JPH08167760A - Collective printed wiring board and its manufacture - Google Patents

Abstract

PURPOSE: To enhance precision of circuit pattern formation, to raise the manufacturing yield, to reduce the manufacturing cost, and to raise the productivity by making a circuit pattern on the front of a collective printed wiring board the same as a circuit pattern on the rear. CONSTITUTION: A front-side circuit pattern 12a of a child board is formed in an approximately half-region 11 for a collective printed wiring board to be formed on a CAD picture screen, and a rear side circuit pattern 12b under 18 reversion of the rear-side circuit pattern when the child board is looked at from the rear side is formed in the remaining approximately half region, and the circuit patterns of the collective printed wiring board are designed. Namely, the front and rear circuit patterns of a board are obtained not by arranging exactly the same circuit patterns side by side, but by arranging the front and rear circuit patterns of the child board side by side. Consequently, it becomes possible to lessen misregistration, to enhance the precision of circuit pattern formation, and to raise the manufacturing yield and the productivity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collective printed wiring board in which a plurality of at least one kind of sub boards are incorporated and a method for manufacturing the same.

[0002]

2. Description of the Related Art Generally, when manufacturing a printed wiring board, a collective printed wiring board in which a plurality of printed wiring boards called sub-boards are incorporated into a large board is formed and divided into sub-boards. To obtain the final product, a printed wiring board.

As the collective printed wiring board, the same kind of collective printed wiring board in which a plurality of one kind of sub-boards having the same outer shape and circuit pattern are incorporated, and one or more kinds of sub-boards having different outer shape and circuit pattern. An example is a heterogeneous set printed wiring board in which is embedded.

The following method can be given as a specific method for manufacturing the above-mentioned aggregated printed wiring board.

For example, in the above-mentioned same type aggregate printed wiring board, for example, as shown in FIG. 9A, the front side circuit pattern 102a of the same type of sub-boards 102 and 103 is formed on the front surface 101a of the wide substrate 101 to be the aggregate printed wiring board. , 10
3a are formed in a collective state, and as shown in FIG. 9B, the circuit patterns 102b and 103b on the back side of these child boards 102 and 103 are formed in a collective state on the back surface 101b. 9A and 9B, the through hole 107 in FIG. 9A and the through hole 107 in FIG. 9B show the same hole portion.

Therefore, first, the circuit pattern design and the back surface 10 which match the circuit pattern in the aggregated state of the front surface 101a.
The design of the circuit pattern according to the circuit pattern in the collective state of 1b is performed by CAD (Computer Aided De).
sign) or the like.

The front surface 101a and the back surface 101b
Of a screen or a negative (positive) film for forming each circuit pattern according to the design data of the circuit pattern of CAM (Computer Aided Ma)
nufacturing) or the like.

Next, the screen or negative (positive)
Circuit patterns are formed on the front surface and the back surface of the substrate by using a film, for example, by a method such as etching. In the circuit pattern forming step, a screen and a negative (positive) film are used depending on the fineness of the circuit pattern. If the circuit pattern is not relatively fine, the screen is used and the circuit pattern is relatively fine. In such a case, a negative (positive) film is used.

Subsequently, the front surface 101a and the back surface 101b
On the basis of the design data of the circuit pattern, the screen for applying the soldering paste is formed by CAM or the like, and using this, the soldering paste is screen-printed on the circuit patterns on the front surface 101a and the back surface 101b, respectively. , Forming a soldering paste layer.

Next, based on the design data of the circuit patterns on the front surface 101a and the back surface 101b, parts are mounted on the front surface 101a.
Then, the same kind of printed wiring board is manufactured by mounting the circuit pattern on the back surface 101b by CAM or the like.

On the other hand, the same applies to the case of manufacturing a heterogeneous set printed wiring board. In the heterogeneous set printed wiring board described above, for example, as shown in FIG. 10A, the front side circuit patterns 105a, 1 of the heterogeneous sub-boards 105, 106 having different outer shapes and circuit patterns are formed on the surface 104a of the substrate 104.
06a is formed in a collective state, and as shown in FIG. 10B, the circuit patterns 105b and 106b on the back sides of the child substrates 105 and 106 are formed in a collective state on the back surface 104b. Note that, in FIG. 10, the through hole 109 in FIG. 10A and the through hole 109 in FIG. 10B show the same hole portion, and the through hole 110 in FIG.
The through holes 110 in (b) show the same hole portion.

Therefore, first, the circuit pattern design and the back surface 10 that match the circuit pattern in the aggregated state of the front surface 104a are performed.
A circuit pattern is designed by CAD or the like in accordance with the circuit pattern in the assembled state of 4b, and thereafter, a heterogeneous assembled printed wiring board is manufactured through the same steps as those for the homogeneous assembly printed wiring board.

