JPH08335839A - Production of vibrator - Google Patents

Abstract

PURPOSE: To keep the stable oscillation frequency for a long period in production of a crystal vibrator, etc. CONSTITUTION: A diaphragm 1 is directly junctioned to a 1st cover 3, and a conduction electrode 18 is formed on the inner surfaces of through holes 4 and 5 and at their periphery. The electrode 18 is electrically connected to the exciting electrodes 10 and 11 which are formed on the diaphragm 1. A 2nd cover 2 is directly junctioned to the diaphragm 1 to package it. Then the sealing electrodes 6 and 7 consisting of a laminated film including an Ni or Zn lower layer and a solder upper layer are formed on the cover 2 by a vapor deposition or sputtering treatment. Thus a container having its internal vacuum state is sealed airtightly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a vibrator such as a crystal, and more particularly to a method of manufacturing a vibrator for stabilizing an oscillation frequency for a long period of time.

[0002]

2. Description of the Related Art A vibrating plate having a tongue-shaped vibrating portion is provided with excitation electrodes on the front and back surfaces thereof, and leads from the excitation electrodes on the front and back surfaces are respectively passed through the roots of the vibrating portion. An electrode is drawn out, one of the front and back lead electrodes forms a first connecting portion, the other lead electrode forms a second connecting portion after penetrating to the one lead electrode side, and is made of quartz or glass. The first cover having a through hole and the vibrating plate are joined together at the outer peripheral portion of the vibrating portion having a tongue shape.
The second connecting portion forms an electrode for both conduction and sealing on the inner surface of the through hole and the periphery of the through hole through the through hole provided in the first cover, and is connected to the second cover made of crystal or glass. The vibrating plate is joined to the surface opposite to the first cover at the outer periphery of the tongue-shaped vibrating portion in a vacuum or in an inert gas atmosphere such as nitrogen to form a package, and the inner surface of the through hole of the first cover. Further, solder is formed around the through holes by welding, printing or plating.

[0003]

In the above-mentioned conventional example, since the through hole provided in the first cover is sealed only by the electrode having both conduction and sealing, the airtightness is low, and the solder is welded, printed or plated. However, there was a problem of leakage before the formation.

Further, there is a problem that the oscillation frequency cannot be stabilized for a long period of time due to the influence of organic substances such as flux of solder used for welding, printing or plating.

Therefore, the present invention provides a method of manufacturing a vibrator which enhances the airtightness in the through hole portion and enables long-term stabilization of the oscillation frequency.

[0006]

In order to achieve this object, the present invention is to form excitation electrodes on the front and back surfaces of a diaphragm having a tongue-shaped vibrating portion, and to form excitation electrodes on these front and back surfaces. Lead electrodes are drawn out from the excitation electrodes via the roots of the vibrating portions, and one of the front and back lead electrodes is the first electrode.
And the other lead electrode penetrates to the one lead electrode side to form a second connection portion, and the first cover made of crystal or glass and provided with a through hole and the diaphragm are The tongue-shaped vibrating portion is joined at the outer peripheral portion, and the first and second connecting portions are connected to the conductive electrode formed on the inner surface of the through hole and around the through hole through the through hole provided in the first cover. The second cover, which is electrically connected to the first cover and the second cover made of crystal or glass, is joined to the surface opposite to the first cover at the outer periphery of the tongue-shaped vibrating portion to form a package. A laminated film mainly composed of solder is formed by vapor deposition or sputtering on a conductive electrode formed on the inner surface of the through hole and around the through hole to form a sealing electrode, which is hermetically sealed.

[0007]

According to the above method, the through hole of the first cover is covered with not only the conductive electrode but also the laminated film mainly composed of solder, so that the airtightness is enhanced.

Further, in this case, since the laminated film mainly composed of solder is formed by vapor deposition or sputtering in a vacuum, the inside of the container can be sealed in a vacuum state, and the oscillation frequency can be stabilized for a long period of time. Is.

