JPH0852744A - Release material for mold for molding photosemiconductor apparatus and photosemiconductor apparatus manufactured using mold treated with the same release material - Google Patents
Release material for mold for molding photosemiconductor apparatus and photosemiconductor apparatus manufactured using mold treated with the same release materialInfo
- Publication number
- JPH0852744A JPH0852744A JP6189687A JP18968794A JPH0852744A JP H0852744 A JPH0852744 A JP H0852744A JP 6189687 A JP6189687 A JP 6189687A JP 18968794 A JP18968794 A JP 18968794A JP H0852744 A JPH0852744 A JP H0852744A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molding
- release material
- molecular weight
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 title claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- -1 polypropylene Polymers 0.000 claims abstract description 24
- 229920000098 polyolefin Polymers 0.000 claims abstract description 17
- 239000004743 Polypropylene Substances 0.000 claims abstract description 12
- 229920001155 polypropylene Polymers 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 238000013329 compounding Methods 0.000 claims description 7
- 239000006082 mold release agent Substances 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 230000003578 releasing effect Effects 0.000 abstract description 9
- 235000013873 oxidized polyethylene wax Nutrition 0.000 abstract description 8
- 239000004209 oxidized polyethylene wax Substances 0.000 abstract description 8
- 239000001993 wax Substances 0.000 description 31
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000473 propyl gallate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は光半導体装置成形用金型
に離型皮膜を形成する光半導体装置成形用金型離型付与
材及び該離型付与材により処理された金型を用いて製造
された光半導体装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a mold releasing material for molding an optical semiconductor device for forming a mold release film on a mold for molding an optical semiconductor device, and a mold treated with the mold releasing material. The present invention relates to a manufactured optical semiconductor device.
【０００２】[0002]
【従来の技術】発光素子、受光素子等の光半導体素子の
封止材料として、透明性、耐熱性、接着性、電気特性等
に優れるという観点から、一般に酸無水物硬化エポキシ
樹脂系の封止材料が使用されている。この封止材料には
金型からの離型性を改善する目的で内部離型剤が添加さ
れている。2. Description of the Related Art As an encapsulating material for optical semiconductor elements such as light emitting elements and light receiving elements, generally, acid anhydride cured epoxy resin encapsulation is used from the viewpoint of excellent transparency, heat resistance, adhesiveness, electrical characteristics and the like. Material is used. An internal mold release agent is added to this sealing material for the purpose of improving the mold releasability from the mold.
【０００３】しかしながら、この封止材料は透明性が重
視されるため、内部離型剤としては樹脂と相溶性を有す
るもの（これらは、通常離型効果に乏しい。）に限定さ
れており、また添加量も少量に抑えられている。このた
めトランスファーモールドを行った場合、封止材料と金
型との離型が不十分であった。これを改善するため一般
的には、予め金型にシリコーン系離型剤やフッ素系離型
剤等の外部離型剤を吹きつけて金型からの離型性を向上
させている。However, since transparency is important in this sealing material, the internal release agent is limited to those having compatibility with the resin (these are usually poor in releasing effect), and The amount added is also kept small. Therefore, when transfer molding was performed, the mold release between the sealing material and the mold was insufficient. In order to improve this, in general, an external release agent such as a silicone-based release agent or a fluorine-based release agent is sprayed on the mold in advance to improve the releasability from the mold.
