical bodies 141, 142 ,. 1
Louvers 151a are formed on 52, ....

The heat dissipating portion 14 thus constructed is located above the power pack 16 fixed to the outer surface of the cooling tank 13, and is installed in a so-called over-hung position. Then, cooling fans 23, 23 are installed on the upper end of the heat dissipation portion 14. These cooling fans 2
3 and 23 are designed to generate wind from the bottom to the top.
The cooling air flowing from the bottom to the top is generated in the spaces 146, ... Formed between the 1, 142 ,. As a result, the air around the power pack 16 disposed below the heat radiating portion 14 is forcibly pulled, and the space formed between the plurality of hollow cylindrical bodies 141, 142, ... In the heat radiating portion 14. The cooling air flows from the bottom to the top at these intervals 146, and is discharged upward.

Even in the case of such a structure, the heat generated in the power pack 16 is transferred to the refrigerant 12 in the cooling tank 13 to heat the refrigerant 12, which boils and is vaporized. The vaporized refrigerant rises to reach the heat dissipation portion 14, and is directly in the walls of the hollow cylindrical bodies 141, 142 ... Or through the inner fins 205 provided inside the hollow cylindrical bodies 141, 142.
Heat is transmitted to the wall of 42 ... Therefore, the refrigerant vapor is cooled by the outside air outside the heat dissipation portion 14, condensed and liquefied, and returned to the cooling tank 13.

At this time, the hollow cylinders 141, 142, ... Transfer the heat received from the boiling steam to the radiation fins 151, 152, and let it escape to the outside through the radiation fins 151, 152 ,. At this time, the outer surfaces of the hollow cylindrical bodies 141, 142, ... And the surfaces of the heat radiation fins 151, 152, ... Are forcibly cooled by the air blown from the axial fans 23, 23, so that the cooling effect of the refrigerant is enhanced.

In this case, the axial fans 23, 23
While forcibly blowing the heat radiating portion 14 as described above,
Air is introduced from the space around the power pack 16 located at the lower part and passed through the spaces 145, 146 formed between the hollow cylindrical bodies 141, 142, ... The air passage 25 is formed, and therefore, the periphery of the power pack 16 is forcedly cooled.

As a result, also in the case of this embodiment, the heat generated in the power pack 16 is released to the atmosphere through the heat radiating portion 14 by the vaporization and cooling of the refrigerant, and the air blown around the power pack 16. There are two types of heat dissipation paths that are released to the atmosphere through the, so that the cooling performance is improved.

In the case of this embodiment, since the cooling tank 13 is constructed by laminating the thin-walled constituent members 210 and 211, the thin-walled constituent members 210 and 211 are press-molded, so that it is necessary to manufacture them by cutting or die casting. There is no increase in weight and productivity is improved. Further, since the cooling tank 13 and the heat dissipation portion 14 are configured as separate bodies,
The heat dissipation part 14 can be formed relatively large with respect to the cooling tank 13, the heat dissipation area of the heat dissipation part 14 can be increased, and the liquefaction performance can be improved.

Further, the thin-walled structural members 210 and 211 are
Since the portions to be joined are formed in a concave shape and the depressions are overlapped and adhered to each other, and these adhered portions are joined by brazing, these joints 220 have high strength.
Through holes 230 are formed in the joint portion 220, and the bolts 171, 172 are inserted into the through holes 230.
The power pack 16 is fixed with these bolts 171, 172 .... Therefore, the power pack 16 comes to be supported by the joint portion 220 having high strength, and the support strength of the power pack 16 is increased.

Further, the bolts 171, 172, ...
Since the through holes 230 formed in 20 are penetrated,
It is not necessary to use a special fixing device such as a seat cock, and the cost can be reduced. And the through hole 23
The periphery of 0 ... Is a concave surface, and the concave surfaces are joined by brazing, so that the power pack 16 can be attached without impairing the airtightness. Thin wall component 210, 21
Since No. 1 has the uneven surface as described above, the rigidity of the entire cooling tank 13 and the rigidity of the power pack 16 mounting surface are increased by the uneven shape, and the pressure resistance is improved.

Further, in the case of the structure shown in FIG. 5, since the cooling container 13 is formed by dividing the refrigerant container into three parts, it is particularly suitable for products such as automobiles which are subject to vibration and inclination. In the case of application, the divided structure can suppress the fluctuation of the liquid surface, which is advantageous for vibration and inclination.

