JPH0791827A - Drying system - Google Patents
Drying systemInfo
- Publication number
- JPH0791827A JPH0791827A JP5255159A JP25515993A JPH0791827A JP H0791827 A JPH0791827 A JP H0791827A JP 5255159 A JP5255159 A JP 5255159A JP 25515993 A JP25515993 A JP 25515993A JP H0791827 A JPH0791827 A JP H0791827A
- Authority
- JP
- Japan
- Prior art keywords
- air
- drying
- drying system
- nozzle
- taken
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Drying Of Solid Materials (AREA)
- Drying Of Gases (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フロン規制後の半導体
ウエファその他各種の精密電子部品の製造工程等に適用
される改良された乾燥システムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved drying system applied to the manufacturing process of semiconductor wafers and various other precision electronic parts after the CFC regulation.
【０００２】[0002]
【従来の技術】金属やプラスチック等の固体の表面に付
着する水分は、その表面張力によって、微細な水玉とな
っている。而して、当該固体の表面に熱風が送られても
乾燥の効率が悪くしかも出来上りが不十分でこの対策に
苦慮しているのが実状であった。特に、半導体のウエフ
ァの乾燥には、従来から、フロンが使用されているが、
環境破壊防止の観点から、使用抑制の方向が打出されて
おり、水洗に代替せざるを得ないこととなり、上述の問
題点が俄かに浮上するに至った。2. Description of the Related Art Water adhering to the surface of a solid such as metal or plastic becomes fine polka dots due to its surface tension. Thus, even if hot air is blown to the surface of the solid, the efficiency of drying is inferior and the finished product is insufficient. In particular, freon has been used for drying semiconductor wafers,
From the viewpoint of preventing environmental damage, the use of water has been restrained, and it has no choice but to replace it with water, and the above-mentioned problems have emerged.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記の実状
に鑑みてなされたもので、水洗された金属又はプラスチ
ック等の固体の表面の水分を迅速にかつ完全に乾燥除去
するための有効な手段を種々研究・検討した結果、乾燥
システムのなかで、使用するエアの水分もほぼ完全に除
去する所謂超乾燥空気が効果的であり、さらに、ノズル
から噴出するエアに超音波が含ませられている場合に、
水滴に振動を与える作用が働いて乾燥が格段に早めら
れ、しかも、乾燥後に、従来残る水滴による所謂隈取
（くまどり）が全く残らず、半導体の性能の保持に極め
て効果的であることを知得し、本発明を完成するに至り
たるものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is effective for quickly and completely drying and removing water on the surface of a solid such as a metal or plastic that has been washed with water. As a result of various researches and studies of means, in the drying system, so-called ultra-dry air, which almost completely removes the water content of the air used, is effective, and further, the air ejected from the nozzle contains ultrasonic waves. If
It is known that the action of giving vibration to water droplets accelerates drying drastically, and after drying, so-called "kumadori" due to water droplets that remain in the past does not remain at all, which is extremely effective in maintaining the performance of semiconductors. Thus, the present invention has been completed.
【０００４】[0004]
【課題を解決するための手段】本発明は、 ａ．コンプレッサ等により取り入れられヒータで加熱さ
れたエアがノズルから乾燥対象物に吹付けられる工程を
有する乾燥システムにおいて、 ｂ．上記工程中に、取入れられたエアの水分をほぼ完全
に除去するエアドライヤ装置を設けるとともに、 ｃ．エアに対し少くとも周波数が１８，０００ヘルツ以
上の超音波を照射する超音波発生装置を設けて構成され
る ｄ．乾燥システム をその要旨として成立するものである。The present invention comprises: a. In a drying system having a process in which air taken in by a compressor or the like and heated by a heater is blown from a nozzle onto an object to be dried, b. During the above process, an air dryer is provided which almost completely removes the moisture of the taken-in air, and c. It is configured by providing an ultrasonic wave generator for irradiating air with ultrasonic waves having a frequency of at least 18,000 Hz or more. D. The drying system is established as its gist.