【０００４】上記の対策はトランスファーモールドショ
ット数が少ないうち（２〜３ショット）は効果的である
がショット数の増加に伴い離型性が急激に悪化する。こ
のためトランスファーモールド後頻繁に離型剤を金型に
吹き付ける作業を繰り返す必要があった。また、この場
合は離型剤を金型に噴射した後にダミー材料を１〜２回
モールドして金型の汚れを除去した後に製品をモールド
する必要があり、コスト的にも連続生産を行う上でも大
きな問題となっていた。The above measures are effective when the number of transfer mold shots is small (2 to 3 shots), but the mold releasability deteriorates rapidly as the number of shots increases. For this reason, it was necessary to frequently repeat the operation of spraying the release agent onto the mold after the transfer molding. In this case, it is necessary to mold the dummy material once or twice to remove the stains on the mold after spraying the mold release agent on the mold, and then mold the product. But it was a big problem.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上記問題点を
解決するためになされたものであり、金型表面に離型持
続性に優れた皮膜を形成することにより、成形時、ダミ
ーショットを不要とし、また連続ショット数を大幅に向
上させることができる光半導体装置成形用金型離型付与
材を提供することを目的とする。また、本発明は、この
金型離型付与材で処理された金型を用いて封止すること
により製造コストが低減した安価な光半導体装置を提供
することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a dummy shot can be formed during molding by forming a film having excellent mold release sustainability on the surface of a mold. It is an object of the present invention to provide a mold release imparting material for forming an optical semiconductor device, which is unnecessary and can significantly improve the number of continuous shots. Another object of the present invention is to provide an inexpensive optical semiconductor device in which the manufacturing cost is reduced by sealing using a mold treated with the mold release imparting material.
【０００６】[0006]
【課題を解決するための手段】本発明者らは上記の課題
を解決すべく鋭意研究を重ねる中で、種々の離型剤（滑
剤）について検討を加えた。その結果、エポキシ樹脂組
成物と相溶性を有する離型剤を用いた場合は離型付与剤
としたときに離型性を殆ど発現しないことを確認した。
一方、エポキシ樹脂組成物と完全に非相溶な離型剤を用
いた場合でも離型付与性が殆ど発現しないという知見を
得た。Means for Solving the Problems The present inventors have conducted various studies on various mold release agents (lubricants) in the course of earnestly researching to solve the above problems. As a result, it was confirmed that when a release agent compatible with the epoxy resin composition was used, the release property was hardly exhibited when the release agent was used.
On the other hand, it was found that even when a releasing agent that is completely incompatible with the epoxy resin composition is used, the releasing property is hardly exhibited.
【０００７】そこで本発明者らは、エポキシ樹脂組成物
と準相溶性を示す離型剤について研究を進めた。その結
果特定の低分子量ポリオレフィンワックスを用いること
により金型に優れた離型性と離型持続性を付与できるこ
とを見出し、この知見に基づいて本発明を完成するに至
った。[0007] Therefore, the present inventors have conducted research on a mold release agent exhibiting a quasi compatibility with the epoxy resin composition. As a result, they have found that the use of a specific low molecular weight polyolefin wax can impart excellent mold releasability and mold releasability to the mold, and have completed the present invention based on this finding.
【０００８】すなわち、本発明は（Ａ）エポキシ樹脂、
（Ｂ）硬化剤、（Ｃ）硬化促進剤及び（Ｄ）低分子量ポ
リオレフィンワックスを必須成分として含有し、（Ｄ）
成分の低分子量ポリオレフィンワックスが数平均分子量
１０００〜１００００の範囲の酸化型ポリエチレンワッ
クス及び／又は酸化型ポリプロピレンワックスであり、
その配合量が（Ａ）〜（Ｄ）成分の合計量の５〜５０重
量％の範囲であることを特徴とする光半導体装置成形用
金型離型付与材を提供するものである。That is, the present invention relates to (A) epoxy resin,
(B) contains a curing agent, (C) a curing accelerator, and (D) a low molecular weight polyolefin wax as essential components, and (D)
The low molecular weight polyolefin wax as a component is an oxidation type polyethylene wax and / or an oxidation type polypropylene wax having a number average molecular weight in the range of 1,000 to 10,000,
The present invention provides a mold releasing agent for optical semiconductor device molding, characterized in that the compounding amount thereof is in the range of 5 to 50% by weight based on the total amount of the components (A) to (D).
