JPH08297699A - System and method for supporting production failure analysis and production system - Google Patents

Abstract

PURPOSE: To easily decide whether a countermeasure is effective for reducing failures or not by managing a defect rate found from the defect result while relating it with countermeasure contents and countermeasure time found from the countermeasure result. CONSTITUTION: Based on inputted information and information held in a failure occurrence tendency table 212, inspection point information storage means 208, defect result storage means 206 and substrate manufacture result storage means 207, a failure rate managing means 201 prepares a record concerning a defect managing term and stores it in a failure rate managing data storage means 209. While using the information for failure rate management stored in the failure managing data storage means 209, the information held in the failure occurrence tendency table 212 and the countermeasure contents and failure occurrence tendency inputted through an input device, a countermeasure analyzing means 202 updates the record held in the failure rate managing data storage means 209, further prepares information for image display and stores it in a data storage means 210 for image display.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing defect analysis system and a manufacturing defect analysis method for analyzing the effect of countermeasures against the occurrence of product defects in a manufacturing line.

[0002]

2. Description of the Related Art As a method for inferring the cause of a manufacturing defect that requires investigation of the cause, it is disclosed in Japanese Patent Laid-Open No. 2-234.
No. 451 publication “Method of extracting defective process in LSI manufacturing process”
Then, a trouble database showing correspondences between troubles occurring in each process of estimating the cause of defects occurring in the LSI manufacturing process and defects on the (wafer) caused by the troubles is created and stored in the database. Based on this, a method for extracting a defective process is described.

Further, in "Appearance inspection method and apparatus therefor and method for removing cause of abnormality in manufacturing process of product" described in Japanese Patent Application Laid-Open No. 2-287241, defect inspection data of an appearance inspection apparatus is collected and accumulated to detect defect space. The characteristic parameters are extracted by analyzing the statistical distribution and temporal variation, and the cause is estimated by performing abnormality diagnosis of the manufacturing process using the knowledge base system.

[0004]

In the method of extracting defective processes based on a trouble database, in order to identify a true defective cause process, the cause is determined in the descending order of defect occurrence frequency or in ascending order of occurrence date and time. Extract steps. In addition, in the method of eliminating the cause of abnormalities during the manufacturing process of the product,
The certainty factor representing the degree of possibility as a cause is set in advance as a part of empirical knowledge and used for analysis. These methods contribute to the improvement of the reliability of the analysis based on the analysis result and the empirical knowledge of the setter.

However, these prior arts do not consider the analysis of the effect of countermeasures such as how much the defect occurrence is suppressed by those methods as a result of the countermeasures. Also,
To understand the effect of the measures, it is necessary to refer to and analyze a huge amount of actual data, and it is extremely difficult to manually cover all the data.

Therefore, the present invention is to judge the effect of the countermeasure and
An object of the present invention is to provide a manufacturing defect analysis support method for supporting selection of measures, and a manufacturing defect analysis support system and a manufacturing system using the method.

[0007]

To achieve the above object, in the present invention, in a manufacturing defect analysis support system for analyzing a product defect that occurs in a product manufacturing line, the measures taken in the manufacturing line are Based on the countermeasure content and the countermeasure information having the countermeasure time, the defect content before and after the countermeasure content included in the countermeasure information and the countermeasure time included in the countermeasure information with respect to at least one of the countermeasure information. A manufacturing defect analysis support method is provided, which supports the manufacturing defect analysis by associating and outputting the defect ratio, which is the occurrence ratio of the product defects in the management period, and the countermeasure information.

Further, the present invention provides a manufacturing defect analysis support system and a manufacturing system using this method.

Here, the production line is a mechanism having one or more processes for producing some kind of product, and may be a system including a plurality of devices or a single device. Further, not only the case where a large number of the same products are manufactured, but also the case where a small number (or one) of a variety of products are manufactured are included in the manufacturing line of the present invention. Further, the production of a product includes simple copying and the like.

[0010]

According to the present invention, the defect rate obtained from the defect record, the countermeasure content and the countermeasure time obtained from the countermeasure record are managed in association with each other. In this way, based on the result of the failure analysis, the defect rate and the content of the countermeasure can be associated with the time with respect to the defect for which the countermeasure is taken. Therefore, the countermeasure (that is, It is possible to easily determine whether or not the analysis method that led to the selection of the countermeasure) was effective in reducing defects.

For example, the contents of the measures executed in the past,
When outputting the failure rate before and after the time of execution of the countermeasure in association with the output device, the user, for each content of the countermeasure,
The change in the defective rate due to the countermeasure can be recognized at a glance, and the countermeasure to be implemented can be easily selected.
In this case, it is desirable to display the defect rate as a graph. This is because it becomes easier to recognize the transition of the defective rate.

Further, in this case, it is desirable to perform the above-mentioned output processing for the countermeasure information satisfying a predetermined condition among the countermeasure information stored in the countermeasure result storage means. This is because information that is considered to be particularly useful for supporting selection is selectively presented.

As described above, according to the present invention, it is possible to easily determine whether or not the implemented countermeasure is effective from the variation of the defect rate before and after the countermeasure implementation time. Therefore, a predetermined condition is set, for example, whether it is performed for the first time (that is, whether the countermeasure content is first registered in the countermeasure result storage means), or the defect rate changes to a predetermined value or more before and after the countermeasure time. It is possible to determine whether or not the defective rate has changed to a value equal to or less than a predetermined value before and after the countermeasure time. This is particularly effective or ineffective in reducing defects, or can extract new measures, and is effective in supporting selection.

Further, the present invention further comprises a check item database for accumulating analysis knowledge, and an analysis processing means for estimating a cause candidate of a phenomenon of a defect that has occurred based on the accumulated analysis knowledge. Is desirable. Here, the analysis knowledge is specifically realized by a check item record having a check item for estimating a cause and a cause estimated when the phenomenon corresponds to a predetermined phenomenon for each check item. In this case, according to the present invention, cause candidates are presented depending on whether or not the tendency of defect occurrence and the like meet the criteria of check items. Therefore, the user is presented not only with the measure candidate but also with the estimated cause candidate, so that it becomes easier to select the measure.

The analysis processing means further comprises a countermeasure content storage means for pre-storing information (text information, drawing information, etc.) indicating the countermeasure content according to the cause, and the analysis processing means is any of the above cause candidates. Alternatively, the selection may be accepted, and the information indicating the countermeasure stored in the countermeasure content storage unit in advance may be output according to the selected cause. By doing so, the user can recognize the content of the countermeasure to be executed by only selecting one of the estimated cause candidates. Here, the information indicating the content of the countermeasure may be displayed and output on the display device, but the manufacturing line receives the countermeasure instruction signal and executes the instructed countermeasure (at least the instruction of the operator of the manufacturing line is instructed). If you have a means to display the contents),
You may output to a manufacturing line as a countermeasure signal. In this case, the manufacturing defect analysis support system of the present invention directly notifies the manufacturing line of the countermeasures without the intervention of the user, so that the burden on the user can be reduced.

For each defect cause candidate, a score indicating the priority of the candidate is attached, and the check item record is
By further having a correlation value that is an index of the probability of the probable cause, the analysis processing means,
The score of the defect occurrence cause candidate registered in the check item record that meets the judgment criteria of each registered check item is increased by the correlation value included in the record, and the score is calculated in advance. Cause candidates larger than a predetermined value may be set as the estimated cause candidates. By doing so, it is possible to present a more accurate cause candidate in consideration of the correlation and the appearance frequency of the failure phenomenon that meets the conditions.

It should be noted that the input of the check item and the corresponding cause candidate is accepted, and the entered check item and the corresponding cause candidate are inconsistent with the contents of the check item record already held in the check item database. If it is determined that there is no contradiction, a check item record may be created based on the input check item and the corresponding cause candidate, and stored in the check item database. If you do this,
It is possible to easily register a new check item record while ensuring the consistency between the check item records. Even if there is a contradiction, if you select to register, create a check item record in the same way,
It may be stored in the check item database.

The manufacturing failure analysis support method / system described above can be incorporated into a product manufacturing system. That is, the present invention provides a manufacturing system in which the manufacturing line is connected to the manufacturing defect analysis support method described above.

In addition to the means for manufacturing the product, the manufacturing line receives the instruction for the countermeasure work and executes the instructed countermeasure work, and the detected product defect content to the manufacturing defect analysis apparatus. In the case of having a means for notifying and a means for notifying the manufacturing defect analysis device of the manufacturing performance information and the countermeasure performance information, the manufacturing defect analysis device, the content of the product defect notified from the manufacturing line. Based on the defect record data, the defect record data is created and stored in the defect record storage unit, and the countermeasure information is collected based on the manufacturing record information and the countermeasure record information notified from the manufacturing line. In the case where there is a means for creating and storing in the above-mentioned countermeasure record storage means and outputting the above-mentioned countermeasure information as a countermeasure work instruction to the manufacturing line, The creation of broadcast, accumulation, and there is no need through the user to countermeasure instruction. Therefore, according to such a manufacturing system of the present invention, the burden on the user can be further reduced.

Further, the manufacturing line is provided with means for receiving the instruction of the repair work and executing the instructed repair work, and the manufacturing defect analysis device is based on the content of the product defect notified from the manufacturing line. It is also possible to further include means for creating correction work instruction information and outputting it to the production line. This way, the operator of the production line
The manufacturing system automatically executes the repair work when it detects the occurrence of a defect without detecting the occurrence of the defect itself and instructing the repair work. By oversight, it is possible to prevent the generation of defective products that are not repaired.

In the manufacturing defect analysis support system of the present invention, the manufacturing condition management items and design specification items that may cause the defects are correlated with the defect occurrence tendency peculiar to the cause of the defects in each defect type. It is also possible to provide a check item database in which is set and a cause / countermeasure correspondence database in which countermeasure contents corresponding to the cause described in the check item database are set. This manufacturing failure analysis support system extracts the occurrence position of a defect, defective part, manufacturing condition, etc. from the inspection result, searches the above database, and presents the cause of failure and countermeasures. At this time, the manufacturing defect analysis support system accumulates the information for each check item in the defect rate management data, extracts the countermeasure content at the time when the change of the defect rate is peculiar from the defect rate management data, and updates the check item database. It warns that there is a need to do it, displays the details of each measure taken at the same time and the tendency of failure, and by supporting the user, quantitatively grasps the effect of the measure, estimates the cause of the failure, and checks for use in the measure. Update the item database.

[0022]

【Example】

(Embodiment 1) As an embodiment of the present invention, a manufacturing defect analysis system and method for analyzing defects occurring in printed circuit board mounting will be described below.

A. Analysis Target First, the printed circuit board mounting line to be analyzed will be described. The printed board mounting line to be analyzed in this embodiment is shown in FIG. The printed board mounting line is
Printing machine 301, mounting machine 302, reflow soldering device 30
3, appearance inspection device 304, solder correction means 305, insertion machine 306, flow soldering device 307, hand assembly means 308,
The visual inspection means 309, the correction means 310, the in-circuit tester 311, and the function tester 312 are provided. These devices and the like 301 to 312 are, respectively,
Corresponding to steps 1 to 12, the substrate to be processed is processed in the order of steps 1 to 12.

Printing machine 301, mounting machine 302, reflow soldering apparatus 303, inserting machine 306, flow soldering apparatus 30
7 is a manufacturing apparatus. The printing machine 301 is an apparatus that applies a solder paste onto a board, and the mounting machine 302 is an apparatus that places a component on the board.
Reference numeral 3 is a device for melting the solder paste and electrically connecting the component and the substrate. Further, the inserter 306 is a device for placing an insert component on the board, and the flow soldering device 30
Reference numeral 7 is an apparatus for soldering the insertion part placed on the board and the board.