[0009]

EXAMPLES Examples of the present invention will be described. FIG. 1 shows a substrate structure of a package according to the vibrator manufacturing method of the present invention.
In FIG. 1, reference numeral 1 denotes a diaphragm, which is composed of a quartz plate having a plate thickness of 100 μm. The thickness of the diaphragm 1 is 400μ on the front and back sides.
The 2nd cover 2 and the 1st cover 3 which consist of a m crystal plate are directly joined. It is to be noted that reference numerals 4 and 5 in FIG. 1 are through holes, which are arranged in a diagonal line portion on the back surface of the first cover 3, and the sealing electrodes 6 and 7 are formed on the inner surfaces of the through holes 4 and 5 and around them. .

As shown in FIGS. 2 and 3, the vibrating plate 1 has a U-shaped cut groove 8 formed therein, and a tongue-shaped vibrating portion 9 is formed thereby. Excitation electrodes 10 and 11 are formed on the front surface and the back surface of the vibrating portion 9, and the lead electrodes 13 and 1 are formed via the root portion 12 of the vibrating portion 9, respectively.
4 is pulled out. Of these, the end portion of the lead electrode 13 penetrates the diaphragm 1 by the through hole 15 as shown in FIGS. 2 to 5, and then passes through the side of the vibrating portion 9 as shown in FIG. Connection part 1 extended to the other side
6 is formed. Further, the lead electrode 14 is
The connection part 17 is formed on the side.

Then, they are connected to the sealing electrodes 6 and 7 through the conducting electrodes 18 in the through holes 4 and 5 formed in the first cover 3 corresponding to these connecting portions 16 and 17, respectively.
The second cover 2 and the first cover 3 sandwich the front and back outer peripheral portions of the diaphragm 1 at their outer peripheral portions and are directly joined to each other. The lead electrode 13 is bonded at the outer periphery of the
The portion of the vibration passing through the outside of the vibrating portion 9 is joined to the first cover 3 on the outside thereof.

As is apparent from FIGS. 5 and 6, the vibrating plate 1 is thickened only at the sandwiching portion between the second cover 2 and the first cover 3, and the vibrating portion 9 and the lead electrode 13,
The plate thickness of the portion forming 14 and the like is reduced by etching. FIG. 4 shows the diaphragm 1 after this etching process.
The plate thickness is thinned by etching on both surface portions corresponding to the frame line 19.

The features of this embodiment will be described below. 5 and 6 are cross-sectional views of the packaged vibrator according to this embodiment. First, the diaphragm 1 and the first cover 3 having the through holes 4 and 5 are directly joined. The through holes 4 and 5 provided in the first cover 3 have a conical shape with a smaller diameter on the diaphragm 1 side, and a laminated film having Cr as a lower layer and Cu as an upper layer is vapor-deposited on or around the inner surface thereof. The conductive electrode 18 is formed by sputtering. At this time,
Cr is formed in a thickness of 0.1 μm to 0.3 μm in order to strengthen the adhesion between crystal and Cu, and Cu is formed in a thickness of 1 μm to 4 μm. The conduction electrode 18 is formed on the inner surfaces of the through holes 4 and 5 and around it, and is electrically connected to the connection portions 16 and 17. After that, the second cover 2 and the diaphragm 1
Direct bonding is performed in air to package.

In this state, Ni or Zn is used as the sealing electrodes 6 and 7 in the lower layer so as to cover the inner surface of the through holes 4 and 5 and the conduction electrode 18 covering the periphery thereof, and solder is continuously deposited thereon by vapor deposition or sputtering. It is formed as a laminated film. At this time, Ni or Zn is formed to have a thickness of about 1 μm in order to enhance the adhesion between the crystal, Cu and an oxide film of Cu and the solder, and the solder is formed to have a thickness of 5 μm to 15 μm. Next, place this packaged oscillator in a vacuum at 250 ° C to 350 ° C.
Anneal at the temperature of.

This annealing may be performed at a temperature higher than the melting point of the solder in an atmosphere of an inert gas such as nitrogen or argon.