Further, as shown in FIG. 5, a through hole 23 for mounting the power pack 16 accommodating the IGTB module.
By making the portion where 0 is formed (fixed region) wider than the other regions, the opening position of the through hole 230 can be changed when the power pack 16 having the screw pitches of the same pitch is mounted. That is, a through hole is usually formed at the position depicted by the solid line in FIG. 5, but if it is desired to attach power packs 16 of different sizes such as housing IGTB modules of different outputs, the screw spacing is If the pitches are different, it is necessary to open the through holes at other positions. By forming a large area (fixed area) in which the through hole 230 is formed in advance, the position of the through hole can be easily changed, and since the concave surfaces are joined by brazing, airtightness is improved. The power pack 16 can be attached without damage. Therefore, versatility is expanded, and cost can be reduced.

In such a case, the same cooling tank 13 is used.
Different types and sizes of power packs 16 can be attached to the power packs 16 and the power packs 16 can be effectively cooled when used in an electric vehicle or the like having different power semiconductor power elements that operate at various timings.

FIG. 10 shows a fifth embodiment, FIG. 10 (A) is a front view of a boiling cooling device, and FIG. 10 (B) is a side view of the same. And Figure 1
0 (C) is a view from above. The difference from the third embodiment is that the hollow cylindrical bodies 141, 1 constituting the heat dissipation portion 14 are different.
42 are formed by laminating metal thin plates 310 and 311 having good thermal conductivity, such as copper and aluminum plates, respectively.

When the cooling tank 13 and the heat radiating portion 14 are both constructed by laminating thin members as in this embodiment, the productivity is further improved. FIG. 11 shows a sixth embodiment, in which power packs 16, 16 as heating elements are attached to both sides of the cooling tank 13, respectively. With this configuration, the following effects are further obtained. That is, when mounting a plurality of heating elements 16, ... If the structure is such that it is mounted on only one side surface of the cooling tank 13 as shown in FIGS. 1 to 10, the physique of the cooling tank 13 must be extended laterally or vertically. It must be done, and the physique will become large. On the other hand, as shown in FIG. 11, if the heating elements 16 are attached to both surfaces of the cooling tank 13, the size of the cooling tank 13 can be reduced.

Further, if the heating elements 16 are back-to-back, the back-to-back heating elements 16 and 16 can be commonly fastened together by the bolts 171, 172, and the number of bolts and nuts to be used can be omitted. This will improve productivity. Further, since there is a space around the heating element 16, there is also an effect of being directly cooled by the forced cooling air that flows in the vertical direction.

In each of the above embodiments, the axial flow fan 23 is used as the cooling air blowing mechanism, but an appropriate blowing mechanism can be adopted as this blowing means. For example, in FIG.
And FIG. 13 shows an example in which a cross flow fan 24 is adopted instead of the axial flow fan. The seventh embodiment shown in FIG. 12 shows an example in which the heat dissipation portion 14 is set on the cooling tank 13 at a predetermined inclination angle θ corresponding to the first embodiment of FIG. The eighth embodiment shown in FIG. 13 shows a case where the heat radiating portion 14 is set horizontally corresponding to the third embodiment shown in FIG.

In the seventh and eighth embodiments, the power pack 16 is driven by the cross flow fan 24.
The air around the air is sucked upward, and the space 145 formed between the hollow cylindrical bodies 141, 142, ...
It passes through 146 and is sent to the back surface side of the heat dissipation portion 14.

In this case, the heat radiating portion 14 is provided with, for example, a blow control plate 241 which surrounds the cross flow fan 24 and regulates the blow path. Such a blow control plate 2
The reference numeral 41 has an effect of passing the air around the power pack 16 through the heat dissipation part 14 and guiding it to the back side of the heat dissipation part 14, and controls the direction of the cooling air flowing through the blower passage 25, and thus the power pack 16 and the heat dissipation part. Since the amount of air blown through 14 is increased, the cooling performance is improved.

In the ninth embodiment shown in FIG. 14, the position of the heat radiating portion 14 is set from above the cooling tank 13 to the power pack 1.
It is deviated to the 6 side and set. That is, the cooling tank 13
And the heat radiating section 14 are set in different stages, and the two are communicated with each other by a crank-shaped communication passage 131, and boiling steam generated on the surface of the heat radiating plate 18 of the power pack 16 is continuously connected. The heat dissipation part 14 is guided into the hollow cylindrical body through the passage 131.

An air flow control plate 241 is provided at a position opposed to the back surface of the heat dissipation portion 13 so as to be separated therefrom, and an air flow passage 25 is formed between the back surface of the heat dissipation portion 13 and the air flow control plate 241. I am doing it. A cross flow fan 24 is set above the air passage 25. Due to the operation of the cross flow fan 24, cooling air is generated from the space around the power pack 16 through the front surface of the heat radiating portion 14, and this cooling air passes through the heat radiating portion 14 and is guided to the rear surface side of the heat radiating portion 13 to radiate heat. The air flows upward through a ventilation passage 25 formed between the rear surface of the portion 13 and the ventilation control plate 241.