The visual inspection device 304, the in-circuit tester 311, and the function tester 312 are inspection devices. The visual inspection device 304 inspects the state of the solder, and detects defective soldering such as insufficient solder, excessive solder bridge or excessive solder, and defective mounting such as component mounting position deviation and polarity difference (reverse mounting). It is a device that does. The in-circuit tester 311 is a device that determines solder bridge, short open, and quality of mounted components, and the function tester 312 is a device that performs a test for each function of the mounted component to be processed.

Hand assembly means 308, solder correction means 305,
The visual inspection means 309 and the correction means 310 perform manual work. The hand-assembling means 308 mounts and solders manually mounted components. The solder repair means 305 repairs defects found in the visual inspection device or defects found in the visual inspection process described later, that is, parts replacement, solder remounting, etc. Done. In the visual inspection means 309, the inspector inspects for the presence of soldering defects and assembling defects. Further, in the correction means 310, the visual inspection means 309
The defect found in is corrected.

The substrate to be processed is loaded from the first step, the solder paste is applied on the substrate by the printing machine 301 (mounting step 1), the components are placed by the mounting machine 302 (mounting step 2), and the reflow soldering is performed. The device 303 melts the solder paste (mounting step 3) and electrically connects the component and the substrate. As a result, the component is mounted on the board.

The board on which the components are mounted is then inspected by the appearance inspection device 304 for the state of solder, and the soldering failure such as insufficient solder, solder bridge, or excessive solder, and displacement of the mounting position of the components. , Whether or not there is a built-in defect such as polarity difference (reverse attachment) is determined (mounting process 4). When the appearance inspection device 304 detects a defect,
The solder correcting means 305 replaces the parts, reseats the solder, and the like (mounting step 5).

Next, the inserted component is placed on the board on which the component is mounted by the inserter 306 (mounting step 6) and soldered by the flow soldering device 303 (mounting step 7). Further, the hand-assembling means 308 mounts and solders the manually mounted components on the board (mounting step 7).

The visual inspection means 309 inspects for soldering defects and assembling defects (mounting step 9).
When a defect is detected, the correcting unit 310 corrects the detected defect by replacing parts, re-soldering, or the like (mounting step 10). Further, the in-circuit tester 311 determines solder bridge, short open, quality of mounted components, etc. (mounting process 11), and the function tester 312 performs a test for each function to check whether the mounted substrate is defective or not. It is determined (mounting process 12).

FIG. 4 shows an example of a phenomenon of a defect occurring in the mounting process which is an analysis target in the present embodiment and its cause. The cause of failure is to examine the manufacturing conditions of each device when the failure occurred, the matching of the board and the manufacturing conditions, what kind of failure has occurred at what position, and what causes each failure in the past. It is specified by

The analysis system of this embodiment analyzes the cause of the defect registered in the defect record, selects the countermeasure corresponding to the cause, notifies the corresponding process, and then changes the defect rate. By managing and analyzing the data and displaying the analysis result, it helps to grasp the effectiveness of the analysis / countermeasure method.

B. Configuration of Analysis System In the analysis system of the present embodiment, as shown in FIG. 30, a main storage device 3007 and a central processing unit (CPU) 3006.
And a magnetic disk device 30
01, a floppy disk input device 3003, an input / output device 3004, and a printer 3005. The magnetic disk device 3001 is an external storage device for storing a check item DB, a defect record, defect rate management data, and the like. The floppy disk input device 3003 is a device for reading out the information held on the floppy disk and notifying the information to the processing device 3002.
Includes a display which is an output device and a keyboard and a mouse which are input devices. Printer 3005
Is an auxiliary output device.

A functional block diagram of the processing apparatus 3002 of this embodiment is shown in FIG. The processing device 3002 of this embodiment is
A defect rate management unit 201, a countermeasure analysis unit 202, and a countermeasure status display unit 203 are provided. Countermeasure status display means 20
3 includes a countermeasure content / defective tendency display means 204. These means 201 to 204 execute instructions stored in the main storage device 3007 in advance in the CPU 30.
It is realized by executing 06.

Further, the processing apparatus 3002 includes a defect record storage unit 206, a board manufacturing record storage unit 207, an inspection point information storage unit 208, a defect rate management data storage unit 209, and a screen display data storage unit 210. , Defect occurrence tendency table 212 and countermeasure result storage means 213
With. These storage means 206 to 210, 21
Reference numerals 2 and 213 are storage areas secured in the main storage device 3007 for holding information.

C. Storage Means Next, each storage means 206 provided in the main storage device 3007
210 to 212, 213 will be described.

(1) Defect record storage means 206 FIG. 9 schematically shows an example of the data structure of the defect record storage means 206. The defect record storage unit 206 is a storage region for holding history information related to defect generation, and stores a generation number storage region 908, a set drawing number storage region 901 indicating a board type, for each defect generation. A serial number storage area 902 that is an identifier of each board, a defective part name storage area 903 that is a name of a part in which a defect is detected, a mounting area 904 of a mounting position of the defective part on the board, and a defect. A storage area 905 for the name of the inspection process in which the part is found, a storage area 906 for the date and time when the defect was found, and a storage area 907 for information indicating a specific phenomenon of the failure are provided.

(2) Substrate manufacturing record storage means 207 FIG. 8 schematically shows an example of the data structure of the board manufacturing record storage means 207. The board manufacturing record storage unit 207 is a storage area provided for each mounting process and for holding information indicating the manufacturing record in the mounting process.

The individual board manufacturing record storage means 207 stores, for each processed board, a storage area 801 for storing the start time of the board and a storage area 8 for storing the end time of the board.
04 and a storage area 802 for the assembly drawing number indicating the type of the board
And a storage area 803 for storing a serial number which is an identifier of each board.

(3) Inspection point information storage means 208 An example of the data structure of the inspection point information storage means 208 is shown in FIG.
0 schematically shows. Inspection point information storage means 208
Is a storage area 1001 for storing the set drawing number for each set drawing number,
An inspection process storage area 1002 for holding information indicating an inspection process for inspecting the product of the assembly diagram number and an inspection point storage area 1003 for holding the number of points to be inspected in the inspection process are provided. It is a storage area.
The inspection point information storage unit 208 can include a plurality of sets of an inspection process storage area 1002 and an inspection point number storage area 1003. In the example shown in FIG. 10, the number of inspection points in the inspection process indicated by the information held in the inspection process storage area 1002a is the point number storage area 10
03a, and the number of inspection points in the inspection process indicated by the information held in the inspection process storage area 1002b is retained in the point number storage area 1003b.

The inspection process information and the number of points are stored in advance. In the present embodiment, the inspection results in the visual inspection step (mounting step 4) and the visual inspection step (mounting step 9) are analyzed. Therefore, the inspection point information storage unit 208 of this embodiment holds the number of inspection points for each of the visual inspection step (mounting step 4) and the visual inspection step (mounting step 9) in advance.

(4) Defect Rate Management Data Storage Means 209 An example of the data structure of the defect rate management data storage means 209 is schematically shown in FIG. In this embodiment, regarding the inspection process,
Information is accumulated for each defect phenomenon for an arbitrary period, and the defect rate and the like during the period are obtained, which is used as the basis for analyzing the cause of defect occurrence and selecting a countermeasure method. The period for accumulating this information is called the defect rate management period.

The defective rate management data storage means 209 is provided for each inspection process and defective phenomenon. The individual defective rate management data storage unit 209 stores a storage area 501 of a flag indicating a management state and a defective rate management period storage area for storing the start date and end date and time of the defective rate management period for each defective rate management period. 502, a storage area 504 for the defect rate during the defect rate management period, a storage area 505 for the assembly number indicating the type of substrate to be processed, and a defect occurrence tendency record (held in the defect occurrence tendency table 212). ) Storage area 509 for the trend data number, storage area 506 for the number of executed countermeasures, storage area 507 for the countermeasure content number indicating the content of the selected countermeasure, and storage area for the date and time when the countermeasure was implemented. 508 and the table. Each row of this table stores information (defective rate management data) regarding one defective rate management period. The information of each defective rate management period is stored such that the line numbers are in ascending order of start date and time.

The management status flag stored in the flag storage area 501 is a number from "0" to "6", and an analysis of the result of the defective rate management period indicated by the line in which the flag is stored is carried out. And at what stage the countermeasures are in place. “0” indicates that the countermeasure has not been implemented yet, “1” indicates that the countermeasure has been implemented but the result has not been analyzed, and “2” indicates that the result has been analyzed and the next “ It shows that it does not correspond to “3” to “5”. "3" indicates that the measures were implemented but there was no effect, "4" indicates that the measures were implemented and a remarkable effect was obtained,
"5" indicates that the implemented measure was a new measure. Further, "6" indicates that the result has already been displayed.

Further, the countermeasure content storage area 507 can hold a plurality of countermeasure numbers. The number of countermeasure numbers stored in the countermeasure content storage area 507 is stored in the countermeasure number storage area 506.

(5) Screen display data storage means 210 The screen display data storage means 210 is a storage area for holding in advance information for screen display such as screen format.

(6) Defect occurrence tendency table 212 An example of the data structure of the defect occurrence tendency table 212 is schematically shown in FIG. The defect occurrence tendency table 212 is a table for holding a defect occurrence tendency record indicating a tendency of defect occurrence, and one row represents one record.

In the present embodiment, regarding the tendency of occurrence of defects,
The tendency check items are set in advance, and FIG.
As shown in, the tendency code is defined for each check item as a code representing the item. The defect occurrence tendency table 212 has a deflection rate storage area 60 for holding the deflection rate for each tendency code for each tendency code.
Equipped with 0. Note that FIG. 6 illustrates the table 212 by taking the case where the number of trend check items is n (where n is an arbitrary positive integer) as an example, and the trend code 1 corresponding to each trend check item is shown. Deflection ratio storage areas 601 to 60n for .about.n are provided.

The defect occurrence tendency record is provided with a tendency data number as its identification code. Therefore, the defect occurrence tendency table 212 further includes a tendency data number storage area 610 in each row.

(7) Countermeasure result storage means 213 FIG. 11 schematically shows an example of the data structure of the countermeasure result storage means 213. The countermeasure record storage unit 213 is a table that holds, for each opportunity in which the countermeasure is executed, a countermeasure record record that is information about the countermeasure executed in the opportunity.
The countermeasure record is added to the countermeasure record storage unit 213 every time the countermeasure is executed.

In FIG. 11, one countermeasure result record is represented by one line. Each row of table 213 is
A countermeasure execution date / time storage area 1102 for holding the time when the countermeasure is taken, a countermeasure target storage area 1101 which is a storage area of a number indicating a defect record as a countermeasure target, and the content of the countermeasure executed at that date / time And a countermeasure content storage area 1103, which is a storage area of information indicating

The countermeasure target storage area 1101 of each row stores the defect record number of the defect which is the target of the countermeasure performed on that occasion (of the defect record record held in the generation number storage area 908 of the defect record storage means 206). A plurality of defect record number storage areas 1104 for holding (identifiers) can be provided respectively. That is, in the present embodiment, it is possible to register a plurality of defect records as countermeasure targets in one countermeasure record record.

Further, the countermeasure record storage means 213 can be provided with a plurality of countermeasure content storage areas 1103 in one line.
In other words, in this embodiment, one measure record is
It is possible to register multiple measures that were executed at the same opportunity.