【０００９】上記（Ａ）成分となるエポキシ樹脂として
は１分子中に２個以上のエポキシ基を有するもので、エ
ポキシ樹脂成形材料として使用されているものであれば
制限はなく、フェノールノボラック型エポキシ樹脂、オ
ルソクレゾールノボラック型エポキシ樹脂を代表とする
フェノール類とアルデヒド類のノボラック樹脂をエポキ
シ化したもの、ビスフェノールＡ、ビスフェノールＦ、
ビスフェノールＳ等のジグリシジルエーテル、フタル
酸、ダイマー酸等の多塩基酸とエピクロルヒドリンの反
応により得られるグリシジルエステル型エポキシ樹脂、
ジアミノジフェニルメタン、イソシアヌル酸等のポリア
ミンとエピクロルヒドリンの反応により得られるグリシ
ジルアミン型エポキシ樹脂、オレフィン結合を過酢酸等
の過酸により酸化して得られる綿状脂肪族エポキシ樹
脂、及び脂環族エポキシ樹脂などがある。これらは、１
種単独で用いてもよいし、適宜何種類でも併用してもよ
い。The epoxy resin used as the component (A) is one having two or more epoxy groups in one molecule and is not limited as long as it is used as an epoxy resin molding material. Phenol novolac epoxy Resin, epoxidized novolak resin of phenols and aldehydes represented by orthocresol novolac type epoxy resin, bisphenol A, bisphenol F,
Glycidyl ester type epoxy resin obtained by reaction of diglycidyl ether such as bisphenol S, polybasic acid such as phthalic acid and dimer acid, and epichlorohydrin,
Glycidylamine type epoxy resin obtained by reaction of polyamines such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin, cotton-like aliphatic epoxy resin obtained by oxidizing olefin bond with peracid such as peracetic acid, and alicyclic epoxy resin There is. These are 1
The seeds may be used alone or in any suitable combination.
【００１０】本発明の（Ｂ）成分である硬化剤は、エポ
キシ樹脂と硬化反応を示すものであれば特に制限され
ず、公知の硬化剤が使用されるが、トランスファー成形
性を考慮すると、フェノール樹脂又は酸無水物が好まし
い。このうち酸無水物はモノマーであるため、トランス
ファー成形時に一部が蒸発し金型に付着する。従って本
発明の離型付与剤に用いる硬化剤としてはフェノール樹
脂がより好ましい。The curing agent which is the component (B) of the present invention is not particularly limited as long as it shows a curing reaction with the epoxy resin, and known curing agents are used. Resins or acid anhydrides are preferred. Of these, the acid anhydride is a monomer, so a part thereof is evaporated during transfer molding and adheres to the mold. Therefore, a phenol resin is more preferable as the curing agent used in the release agent of the present invention.
【００１１】上記フェノール樹脂としては、フェノー
ル、クレゾール、キシレノール、レゾルシン、カテコー
ル、ビスフェノールＡ等のフェノール類とホルムアルデ
ヒドとを酸性触媒下で縮合反応させて得られるノボラッ
ク型フェノール樹脂があり、これらは単独で用いること
もできるし、また２種以上併用してもよい。As the above-mentioned phenol resin, there is a novolak type phenol resin obtained by subjecting phenols such as phenol, cresol, xylenol, resorcin, catechol and bisphenol A to a condensation reaction with formaldehyde under an acidic catalyst, and these are used alone. They can be used, or two or more kinds may be used in combination.
【００１２】また、（Ａ）成分と（Ｂ）成分の配合量は
（Ａ）成分中のエポキシ基の数と（Ｂ）成分中の水酸基
の数の比が０．７〜１．３になるように配合することが
好ましい。Further, the compounding amounts of the component (A) and the component (B) are such that the ratio of the number of epoxy groups in the component (A) and the number of hydroxyl groups in the component (B) is 0.7 to 1.3. It is preferable to mix them as follows.