【０００５】[0005]
【実施例】図１は、従来の乾燥システムを示す説明図、
図２は本発明に係る乾燥システムを示す説明図、図３は
本発明に係る超音波発生装置を付設したノズルを示す説
明図である。EXAMPLE FIG. 1 is an explanatory view showing a conventional drying system,
FIG. 2 is an explanatory view showing a drying system according to the present invention, and FIG. 3 is an explanatory view showing a nozzle provided with an ultrasonic generator according to the present invention.
【０００６】図１に示す従来の乾燥システムにおいて
は、コンプレッサ（又は送風機等）１により取り入れら
れたエアがヒータ２に誘導されて加熱されたのち、ノズ
ル３より、コンベア４等で緩徐に移動する乾燥対象物５
例えば半導体ウエファなどに吹付けて乾燥する工程を有
するものであった。In the conventional drying system shown in FIG. 1, the air taken in by the compressor (or the blower or the like) 1 is guided to the heater 2 and heated, and then slowly moved from the nozzle 3 by the conveyor 4 or the like. Object to be dried 5
For example, it has a step of spraying a semiconductor wafer or the like and drying it.
【０００７】これに対し、本願発明は、上記の工程中
に、図２に示す如く、取り入れられたエアの超乾燥とも
云うべき水分が殆んど除去されて含水分率の低い乾燥空
気とするためのエアドライヤ装置６と、エアに対し、少
くとも周波数が１８，０００ヘルツ以上の超音波を照射
・混在せしめる超音波発生装置７とを設けて構成され
る。On the other hand, according to the present invention, as shown in FIG. 2, during the above-mentioned process, almost all of the moisture, which should be called super-drying of the taken-in air, is removed to obtain dry air having a low moisture content. And an ultrasonic generator 7 for irradiating and mixing ultrasonic waves having a frequency of at least 18,000 Hz with respect to the air.
【０００８】エアドライヤ装置には、米国マッキンタイ
ア社のコンパクト・エアドライヤ（商品名）が好ましく
使用される。図示しないが、その原理は下記のとおりで
ある。即ちコンプレッサから送られた圧縮空気はエア・
フィルタで凝縮水、ダスト等が除去されたのち規定圧力
に調整され、さらに、マイクロミストフィルタで細かい
ダスト、オイルミスト等が除去されて複数の乾燥筒に交
互に送り込まれ、該筒の内部に充填される吸着剤により
除湿されて乾燥空気となって出口から取り出されるもの
である。乾燥筒を交互に使用するのは、一部の乾燥空気
で吸着剤の吸湿分を除去排出するためである。For the air dryer device, a compact air dryer (trade name) manufactured by McIntyre Company, USA is preferably used. Although not shown, the principle is as follows. That is, the compressed air sent from the compressor is air
After the condensed water, dust, etc. are removed by the filter, the pressure is adjusted to the specified pressure, and the fine dust, oil mist, etc. are removed by the micro mist filter, which are then sent alternately to multiple drying tubes and filled inside the tubes. It is dehumidified by the adsorbent to be dried air and taken out from the outlet. The reason why the drying cylinders are alternately used is that a part of the dry air removes and discharges the moisture content of the adsorbent.
【０００９】超音波発生装置７を付設するノズル３は図
３に示される。超音波発生装置７は通常加熱された空気
に混在せしめられて、最も効率よく乾燥対象物５に照射
せしめられる。超音波発生装置７の細孔７ａには、加熱
されたエア１０が誘導され、障壁１１で混在されて一旦
逆戻りして出口８から吹付けられる。超音波は１８，０
００ヘルツ以上の周波数を有するものが好ましく、乾燥
時間の短縮化に寄与する。水分を弾き飛ばす作用効果が
大なるものと思料される。乾燥終了後乾燥対象物の表面
に、隈取りの現象は全く認められなかった。The nozzle 3 to which the ultrasonic generator 7 is attached is shown in FIG. The ultrasonic wave generator 7 is usually mixed with the heated air to irradiate the object to be dried 5 most efficiently. The heated air 10 is guided to the pores 7a of the ultrasonic wave generator 7, mixed with the barrier 11 and once returned to be blown from the outlet 8. Ultrasound is 18,0
Those having a frequency of 00 hertz or higher are preferable, and contribute to shortening the drying time. It is considered that the action and effect of repelling water is great. After the drying was completed, no phenomenon of kumadake was observed on the surface of the object to be dried.