D. Processing of Processing Device 3002 As described above, the processing device 3002 of this embodiment includes the defect rate management unit 201, the countermeasure analysis unit 202, and the countermeasure status display unit 203.

The defect rate management means 201 is the input device 300.
3, 3004 is a means for creating and accumulating information for defect rate management using the information on defect occurrence input via 3004. That is, in this embodiment, the defect rate management means 2
01 indicates the input information and the defect occurrence tendency table 21.
2 and the inspection point information storage unit 208, the defect record storage unit 206, and the information held in the board manufacturing record storage unit 207, a record relating to the defect rate management period is created and stored in the defect rate management data storage unit 209. Store.

The countermeasure analysis unit 202 receives information for defect rate management accumulated in the defect rate management data storage unit 209, information held in the defect occurrence tendency table 212, and the input devices 3003 and 3004. The record held in the defect rate management data storage unit 209 is updated using the countermeasure content and defect occurrence tendency that have been input, and further, information for screen display is created, and screen display data is created. It is stored in the storage means 210.

The countermeasure status display means 203 includes a countermeasure content / defective tendency display means 204 and displays the countermeasure content and defective tendency.

The countermeasure content / defective tendency display means 204 uses the image display data created by the countermeasure analysis means 202, which is held in the image display data storage means 210,
It is means for displaying the contents of countermeasures or the tendency of defects on the output devices 3004 and 3005. Next, each means 201 described above
Details of the processing of steps 205 to 205 will be described.

(1) Defect Rate Management Unit 201 As described above, the defect rate management unit 201 of this embodiment is
Further, a record (defective rate management data) relating to the defective rate management period is created, and the defective rate management data storage means 209.
To be stored.

First, the creation and storage of defect rate management data will be described. The defect rate management means 201 performs the defect rate management data creation process shown in FIG. 7 at a predetermined cycle. The timing of creating the defect rate management data is determined depending on how many parameters the defect analysis / countermeasure is performed, and once when the analysis / countermeasure is performed based on the data for one day, once a day, When analysis / countermeasures are performed based on the data for one month, it is once a month.

The flow of the defect rate management data creation process is shown in FIG.
Shown in In this process, when a defect occurs, defective rate management data is created and stored in the defective rate management data storage unit 209 (steps 701 to 706), and information on the executed countermeasures is stored as defective rate management data storage unit 209. Stored in /
This is a process of updating (steps 707 to 709). Steps 701 to 709 are repeated for all the inspection steps to be processed for the number of defective phenomena. It should be noted that in FIG. 7, the arrow indicates updating or reading of the file.

First, the defect rate management means 201 reads in the defect rate management data of the inspection process / defective phenomenon to be processed through the floppy disk input device 3003 (step 701). Next, the defect rate management unit 201 opens the substrate manufacturing record storage unit 207 of the inspection process to be processed, and the date and time held in the loading start date and time storage area 801 from the substrate manufacturing record storage unit 207 is the defect rate management unit 207. Of the defective rate management period end dates and times (held in the defective rate management period storage area 502) of the respective defective rate management data held in the data storage unit 209, the record having a later date and time than the latest one ( Line). Also,
The defect rate management unit 201 counts the number of types of serial numbers for all the detected records, and obtains the total number thereof, thereby calculating the number of substrates of the defect rate management data to be processed (step 702).

Next, the defect rate management means 201 opens the defect record storage means 206 (step 703) and, based on the information held in the defect record storage means 206, a process target assembly diagram in the process target process. The number of defective cases of the defective phenomenon to be processed of the number is calculated (step 704).

Further, the defect rate management means 201 calculates the defect rate for each assembly drawing number (step 705). In addition,
In step 704, the defective rate of the assembly drawing number whose number of defective records is 0 is set to “0”, and the defective rate in other cases is calculated by the following calculation formula.

Defect rate = (number of defective records calculated in step 704) / (number of inspection points × number of substrates) × 100 where the number of substrates is the number of substrates of the assembly drawing number calculated in step 702, The number of inspection points represents the number of points to be inspected in each assembly drawing number for each inspection process, and is the number of lines in the inspection point information storage unit 208 that holds the processing assembly drawing number in the assembly drawing number storage area 1001. It is held in the point number storage area 1003 corresponding to the inspection step storage area 1002 that holds information indicating the inspection step to be processed. Next, the defect rate management unit 201 secures an area for newly storing defect rate management data in the defect rate management data storage unit 209 to be processed, creates defect rate management data, and secures this region. (Step 706).

That is, the defect rate management means 201, for all the records detected in step 701, its defect rate management period (the start date and time storage area 8 of the records).
01 is set as the start date and time, and the date and time held in the insertion end date and time storage area 804 is set as the end date and time).
The row 9 is stored in the defective rate management period storage area 502, the assembly drawing number is read from the area 802, and stored in the area 505. In addition, the defect rate management unit 201, step 705.
The defective rate calculated in step S4 is stored in the defective rate storage area 504, "0" indicating that no countermeasure has been taken is stored in the flag area 501, the tendency data number storage area 509, the countermeasure number storage area 506,
Measure content storage area 507 and measure time storage area 50
Initialize 8. In addition, the created defect rate management data is
It is added at a position such that the time series with the existing defect rate management data is maintained in the order of being maintained.

When the defect rate management data is created in this manner, the defect rate management means 201 extracts the defect rate management data whose defect rate is larger than 0 and whose flag is "0" indicating that no countermeasure has been taken. In order to detect whether the countermeasure against the defect indicated by is already executed, the countermeasure result storage means 213 is read (step 707).

The defect rate management means 201 which has opened the countermeasure record storage means 213 is the defect rate management data storage means 20.
From 9, the defect rate management data in which a defect has occurred but the flag is not taken as a countermeasure is detected, the defect record corresponding to the data is detected, and a record indicating the countermeasure taken for the defect record is obtained. Detected from the countermeasure record storage means 213,
The content is stored in the defective rate management data storage unit 209 (step 708).

Specifically, first, the defect rate management means 201
Is the defect rate (held in the defect rate storage area 504)
Is larger than 0 and the flag (held in the flag storage area 501) has a defect rate management data of "0" which indicates an unmeasured condition, and is processed. Next, the defect rate management unit 201, from the defect record storage unit 206, the defect rate management data of the processing target, the inspection process, the defect phenomenon,
Further, the defect record record having the same set drawing number and the defect discovery date of the defect record within the defect rate management period of the defect rate management data is detected. Next, the defect rate management means 201 determines the defect generation number of the detected defect record (held in the generation number storage area 908).
Is detected and the number is stored in the generation record storage area 1104 of the defect record number storage area 1101 from the countermeasure record storage means 213.
Search for the record to be stored in. At this time, if a record is detected, it means that the countermeasure has been executed. Therefore, the defect rate management unit 201 causes the flag storage area 5 of the row to be processed.
“1” indicating that the countermeasure has been taken is stored in 01, and the number of countermeasures registered in the detected countermeasure result record is stored in the countermeasure number storage area 5
06, and the contents of the countermeasures (the countermeasure contents storage area 1
A code indicating that (held in 103) is stored in the countermeasure content storage area 507, and the date and time held in the countermeasure date and time storage area 1102 is stored in the countermeasure date and time storage area 508.

When the countermeasure content registration is completed, the defect rate management means 201 passes control to the countermeasure analysis means 202, and with respect to the defect rate management data in which “1” indicating that the countermeasure is completed is held in the flag storage area 501. Then, the content of the countermeasure at the time when the change of the defective rate is peculiar is extracted (step 709).

(2) Countermeasure Analysis Means 202 In step 709, as shown in FIG. 1, the countermeasure contents at the time when the change of the defect rate is peculiar are extracted and the extraction result is reflected in the next analysis. The processing of the countermeasure analysis means 202 in this step 709 will be described below. Note that, in FIG. 1, arrows indicate writing of data to files.

First, the countermeasure analysis means 202 analyzes and extracts countermeasures (step 100). Step 1
In 00, first, the countermeasure analysis unit 202 examines whether or not the change in the defect rate is peculiar, by analyzing all the rows in which “1” indicating that the flag storage area 501 has not been analyzed is held. Then, the defect rate management data (record) that was unique is extracted. It should be noted that the change in the defect rate was peculiar to here, whether the measure had no effect (step 101), the effect was remarkable (step 102), or the measure implemented was new. Means (step 103).

Whether or not the change in the defective rate is peculiar is determined by the following determination formula. That is, the failure rate management data arranged in chronological order is 1, 2, ...
, N, the defect rate of the defect rate management data i is expressed as r _i (1 ≦ i ≦
n) (in this case, the defective rate after the countermeasure is expressed as r _{i + 1} ), if r _i + α ≦ r _{i + 1} , it is determined that the countermeasure has no effect, and [max { If r ₁ ... R _i } -min {r ₁ ... R _i }] × β ≧ r _{i + 1} , it is determined that the effect of the countermeasure is remarkable.
It should be noted that α and β are numerical values preset for each defect phenomenon. A specific example of the values of α and β is shown in FIG. If the countermeasure content is not registered in any of the countermeasure content storage areas 507 of other rows of the defect rate management data storage unit 209, it is determined that the countermeasure is a new countermeasure. If the judgments of the new countermeasure, no countermeasure effect, and remarkable countermeasure effect overlap, it is determined that the countermeasure is a new countermeasure.

In step 101, when the defect rate management data that is not effective in the countermeasure is extracted, the countermeasure analysis means 202 stores "3" in the flag storage area 501 of the row of the record. In step 102, when the defect rate management data having a remarkable effect on the countermeasure is extracted, the countermeasure analysis unit 202 stores “4” in the flag storage area 501 of the row of the record. Further, when the defect rate management data for which a new measure is taken is extracted in step 103, the measure analysis means 202 stores “5” in the flag storage area 501 of the row of the record. Finally, the countermeasure analysis unit 202 stores all the defect rate management data that has not been extracted in any of the steps 101 to 103 and holds “1” indicating that the flag storage area 501 has not been analyzed. The flag storage area 501 of the row stores “2” indicating that analysis has been completed.

Step 1 in the above step 100
If the defect rate management data is not extracted from 01 to 103, the countermeasure analysis unit 202 ends the process and passes control to the countermeasure status display unit 203 (step 104), and any defect rate management data is extracted. For example, a defect occurrence tendency is defined for the defect rate management data (step 10).
5). The defect occurrence tendency is defined by a bias rate with respect to a predetermined tendency check item. A specific example of the trend check item is shown in FIG.

In step 105, the countermeasure analysis means 2
02 secures an area for storing a new record in the defect occurrence table 212, and then issues a unique trend data number to store a trend data number storage area 610 of a newly secured row, The defect rate management data to be processed is stored in the tendency data number storage area 509. Further, the countermeasure analysis unit 202 selects, for each tendency check item, among the defect record records of defects that have occurred within the period of the defect rate management data to be processed detected in step 708 (this total number is x). , The information held in the failure phenomenon storage area 907 corresponds to the failure phenomenon predetermined for the tendency check item (this total number is y
Is calculated, and y ÷ x × 100 is obtained to obtain the deflection rate, which is stored in the deflection rate storage area 600 of the trend code representing the relevant trend check item of the newly secured row.

Next, the countermeasure analysis means 202 stores the screen display data for displaying the edited result on the display of the input / output device 3004 as the defective rate management data storage means 209.
Substrate manufacturing record storage means 207, defect record storage means 20
6, inspection point information storage means 208, countermeasure record storage means 213, and defect occurrence tendency table storage means 212
Is created and stored in the screen display data storage means 210, and the process ends (step 106).