[0013]

However, when various kinds of aggregate printed wiring boards are manufactured by the above manufacturing method, the following inconveniences occur.

That is, since the circuit patterns in the assembled state are different on the front surface and the back surface of the substrate, two kinds of screens or negative (positive) films for forming the circuit patterns are formed. Therefore, if a circuit pattern is formed on the front surface and the back surface of the substrate using these, there is a high possibility that the circuit pattern formation position on the front surface and the back surface will be displaced, which leads to a decrease in the circuit pattern formation accuracy.
This causes a decrease in manufacturing yield and a decrease in productivity.

Further, since the circuit patterns on the front surface and the back surface of the substrate are different, it is necessary to prepare two kinds of screens for forming a circuit pattern or a negative (positive) film and a screen for applying a soldering paste. Becomes expensive, and it is difficult to reduce the manufacturing cost and improve the productivity.

Therefore, the present invention has been proposed in view of the conventional circumstances, and has high circuit pattern forming accuracy, improved manufacturing yield, reduced manufacturing cost, and improved productivity. It is an object to provide a plate and a method for manufacturing the plate.

[0017]

Means for Solving the Problems As a result of intensive studies made by the present inventors in order to solve the above problems, if the circuit patterns in the assembled state on the front surface and the back surface of the assembled printed wiring board are the same, It has been found that since the circuit pattern can be formed by the same screen or a negative (positive) film, the accuracy of forming the circuit pattern is increased and the manufacturing yield is improved. Further, it was also found that in this way, it is not necessary to prepare only one kind of various screens and films, and the manufacturing cost is reduced.

That is, according to the present invention, in a collective printed wiring board in which a plurality of at least one kind of sub-boards are incorporated, a circuit pattern in a collective state arranged on the front surface of the collective printed wiring board and a collective state arranged on the back surface thereof. The circuit patterns are the same.

When manufacturing a collective printed wiring board, when the circuit pattern on the back surface is formed after the circuit pattern on the front surface of the board is formed, the child board is placed on the back side of the circuit pattern forming position on the front side of a predetermined child board. The back side circuit pattern needs to be formed.

Therefore, when the printed circuit board of the present invention has the same circuit pattern on the front surface and the back surface, the front side and the back side of the predetermined sub-board are symmetrically positioned with respect to the center line of the sub-board forming portion. The circuit pattern of
When the circuit pattern on the back side is formed after the circuit pattern on the front side of the board is formed, the circuit pattern on the back side of the child board needs to be formed on the back side of the circuit pattern forming position on the front side of the predetermined child board. .

When the printed circuit board of the present invention has the same circuit pattern on the front surface and the back surface, the circuit pattern on the front side of the predetermined sub-board is the same as the circuit board on the back side. The circuit pattern on the back side when viewed from the back side needs to be inverted by 180 °.

That is, as the manufacturing method for manufacturing the collective printed wiring board of the present invention, the circuit pattern on the front side of the sub-board is formed on the screen in approximately half the area where the circuit pattern of the collective printed wiring board is to be formed. The circuit pattern of the collective printed wiring board is designed so that a circuit pattern obtained by inverting the circuit pattern on the back side when the above-mentioned sub-board is viewed from the back side by 180 ° is formed in the remaining approximately half area.
The step performed by D, the step of forming the same circuit pattern by the same data designed by CAD on the front surface and the back surface of the substrate, and the CAD on the circuit pattern on the front surface and the back surface of the substrate.
There is a step of forming a soldering paste layer in the same pattern with the same data designed by, and a step of similarly mounting a component with the same data designed by CAD on the circuit patterns on the front surface and the back surface of the board.

[0023]

In the collective printed wiring board of the present invention, the circuit patterns in the collective state arranged on the front surface and the circuit pattern in the collective state arranged on the rear surface of the collective printed wiring board are the same, and therefore the circuit on the front surface and the circuit surface on the back surface are the same. The pattern can be formed using the same screen or a negative (positive) film, the positional deviation is small, and the circuit pattern forming accuracy is improved. Further, since it is only necessary to prepare one kind of various screens or negative (positive) films, the manufacturing cost is reduced.