【００１３】本発明の（Ｃ）成分である硬化促進剤はエ
ポキシ樹脂と硬化剤の硬化反応を促進するものであり、
この硬化促進剤としては、例えば、１，８−ジアザ−ビ
シクロ（５，４，０）ウンデセン−７、トリエチレンジ
アミン、ベンジルジメチルアミン、トリエタノールアミ
ン、トリス（ジメチルアミノメチル）フェノール等の三
級アミン、２−メチルイミダゾール、２−フェニルイミ
ダゾール、２−フェニル−４−メチルイミダゾール、２
−ヘプタデシルイミダゾール等のイミダゾール類、トリ
ブチルホスフィン、メチルジフェニルホスフィン、トリ
フェニルホスフィン、ジフェニルホスフィン等の有機ホ
スフィン類、テトラフェニルホスホニウムテトラフェニ
ルボレート、トリフェニルホスフィンテトラフェニルボ
レート、２−エチル−４−メチルイミダゾールテトラフ
ェニルボレート等のテトラフェニルボロン塩などが挙げ
られる。これら硬化促進剤は単独で使用してもよいし、
２種以上併用してもよい。硬化促進剤の配合量は（Ａ）
成分のエポキシ樹脂と（Ｂ）成分の硬化剤の合計量に対
して０．１〜５重量％にすればよい。The curing accelerator which is the component (C) of the present invention accelerates the curing reaction between the epoxy resin and the curing agent.
Examples of the curing accelerator include tertiary amines such as 1,8-diaza-bicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, and tris (dimethylaminomethyl) phenol. , 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2
-Imidazoles such as heptadecyl imidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine and diphenylphosphine, tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, 2-ethyl-4-methylimidazole Examples thereof include tetraphenylboron salts such as tetraphenylborate. These curing accelerators may be used alone,
You may use 2 or more types together. The compounding amount of the curing accelerator is (A)
It may be 0.1 to 5% by weight based on the total amount of the component epoxy resin and the component (B) curing agent.
【００１４】本発明において（Ｄ）成分の低分子量ポリ
オレフィンワックスは離型皮膜の主成分となるものであ
る。ポリオレフィンワックスとしては種々のものが知ら
れており、例えばポリエチレンワックスやポリプロピレ
ンワックス等が挙げられるが、これらのワックス類はエ
ポキシ樹脂組成物に非相溶であるため、離型付与性が乏
しい。本発明に用いられるポリオレフィンワックスはエ
ポキシ樹脂組成物と準相溶性を示す必要があるため、例
えば分子構造内にエポキシ基と反応性を有する官能基が
導入される。官能基としてはＣＯＯＨ基、ＯＨ基等が好
適である。従って本発明においては、ポリエチレンワッ
クス、ポリプロピレンワックスを空気あるいはオゾンに
より酸化して上記の官能基が導入された酸化型ポリエチ
レンワックス、酸化型ポリプロピレンワックスが好適に
用いられる。また、上記官能基をグラフト重合によりポ
リエチレンワックス、ポリプロピレンワックスに導入し
て得られる酸化型ポリエチレンワックス、酸化型ポリプ
ロピレンワックスを用いることも可能である。そしてこ
れら酸化型ポリオレフィンワックスは酸価が５〜３０、
更に好ましくは７〜２０の範囲のものが好ましく用いら
れる。In the present invention, the low molecular weight polyolefin wax as the component (D) is the main component of the release coating. Various types of polyolefin waxes are known, and examples thereof include polyethylene wax and polypropylene wax. However, these waxes are incompatible with the epoxy resin composition, and therefore have poor mold release property. Since the polyolefin wax used in the present invention needs to exhibit quasi compatibility with the epoxy resin composition, for example, a functional group reactive with an epoxy group is introduced into the molecular structure. COOH group, OH group and the like are preferable as the functional group. Therefore, in the present invention, an oxidized polyethylene wax or an oxidized polypropylene wax in which the above functional group is introduced by oxidizing polyethylene wax or polypropylene wax with air or ozone is preferably used. Further, it is also possible to use an oxidized polyethylene wax or an oxidized polypropylene wax obtained by introducing the above functional group into polyethylene wax or polypropylene wax by graft polymerization. The acid value of these oxidized polyolefin waxes is 5 to 30,
It is more preferably used in the range of 7 to 20.