(3) Countermeasure Status Display Means 203 When the instruction to display the countermeasure contents and defect tendency is input through the input device 3004, the countermeasure status display means 203 is activated. Upon receipt of this display instruction, the countermeasure status display means 203 causes the countermeasure content / defective tendency display means 204 to display the countermeasure content and defective tendency.

(4) Countermeasure content / defective tendency display means 204 The measure content / defective tendency display means 204 is based on the information stored in the screen display data storage means 210.
The image is displayed on the display of the input / output device 3004.

FIG. 14 shows an example of the image displayed here. This screen shows defect type 1401, line (process) series 1402, assembly drawing # 1403, defective component mounting process 14
04, a countermeasure content table 1409, a simultaneous countermeasure content non-display instruction area 1408, and an end instruction area 1412.
In this embodiment, the input of the display content instruction is performed by pressing the key of the keyboard of the input / output device 3004 or by specifying the area on the display screen by clicking the mouse of the input / output device 3004.

The contents of the measures are as follows: no effect, remarkable effect,
There are three types of tables depending on which of the new measures is taken, and the selected table 1409 is displayed according to the selection accepted via the input / output device 3004. In addition,
In FIG. 14, as an example, a table 1409 when a new countermeasure is selected is shown.

A table 1409 is input through the input / output device 3004.
When the designation of any of the items 1405 is received, the countermeasure content / defective tendency display means 204 causes the graph 1406 showing the transition of the defective rate before and after the countermeasure implementation regarding the countermeasure content of the designated item, and the deviation for each tendency code. Graph 1 showing rate
As shown in FIG. 14, a window (a rectangular area displayed overlaid on the already displayed image) 14
Display as 10. When displaying the graph 1406, the countermeasure content / defective tendency display unit 204 accepts, via the input / output device 3004, which defective rate management period the defective rate transition is to be displayed in, and the designated defective rate. The transition of the defective rate during the rate management period is displayed as a graph 1406, and the result is displayed in the flag storage area 501 of the row of the defective rate management data storage unit 209 which holds the defective rate management data during the designated defective rate management period. “6” indicating that the display has been completed is stored.

Further, when the simultaneous countermeasure content display instruction area 1408 is instructed via the input / output device 3004, the countermeasure content / defective tendency display means 204 accepts the input of the countermeasure time, and is performed at the accepted time. Measures (contents of the measures (held in the region 1103), which are held in the countermeasure result storage unit 213 and are included in the measure result record having the time as the countermeasure implementation date and time (held in the region 1102)), Display as a window.

When the end instruction area 1412 is instructed via the input / output device 3004, the countermeasure content / defective tendency display means 204 ends the processing.

(Embodiment 2) As another embodiment, a check item database (D
Accumulate in B), perform failure analysis using check items,
2. Description of the Related Art There is a manufacturing failure analysis apparatus and method that adds an analysis processing method, which proposes a cause of failure and a countermeasure method from the result of analysis and presents it to a user. The failure analysis system of the present embodiment can accumulate analysis knowledge, estimate and evaluate the cause of failure using this analysis knowledge, and present candidates for countermeasures. The hardware configuration of the failure analysis system of this embodiment is the same as that of the system of the first embodiment.

The failure analysis system of the present embodiment, regarding the analysis items held in the check item database,
Extract the necessary countermeasures for analysis according to the fluctuation of the defective rate,
We will support the update of the check items instructing the countermeasures.

The failure analysis system 1600 of this embodiment is
As shown in FIG. 31, analysis knowledge update support means 1602
And a check item database 211 and an analysis processing unit 215, and further, a reference data storage unit 216 for holding information referred to by the analysis processing unit 215.
And a non-defective product manufacturing condition database 217 and countermeasure content storage means 218.

The check item database 211 is a database for accumulating analysis knowledge. Check item database 211 and reference data storage means 216
The non-defective product manufacturing condition database 217 and the countermeasure content storage unit 218 are storage areas secured in the main storage device 3007.

The analysis processing means 214 is means for presenting candidates for countermeasures against the defects that have occurred, based on the analysis knowledge accumulated in the check item database 211. The analysis knowledge update support means 1602 is means for generating and accumulating analysis knowledge on the basis of information on the defects that have occurred, the countermeasures taken, and the results of the countermeasures. The analysis processing means 214 and the analysis knowledge update support means 1602 are the main storage device 3007.
Instructions previously stored in the CPU
It is realized by executing 3006.

Similar to the system of the first embodiment, the analysis knowledge update support means 1602 has a defect rate management means 201, a countermeasure analysis means 202, a countermeasure status display means 203, a defect record storage means 206, a board manufacturing record storage means 207, Inspection point information storage means 208, defect rate management data storage means 20
9, a screen display data storage unit 210, a defect occurrence tendency table storage unit 212, a countermeasure record storage unit 213, and a check item database 211. The countermeasure status display means 203 of this embodiment further includes an analysis knowledge update support means 205 in addition to the countermeasure content / defective tendency display means 204.

FIG. 16 shows an outline of the flow of information in the failure analysis system 1600 of this embodiment. In the present embodiment, the analysis knowledge update support unit 1602 analyzes the analysis knowledge by analyzing the defect record detected in the printed board mounting line 1601 and checks the analysis knowledge database 211.
Accumulate in. By analyzing the failure phenomenon by using the analysis knowledge accumulated in the check item database 211,
The analysis processing means 215 presents candidates for measures against the defective phenomenon and displays the details of the measures.

A. Storage Means Here, only the storage means added to the first embodiment will be described. Other storage means are the same as those in the first embodiment.

(1) Reference Data Storage Means 216 The reference data storage means 216 stores in advance information on work standards that have been determined in advance for each process of the printed circuit board mounting line to be analyzed by the failure analysis system of this embodiment. This is a storage area to hold.

(2) Non-defective product manufacturing condition database 217 The non-defective product manufacturing condition database 217 holds a manufacturing condition record indicating a manufacturing condition when the non-defective product having the assembly drawing number is manufactured. As shown in FIG. 36, the good product manufacturing condition database 2
Reference numeral 17 denotes a storage area 361 for the assembly drawing number, a storage area 362 for the manufacturing condition type, and a range of manufacturing conditions in which a good product of the product has been manufactured in the past (manufacturing conditions in which the defect rate is less than or equal to the acceptable standard are the most continuous 36) and a storage area 363 for storing non-defective item manufacturing conditions, and in FIG. 36, one line represents one manufacturing condition record.

(3) Countermeasure Content Storage Means 218 The countermeasure content storage means 218 stores, for each defect cause candidate,
It is a storage area that holds information regarding the content of measures against the occurrence of the defect.

(4) Check item database 211 The analysis knowledge is stored in the check item database 211. The check item database 211 is a database for holding a check item record which is a record expressing, for each predetermined check item in each inspection step to be analyzed, analysis knowledge about measures against a defect occurrence of the item. is there. The data structure of the check item database 211 is schematically shown in FIG. In FIG. 15, the check item database 2
11 is represented in the form of a table including a plurality of rows, and each row represents one check item record.

In this embodiment, the check items are set for each defect type, each mounting line, and each mounting process of the defective parts. The cause of this is different for different types of defects,
Further, if the mounting line and the mounting process of the defective component are different, the device or the like that is the cause of the generation will be different. Here, the check item is defined by a check item record including an item to be checked, a candidate of a defect occurrence cause related to the check result, and a correlation value indicating the strength of correlation between them.

Therefore, the check item database 211
Is an area for storing the check item record of the check item, that is, a check item storage area 151 for storing the item to be checked, for each check item record indicating the relationship between the check item and the cause of the defect occurrence.
And a cause storage area 152 for storing a defect occurrence process and a cause, and a correlation value storage area 153 for storing a correlation value for each defect occurrence cause (process). The cause storage area 152 can hold a plurality of pieces of defect occurrence cause information including a defect occurrence process causing the cause and a defect occurrence cause event in the process. In FIG. 15, the defect occurrence process is indicated by the process number, and the defect occurrence cause event is
It is shown in parentheses immediately after the number indicating the defective process in which the event occurred.

The correlation value storage area 153 holds a correlation value for each defect detection process. In the present embodiment, the defects detected in the visual inspection process (mounting process 4) and the visual inspection process (mounting process 9) are analyzed. Therefore, the correlation value storage area 153 includes a correlation value storage area 1531 for the visual inspection process and a correlation value storage area 1 for the visual inspection process.
And 532. In the example illustrated in FIG. 15, the fifth check item record has two types of defect occurrence causes, and the correlation value storage areas 1531 and 1352 in the fifth row are included.
Has two types of correlation values for each cause and for each inspection process. In the present embodiment, the initial value of the correlation value is determined in advance according to the check item, the cause of defect occurrence, and the defect detection process.

In this embodiment, a plurality of check items are registered in one check item record. Therefore, a plurality of check item storage areas 151 are provided, and in FIG. 15, as an example, n pieces (n is an arbitrary positive integer)
Check item storage area 151 (1511-151n)
The case where is provided is illustrated.

The “items to be checked” stored in the check item storage area 151 are information relating to manufacturing conditions in a process or information relating to defects that have occurred (trends such as defect occurrence positions). If the item to be checked is information related to manufacturing conditions in a process, the check item storage area 151 stores a process number and a management item number indicating which manufacturing condition is the target. If the item to be checked is information on a defect that has occurred, a tendency code number indicating the tendency of defect occurrence is stored. As shown in FIG. 13, the tendency code number is an identification code assigned to a predefined failure occurrence tendency, and has a positive value and a negative value. The same absolute value of the tendency code and the opposite sign indicates that the tendency in the same event is opposite. For example, the first check item storage area 151 of the fourth check item record shown in FIG.
The tendency code “3” held in 1 indicates a tendency in which defective parts are concentrated in the same part, and the tendency code “-3” held in the first check item storage area 1511 of the fifth check item record. ", On the contrary, indicates a tendency that defective parts do not concentrate on the same part.

B. Analysis Processing Unit 215 Next, the flow of processing of the analysis processing unit 215 will be described with reference to FIG. Note that the dotted arrow in FIG.
Means reading data from a file. When the system 1600 is started (step 1701) and the selection to execute the analysis process is input (step 170).
2), the analysis processing means 215 is activated, and steps 1711 to 1717 shown in FIG. 17 are executed.

The analysis processing means 215 first accepts the designation of the assembly drawing number, the defective part, and the defect type of the analysis target via the input / output device 3004 (step 1711), and the specified assembly drawing number, defective part, Based on the defect type and defect detection process, all applicable check item records are
It is read from the check item database 211 (step 1712). The correspondence relationship between the assembly drawing number, the defective part, the defective type, the defective detection process, and the check item record is predetermined.

In the read check item record,
Multiple check items are registered. Therefore, for each of these check items, the analysis processing means 21
5 performs a predetermined check for each check item, and uses the check result to give priority to defect occurrence cause candidates (step 1713).

That is, first, the analysis processing means 215
An area of the score table, which is a temporary storage area for storing the score, is secured in the main storage device 3007. As shown in FIG. 34, the score table 340 shows, for each defect occurrence cause candidate, a cause candidate storage area 341 for storing information indicating the cause candidate, and a score that is an index indicating the likelihood of the cause candidate. It is a table including a score storage area 342 for storing. The score storage area 342 stores “0” as an initial value.