Further, in the method for manufacturing a collective printed wiring board according to the present invention, the circuit pattern on the front side of the sub-board is formed in a substantially half area of the portion on the screen where the circuit pattern of the collective printed wiring board is to be formed, In the other half of the area, the circuit pattern on the back side when the above-mentioned sub-board is viewed from the back side is set to 1
The circuit pattern of the collective printed wiring board is designed by CAD so that a circuit pattern inverted by 80 ° is formed, and the same circuit pattern is formed on the front surface and the back surface of the substrate based on the same data designed by the CAD. Then, the soldering paste layer is formed in the same pattern on the circuit patterns on the front and back of the board, and the same components are mounted on the circuit patterns on the front and back of the board, so the same design data is used for all processes. It is diverted and the manufacturing process is simplified.

[0025]

Embodiments to which the present invention is applied will be described below in detail with reference to the drawings.

Example 1 In this example, an example in which the present invention is applied to a homogeneous printed wiring board will be described. In the collective printed wiring board of the present embodiment, as shown in FIG. 1A, a first subsidiary board 2 and a second subsidiary board 3 of the same type having the same outer shape and circuit pattern serve as the collective printed wiring board. It is arranged on the wide substrate 1.

A circuit pattern 2a on the front side of the first sub-board 2 and a circuit pattern 3b on the back side of the second sub-board 3 are sequentially formed on the front surface 1a of the board 1 from the left in the figure,
As shown in (b), the back surface 1b of the substrate 1 is
The second sub-board 3 and the circuit pattern 2b on the back side of the sub-board 2 of
The circuit pattern 3a on the front side is sequentially formed. In addition, in FIG. 1, the through hole 4 in FIG.
1B shows the same through hole 4, and FIG. 1A shows the same through hole 5 and FIG. 1B shows the same through hole 5.

Therefore, when viewed as a circuit pattern in an aggregated state, the same circuit pattern is formed on the front surface and the back surface. In the assembled printed wiring board of the present embodiment shown in FIG. 1, it is assumed that components not shown are mounted at predetermined positions.

In order to manufacture the collective printed wiring board of the present embodiment, first, a common circuit pattern is designed on the front surface and the back surface by CAD. That is, as shown in FIG. 2, the circuit patterns 2a on the front side of the sub-boards 2 and 3 are formed in the substantially half area of the aggregate printed wiring board forming portion 11 on which the circuit pattern of the aggregate printed wiring board on the CAD screen is to be formed.
A circuit pattern 12a on the front side to be 3a is formed. Next, as shown in FIG. 3, the sub-boards 2, 2 are formed in the remaining approximately half area of the aggregate printed wiring board forming portion 11 on the CAD screen.
The back side circuit pattern 12b to be the back side circuit patterns 2b and 3b is formed.

Subsequently, as shown in FIG. 4 together with the CAD screens shown in FIGS. 2 and 3, the circuit pattern on the front side of the child board is formed in an area approximately half of the aggregate printed wiring board forming portion 11 on the CAD screen. 12a is formed, and the circuit pattern of the rear printed circuit board 12b is formed in the remaining approximately half area in which the back side circuit pattern when the back side of the child board is viewed from the back side is inverted by 180 ° is formed. To design. That is, in this embodiment, the circuit patterns on the front surface or the back surface of the board are not the same circuit patterns as in the conventional case, but the circuit patterns on the front side and the back side of the child board are arranged side by side. .

Next, a screen or a negative (positive) film for forming a circuit pattern is formed using CAM or the like by the data designed by the above CAD. Then, a circuit pattern is formed on the surface of the substrate by etching using a screen or a negative (positive) film, and a circuit pattern is also formed on the back surface of the substrate by etching using the same screen or a negative (positive) film. . As a result, the same circuit pattern is formed on the front surface and the back surface of the substrate.

At this time, in this embodiment, since the circuit patterns on the front surface and the back surface are formed by the same screen or negative (positive) film, the positional deviation is small, the circuit pattern forming accuracy is increased, and the manufacturing yield is high. And productivity is improved.

Furthermore, in the present embodiment, only one type of screen or negative (positive) film may be prepared, the manufacturing cost is reduced and the productivity is improved.

Next, a screen C for applying the soldering paste to the circuit patterns on the front surface and the back surface of the substrate is used.
It is formed using CAM or the like based on the same data designed by AD. Then, using the screen, a soldering paste is screen-printed on the circuit patterns on the front surface and the back surface of the substrate in the same pattern to form a soldering paste layer.

At this time, in the present embodiment, only one type of screen need be prepared, the manufacturing cost is reduced and the productivity is improved.

Next, components such as electronic components are mounted on the circuit patterns on the front surface and the back surface of the substrate using CAM or the like based on the same data designed by CAD, and the collective printed wiring board of this embodiment is completed. At this time, since the same circuit pattern is formed on the front surface and the back surface of the substrate, the data used for mounting the component on the front surface can be used as it is on the back surface and the component can be similarly mounted.