【００１５】また本発明の低分子量ポリオレフィンワッ
クスの数平均分子量は、１０００〜１００００、好まし
くは２０００〜９０００の範囲にある必要がある。数平
均分子量が１０００を下回るとエポキシ樹脂組成物との
相溶性が向上し離型付与性が低下し、逆に数平均分子量
が１００００を超えるとエポキシ樹脂組成物への均一分
散性が悪化し、離型付与性が低下するためである。この
（Ｄ）成分の低分子量ポリオレフィンワックスの配合量
は上記（Ａ）〜（Ｄ）成分の合計量の５〜５０重量％、
好ましくは１０〜３０重量％の範囲にする必要がある。
配合量が５重量％を下回ると、離型性、離型持続性が殆
ど発現されず本発明の目的が達成されない。逆に配合量
が５０重量％を超えると、タブレット成形化が困難にな
るとともにトランスファー成形性も悪化するからであ
る。The number average molecular weight of the low molecular weight polyolefin wax of the present invention must be in the range of 1000 to 10000, preferably 2000 to 9000. When the number average molecular weight is less than 1000, the compatibility with the epoxy resin composition is improved and the mold release property is reduced, and when the number average molecular weight is more than 10,000, the uniform dispersibility in the epoxy resin composition is deteriorated, This is because the mold releasability is reduced. The blending amount of the low molecular weight polyolefin wax as the component (D) is 5 to 50% by weight based on the total amount of the components (A) to (D),
It should preferably be in the range of 10 to 30% by weight.
When the compounding amount is less than 5% by weight, releasability and releasability are hardly exhibited, and the object of the present invention is not achieved. On the other hand, if the compounding amount exceeds 50% by weight, tablet forming becomes difficult and transfer formability deteriorates.
【００１６】本発明に好適に用いられる上記のような低
分子量ポリオレフィンワックスとしては例えばハイワッ
クス４０５１Ｅ、４０５２Ｅ、４２０２Ｅ、１１０５
Ａ、２２０３Ａ（以上三井石油化学工業社製酸化型ポリ
エチレンワックス）、サンワックスＥ−３１０、Ｅ−３
３０、Ｅ−２５０Ｐ（以上三洋化成工業社製酸化型ポリ
エチレンワックス）、ユーメックス１１０ＴＳ（以上三
洋化成工業社製酸化型ポリプロピレンワックス）、ＰＥ
Ｄ−１９１、ＰＥＤ−５２１、ＰＥＤ−１２１、ＰＥＤ
−１５３、ＰＥＤ−２６１、ＰＥＤ−５２２、ＰＥＤ−
１３６（以上ヘキスト社製酸化型ポリエチレンワック
ス）等が挙げられ、これらは単独で用いてもよいし、２
種類以上併用してもよい。これら低分子量ポリオレフィ
ンワックスの配合方法は、予めエポキシ樹脂と加熱混融
して分散させてもよいし、組成物の混合又は混練時に直
接添加してもよい。また、このようにして製造された離
型付与材に、更に上記低分子量ポリオレフィンワックス
を少量（全重量の５重量％以下）ドライブレンドで添加
することもできる。Examples of the above-mentioned low molecular weight polyolefin wax which is preferably used in the present invention include high waxes 4051E, 4052E, 4202E and 1105.