【００１０】[0010]
【発明の効果】本発明は以上の構成に基づくもので、エ
アドライヤ装置を用いて加熱前のエアを清浄化して乾燥
し、加熱エアに超音波を混在する熱音波発生装置を含む
ものであるから、乾燥が短時間に終了するとともに乾燥
後における金属及びプラスチック等の乾燥対象物に隈取
り等のない清浄面が顕出することとなり、半導体ウエフ
ァ、精密器機部品等の高度の乾燥技術を要する分野に適
用して極めて有用なものである。EFFECTS OF THE INVENTION The present invention is based on the above-mentioned constitution. Since the air before drying is cleaned and dried by using an air dryer, a thermosonic wave generator for mixing ultrasonic waves with the heated air is included. Is completed in a short time, and a dry surface such as metal and plastic that does not have any darkening appears after drying, and it is applied to fields requiring advanced drying technology such as semiconductor wafers and precision instrument parts. It is extremely useful.
【図１】従来の乾燥システムを示す説明図である。FIG. 1 is an explanatory diagram showing a conventional drying system.
【図２】本発明に係る乾燥システムを示す説明図であ
る。FIG. 2 is an explanatory diagram showing a drying system according to the present invention.
【図３】本発明に係る超音波発生装置を付設したノズル
を示す説明図である。FIG. 3 is an explanatory diagram showing a nozzle provided with an ultrasonic generator according to the present invention.
１ コンプレッサ ２ ヒータ ３ ノズル ４ コンベア ５ 乾燥対象物 ６ エアドライヤ装置 ７ 超音波発生装置 ７ａ （超音波発生装置の）細孔 １１ 障壁 DESCRIPTION OF SYMBOLS 1 Compressor 2 Heater 3 Nozzle 4 Conveyor 5 Object to be dried 6 Air dryer device 7 Ultrasonic generator 7a Pore (of ultrasonic generator) 11 Barrier
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成５年１１月１１日[Submission date] November 11, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Name of item to be amended] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【特許請求の範囲】[Claims]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の詳細な説明[Name of item to be amended] Detailed explanation of the invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は、フロン規制後の半導体
ウエファその他各種の精密電子部品の製造工程等に適用
される改良された乾燥システムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved drying system applied to the manufacturing process of semiconductor wafers and various other precision electronic parts after the CFC regulation.
【０００２】[0002]
【従来の技術】金属やプラスチック等の固体の表面に付
着する水分は、その表面張力によって、微細な水玉とな
っている。而して、当該固体の表面に熱風が送られても
乾燥の効率が悪くしかも出来上りが不十分でこの対策に
苦慮しているのが実状であった。特に、半導体のウエフ
ァの乾燥には、従来から、フロンが使用されているが、
環境破壊防止の観点から、使用抑制の方向が打出されて
おり、水洗に代替せざるを得ないこととなり、上述の問
題点が俄かに浮上するに至った。2. Description of the Related Art Water adhering to the surface of a solid such as metal or plastic becomes fine polka dots due to its surface tension. Thus, even if hot air is blown to the surface of the solid, the efficiency of drying is inferior and the finished product is insufficient. In particular, freon has been used for drying semiconductor wafers,
From the viewpoint of preventing environmental damage, the use of water has been restrained, and it has no choice but to replace it with water, and the above-mentioned problems have emerged.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記の実状
に鑑みてなされたもので、水洗された金属又はプラスチ
ック等の固体の表面の水分を迅速にかつ完全に乾燥除去
するための有効な手段を種々研究・検討した結果、乾燥
システムのなかで、使用するエアの水分もほぼ完全に除
去する所謂超乾燥空気が効果的であり、さらに、ノズル
から噴出するエアに超音波が含ませられている場合に、
水滴に振動を与える作用が働いて乾燥が格段に早めら
れ、しかも、乾燥後に、従来残る水滴による所謂隈取
（くまどり）が全く残らず、半導体の性能の保持に極め
て効果的であることを知得し、本発明を完成するに至り
たるものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is effective for quickly and completely drying and removing water on the surface of a solid such as a metal or plastic that has been washed with water. As a result of various researches and examinations of means, in the drying system, so-called ultra-dry air, which almost completely removes the water content of the air used, is effective. If
It is known that the action of giving vibration to water droplets accelerates drying drastically, and that after drying, so-called "kumadori" due to water droplets that remain in the past does not remain at all, and it is extremely effective in maintaining the performance of semiconductors. Thus, the present invention has been completed.