Therefore, in this embodiment, the same design data is used for all the processes, and since CAD and CAM are used, automation is promoted, the manufacturing process is simplified, and the productivity is improved. . Further, by simplifying the manufacturing process in this way, it is possible to prevent a decrease in manufacturing yield due to a work mistake or the like.

Example 2 In this example, an example in which the present invention is applied to a heterogeneous set printed wiring board will be described. In the collective printed wiring board of the present embodiment, as shown in FIG. 5A, the first subsidiary boards 22 and 24 and the second subsidiary boards 23 and 25 having different outer shapes and circuit patterns are assembled printed wiring boards. The first sub-boards 22 and 24 having a large outer shape and the second sub-boards 23 and 25 having a smaller outer shape are formed on each of the left and right sides with the center of the wide board 21 as a boundary. It is arranged in. In addition, in FIG.
The through holes 26 in FIG. 5A and the through holes 26 in FIG. 5B are the same, and the through holes 27 in FIG.
The same through holes 27 are shown in (b).

Then, as shown in FIG. 5A, a circuit pattern 22a on the front side of the first child board 22 and a circuit pattern on the front side of the second child board 23 are arranged on the front surface 21a of the board 21 from the left in the figure. 23a, the circuit pattern 25b on the back side of the second child board 25, the circuit pattern 2 on the back side of the first child board 24
4b are sequentially formed.

As shown in FIG. 5B, on the back surface 21b of the substrate 21, the circuit pattern 22b on the back side of the first child board 22 and the circuit pattern on the back side of the second child board 23 from the left in the figure. 23b, the circuit pattern 25a on the front side of the second child board 25, and the circuit pattern 24a on the front side of the first child board 24.
Are sequentially formed.

Therefore, also in the collective printed wiring board of the present embodiment, similar to the collective printed wiring board described in the first embodiment, when viewed as a circuit pattern in a collective state, the same circuit pattern is formed on the front surface and the back surface. Will be there. In the aggregated printed wiring board of this embodiment shown in FIG. 5 as well, it is assumed that components not shown are mounted at predetermined positions.

In order to manufacture the collective printed wiring board of this embodiment, first, a common circuit pattern is designed on the front surface and the back surface by CAD. That is, as shown in FIG. 6, a circuit on the front side of the first sub-boards 22 and 24 is formed in an approximately half region of the collective printed wiring board forming portion 31 on which the circuit pattern of the collective printed wiring board on the CAD screen is to be formed. A first front side circuit pattern 32a to be a pattern and a second front side circuit pattern of the second child boards 23 and 25.
The front side circuit pattern 33a is formed in combination.

Next, as shown in FIG. 7, in the remaining approximately half of the aggregate printed wiring board forming portion 31 on the CAD screen, the first circuit board on the back side of the first sub boards 22 and 24 is formed. The circuit pattern 32b on the back side and the circuit pattern 33b on the second back side which is the circuit pattern on the back side of the second child boards 23, 25 are formed in combination.

Subsequently, as shown in FIG. 8 together with the CAD screens shown in FIGS. 6 and 7, the circuit on the front side of each sub-board is provided in an approximately half region of the collective printed wiring board forming portion 31 on the CAD screen. A set in which the patterns 32a and 33a are formed, and the circuit patterns 32b and 33b on the back side are formed in the remaining approximately half area in a state where the circuit patterns on the back side when the above-mentioned respective sub-boards are viewed from the back side are inverted by 180 °. Design the circuit pattern of the printed wiring board.

Thereafter, the collective printed wiring board of this embodiment is manufactured through the same steps as the manufacturing method of the collective printed wiring board described in the first embodiment.

Also in this embodiment, the circuit patterns on the front surface and the back surface are formed by the same screen or a negative (positive) film, so that the circuit pattern forming accuracy is improved, the manufacturing yield is improved, and the productivity is improved. To do.

Also in the present embodiment, only one type of screen or negative (positive) film may be prepared, the manufacturing cost is reduced and the productivity is improved.

Further, also in this embodiment, the same design data is used for all the processes, and since CAD and CAM are used, automation is promoted, the manufacturing process is simplified, and the productivity is improved. . Further, by simplifying the manufacturing process in this way, it is possible to prevent a decrease in manufacturing yield due to a work mistake or the like.

[0049]

As is apparent from the above description, in the collective printed wiring board of the present invention, the circuit pattern in the collective state arranged on the front surface and the circuit pattern in the collective state arranged on the back surface of the collective printed wiring board. Since the same pattern is used, the front and back circuit patterns can be formed using the same screen or negative (positive) film, there is little misalignment, circuit pattern formation accuracy is increased, manufacturing yield is improved, and productivity is also improved. To do. Further, since only one kind of various screens or negative (positive) films need be prepared, the manufacturing cost is reduced and the productivity is improved.