When the temporary area is secured, the analysis processing means 2
15 stores the defect occurrence cause candidates held in the cause storage areas 152 of all the check item records read in step 1712 in the cause candidate storage area 341 of the score table 340. Even when one cause is registered in a plurality of check item records, there is only one cause candidate storage area 341 of the score table 340 in which the cause is registered, and one cause is stored in the score table 340. There will be no duplicate registration. Also,
When a plurality of causes are registered in the cause storage area 152 as in the fifth check item record shown in FIG. 15, each cause has a different cause candidate storage area 3
It is stored in 41.

When the score table 340 is created in this way, the analysis processing means 215 calculates the score of the cause candidate based on all the check item records read in step 1712.

That is, for example, if the "manufacturing condition in the process" is held in the check item storage area 151 of the check item record read in step 1712, the analysis processing means 215 manufactures the defective board. The manufacturing conditions at that time are read from the manufacturing performance data storage means 207 and it is inspected whether or not they meet a predetermined work standard (held in the standard data storage means 216). Furthermore, the analysis processing means 21
No. 5 is a manufacturing condition when a defect occurs, which is a condition when a non-defective product of the same substrate is manufactured in the past (non-defective product manufacturing condition database 21).
(Held in 7)). Also,
The analysis processing means 215 inspects whether the manufacturing conditions have been changed immediately before the occurrence of the defect.

Here, when it is detected that the manufacturing conditions do not meet the work standard, the manufacturing conditions are different from the non-defective manufacturing conditions, or the manufacturing conditions are changed, the analysis processing means 215 is executed. Causes the score of the cause candidate associated with the check item to be increased by the correlation value.

That is, first, the analysis processing means 215
All the causes held in the cause storage region 152 of the row of the check item record holding the check item in the check item storage region 151 and the correlation value (correlation value storage region (153
1 or 1532)) is detected. Next, for each of all the detected causes, the analysis processing means 215 sets the cause to the cause candidate storage area 34.
The row of the score table 340 held in 1 is detected, and the value stored in the score storage area 154 of that row is added to the detected correlation value corresponding to the cause candidate to be processed. , Are stored in the original cause candidate storage area 341.

When the tendency code is held in the check item storage area 151 of the read check item record, the analysis processing means 215 causes the tendency check item (specific example shown in FIG. 13) corresponding to the tendency code. ), A failure phenomenon (held in the area 907) is applied to a criterion determined in advance according to the tendency check item, and a failure history record to be analyzed (a failure history stored in the failure history storage unit 206). Of the records, the number of assembly drawing numbers, defective parts, and defective types specified in step 1711 as the analysis target is detected, and the deflection rate is calculated from this number and the total number of failure record records to be analyzed. Whether or not the tendency is present is determined by whether or not the deflection rate is within a predetermined range.
The method of calculating the deflection rate is the same as that in step 105 described above.

If it is determined that there is a tendency, the analysis processing means 215 causes the analysis processing means 215 to associate the check item with the check item in the same manner as when the above-mentioned check item is the manufacturing condition. The candidate score is increased by the correlation value.

When all the checks are completed, the analysis processing means 215 compares the scores of the respective cause candidates, and all the cause candidates listed in the other boundary order of the scores (may be the cause candidates having a predetermined score or more). ) And the score thereof are displayed on the display of the input / output device 3004 (step 1714), and the input for selecting the cause of the defect is accepted (step 1715).

When the selection of the cause of the defect occurrence is accepted via the input / output device 3004, the analysis processing unit 215 holds the selected cause of the defect occurrence in the cause storage area 152 in each row of the check item database 211. Of the correlation value storage area (1531 or 153) corresponding to the defect finding process input in step 1711
The correlation value corresponding to the cause held in 2) is incremented by 1 (step 1716). Here, step 1715 may be omitted and the cause candidate with the highest priority may be treated as the selected one after step 1716. If you do this, step 1
The execution of 714 may also be omitted.

Further, the analysis processing means 215 reads the countermeasure content corresponding to the selected cause of failure from the countermeasure content storage means 218 and reads the selected cause of failure on the display of the input / output device 3004. The contents of countermeasures are displayed (step 1717). The process in step 1717 may be performed in the process in step 1714, and the cause candidate, the countermeasure content, and the score thereof may be displayed on the display.

In the present embodiment, the countermeasure content is only displayed on the display, but the failure analysis system 16
00, a means for changing the manufacturing condition of the printed board mounting line may be provided, and the countermeasure displayed in step 1717 may be executed by this manufacturing condition changing means. In this case, of the countermeasures displayed in step 1717, the selection of the countermeasure to be actually executed may be accepted via the input / output device 3004.

C. Analysis Knowledge Update Support Unit 1602 As described above, the analysis knowledge update support unit 1602, the countermeasure status display unit 203, and the check item update unit 205.
Is different from the analysis system of the first embodiment. Since the other points are the same as those described in the first embodiment, the check item updating unit 205, which is a difference from the first embodiment, will be described here.

FIG. 32 shows an example of an image displayed by the countermeasure content / defective tendency display means 204 in this embodiment. The difference from the image (illustrated in FIG. 14) displayed in the first embodiment is that the update instruction area 1411 is provided.

When the update instruction area 1411 is instructed via the input / output device 3004, the countermeasure content / defective tendency display means 204 activates the check item update means 205.
The activated check item updating unit 205 receives an instruction to update a check item record (add, delete, or change a record) via the input / output device 3004, and according to the instruction, each storage area 151 to 1 of the check item database 211. 153 is updated. The change of the check item record includes the change, deletion, and addition of the check item, and the change, deletion, and addition of the defect occurrence cause. Note that when deleting or adding the cause of failure, it is also required to delete or add the correlation value. Also, the correlation value can be changed as the change of the check item record.

(Third Embodiment) As shown in FIG. 35, the failure analysis system 1800 of the present embodiment has a configuration similar to that of the second embodiment, and further includes a non-defective product completion record editing means 219.
Judgment history database 220, screen-specific reference content database 221, and non-defective / defective product list data storage 22
3 and 3. Further, the analysis processing means 222 of this embodiment
Has a statistical display function in addition to the function of the analysis processing means 215 of the second embodiment. Other configurations are
Since it is the same as that of the second embodiment, differences from the second embodiment will be mainly described here.

First, an outline of the flow of information in the failure analysis system 1800 of this embodiment shown in FIG. 18 will be described. In this embodiment, the analysis knowledge update support means 1602 accumulates the analysis knowledge in the check item database 211 by analyzing the performance data in the printed board mounting line 1601. Further, the non-defective item manufacturing condition editing means 219 accumulates knowledge of the non-defective item manufacturing condition in the non-defective item manufacturing condition database 217 based on the actual data. By using the knowledge accumulated in the check item database 211 and the non-defective product manufacturing condition database 217 to analyze the failure phenomenon, the analysis processing means 22
2 presents candidates for measures against the defective phenomenon and displays the contents of measures.

A. Storage Means The storage means added to the system of the second embodiment is the judgment history database 220 and the reference content database 2 for each screen.
21 and non-defective / defective product number list data storage means 223. These storage means are also storage areas secured in the main storage device 3007.

(1) Judgment History Database 220 The judgment history database 220 is a database for storing judgment history records indicating the history of selection of the display screen and display contents. Judgment history database 220
24, as shown in FIG. 24, a storage area 240 of a sequence number indicating the storage order of judgment history records and a display screen information storage area 241 for storing a code indicating a display screen.
And a storage area 242 for display contents and a storage area 243 for display conditions. In addition, in FIG. 24, one record is illustrated as being stored in one line.

The display condition storage area 243 holds a set drawing number storage area 2431 and a display target serial number storage area 2432 in order to hold various kinds of information regarding the display target.
And a process / production period storage area 2433 and an inspection process /
A defect detection period storage area 2434 is provided.

(2) Screen-by-screen reference content database 221 The screen-by-screen reference content database 221 is a database in which check items displayed on each screen (that is, which can be judged from the screen) are registered in advance. is there. 25. Reference content database 2 for each screen in FIG.
An example of 21 is shown typically. The screen-specific reference content database 221 holds a display screen information storage area 251 for holding a code indicating a display screen and check items that are predetermined in correspondence with the display screen indicated by the information held in the area. And a check item storage area 252 for

(3) Non-defective / Defective Product Number List Data Storage Means 223 The non-defective / defective product number list data storage means 223 is a storage area for holding non-defective / defective product number list data for each manufacturing condition. The number of non-defective / defective product list data 280 by manufacturing condition is
As shown in FIG. 28, information 286 indicating which manufacturing condition of the product has the manufacturing condition and information 287 indicating which manufacturing condition type the data belong to are attached. Storage area 2 for the total number of manufactured items for each representative condition value of the type (previously held in the area 281)
82, a non-defective product manufacturing number storage area 283, a defective product manufacturing number storage area 284, and a defective rate storage area 285.

B. Non-defective manufacturing condition editing means 219 The non-defective manufacturing condition editing means 219 edits the manufacturing conditions at the time of manufacturing without causing a defect for each type of product, and sets the non-defective manufacturing condition database 21 as the non-defective manufacturing conditions.
7 is a means for accumulating. Non-defective manufacturing condition editing means 219
Creates a good product manufacturing condition record based on the list of good product / defective product number by manufacturing condition, and stores it in the good product manufacturing condition database. The flow of the non-defective item manufacturing condition accumulating process of the non-defective item manufacturing condition editing means 219 will be described with reference to FIG.

First, the non-defective item manufacturing condition editing means 219 searches for the last update date of the non-defective item manufacturing condition DB (step 270).
1) Then, the manufacturing record after the last update date is detected from the manufacturing record storage means 207, and the number of non-defective products and the number of defective products manufactured under each manufacturing condition are counted based on these records, The contents of the areas 282 to 284 of the condition-defective product / defective product number list data are updated (step 2702). At this time, among the defective products, if it is known that the cause of the defective products is clearly different from the current manufacturing conditions, the product may be counted as a good product.

Next, the non-defective item manufacturing condition editing means 219
From the value held in the total manufacturing number storage area 282 and the value held in the defective rate manufacturing number storage area 284, the defective rate under each manufacturing condition is calculated and stored in the defective rate storage area 285 (step 2703). .

In this way, when the latest performance is reflected in the manufacturing condition-based non-defective / defective product number list data, the non-defective product manufacturing condition editing means 219 determines that the defective rate is acceptable from the manufacturing condition-specific non-defective / defective product number list data. A manufacturing condition that is less than or equal to the range is searched (step 2704), and a range in which the defective condition is less than or equal to the allowable range and is continuous over the widest range is the assembly number assigned to the non-defective product / defective product number list data by that manufacturing condition Is stored in the non-defective product manufacturing condition storage area 363 of the row in which the assembly drawing number and the manufacturing condition type of the non-defective product manufacturing condition database 217 match (step 2705).

C. Analysis Processing Means 222 The flow of processing of the analysis processing means 222 of this embodiment is shown in FIG. Steps 1701, 1702, 1711 to 171
The process of 7 is the same as that described in the second embodiment. However, in the present embodiment, if the selection input in step 1702 is an instruction to display statistics, the analysis processing means 2
22 initializes the judgment history database 220, then executes the following steps 1703 to 1710, and then executes step 1717.

Steps 1703 to 1710 are processes for realizing the statistical display function. This statistical display function performs statistical processing and display of defect record, manufacturing record, work standard data, design standard data, good product manufacturing condition data, stores the displayed content in the judgment history database 220, and stores the judgment history database 221 and With reference to the screen-by-screen reference content database 221, the screen displayed when the analysis method is registered and the tendency that can be judged from the screen are presented, and the check item database 221 is updated.