When the small diameter side of the through hole 4 has an overhang-like deformation or defect as shown in FIG. 7, the conduction electrode 18 is formed along the deformation or defect, but the sealing electrode 6 is formed. After being formed on the conductive electrode 18, the solder flows by annealing so as to fill the deformed or defective portion, and since the solder is formed by vacuum deposition or sputtering, it does not contain impurities such as organic substances. Since it is not present, it becomes an extremely tight state, airtightness can be secured, and the inside of the container can be sealed in a vacuum state.

[0017]

As described above, according to the present invention, excitation electrodes are formed on the front and back surfaces of a diaphragm having a tongue-shaped vibrating portion, and vibrations are generated from the front and back excitation electrodes, respectively. A lead electrode is led out through the root part of the part, one of the lead electrodes on the front and back surfaces forms a first connecting portion, and the other lead electrode penetrates to the one lead electrode side and then a second connecting portion. The first cover made of crystal or glass and having a through hole is joined to the diaphragm at the outer periphery of the tongue-shaped vibrating portion, and the first and second connecting portions are The second cover made of crystal or glass and the diaphragm are electrically connected to the inner surface of the through hole and the conductive electrode formed around the through hole through the through hole provided in the cover. The outer surface of the tongue-shaped vibrating part is joined to the opposite surface to form a package, and the first package The solder around the inner surface and the through hole of the through-hole of the over formed by vapor deposition or sputtering a laminated film consisting mainly as a sealing electrode, in which hermetically sealed.

According to the above manufacturing method, the through hole of the first cover is covered with not only the conductive electrode but also the laminated film mainly composed of solder, so that the airtightness is enhanced.

Further, in this case, since the sealing electrode is formed of Ni or Zn in the lower layer to enhance the adhesion to Cu, the oxide film of Cu and the crystal face, the hermeticity is further enhanced.

Further, in this case, since the solder is formed by vapor deposition or sputtering in a vacuum, the inside of the container can be sealed in a vacuum state, and the oscillation frequency can be stabilized for a long period of time.

[Brief description of drawings]

FIG. 1 is a perspective view of a vibrator obtained by a vibrator manufacturing method according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the oscillator.

FIG. 3 is an exploded perspective view of the oscillator.

FIG. 4 is a top view of the diaphragm.

FIG. 5: A of FIG. 4 of a vibrator in which a cover is joined to the same diaphragm.
-A sectional view

FIG. 6 is a vibrator of FIG. 4 in which a cover is joined to the diaphragm.
-B cross section

FIG. 7 is an enlarged sectional view of the through hole portion.

[Explanation of symbols]

 1 Vibration Plate 2 2nd Cover 3 1st Cover 4 Through Hole 5 Through Hole 6 Sealing Electrode 7 Sealing Electrode 8 Cut Groove 9 Vibrating Section 10 Excitation Electrode 11 Excitation Electrode 12 Root 13 Lead Electrode 14 Lead Electrode 15 Through Hole 16 Connection Part 17 Connection Part 18 Conductive Electrode 19 Frame Line

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hideki Azumaya Hideki Higashiya 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Keisaburo Kuramasu 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (6)