A, 2203A (Oxidized polyethylene wax manufactured by Mitsui Petrochemical Co., Ltd.), Sun Wax E-310, E-3
30, E-250P (Oxidized polyethylene wax manufactured by Sanyo Chemical Industry Co., Ltd.), Umex 110TS (oxidized polypropylene wax manufactured by Sanyo Chemical Industry Co., Ltd.), PE
D-191, PED-521, PED-121, PED
-153, PED-261, PED-522, PED-
136 (above Oxidized polyethylene wax manufactured by Hoechst) and the like, and these may be used alone, or 2
You may use together more than one kind. As for the method of blending these low molecular weight polyolefin waxes, they may be previously heat-kneaded and dispersed with the epoxy resin, or may be added directly at the time of mixing or kneading the composition. Further, a small amount (5% by weight or less of the total weight) of the above-mentioned low molecular weight polyolefin wax may be added to the release agent thus produced by dry blending.
【００１７】また、本発明の離型付与材には通常の電子
部品封止用エポキシ樹脂成形材料に用いられる無機充填
材、有機充填材、離型剤、カップリング剤、着色剤等を
配合することができる。更に、上記低分子量ポリオレフ
ィンワックスの熱酸化劣化を防止する目的で酸化防止剤
を配合してもよい。この酸化防止剤は公知のものでよ
く、例えば有機リン化合物、チオエーテル化合物、ヒン
ダードフェノール化合物等が挙げられる。Further, the releasing agent of the present invention contains an inorganic filler, an organic filler, a releasing agent, a coupling agent, a coloring agent and the like which are used in usual epoxy resin molding materials for sealing electronic parts. be able to. Further, an antioxidant may be added for the purpose of preventing thermal oxidation deterioration of the low molecular weight polyolefin wax. This antioxidant may be a known one, and examples thereof include organic phosphorus compounds, thioether compounds, hindered phenol compounds and the like.
【００１８】[0018]
【実施例】以下、本発明を実施例により、更に詳細に説
明するが、本発明はこれに限定されるものではない。EXAMPLES The present invention will now be described in more detail by way of examples, which should not be construed as limiting the invention thereto.
【００１９】表１に示すとおり各原料を配合し、押し出
し機（バレル温度８０℃）にて混練後、冷却粉砕し、目
的とする粉末状の離型付与材を得た。なお、表１中の各
成分の配合量は、ポリオレフィン混合量を除き、全て重
量部で表したものである。As shown in Table 1, the respective raw materials were blended, kneaded in an extruder (barrel temperature 80 ° C.), and then cooled and pulverized to obtain a target powdery release agent. In addition, the compounding amount of each component in Table 1 is expressed in parts by weight except for the polyolefin mixing amount.
【００２０】[0020]
【表１】 [Table 1]
【００２１】＊１：東都化成株式会社製オルソクレゾー
ルノボラック型エポキシ樹脂 ＊２：日立化成工業株式会社製フェノールノボラック樹
脂 ＊３：北興化学株式会社製トリフェニルホスフィン ＊４：三洋化成工業株式会社製酸化型ポリエチレンワッ
クス 酸価２０（数平均分子量２，０００） ＊５：三洋化成工業株式会社製酸化型ポリプロピレンワ
ックス 酸価７（数平均分子量３，５００） ＊６：三洋化成工業株式会社製非酸化型ポリプロピレン
ワックス（数平均分子量３，０００） ＊７：三洋化成工業株式会社製非酸化型ポリエチレンワ
ックス（数平均分子量２，０００）* 1: Orthocresol novolac type epoxy resin manufactured by Tohto Kasei Co., Ltd. * 2: Phenol novolac resin manufactured by Hitachi Chemical Co., Ltd. * 3: Triphenylphosphine manufactured by Hokuko Kagaku Co., Ltd. * 4: Oxidation manufactured by Sanyo Chemical Co., Ltd. Type Polyethylene Wax Acid Value 20 (Number Average Molecular Weight 2,000) * 5: Sanyo Kasei Kogyo Co., Ltd. Oxidized Polypropylene Wax Acid Value 7 (Number Average Molecular Weight 3,500) * 6: Sanyo Kasei Co., Ltd. Non-Oxidized Type Polypropylene wax (number average molecular weight 3,000) * 7: Non-oxidizing polyethylene wax manufactured by Sanyo Chemical Industries, Ltd. (number average molecular weight 2,000)
【００２２】これらの離型付与材を、キュラストメータ
ー（今中機械工業社製ＪＳＲ型）を用いて金型温度１５
０℃、硬化時間３分で１ショット成形し、次いでＣＥＴ
−１０００（日立化成工業社製光半導体素子用エポキシ
樹脂封止材）２ｇを使用し、１５０℃で１分間の成形を
繰り返した。その時のトルク及び金型開きの際に発生す
る離型音の有無を調べた。比較例４として市販のフッ素
系外部離型剤（セパラックＲＡ−８５１Ｐ 山一化学工
業社製）を金型に噴射した場合も調べた。それらの結果
を表２に示す。A mold temperature of 15 is applied to each of these release imparting materials using a curast meter (JSR type manufactured by Imanaka Machinery Co., Ltd.).