When the statistics display instruction is selected, the analysis processing means 222 accepts the selection of the statistics display screen (step 1703). The statistical display screen displayed by the analysis processing unit 222 includes, for example, a defect position display screen, a Pareto diagram for each board showing the number of defects, a transition diagram display screen for the number of defects, and when and which process is performed for each substrate. It is a board history display screen showing whether it has passed, and a work record display screen showing a change history of manufacturing conditions of each device.

The defective position display screen 190 includes a board 191, a component 192 mounted on the board, and a circle 193 indicating occurrence of a failure, as shown in FIG. The circle 193 indicating the occurrence of a defect represents the defect occurrence position by its position and the defect occurrence number by its size.
The number of occurrences of defects may be represented by color.

FIG. 20 shows an example of a display screen 2000 of a Pareto chart for each board showing the number of defects. In the screen example shown in FIG. 20, a graph 2001 of the number of occurrences of defects by board and Table 20
02 is displayed.

Display screen 2100 of the transition chart of the number of defects
An example of is shown in FIG. In the screen example shown in FIG. 21, a menu 2102 for accepting selection of which item the graph is to be displayed in and a selected item (see FIG. 2).
In the example shown in FIG. 1, a graph 210 showing the transition of the number of defects generated for “B side bridge” is selected).
1 and are displayed.

FIG. 22 shows an example of the board history display screen 2200. In the screen example shown in FIG. 22, a table 2201 showing the history of the designated board is displayed. History table 2201
Contains the name of each process that processed the substrate to be displayed and the time at which the substrate was put into the process.

FIG. 23 shows an example of the work record display screen 230. In the screen example shown in FIG. 23, a table 231 showing the transition of the manufacturing condition of the specified manufacturing condition type in the specified process is displayed. The table 231 showing the transition of the manufacturing condition includes specific data of the manufacturing condition and the time when the condition is changed.

When the selection of the screen to be displayed is input, the analysis processing means 222 accepts the designation of the display content and the display range of the screen selected in step 1703 (step 1
704).

The designation accepted in step 1704 is, for example, the defective position display screen 19 shown in FIG.
When 0 is selected, the assembly drawing number, which is the type of the board, the defect occurrence period, and the defect type are designated. Also,
If the board-specific Pareto chart display screen 2000 shown in FIG. 20 is selected, designation of a defect occurrence period and a defect type is accepted. When the defect occurrence number transition diagram display screen 2100 shown in FIG. 21 is selected, the assembly drawing number, which is the type of the board, the defect occurrence period, and the defect type are accepted. Substrate history display screen 2 shown in FIG.
When 200 is selected, designation of a serial number for identifying each board is accepted. FIG. 23
When the work record display screen 230 shown in is selected, the designation of the process (device) to be displayed and the management item of each process (device) is accepted.

In this way, when the designation of the screen to be displayed and the display content etc. is received, the analysis processing means 222 shows the code indicating the screen selected in step 1703, the display content and the display designated in step 1704. A judgment history record is created based on the range and stored in the judgment history database 220 (step 1705).

Next, the analysis processing means 222 uses steps 1703 and 17 based on the information held in the manufacturing performance data storage means 207 and the defect performance storage means 206.
Image data for displaying the designated content accepted in 04 is created, the image of the designated content is displayed on the display of the input / output device 3004, and the instruction is accepted (step 1706).

If an instruction other than the end is input in step 1706 (step 1707), the analysis processing means 2
22 returns the processing to step 1703, and returns to step 17
The processing from 03 to step 1706 is repeated. When the end of the statistics display function is instructed (step 1707), the analysis processing means 222 executes the following steps 1708 to 1710 to realize the user know-how registration function.

First, the analysis processing means 22 detects all the displayed screens from the judgment history database 220,
A check item (or a defect occurrence tendency) that can be determined from the information displayed on the screen from the check item storage area 252 of the row that holds the code indicating the screen in the display screen information storage area 251 from the screen reference content database 211
Is detected, and a list of the detected check items (or failure occurrence tendency) is displayed on the display of the input / output device 3004 (step 1708). It is presumed that the check item (or the defect occurrence tendency) displayed here is actually used by the user for determining the defect cause search while referring to the screen. Therefore, these are candidates for check items that are directly used for determining the cause of a defect.

Next, the analysis processing means 222 accepts the input of selection of the item used for estimating the cause of failure and the input of the estimated cause of failure from the displayed candidates, and further the display in step 1706. All the screens (data) that have been displayed are displayed, and the input of the information regarding the defect whose cause is estimated is accepted on each screen (step 1
709). The information related to the defect that is estimated here for the cause of the defect includes information such as the defect type, the assembly drawing number, the defect-related part, and the defect finding process.

Finally, the analysis processing means 222 updates the check item database 211 based on the items accepted in step 1709 (step 1710), executes the above step 1717, and ends the process.

Next, the procedure for updating the check item database 211 in step 1710 will be described with reference to FIG.

That is, first, the analysis processing means 222
From the assembly number (indicating the type of board) input in step 1709, it is predetermined for each board based on the assembly information of the board of the assembly number which is predetermined according to the assembly number. The mounting line of the board which is present is detected (step 2601). The analysis unit 222 also detects the mounting process of the defect-related component input in step 1709 from the assembly information corresponding to the assembly drawing number (step 2602).

In this way, when the mounting line and the mounting process in which the defect specified in step 1709 has occurred are detected, the analysis processing means 222 stores the check items in the case where the defect occurs in the execution process in the check item database. It is read from 211 (step 2603). That is, the analysis processing means 222 causes the check item database 2 corresponding to the mounting line detected in step 2601.
Of the 11 rows, all the rows holding the information indicating the process detected in step 2602 in the cause storage area 152 are detected.

Next, the analysis processing unit 222 holds the check items (items that can be used for defect cause estimation) input in Step 1709 in the check item storage area 151 among the lines detected in Step 2603 and It is determined whether or not there is a line in the storage area 152 that holds the presumed cause input in step 1709 (step 260).
4).

Here, if there is such a line, the analysis processing unit 222 holds information indicating the defect finding process accepted in step 1709 in the correlation value storage area 153 of the line, for each defect finding process. Correlation value storage area (153
The value held in 1 or 1532) is incremented by 1 and the process proceeds to step 2610 (step 2605).

If no line is detected in step 2604, the analysis processing means 222 executes step 1709.
The combination of check items and probable causes specified in
It is determined whether or not there is a contradiction with the combination of the check item and the probable cause of the check item record already registered in the check item database 211 (step 26).
06).

When the contradiction is detected, the analysis processing means 222
Receives an input as to whether or not to newly register the conflicting check item and the probable cause as a check item record in the check item database 211 (step 2607), and if registration is requested (step 260).
8), create a check item record from the mounting line detected in step 2601, the check item and the probable cause specified in step 1709, and the mounting process detected in step 2602, and store it in the check item database 211. (Step 2609), the process proceeds to step 2610. Note that here, in step 170
The initial value of the correlation value of the defect finding process designated in 9 is set to "1", and the initial value of the correlation value of the process not designated is set to "0". If the registration is not requested (step 2608), the analysis processing unit 222 advances the direct processing to step 2610.

When the input check item and the probable cause do not conflict with the already registered check item record (step 2606), the analysis processing means 222 advances the direct processing to step 2609, and inputs the input information into the check item database 211. Register in step 2
Proceed to 610.

In step 2610, the analysis processing means 222 determines whether or not all the check items input in step 1709 have been processed,
If unprocessed check items remain, the process returns to step 2604, and if all check items have been processed, the process ends.

The contradiction determination in step 2606 is performed as follows. That is, the analysis processing unit 222 determines that there is no contradiction if the check item input in step 1709 is not the tendency code. If the input check item is a tendency code, the analysis processing unit 222 holds the estimated cause input in step 1709 in the cause storage area 152 of the lines detected in step 2603, and the check item storage area 151. In any of the above, it is determined whether or not there is a line that holds a value having the same absolute value and the opposite sign as the check item (item that could be used for defect cause estimation) input in step 1709 as the tendency code. , It is determined that there is a contradiction, and if not, it is determined that there is no contradiction.

(Embodiment 4) Next, an embodiment of a printed board mounting system will be described as an embodiment of a mounting system. The printed board mounting system of the present embodiment is schematically shown in FIG.

A. Printed Circuit Board Mounting Line 2910 The printed circuit board mounting line 2910 of this embodiment includes means for receiving an input of an instruction for a countermeasure work and taking a countermeasure according to the content of the instruction. Note that measures taken by this means include changing the reflow temperature, cleaning the metal mask, and changing the conveyor speed. It should be noted that, instead of directly changing the line speed or the like by a signal as in the present embodiment, a display device (not shown) is provided in the printed board mounting line 2910 and the instructed countermeasure contents are displayed on the display screen. By doing so, it may be displayed to the operator of the line 2910.

Further, the printed board mounting line 2910 of this embodiment is provided with means for notifying the mounting defect countermeasure / correction instruction system 2900 of the details of the countermeasures taken and the production record. Specifically, the printed board mounting line 2910 is provided with an input device (not shown), and is provided with means for receiving an input of countermeasure contents by an operator and outputting the input.

Further, the printed board mounting line 2 of this embodiment
910 solder correction means 305 and correction means 310
Each includes a unit that receives an input of a correction instruction and executes a board correction operation according to the instruction content. Specifically, since the correction means 305 and 310 perform manual correction, the correction means 305 and 310
Reference numerals 310 each include a display device (not shown), and the input instruction content is displayed on the display device as an instruction to a worker of those steps in the form of a component mounting screen indicating a correction position.

Further, when the appearance inspection device 304 and the visual inspection means 309, which are the defect detecting means of the printed board mounting line 2910 of this embodiment, detect the occurrence of the defect,
Each unit has means for notifying the mounting defect countermeasure / correction instruction system 2900 of the contents. Specifically, for example,
Each defect detecting means includes a display device (not shown) and an input device (not shown), and each defect detecting means 304, 309.
Displays a component mounting diagram on the display screen, accepts input of information such as a defect detection position, and notifies the input information to the mounting defect countermeasure / correction instruction system 2900. As an input method, a method of inputting via a pressure sensitive means such as a touch panel, an optical means, a magnetic means or the like can be used. It should be noted that each of the defect detecting means has a display device (not shown) and an input device (not shown) for accepting a countermeasure work instruction input in another process, for accepting a correction instruction input, for inputting a countermeasure content, etc. The display device and / or the input device may be shared.

B. Mounting defect countermeasure / correction instruction system 29
The mounting defect countermeasure / correction instruction system 2900 includes a defect record collection unit 2901 that collects defect records from the inspection results of the inspection units 304 and 309, and a correction work instruction unit that issues a correction work instruction to a defective substrate based on the defect record. 2902, defect analysis support means 2903 for supporting failure cause analysis based on the defect record, countermeasure work instruction means 2904 for instructing countermeasure work for the defect cause found using the analysis support function, and printed board mounting line 2910 A manufacturing record collecting unit 2905 that collects the manufacturing record and the countermeasure record from the notified record information and an assembly information database (not shown in FIG. 29) that holds the board assembly information are provided.

(1) Defect record collecting means 2901 The defect record collecting means 2901 includes the inspection means 304, 30.
Accepts notification of inspection result information (defect phenomenon, assembly number and sequence number of defective board, defect location, discovery date, and discovery time) from 9, format conversion to create defect record, and defect record storage In addition to being stored in the means 206, a defect occurrence correction instruction means 2902
Notify to The data structure of the defect record is
This is similar to that described in the first embodiment. As shown in FIG. 40, the defect record storage unit 206 of the present embodiment is the first embodiment.
The data structure is the same as that in the above case, and further, the correction record storage area 909 for holding the correction record is provided in each row.