[Claims] 1. A vibrating plate having a tongue-shaped vibrating portion is provided with excitation electrodes on the front and back surfaces thereof, and leads from the excitation electrodes on the front and back surfaces are respectively passed through the root portions of the vibrating portion. An electrode is drawn out, one of the front and back lead electrodes forms a first connecting portion, the other lead electrode forms a second connecting portion after penetrating to the one lead electrode side, and is made of quartz or glass. The first cover having a through hole and the vibrating plate are joined together at the outer peripheral portion of the vibrating portion having a tongue shape.
The second connecting portion is electrically connected to the conducting electrode formed on the inner surface of the through hole and the periphery of the through hole through the through hole provided in the first cover, and the second cover made of crystal or glass and the above-mentioned second cover. The vibrating plate is joined to the surface opposite to the first cover at the outer periphery of the tongue-shaped vibrating portion to form a package, and a laminated film mainly composed of solder is formed on the inner surface of the through hole of the first cover and around the through hole. A method for manufacturing a vibrator, in which a sealing electrode is formed by vapor deposition or sputtering to hermetically seal. 2. A vibrating plate having a tongue-shaped vibrating portion, excitation electrodes are formed on the front and back surfaces of the vibrating plate, and leads are formed from the front and back excitation electrodes via the root portion of the vibrating portion. An electrode is drawn out, one of these front and back lead electrodes forms a first connection portion, the other lead electrode forms a second connection portion after penetrating to the one lead electrode side, and is made of quartz or glass. The first cover having a through hole and the vibrating plate are joined together at the outer peripheral portion of the vibrating portion having a tongue shape.
The second connecting portion is electrically connected to the conducting electrode formed on the inner surface of the through hole and the periphery of the through hole through the through hole provided in the first cover, and the second cover made of crystal or glass and the above-mentioned second cover. The vibrating plate is joined to the surface opposite to the first cover at the outer periphery of the tongue-shaped vibrating portion to form a package, and a laminated film mainly composed of solder is formed on the inner surface of the through hole of the first cover and around the through hole. Is formed by vapor deposition or sputtering to form a sealing electrode, which is annealed in a vacuum at a temperature higher than the melting point of the solder used and is hermetically sealed. 3. A vibrating plate having a tongue-shaped vibrating portion is provided with excitation electrodes on the front and back surfaces thereof, and leads from the excitation electrodes on the front and back surfaces respectively through the roots of the vibrating portion. An electrode is drawn out, one of the front and back lead electrodes forms a first connecting portion, the other lead electrode forms a second connecting portion after penetrating to the one lead electrode side, and is made of quartz or glass. The first cover having a through hole and the vibrating plate are joined together at the outer peripheral portion of the vibrating portion having a tongue shape.
The second connecting portion is electrically connected to the conducting electrode formed on the inner surface of the through hole and the periphery of the through hole through the through hole provided in the first cover, and the second cover made of crystal or glass and the above-mentioned second cover. The vibrating plate is joined to the surface opposite to the first cover at the outer periphery of the tongue-shaped vibrating portion to form a package, and a laminated film mainly composed of solder is formed on the inner surface of the through hole of the first cover and around the through hole. Is manufactured by vapor deposition or sputtering to form a sealing electrode, which is annealed at a temperature higher than the melting point of the solder used and in an inert gas atmosphere such as nitrogen or argon to hermetically seal. 4. A vibrating plate having a tongue-shaped vibrating portion, excitation electrodes are formed on the front and back surfaces of the vibrating plate, and leads are respectively led from the front and back excitation electrodes via the root portion of the vibrating portion. An electrode is drawn out, one of the front and back lead electrodes forms a first connecting portion, the other lead electrode forms a second connecting portion after penetrating to the one lead electrode side, and is made of quartz or glass. The first cover having a through hole and the vibrating plate are joined together at the outer peripheral portion of the vibrating portion having a tongue shape.
The second connecting portion is electrically connected to the conducting electrode formed on the inner surface of the through hole and the periphery of the through hole through the through hole provided in the first cover, and the second cover made of crystal or glass and the above-mentioned second cover. The vibrating plate is joined to the surface opposite to the first cover at the outer periphery of the tongue-shaped vibrating portion to form a package, and a laminated film mainly composed of solder is formed on the inner surface of the through hole of the first cover and around the through hole. A method for manufacturing a vibrator, in which a sealed electrode is formed by vapor deposition or sputtering while being heated to 250 ° C. to 350 ° C., and is hermetically sealed. 5. The method of manufacturing a vibrator according to claim 1, wherein the sealing electrode formed in the through hole is a laminated film in which at least Ni is formed in a lower layer and solder is formed in an uppermost layer. 6. The vibrator manufacturing method according to claim 1, wherein the sealing electrode formed in the through hole is a laminated film in which at least Zn is formed in a lower layer and solder is formed in an uppermost layer.