1 shot molding at 0 ℃, curing time 3 minutes, then CET
2 g of -1000 (epoxy resin encapsulating material for optical semiconductor element manufactured by Hitachi Chemical Co., Ltd.) was used, and molding at 150 ° C. for 1 minute was repeated. The torque at that time and the presence or absence of a release sound generated when the mold was opened were examined. As Comparative Example 4, a case where a commercially available fluorine-based external release agent (Separac RA-851P manufactured by Yamaichi Chemical Industry Co., Ltd.) was sprayed on the mold was also examined. Table 2 shows the results.
【００２３】[0023]
【表２】 [Table 2]
【００２４】比較例１では３ショット目、比較例２、３
では２ショット目、比較例４では５ショット目で離型が
困難となった。それに対して実施例は明らかに離型性が
優れる。Comparative Example 1 is the third shot, Comparative Examples 2 and 3
In the second shot, in Comparative Example 4, the mold release became difficult at the fifth shot. On the other hand, the examples clearly have excellent releasability.
【００２５】また、上記の離型付与材をトランスファー
成形用金型（１２８×１２．７×４ t ４個取り）を用
い、成形温度１５０℃、成形時間３分間、成形圧力７Ｍ
Ｐａの条件で１ショット成形した後、同温度、同圧力、
成形時間１分間でのＣＥＴ−１０００の連続ショット回
数を測定した。結果を以下に示す。 実施例１：１０回 ２： ９回 ３：１１回 ４：１２回 比較例１：２回 ２：１回 ３：１回 ４：３回（１回目の成形品濁る）Further, the release-imparting material described above is transferred.
Mold for molding (128 x 12.7 x 4 t For 4 pieces)
Molding temperature 150 ° C, molding time 3 minutes, molding pressure 7M
After one shot molding under the condition of Pa, the same temperature, the same pressure,
Continuous shot times of CET-1000 with molding time of 1 minute
The number was measured. The results are shown below. Example 1: 10 times 2: 9 times 3:11 times 4:12 times Comparative Example 1: 2 times 2: 1 times 3: 1 times 4: 3 times (the first molded product becomes cloudy).