The defect record collecting means 290 of the present embodiment.
No. 1 stores information indicating the format of the notification and the method of converting into the defective record for each inspection means in the main storage device 3007, and even if the format and the code used for the notification are different, It is possible to correctly create a defect record. For example, in this embodiment,
The visual inspection device 304 represents a defect phenomenon called a bridge by a symbol "B", and the visual inspection means 309 indicates "B".
Although represented by the symbol “U”, the defect record collecting means 2901
Is converted into a code for the defect record storage means 206, which means “bridge”.

Further, the defect record collecting means 290 of this embodiment.
1 converts the defective portion into coordinates. These coordinates are based on the same coordinate axis as the coordinates of the mounting position of the assembly information used when calculating the defect tendency.

FIG. 37 shows a flow of processing of the defect record collecting means 2901. The defect record collection unit 2901 is activated when a defect detection notification is received, receives the notification (step 3701), and formats of the notified information stored in the main storage device 3007 in advance according to the inspection unit of the notification source. And the conversion method (step 37)
02). Next, the defect record collecting means 2901 creates a defect record by using the read conversion method (step 3703) and stores it in the defect record storage means 206 (step 3704). Finally, the defect record collecting means 2901 notifies the correction work instructing means 2902 of the record number of the defect record (the line number in the defect record storing means 206) (step 3705).

(2) Manufacturing record collecting means 2905 The manufacturing record collecting means 2905 is used for the printed board mounting line 2
Manufacturing record and countermeasure record are created from the record information notified from 910, and the manufacturing record storage unit 2
07 and countermeasure result storage means 213. In addition,
The data structures of the manufacturing record, the countermeasure record, the manufacturing record storage unit 207, and the countermeasure record storage unit 213 are the same as those described in the first embodiment.

The manufacturing record collecting means 2905 receives the manufacturing record information from the printed board mounting line 2910 (a board assembly number and a serial number indicating which board was processed in which process at which time, and an identification code of the process). , The progress record information including the process input time and the process end time) is notified, a manufacturing result record is created based on this information and stored in the manufacturing result storage unit 207.

Further, the manufacturing record collecting means 2905 receives the measure record information from the printed circuit board mounting line 2910 (one or more defect targets which indicate what kind of measure was executed for what defect when and what defect). Information, the date and time of implementation of the countermeasure, and information on the actual result of the countermeasure, which is composed of information indicating one or more countermeasures), a countermeasure record record is created based on this information and stored in the countermeasure record storage means 213. Store.

Here, the information indicating the failure as the countermeasure target is the assembly drawing number and the serial number of the board, the defective finding part name, the code indicating the defective phenomenon, the code indicating the defective finding process, and the defective finding date / time input. Including time and. Therefore, the manufacturing record collecting unit 2905 searches the defect record storage unit 206 for a line (record) holding these pieces of information, and sets the line number of the line as the defect record number of the countermeasure record.

(3) Correcting work instructing means 2902 The correcting work instructing means 2902 is the defect record collecting means 290.
When the record number of the defect record is notified from 1, the content of the record is sent to the first correction means after the defect finding step as a correction instruction of the board of the assembly number and the serial number included in the record. (Assembly number, serial number, defective part name, mounting position, defective finding process, defective finding date, and defective phenomenon) is notified to the printed board mounting line 2910.

Note that FIG. 38 shows a processing example when a display device is used as the notification method. In this case, first, the correction work instructing means 2902 identifies each of the boards and the assembly drawing number indicating the type of the board to be corrected through the input device provided in the correcting means 305, 310. Is accepted (step 3801), the defect record and the assembly information of the board designated by the assembly drawing number and the serial number are read from the defect record storage unit 206 and the assembly information database 380, and the information is used. The correction work instruction data is created by editing the screen display data (step 3802). Here, a storage area for storing the correction work instruction data may be secured in the main storage device 3007, and the correction work instruction data created in this area may be held.

Further, a database for storing the correction work instruction data is provided, and the defect result collecting means 2901 performs the same processing as step 3802 in the process of collecting the defect results to create the correction work instruction data and stores the correction work instruction data. The correction work instruction means 2902 may read the correction work instruction data from the correction work instruction data storage database in step 3802 without creating the correction work instruction data.

FIG. 41 shows an example of the data structure of the storage area for the correction work instruction data created in step 3802. The correction work instruction data storage area 410 is
An identification area 420 is provided for each correction process.
A defect information area 421 and a mounted component information area 42
2 and.

The identification area 420 is an assembly number storage area for holding an assembly number and a serial number for indicating which board the information stored in this area 410 is. 411 and a serial number storage area 412, and a correction step information storage area 41 for holding correction step information indicating in which correction step correction is performed.
3 and 3.

The defect information area 421 includes, for each defective part, a defective part name storage area 414 for holding the name of the detected defective part and a defective part mounting position for holding the mounting position of the part. A storage area 415, a defective position storage area 416 for holding the detected defective position,
A defective phenomenon storage area 417 for holding the detected defective phenomenon.

Further, the mounting component information area 422 is the assembly drawing number storage area 411 and the serial number storage area 412.
To hold the names of the components mounted up to the step indicated by the information held in the correction step storage area 413 and their mounting positions on the board indicated by the information held in
Mounted component name storage area 418 and mounting position storage area 41
9 is provided for each mounted component.

The procedure for creating the correction work instruction data stored in the above-mentioned correction work instruction data storage area (step 38)
02) will be described in more detail with reference to FIG. In step 3802, first, the correction work instruction means 290.
In step 2, the defect result storage means 206 is searched based on the assembly drawing number and the serial number received in step 3801, and the defect actuals of the assembly drawing number and the serial number are detected and summarized by inspection process' (step 4201). Next,
The repair work instruction means 2902 detects, for each detection process, the repair process first performed after the detection process from the assembly information database 380, sets the repair process as the defect repair process, and determines the result as the repair process. (Step 4202). Further, the correction work instruction means 2902
For each correction process detected in step 4202, extracts the name and mounting position of the component mounted on the board from the assembly drawing information database 380 until the correction process (step 4203). Finally, the correction work instruction means 2902 secures the correction work instruction data storage area 410 in the main storage device 3007 for each correction process detected in step 4202, and stores the assembly drawing number and serial number accepted in step 3801. Stored in the assembly drawing number storage area 411 and the serial number storage area 412, the information indicating the repair process is stored in the repair process storage area 413, and the defect record information collected for each repair process in step 4202 is Information area 42
1 in each of the storage areas 414 to 417, and step 42
The information of the mounted component extracted in 03 is stored in each of the storage areas 418 to 419 of the mounted component information area 422 (step 4204).

When the correction work instruction data is created in this way, the correction work instruction means 2902 then uses the created correction work instruction data to the correction means 305, 310.
And notify the display device. The correction work instruction screen 3900 output at this time is, as shown in FIG. 39, a board 3901, a component 3902 mounted on the board,
And a circle 3903 indicating a defect occurrence position. With this display, the correction work is performed by the operator (step 38).
04). It is also possible to change the display color of the circle of the repaired part and its defective position 3903 for each repaired location in accordance with the progress of the repairing work, and instruct the repairing procedure or the like by this display color.

Finally, the correction work instructing means 2902 receives the input of the result result of the correction work, and stores the data of the correction work result in the correction result storing area 9 of the defect result storing means 206.
09 (step 3805). The results of the correction work include corrected, false reports (inspection errors that are not defective but judged to be defective), and uncorrected. Therefore, the correction result storage area 909 holds data indicating these. For example, in the analysis processing by the analysis processing unit 222, the data held in the correction result storage area 909 excludes, from the analysis target, the rows in which the data indicating the false information is held in the area 909 in the defect result. Alternatively, it is used for processing such as displaying the false alarm position on the defective position display screen 190.

(4) Defect Analysis Support Means 2903 The defect analysis support means 2903 has the same structure as the failure analysis system 1600 of the second embodiment. The failure analysis support means 2903 of this embodiment uses the analysis knowledge update support means 1602, similarly to the second embodiment, to record the failure record storage means 206,
Manufacturing record storage means 207 and countermeasure record storage means 213
The actual data stored in the check item database 211 is analyzed, and the analysis knowledge is stored in the check item database 211.

Further, similarly to the second embodiment, the failure analysis support means 2903 uses the analysis knowledge accumulated by the analysis processing means 214 in the check item database 211.
It presents candidates for countermeasures against the defects that have occurred and accepts the selection. In addition, the failure analysis support means 290 of the present embodiment.
In step 1717, the notification 3 notifies the countermeasure work instruction means 2904 instead of displaying the selected countermeasure content.

(5) Countermeasure work instruction means 2904 The measure content instruction means 2904, which has been notified from the failure analysis support means 2903, sets the notified measure content in advance in correspondence with the measure content of the printed board mounting line 2910. Notify the process.

C. Effects of this Embodiment According to the mounting defect countermeasure / correction instruction system 2900 of this embodiment, when a defect is found, the cause of the defect occurrence is automatically pursued and a countermeasure is taken. That is, the mounting defect countermeasure / correction instruction system 2900 of the present embodiment registers a defect occurrence board, a defect occurrence component, a defect position, a defect content, etc. from the inspection results of the appearance inspection device 304 and the visual inspection means 309. Generate and accumulate. Further, the mounting defect countermeasure / correction instruction system 290 of the present embodiment
0 analyzes the cause of the defect registered in the defect record storage unit 206 based on the generated defect record, applies a countermeasure corresponding to the cause to the corresponding process, and further manages and analyzes the transition of the defect rate thereafter. By doing so, it helps to grasp the effectiveness of the analysis / countermeasure method. Therefore, according to the present embodiment, it is possible to accumulate a record of implementation of countermeasures and use it for prevention of recurrence of defects.

[0185]

The present invention processes a large amount of defect record data, obtains a defect rate, manages the variation of this defect rate and the details of the countermeasures taken in association with each other, and determines whether or not the effect of the countermeasures taken is effective. to decide. As a result, the user of the present invention can easily recognize the effectiveness of the countermeasure. Therefore, according to the present invention, it becomes easy to select a defect countermeasure to be taken.

[Brief description of drawings]

FIG. 1 is a flowchart showing an outline of processing of a countermeasure analysis means.

FIG. 2 is an explanatory diagram showing a functional configuration of a manufacturing defect analysis apparatus according to the first embodiment.

FIG. 3 is an explanatory diagram showing an outline of a printed board mounting line which is an analysis target.

FIG. 4 is an explanatory diagram showing an example of a defect phenomenon and its cause in a printed board mounting line which is an analysis target.

FIG. 5 is a schematic diagram showing a data structure example of a defect rate management data storage unit.

FIG. 6 is a schematic diagram showing a data structure example of a defect occurrence tendency table.

FIG. 7 is a flowchart showing an outline of defect rate management data creation processing.

FIG. 8 is a schematic diagram showing an example of a data structure of a board manufacturing record storage means.

FIG. 9 is a schematic diagram showing a data structure example of a defect record storage means.

FIG. 10 is a schematic diagram showing a data structure example of inspection point information storage means.

FIG. 11 is a schematic diagram showing an example of the data structure of a countermeasure record storage means.

FIG. 12 is an explanatory diagram showing a specific example of data for calculating a countermeasure effect.