With this structure, the power pack 16 and the heat radiating portion 14 can be forcedly cooled at the same time. Further, the cooling tank 13 and the heat radiating portion 14 can be made more effectively thin, and the dimension in the depth direction can be shortened in the overall configuration of the boiling cooling device 10.

When the heat dissipating portion 14 is eccentrically set on the cooling tank 13 as in the above-described embodiment, the heat dissipating portion 14 and the blow control plate are arranged as in the tenth embodiment shown in FIG. Two
The axial fan 23 may be installed in the upper part of the air passage 25 formed between the fan 41 and the fan 41. Even with this structure,
Air is sucked up from around the power pack 16, the air passes through the heat radiating portion 14, is guided to the rear surface side of the heat radiating portion 13, and flows upward through the air passage 25. Therefore, the power pack 16 and the heat dissipation part 14 can be forcedly cooled at the same time.

In the power pack 16 shown in the above-described embodiments, the opening 19 is formed in one wall surface of the cooling tank 13, and the heat dissipation plate 18 is exposed from this opening 19 to the refrigerant 12. Therefore, the heat sink 18 is directly contacted. However, in the case of such a configuration, when the power pack 16 is removed from the cooling tank 13 for maintenance and inspection, the power pack 16 is attached to a predetermined position and then the refrigerant 12 is sealed in a state of being evacuated again. There is a need. On the other hand, as in the eleventh embodiment shown in FIG. 16, on the mounting surface of the power pack 16 of the cooling tank 13,
The heat dissipation plate 18 of the power pack 16 is attached to the outer wall surface of the cooling tank 13 without forming an opening, and the heat dissipation plate 1
It is also possible that 8 is not directly contacted with the refrigerant 12. In this way, maintenance such as replacement of the power pack 16 can be performed without disturbing the depressurized state inside the cooling tank 13, and the handling thereof is simplified.

Further, FIG. 17 shows a twelfth embodiment, in which the inner fins 26 are mounted inside the hollow cylindrical bodies 141, 142, .... This inner fin 26 is
Made of a metal material having good thermal conductivity such as Al or Cu and brazed inside the hollow cylindrical bodies 141, 142, ...
It is adhered by soldering or the like. By inserting the inner fins 26 in this way, the condensation area is increased and the heat dissipation performance is further improved.

As the heat dissipating member set in the hollow cylindrical bodies 141, 142, ..., The inner fin 27 is constituted by corrugated louver fins as in the thirteenth embodiment shown in FIG. Good. With this structure, vapor diffusion occurs, and the hollow cylindrical body 141,
142, ... It is possible to prevent uneven heat distribution inside the louver and to suppress growth of the liquid film due to condensation by the louver, prevent deterioration of heat dissipation performance due to increase in heat resistance of the liquid film, and further improve heat dissipation performance. To do.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the configuration of a control box using a boiling cooling device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional configuration diagram of the boiling cooling device taken along the line II-II in FIG.

FIG. 3 is a diagram showing an appearance of a boiling cooling device according to a second embodiment of the present invention.

FIG. 4 shows a third embodiment of the present invention and is a cross-sectional configuration diagram of a boiling cooling device.

FIG. 5 is a front view of the boiling cooling device according to the fourth embodiment of the present invention.

FIG. 6 is a side view of the boiling cooling device according to the embodiment.

FIG. 7 is a cross-sectional configuration diagram of the boiling cooling device taken along line VII-VII of FIG.

8 is a cross-sectional configuration diagram of the boiling cooling device taken along the line VIII-VIII in FIG.

9 is a cross-sectional configuration diagram of the boiling cooling device taken along line IX-IX in FIG.

10A and 10B show a fifth embodiment of the present invention, wherein FIG. 10A is a front view of a boiling cooling device, FIG. 10B is a side view of the same, and FIG. The partial sectional view which follows the CC line.

FIG. 11 is a side view of the boiling cooling device according to the sixth embodiment of the present invention.

FIG. 12 is a cross-sectional view of a boiling cooling device showing a seventh embodiment of the present invention.

FIG. 13 is a sectional view of a boiling cooling device showing an eighth embodiment of the present invention.

FIG. 14 is a sectional view of a boiling cooling device showing a ninth embodiment of the present invention.

FIG. 15 is a cross-sectional view of a boiling cooling device according to a tenth embodiment of the present invention.

FIG. 16 shows an eleventh embodiment of the present invention and is a cross-sectional view of a heating element and a cooling tank of a boiling cooling device.

FIG. 17 is a configuration diagram showing a twelfth embodiment of the present invention and showing a hollow cylindrical body forming a heat dissipation portion of a boiling cooling device with a part thereof cut away.