【０００４】[0004]
【課題を解決するための手段】本発明は、 ａ．コンプレッサ等により取り入れられヒータで加熱さ
れたエアがノズルから乾燥対象物に吹付けられる工程を
有する乾燥システムにおいて、 ｂ．上記工程中に、取入れられたエアの水分をほぼ完全
に除去するエアドライヤ装置を設けるとともに、 ｃ．エアに対し少くとも周波数が１０，０００ヘルツ以
上の超音波を照射する超音波発生装置を設けて構成され
る ｄ．乾燥システム をその要旨として成立するものである。The present invention comprises: a. In a drying system having a process in which air taken in by a compressor or the like and heated by a heater is blown from a nozzle onto an object to be dried, b. During the above process, an air dryer is provided which almost completely removes the moisture of the taken-in air, and c. An ultrasonic wave generator for irradiating air with ultrasonic waves having a frequency of 10,000 hertz or more is provided. D. The drying system is established as its gist.
【０００５】[0005]
【実施例】図１は、従来の乾燥システムを示す説明図、
図２は本発明に係る乾燥システムを示す説明図、図３は
本発明に係る超音波発生装置を付設したノズルを示す説
明図である。EXAMPLE FIG. 1 is an explanatory view showing a conventional drying system,
FIG. 2 is an explanatory view showing a drying system according to the present invention, and FIG. 3 is an explanatory view showing a nozzle provided with an ultrasonic generator according to the present invention.
【０００６】図１に示す従来の乾燥システムにおいて
は、コンプレッサ（又は送風機等）１により取り入れら
れたエアが常温またはヒータ２に誘導されて加熱された
のち、ノズル３より、コンベア４等で緩徐に移動する乾
燥対象物５例えば半導体ウエファなどに吹付けて乾燥す
る工程を有するものであった。In the conventional drying system shown in FIG. 1, after air taken in by a compressor (or a blower or the like) 1 is heated to room temperature or to a heater 2 and heated, it is slowly discharged from a nozzle 3 by a conveyor 4 or the like. It has a step of spraying the moving object 5 to be dried, such as a semiconductor wafer, to dry it.
【０００７】これに対し、本願発明は、上記の工程中
に、図２に示す如く、取り入れられたエアの超乾燥とも
云うベき水分が殆んど除去されて含水分率の低い乾燥空
気とするためのエアドライヤ装置６と、エアに対し、少
くとも周波数が１０，０００ヘルツ以上の超音波を照射
・混在せしめる超音波発生装置７とを設けて構成され
る。On the other hand, according to the present invention, as shown in FIG. 2, during the above-described process, almost all of the moisture contained in the taken-in air, which is referred to as super-drying, is removed to obtain dry air having a low moisture content. An air dryer 6 for performing the operation and an ultrasonic generator 7 for irradiating and mixing ultrasonic waves having a frequency of 10,000 hertz or more with respect to the air are provided.
【０００８】エアドライヤ装置には、米国マッキンタイ
ア社のコンパクト・エアドライヤ（商品名）が好ましく
使用される。図示しないが、その原理は下記のとおりで
ある。即ちコンプレッサから送られた圧縮空気はエア・
フィルタで凝縮水、ダスト等が除去されたのち規定圧力
に調整され、さらに、マイクロミストフィルタで細かい
ダスト、オイルミスト等が除去されて複数の乾燥筒に交
互に送り込まれ、該筒の内部に充填される吸着剤により
除湿されて乾燥空気となって出口から取り出されるもの
である。乾燥筒を交互に使用するのは、一部の乾燥空気
で吸着剤の吸湿分を除去排出するためである。For the air dryer device, a compact air dryer (trade name) manufactured by McIntyre Company, USA is preferably used. Although not shown, the principle is as follows. That is, the compressed air sent from the compressor is air
After the condensed water, dust, etc. are removed by the filter, the pressure is adjusted to the specified pressure, and the fine dust, oil mist, etc. are removed by the micro mist filter, which are then sent alternately to multiple drying tubes and filled inside the tubes. It is dehumidified by the adsorbent to be dried air and taken out from the outlet. The reason why the drying cylinders are alternately used is that a part of the dry air removes and discharges the moisture content of the adsorbent.