FIG. 13 is an explanatory diagram showing a specific example of a tendency check item.

FIG. 14 is an explanatory diagram showing an example of a display screen of countermeasure contents and defect tendency in the first embodiment.

FIG. 15 is a schematic diagram showing a data structure example of a check item database.

FIG. 16 is a schematic diagram illustrating an outline of information flow in the failure analysis system according to the second embodiment.

FIG. 17 is a flowchart showing an outline of the processing flow of the analysis processing means of the second embodiment.

FIG. 18 is a schematic diagram illustrating an outline of information flow in the failure analysis system according to the third embodiment.

FIG. 19 is an explanatory diagram showing an example of a defective position display screen.

FIG. 20 is an explanatory diagram showing an example of a display screen of a board-based Pareto chart showing the number of defects.

FIG. 21 is an explanatory diagram showing an example of a display screen of a defect occurrence number transition diagram.

FIG. 22 is an explanatory diagram showing an example of a board history display screen.

FIG. 23 is an explanatory diagram showing an example of a work record display screen.

FIG. 24 is a schematic diagram showing an example of the data structure of a judgment history database.

FIG. 25 is a schematic diagram showing an example of the data structure of a reference content database for each screen.

FIG. 26 is a flowchart showing an outline of the flow of check item database update processing.

FIG. 27 is a flowchart showing an outline of the processing flow of the non-defective product manufacturing condition editing means.

FIG. 28 is a schematic diagram showing a data structure example of non-defective product / defective product number list data by manufacturing condition.

FIG. 29 is a schematic diagram showing an outline of the flow of information in the mounting defect countermeasure / correction instruction system of the fourth embodiment.

FIG. 30 is an explanatory diagram illustrating a hardware configuration example of the failure analysis system according to the first embodiment.

FIG. 31 is a functional block diagram illustrating a functional configuration example of the failure analysis system according to the second embodiment.

FIG. 32 is an explanatory diagram showing an example of a display screen of countermeasure contents and defect tendency in the second embodiment.

FIG. 33 is a flowchart showing an outline of the processing flow of the analysis processing means of the third embodiment.

FIG. 34 is a schematic diagram showing an example of the data structure of a score table.

FIG. 35 is a functional block diagram illustrating a functional configuration example of the failure analysis system according to the third embodiment.

FIG. 36 is a schematic diagram showing a data structure example of a non-defective product manufacturing condition database.

FIG. 37 is a flowchart showing an outline of the processing flow of the defect record collecting means.

FIG. 38 is a flowchart showing an outline of the processing flow of the correction work instruction means.

FIG. 39 is an explanatory diagram showing an example of a correction work instruction screen.

FIG. 40 is a schematic diagram showing an example of the data structure of a defect record storage means loaded with a correction record.

FIG. 41 is a schematic diagram showing a data structure example of correction work instruction data.

FIG. 42 is a flow chart showing a flow of correction work instruction data creation processing.

[Explanation of symbols]

201 ... Defect rate management means, 202 ... Countermeasure analysis means, 20
3 ... Countermeasure status display means, 204 ... Countermeasure content / defective tendency display means, 205 ... Check item updating means, 206 ... Defect record storage means, 207 ... Manufacturing record storage means, 208 ... Inspection point information storage means, 209 ... Defect rate Management data storage means 209, 210 ... Screen display data storage means, 2
11 ... Check item database, 212 ... Defect occurrence tendency table, 213 ... Countermeasure record storage means, 215 ... Analysis processing means, 216 ... Standard data storage means, 217 ... Non-defective manufacturing condition database, 218 ... Countermeasure content storage means, 2
19 ... Non-defective manufacturing condition editing means, 220 ... Judgment history database, 221 ... Screen reference content database, 222
... analysis processing means, 223 ... non-defective / defective product number list data storage means, 280 ... non-defective / defective product number list data by manufacturing conditions, 301 to 312 ... mounting process, 340 ... score table, 1600 ... failure analysis system, 1601 ... printed board Mounting line, 1602 ... Analysis knowledge update support means, 18
00 ... Defect analysis system, 2900 ... Mounting defect countermeasure / correction instruction system, 2901 ... Defect result collection means, 290
2 ... correction work instruction means, 2903 ... defect analysis support means,
2904 ... Countermeasure work instruction means, 2905 ... Manufacturing record collecting means, 2910 ... Printed board mounting line, 3001 ... Magnetic disk device, 3002 ... Processing device, 3003 ... Floppy disk input device, 3004 ... Input / output device, 30
05 ... Printer, 3006 ... Central processing unit, 300
7 ... Main storage device.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masato Takada 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefectural Manufacturing Company

Claims (17)

[Claims] 1. A manufacturing defect analysis support system comprising an input device, an output device and an information processing device for analyzing a product defect occurring in a product manufacturing line, wherein the information processing device comprises a defect rate management period and A defect rate management data storage unit for holding at least one defect rate management data having a defect rate which is the defect occurrence rate in the period, and a countermeasure content and a countermeasure time of the countermeasure executed in the manufacturing line. Measure result storage means for holding one or more measure information that the user has, and at least one of the measure information held in the measure result storage means, the measure contents included in the measure information and the measure information included in the measure information. And a countermeasure situation output means for performing countermeasure situation output processing for outputting the defect rate before and after the countermeasure time taken in association with the output device. A manufacturing failure analysis support system characterized by: 2. The countermeasure status output means according to claim 1, wherein the countermeasure information satisfying a predetermined condition among the countermeasure information stored in the countermeasure result storage means,
A manufacturing failure analysis support system characterized by performing the above countermeasure status output processing. 3. The method according to claim 2, wherein the predetermined condition is that the content of the countermeasure to be contained is first registered in the countermeasure result storage means, and the defect rate management before and after the countermeasure time. At least one of a change in the defect rate during the period is equal to or greater than a predetermined value, and a change in the defect rate during the defect rate management period before and after the countermeasure time is equal to or less than a predetermined value. A manufacturing failure analysis support system characterized by: 4. The manufacturing defect analysis support system according to claim 1, wherein the defect rate is output as a graph. 5. The information processing apparatus according to claim 1, wherein the information processing apparatus has a check item for estimating a cause and a defect occurrence cause candidate that is an estimated cause when a phenomenon defined in advance for each check item is applicable. A check item database for holding a check item record having and, in the above check item database, a defect phenomenon that has occurred is searched for the above check item record corresponding to a predetermined phenomenon for each of the above check items, When the check item record is detected, an analysis processing unit that estimates the defect occurrence cause candidate included in the check item record as the cause of the defect that has occurred is further included in the manufacturing defect analysis. Support system. 6. The information processing apparatus according to claim 5, further comprising: a countermeasure content storage unit that stores in advance information indicating countermeasure content according to a cause, and the analysis processing unit is a candidate for the cause. A manufacturing failure analysis support system, which accepts any one of the above selections and outputs information indicating the countermeasure stored in advance in the countermeasure content storage means according to the selected cause. 7. The manufacturing failure analysis support system according to claim 6, further comprising a display device, wherein the output of the information indicating the countermeasure content is displayed on the display device. 8. The manufacturing failure analysis support system according to claim 6, wherein outputting the information indicating the countermeasure is outputting a signal instructing the countermeasure. 9. The claim 5 further comprises a score storage area for holding a score indicating the priority of the defect occurrence candidate for each defect occurrence cause candidate, wherein the check item record indicates the probability of the estimated cause. The analysis processing means further has a correlation value that is an index, and the analysis processing unit searches the check item record in which the defective phenomenon that corresponds to a predetermined phenomenon for each check item, and the check item record is detected. Then, the apparatus further comprises means for increasing the value held in the score storage area corresponding to the defect occurrence cause candidate included in the check item record by the correlation value included in the check item record, The presumed cause candidate is characterized in that the value held in the score storage area is larger than a predetermined value. Good analysis support system. 10. The information processing apparatus according to claim 9, further comprising: countermeasure content storage means for storing the countermeasure content in advance according to the cause, wherein the analysis processing means includes: Manufacturing defect analysis support characterized by outputting information indicating the countermeasure stored in advance in the countermeasure content storage means in accordance with the largest value stored in the score storage area corresponding to the cause candidate system. 11. The manufacturing defect analysis support system according to claim 10, further comprising a display device, wherein the output of the information indicating the countermeasure is displayed on the display device. 12. The manufacturing failure analysis support system according to claim 10, wherein outputting the information indicating the countermeasure is outputting a signal instructing the countermeasure. 13. The method according to claim 5, wherein the analysis processing means receives the check item and the corresponding cause candidate input via the input device, the input check item and the corresponding cause. Contradiction determining means for determining whether or not the candidate and the contents of the check item record already held in the check item database are inconsistent, and when it is determined that there is no inconsistency, the input check item and the corresponding above A manufacturing defect analysis support system further comprising: means for creating a check item record based on a cause candidate and storing the check item record in the check item database. 14. The method according to claim 13, wherein when the contradiction determining means determines that there is a contradiction, a selection as to whether or not to register is accepted, and when registration is selected, the input check item and the corresponding cause are registered. A manufacturing defect analysis support system further comprising means for creating a check item record based on a candidate and storing it in the check item database. 15. A manufacturing system comprising a product manufacturing line, an input device, an output device, and a manufacturing defect analysis device, wherein the manufacturing line receives means for manufacturing the product and instructions for countermeasure work. A means for executing the instructed countermeasure work, a means for notifying the manufacturing defect analysis device of the detected product defect content, and a means for notifying the manufacturing defect analysis device of the manufacturing record information and the countermeasure record information. The manufacturing failure analysis apparatus has a failure result storage unit for holding at least one failure result data indicating a result of a failure that has occurred, a countermeasure content of a countermeasure executed in the manufacturing line, and a countermeasure time. Based on the countermeasure record storage means for holding one or more countermeasure information it has and the content of the product defect notified from the manufacturing line, defect record data is created and And bad result collection means for storing the actual storage unit, based on the notified the manufacturing performance information and the countermeasure performance information from the production line, to create the countermeasure information,
A check having a means for storing in the countermeasure result storage means, a check item for estimating a cause, and a defect occurrence cause candidate which is an estimated cause when the phenomenon corresponds to a predetermined phenomenon for each check item. A check item database for holding item records, a measure content storage unit that stores the measure contents in advance according to the cause, and a defect record held in the defect record storage unit in the check item database. When the check item record corresponding to the predetermined phenomenon for each check item is searched and the check item record is detected, the defect occurrence cause candidate included in the check item record is searched. , The cause of the above-mentioned defect is estimated, and the above-mentioned pairing is performed in advance according to the estimated cause. Manufacturing system, characterized in that the information indicating the measures stored in the content storage means, as an indication of countermeasure work, has a means for outputting to the production line. 16. The manufacturing line according to claim 15, further comprising means for receiving a correction work instruction and executing the instructed correction work, wherein the manufacturing defect analysis apparatus is notified from the manufacturing line. A manufacturing system further comprising means for creating instruction information for correction work based on the content of the product defect and outputting it to the manufacturing line. 17. A manufacturing defect analysis support system for analyzing a product defect occurring in a product manufacturing line, based on the countermeasure content of the countermeasure executed in the manufacturing line and the countermeasure information having the countermeasure time. For at least one of the countermeasure information, the countermeasure content included in the countermeasure information, and the defect rate that is the occurrence rate of the product defect in the defect rate management period before and after the countermeasure time included in the countermeasure information, and A manufacturing defect analysis support method for supporting manufacturing defect analysis by outputting the countermeasure information in association with each other.