JPH08153666A - Organic material remover - Google Patents

Abstract

PURPOSE: To secure the same functions and performance as the prior art without requiring a transfer stage in one robot by a method wherein a treatment chamber and a cassette are vertically and opposingly arranged and the robot is arranged therebetween. CONSTITUTION: Treatment chambers 1, 1, are provided with means for heating a wafer and means for introducing ozone gas. A robot 2 has three degrees of freedom: namely a vertical direction, a rotation, and a front and back direction, and vacuum-chucks a wafer to carry between a cassette and a treatment chamber. A process is started from a cassette 3, and a wafer is entered into the treatment chambers 1, 1', and ozone gas is flown thereinto to perform a resist remove process. The wafer over with treatment is received in the same slot of the cassette 3. These are repeated, and when all wafers in the cassette 3 are over with treatment, a treatment of a cassette 3' is next started. Meanwhile, the cassette 3 is changed over and a new cassette having an untreated wafer is arranged in a location of the cassette 3 located previously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus,
In particular, the present invention relates to an organic substance removing device that can be used for cleaning organic contaminants on a wafer and removing a resist.

[0002]

2. Description of the Related Art In order to increase the throughput of a semiconductor manufacturing apparatus, the number of processing chambers is plural and the processing chambers are arranged on a plane. A conventional example is shown in FIG.

In FIG. 1, 1, 1'is a processing chamber and 2, 2 '
Is a wafer transfer robot, 3 and 3'is a wafer storage cassette, and 4 is a delivery stage. For example, 25 wafers are stored in each of the cassettes 3 and 3 ′, and the stored wafers are sequentially put into the processing chambers 1 and 1 ′ by the robots 2 and 2 ′ to perform the organic substance removal processing. The stage 4 is used when the wafer is transferred from the robot 2 to the robot 2'when the wafer is put into the processing chamber 1 '. After the processing of the wafers in the cassette 3 is completed, the same processing is performed on the wafers in the cassette 3 '. Further, the cassette 3 which has been processed during this period is replaced, and after the processing of the cassette 3'is completed, the processing of the cassette 3 is performed again, so that the processing can be continued.

In such a conventional technique, high throughput can be obtained.

[0005]

However, in the prior art, since the processing chamber and the cassette are arranged on a plane, two robots are used, and a transfer stage is also required, the area of the apparatus becomes large. There is a drawback that it is expensive and expensive.

The object of the present invention is to overcome these drawbacks.

[0007]

2A and 2B show an organic substance removing apparatus according to an embodiment of the present invention, wherein FIG. 2A is a front view and FIG. 2B is a side view.

In FIG. 2, the processing chambers 1 and 1'and the cassettes 3 and 3'are vertically arranged, and the robot 2 is installed between these processing chambers and cassettes.

The robot 2 has three degrees of freedom in vertical, rotation, and front / rear directions, and transfers a wafer between the cassette and the processing chamber.

[0010]

By aligning the processing chamber and the cassette in the vertical direction and facing each other, and installing the robot between them, it is possible to secure the same function and performance as the conventional one robot without needing a transfer stage. You can

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG.

In FIG. 2, processing chambers 1 and 1'have means for heating the wafer and means for introducing ozone gas. The robot 2 has three degrees of freedom: vertical, rotating, and front / rear, and vacuum sucks a wafer to transfer it between the cassette and the processing chamber. The cassettes 3 and 3'can store, for example, 25 wafers. The process is started from the cassette 3, the wafer is placed in the process chambers 1 and 1 ', heated to 300 ° C., and 5% ozone gas is introduced to perform the resist removal process. Wafer 1
The processing is completed in 1 minute per wafer, and the wafers after the processing are stored in the same slot of the cassette 3. Repeat this,
When the processing of all the wafers in the cassette 3 is completed, the processing of the cassette 3'is started next. During this time, the cassette 3 is replaced and a new cassette containing unprocessed wafers is installed at the position of the previous cassette 3. In this way, the resist removing process is continuously performed.

The robot 2 is installed on a vertically movable table, and when the robot extends its arm in the vertical direction, this table also moves in the same direction to increase the moving speed of the arm, thereby improving the throughput. effective.

[0014]

According to the present invention, the device area can be reduced to about half that of the conventional device. Further, the same performance as the conventional one can be obtained without the need of a transfer stage with only one robot.

[Brief description of drawings]

FIG. 1 is an illustration of a prior art device.

FIG. 2 is an explanatory diagram of a device of the present invention.

[Explanation of symbols]

1, 1 '... processing chamber, 2, 2' ... robot, 3, 3 '... cassette, 4 ... transfer stage, 5 ... robot moving base.

Claims (2)

[Claims] 1. A plurality of processing chambers are arranged in a vertical direction, and the same number of processing object storage containers as the number of processing chambers are arranged in a vertical direction, and the processing chambers and the processing objects are installed in a position facing the processing chambers. An organic substance removing device, characterized in that a mechanism for transporting an object to be treated is installed between the substance storing container. 2. The organic substance removing device according to claim 1, wherein the workpiece transport mechanism has three degrees of freedom in vertical, rotation, and front / rear directions, and a table on which the workpiece transport mechanism is mounted moves vertically.