【０００９】超音波発生装置７を付設するノズル３は図
３に示される。超音波発生装置７は通常常温または加熱
された空気に混在せしめられて、最も効率よく乾燥対象
物５に照射せしめられる。超音波発生装置７の細孔７ａ
には、常温または加熱されたエア１０が誘導され、障壁
１１で混在されて一旦逆戻りして出口８から吹付けられ
る。超音波は１８，０００ヘルツ以上の周波数を有する
ものが好ましく、乾燥時間の短縮化に寄与する。水分を
弾き飛ばす作用効果が大なるものと思料される。乾燥終
了後乾燥対象物の表面に、隈取りの現象は全く認められ
なかった。The nozzle 3 to which the ultrasonic generator 7 is attached is shown in FIG. The ultrasonic wave generator 7 is usually mixed in room temperature or heated air to irradiate the object to be dried 5 most efficiently. Pores 7a of the ultrasonic generator 7
At room temperature, heated air 10 is introduced, mixed in the barrier 11, once returned, and blown from the outlet 8. The ultrasonic waves preferably have a frequency of 18,000 hertz or higher, which contributes to shortening the drying time. It is considered that the action and effect of repelling water is great. After the drying was completed, no phenomenon of kumadake was observed on the surface of the object to be dried.
【００１０】[0010]
【発明の効果】本発明は以上の構成に基づくもので、エ
アドライヤ装置を用いて加熱前のエアを清浄化して乾燥
し、常温または加熱エアに超音波を混在する熱音波発生
装置を含むものであるから、乾燥が短時間に終了すると
ともに乾燥後における金属及びプラスチック等の乾燥対
象物に隈取り等のない清浄面が顕出することとなり、半
導体ウエファ、精密器機部品等の高度の乾燥技術を要す
る分野に適用して極めて有用なものである。The present invention is based on the above construction, and includes a thermosonic wave generator for cleaning air before heating by using an air dryer and drying it, and mixing ultrasonic waves with room temperature or heated air. In addition, as the drying is completed in a short time and a clean surface with no shading appears on the object to be dried such as metal and plastic after drying, it is applied to fields requiring advanced drying technology such as semiconductor wafers and precision instrument parts. It is extremely useful when applied.
Claims (1)
タで加熱されたエアがノズルから乾燥対象物に吹付けら
れる工程を有する乾燥システムにおいて、上記工程中
に、取り入れられたエアの水分をほぼ完全に除去するエ
アドライヤ装置を設けるとともに、エアに対し少くとも
周波数が１８，０００ヘルツ以上の超音波を照射する超
音波発生装置を設けて構成される乾燥システム。1. A drying system having a step of blowing air, which is taken in by a compressor or the like and heated by a heater, from a nozzle to an object to be dried, during the above-mentioned step, the water content of the taken-in air is almost completely removed. A drying system including an air dryer and an ultrasonic generator for irradiating air with ultrasonic waves having a frequency of at least 18,000 Hz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5255159A JPH0791827A (en) | 1993-09-17 | 1993-09-17 | Drying system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5255159A JPH0791827A (en) | 1993-09-17 | 1993-09-17 | Drying system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0791827A true JPH0791827A (en) | 1995-04-07 |
Family
ID=17274887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5255159A Pending JPH0791827A (en) | 1993-09-17 | 1993-09-17 | Drying system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0791827A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211235A (en) * | 2004-11-12 | 2011-10-20 | Asml Netherlands Bv | Lithographic apparatus and method for manufacturing the device |
| DK201670418A1 (en) * | 2016-06-10 | 2017-12-18 | Force Tech | A dryer and a method of drying |
-
1993
- 1993-09-17 JP JP5255159A patent/JPH0791827A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211235A (en) * | 2004-11-12 | 2011-10-20 | Asml Netherlands Bv | Lithographic apparatus and method for manufacturing the device |
| DK201670418A1 (en) * | 2016-06-10 | 2017-12-18 | Force Tech | A dryer and a method of drying |
| US10928131B2 (en) | 2016-06-10 | 2021-02-23 | Force Technology | Dryer and method of drying |
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