FIG. 18 is a structural view showing a thirteenth embodiment of the present invention and showing a hollow cylindrical body forming a heat radiating portion of a boiling cooling device with a part thereof cut away.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Boiling cooling device 11 ... Control box 111 ... Wall surface 12 ... Refrigerant 13 ... Cooling tank 130 ... Heating element mounting surface 131 ... Communication path 14 ... Radiating part 140 ... Radiating fan mounting surface 141, 142 ... Hollow cylindrical body 145, 146 ... Gap 151, 152 ... Radiating fin 171, 172 ... Bolt 175 ... Nut 16,161 ... Power pack 18 ... Radiating plate 19 ... Opening 22 ... Power semiconductor element 23 ... Axial fan 24 ... Crossflow fan 25 ... Blower passage 210, 211 ... Thin-walled component 220 ... Joint part (fixed area) 230 ... through hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiko Suzuki, 1-1, Showa-cho, Kariya city, Aichi Nihon Denso Co., Ltd.

Claims (16)

[Claims] 1. A boiling cooling device for cooling a heating element, wherein the heating element to be cooled is mounted on one or both surfaces, and a refrigerant which is vaporized by the heat generated by the heating element is accommodated inside. A vertical cooling tank; one opening surface is sealed, and the other opening surface is communicated with the cooling tank,
A heat radiating portion at least a part of which is formed of a hollow member that is displaced toward the heating element side or in a direction opposite to the heating element; and a cooling fan which is provided in the heat radiating portion and guides cooling air to the heat radiating portion. Characteristic boiling cooling device. 2. The cooling fan guides cooling air to the heat radiating portion and the heat generating body at the same time.
The boil cooling apparatus according to. 3. The boiling cooling device according to claim 1, wherein the cooling fan guides cooling air to the heat radiating portion and the vertical cooling tank at the same time. 4. The cooling fan guides the cooling air to the heat radiating portion and the circuit component provided near the heat generating body at the same time, according to any one of claims 1 to 3. The boiling cooling device described. 5. The boiling cooling device according to claim 1, further comprising a radiation fin attached to an outer surface of the heat radiation portion. 6. The heat radiating portion is configured by arranging a plurality of hollow members at a predetermined interval, and a space formed between the plurality of hollow members and the heating element or the vertical type. An air blowing passage is configured with a cooling tank or a space around a circuit component, and the cooling fan blows cooling air to the air blowing passage. The boiling cooling device described. 7. The boil cooling apparatus according to claim 6, wherein the heat radiating portion is provided with an air flow control plate for facilitating the air flow of the cooling air flowing through the air flow passage to the heating element. 8. The cooling tank has a heating element mounting plane on which the heating element is mounted, and at least a part of the heat radiating portion is inclined toward the heating element side, and the inclined portion is the heating element mounting surface. The boiling cooling device according to claim 1, wherein the angle formed with the plane is greater than 0 degree and 90 degrees or less. 9. The cooling tank has a heating element mounting plane on which the heating element is mounted, and the heat dissipation section has a cooling fan mounting plane on which the cooling fan is mounted. The angle formed with the plane is greater than 0 degrees and 90 degrees or less.
The boil cooling apparatus according to. 10. The heating element includes a heating element that emits heat and a pack that locks the heating element and fixes the heating element. The heating element cools the heat of the heating element through the pack. The boil cooling apparatus according to claim 1, wherein the boil cooling apparatus is cooled by being transmitted to the tank and being cooled, and cooling air generated by a cooling fan is blown to the pack. 11. The cooling fan sucks cooling air that has passed around the heating element or the vertical cooling tank or circuit components into a space formed between a plurality of hollow members in the heat radiating portion. The boiling cooling device according to claim 6, wherein the boiling cooling device is adapted to be discharged from these spaces. 12. The boiling cooling apparatus according to claim 1, wherein the cooling tank has a flat shape. 13. The boiling cooling apparatus according to claim 1, wherein the cooling tank is formed by bonding a plurality of thin-walled members to each other at their joints. 14. The joint portion has at least a fixing region in which the heating element is mechanically fixed, and the fixing region is formed by laminating the thin members so that the wall surfaces of the cooling tanks facing each other are in close contact with each other. Claim 1 characterized by the above.
The boiling cooling device according to item 3. 15. The joint portion including the fixing region of the thin member that constitutes the cooling tank is formed in a concave or convex shape with respect to a region other than the joint portion, and faces the joint portion including the fixing region. The boiling cooling device according to claim 14, wherein the thin members that are joined are joined by brazing. 16. A through hole is formed in the fixing region of the joint portion, a fastening member is inserted into the through hole, and the heating element is attached to the cooling tank by the fastening member. The boil cooling apparatus according to claim 14 or claim 15.