【００２６】上記の結果から、外部離型剤を使用した場
合（比較例４）は当初は離型性に優れるが、離型剤が成
形品に転写するため離型持続性に乏しく、また成形品の
透明性が低下し易い。また、非酸化型のポリエチレンワ
ックス、ポリプロピレンワックスを用いた場合（比較例
２，３）と酸化型ポリエチレンワックスの配合量が少な
い場合（比較例１）は、成形品の外観に問題は無いもの
の、離型性が悪く、持続性にも乏しい。それに対して実
施例の離型付与材を用いた場合は成形品の外観に問題な
く、離型持続性も大幅に向上していることがわかる。From the above results, when an external mold release agent was used (Comparative Example 4), the mold release property was excellent at first, but the mold release agent was transferred to the molded product, so the mold release persistence was poor, and the molding was also performed. The transparency of the product tends to decrease. In addition, when a non-oxidized polyethylene wax or polypropylene wax is used (Comparative Examples 2 and 3) and a small amount of the oxidized polyethylene wax is mixed (Comparative Example 1), there is no problem in the appearance of the molded product, Poor mold releasability and poor sustainability. On the other hand, when the release-imparting materials of the examples are used, it can be seen that the appearance of the molded product has no problem and the release continuity is significantly improved.
【００２７】[0027]
【発明の効果】本発明によれば、金型表面に離型性、離
型持続性に優れた皮膜を形成でき、この金型を用いて光
半導体素子を封止することにより、従来の外部離型剤を
使用した場合と比べて、連続ショット回数が５倍以上に
改善され、安価な光半導体装置を得ることができる。According to the present invention, it is possible to form a film having excellent mold releasability and mold release durability on the surface of a mold, and by using this mold to seal an optical semiconductor element, the conventional external The number of continuous shots is improved five times or more as compared with the case where a release agent is used, and an inexpensive optical semiconductor device can be obtained.
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/56 Ｔ 23/29 23/31 33/00 Ｎ Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location H01L 21/56 T 23/29 23/31 33/00 N
Claims (2)
（Ｃ）硬化促進剤及び（Ｄ）低分子量ポリオレフィンワ
ックスを必須成分として含有し、（Ｄ）成分の低分子量
ポリオレフィンワックスが数平均分子量１０００〜１０
０００の範囲の酸化型ポリエチレンワックス及び／又は
酸化型ポリプロピレンワックスであり、その配合量が
（Ａ）〜（Ｄ）成分の合計量の５〜５０重量％の範囲で
あることを特徴とする光半導体装置成形用金型離型付与
材。1. An epoxy resin (A), a curing agent (B),
(C) a curing accelerator and (D) a low molecular weight polyolefin wax are contained as essential components, and the low molecular weight polyolefin wax of the component (D) has a number average molecular weight of 1000 to 10
Is an oxidation type polyethylene wax and / or oxidation type polypropylene wax, and the compounding amount thereof is in the range of 5 to 50% by weight of the total amount of the components (A) to (D). Mold release imparting material for equipment molding.
離型付与剤により処理された金型を用いて封止された光
半導体装置。2. An optical semiconductor device encapsulated by using a mold treated with the mold release agent for molding an optical semiconductor device according to claim 1.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6189687A JPH0852744A (en) | 1994-08-11 | 1994-08-11 | Release material for mold for molding photosemiconductor apparatus and photosemiconductor apparatus manufactured using mold treated with the same release material |
| TW084108095A TW274535B (en) | 1994-08-11 | 1995-08-03 | |
| KR1019950024605A KR960009238A (en) | 1994-08-11 | 1995-08-09 | Mold-lubricating material which is processed in a mold for molding an optical-semiconductor device and a method for producing a packaged optical-semiconductor device using the mold-lubricating material. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6189687A JPH0852744A (en) | 1994-08-11 | 1994-08-11 | Release material for mold for molding photosemiconductor apparatus and photosemiconductor apparatus manufactured using mold treated with the same release material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0852744A true JPH0852744A (en) | 1996-02-27 |
Family
ID=16245505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6189687A Pending JPH0852744A (en) | 1994-08-11 | 1994-08-11 | Release material for mold for molding photosemiconductor apparatus and photosemiconductor apparatus manufactured using mold treated with the same release material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0852744A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096164A (en) * | 2001-07-16 | 2003-04-03 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
-
1994
- 1994-08-11 JP JP6189687A patent/JPH0852744A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096164A (en) * | 2001-07-16 | 2003-04-03 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
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