Further, in the method of manufacturing the collective printed wiring board of the present invention, the circuit pattern on the front side of the sub-board is formed on the screen in a substantially half region of the portion where the circuit pattern of the collective printed wiring board is to be formed, In the other half of the area, the circuit pattern on the back side when the above-mentioned sub-board is viewed from the back side is set to 1
The circuit pattern of the collective printed wiring board is designed by CAD so that a circuit pattern inverted by 80 ° is formed, and the same circuit pattern is formed on the front surface and the back surface of the substrate based on the same data designed by the CAD. Then, the soldering paste layer is formed in the same pattern on the circuit patterns on the front and back of the board, and the same components are mounted on the circuit patterns on the front and back of the board, so the same design data is used for all processes. It is diverted, the manufacturing process is simplified, and the productivity is improved.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of an assembled printed wiring board to which the present invention is applied.

FIG. 2 is a view showing an example of a method of manufacturing an aggregate printed wiring board to which the present invention is applied in the order of steps, in which a circuit pattern on the front side is formed in a substantially half region of a portion where the aggregate printed wiring board is formed on a CAD screen. It is a schematic diagram which shows.

FIG. 3 is a view showing an example of a method of manufacturing an aggregate printed wiring board to which the present invention is applied in the order of steps, in which a circuit pattern on the back side is formed in the remaining half of the aggregate printed wiring board forming portion on the CAD screen. It is a schematic diagram which shows the process to do.

FIG. 4 shows an example of a method of manufacturing an aggregated printed wiring board to which the present invention is applied in the order of steps, and is a schematic view showing a step of designing a circuit pattern of the aggregated printed wiring board on a CAD screen.

FIG. 5 is a plan view showing another example of an assembled printed wiring board to which the present invention has been applied.

FIG. 6 shows another example of a method of manufacturing an aggregate printed wiring board to which the present invention is applied, in the order of steps, in which a circuit pattern on the front side is formed in a substantially half region of the aggregate printed wiring board forming portion on the CAD screen. It is a schematic diagram which shows the process to do.

FIG. 7 shows another example of a method of manufacturing an aggregate printed wiring board to which the present invention is applied, in the order of steps, in which a circuit pattern on the back side is formed in the remaining half of the aggregate printed wiring board forming portion on the CAD screen. It is a schematic diagram which shows the process of forming.

FIG. 8 shows another example of the method of manufacturing an aggregated printed wiring board to which the present invention is applied in the order of steps, and is a schematic view showing a step of designing a circuit pattern of the aggregated printed wiring board on a CAD screen.

FIG. 9 is a plan view showing an example of a conventional aggregated printed wiring board.

FIG. 10 is a plan view showing another example of a conventional assembled printed wiring board.

[Explanation of symbols]

1, 21 ... Substrate 1a, 21a ... Front surface 1b, 21b ... Back surface 2, 3 ... Sub-board 2a, 3a, 12a, 22a, 23a, 24a, 25a
... Circuit patterns on the front side 2b, 3b, 12b, 22b, 23b, 24b, 25b
... Circuit pattern on the back side 11, 31 ... Assembly printed wiring board forming portion 22, 24 ... First child board 23, 25 ... Second child board 32a ... First front side Circuit pattern 32b ... Circuit pattern on first back side 33a ... Circuit pattern on second front side 33b ... Circuit pattern on second back side

Claims (2)

[Claims] 1. A collective printed wiring board in which a plurality of at least one kind of sub-boards are incorporated, wherein a circuit pattern in a collective state arranged on a front surface and a circuit pattern in a collective state arranged on a rear surface of the collective printed wiring board are provided. A collective printed wiring board characterized by being the same. 2. A circuit pattern on the front side of the child board is formed in a region of approximately half of a portion where a circuit pattern of the collective printed wiring board is to be formed on the screen, and the child board is arranged in the remaining approximately half region from the back side. The circuit pattern on the back side when viewed is 18
The step of designing the circuit pattern of the collective printed wiring board by CAD so that the circuit pattern inverted by 0 ° is formed, and the step of forming the same circuit pattern by the same data designed by CAD on the front surface and the back surface of the board. And the step of forming the soldering paste layer in the same pattern on the circuit patterns on the front and back of the board with the same data designed by CAD, and the same data designed by CAD on the circuit patterns on the front and back of the board A method for manufacturing an assembled printed wiring board, the method including the step of mounting a component on a substrate.