JPH0761826A - Cooling of mold of molding machine for optics and device therefor - Google Patents

Cooling of mold of molding machine for optics and device therefor

Info

Publication number
JPH0761826A
JPH0761826A JP22794593A JP22794593A JPH0761826A JP H0761826 A JPH0761826 A JP H0761826A JP 22794593 A JP22794593 A JP 22794593A JP 22794593 A JP22794593 A JP 22794593A JP H0761826 A JPH0761826 A JP H0761826A
Authority
JP
Japan
Prior art keywords
mold
temperature control
control rod
molding
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP22794593A
Other languages
Japanese (ja)
Inventor
Takashi Kobayashi
高志 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP22794593A priority Critical patent/JPH0761826A/en
Publication of JPH0761826A publication Critical patent/JPH0761826A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/12Cooling, heating, or insulating the plunger, the mould, or the glass-pressing machine; cooling or heating of the glass in the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To remarkably improve the responsibility, the reproducibility and the efficiency in control for cooling a mold by bringing a temperature control rod having a high thermal conductivity into plane contact with the mold and taking heat away from the mold. CONSTITUTION:The shape 53 of the bottom part of a hole 25 made in an upper mold 19 for moving a temperature control rod for the upper mold is designed so that the shape 26a of the top part of the control rod 26 may be brought into plane contact with it. In the same manner, the shape 53 of the bottom part of a hole 30 made in an under mold 20 for moving a temperature control rod for the under mold is designed so that the shape 31a of the top part of the temperature control rod 31 capable of freely performing a vertical motion may be brought into plane contact with it.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、押圧成形により高精度
を有するガラス光学素子を製造する成形装置の金型温度
冷却方法とその装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold temperature cooling method for a molding apparatus for manufacturing a glass optical element having high precision by press molding, and the apparatus.

【0002】[0002]

【従来の技術】従来、金型の温度を制御する方法として
は、例えば特願平4−034418号公報記載の発明が
ある。上記発明の金型温度制御機構は、上金型および下
金型の少なくとも一方の内部に、流量制御弁を介して型
内部ブロー管から冷却エアーを吹き付け、金型の温度に
より冷却エアーの流量を調整することで、金型の温度を
制御しようとするものである。
2. Description of the Related Art Conventionally, as a method for controlling the temperature of a mold, there is, for example, the invention described in Japanese Patent Application No. 04-034418. The mold temperature control mechanism of the above invention blows cooling air into the inside of at least one of the upper mold and the lower mold from a mold internal blow pipe via a flow control valve, and controls the flow rate of the cooling air depending on the temperature of the mold. By adjusting, the temperature of the mold is controlled.

【0003】[0003]

【発明が解決しようとする課題】しかるに、前記公報に
記載される装置においては、金型の冷却に熱伝導の悪い
気体を媒体として利用していることと、冷却エアーの温
度管理がされていないので、冷却エアーが金型に吹き付
けられる時点では、冷却エアーの温度が上昇してしまう
ことから、冷却効率と応答性が悪いという問題点があっ
た。
However, in the apparatus described in the above publication, a gas having poor heat conduction is used as a medium for cooling the mold, and the temperature of the cooling air is not controlled. Therefore, when the cooling air is blown onto the mold, the temperature of the cooling air rises, so that there is a problem that cooling efficiency and responsiveness are poor.

【0004】困って、本発明は前記従来技術における問
題点に鑑みて開発されたもので、成形工程中の冷却時間
を応答性良く、短時間に変化させることができる光学素
子成形装置の金型温度冷却方法とその装置を提供するこ
とを目的とする。
Unfortunately, the present invention was developed in view of the above problems in the prior art, and a mold for an optical element molding apparatus capable of changing the cooling time during the molding process with good response and in a short time. An object of the present invention is to provide a temperature cooling method and an apparatus therefor.

【0005】[0005]

【課題を解決するための手段】本発明は、加熱軟化させ
たガラス素材を成形室内に配置した金型により押圧して
光学素子を成形する装置において、少なくとも一方の金
型に、該金型よりも温度の低い温度制御部材を面接触さ
せて金型を冷却する方法である。また、底部中央から成
形面方向に穴部が穿設された金型と、前記穴部と面接触
する面形状を有して摺動自在に嵌合された温度制御部材
と、該温度制御部材を移動させる駆動機構とを具備した
ものである。
DISCLOSURE OF THE INVENTION The present invention is an apparatus for molding an optical element by pressing a glass material that has been softened by heating with a mold disposed in a molding chamber. Is a method of cooling a mold by bringing a temperature control member having a low temperature into surface contact. Further, a mold having a hole formed in the molding surface direction from the center of the bottom, a temperature control member having a surface shape in surface contact with the hole and slidably fitted, and the temperature control member. And a drive mechanism for moving the.

【0006】[0006]

【作用】本発明では、金型よりも温度が低く、気体より
も熱伝導の良い温度制御部材を金型に面接触させること
により、効率よく、瞬時に金型から熱を奪い取ることが
可能となる。
In the present invention, it is possible to efficiently and instantly remove heat from the mold by bringing the temperature control member, which is lower in temperature than the mold and has better thermal conductivity than gas, into surface contact with the mold. Become.

【0007】[0007]

【実施例1】図1および図2は本実施例で用いる装置を
示し、図1は縦断面図、図2は要部拡大断面図である。
成形部1の側部には、加熱ヒーター2aを備えて図示し
ない温度制御装置によって所定の温度に設定できる加熱
炉2が隣設されている。成形部1および加熱炉2の周辺
は、石英ガラスまたはステンレスからなるカバー3,上
ベース4および下ベース5により密閉されて成形室6が
形成されている。
Embodiment 1 FIGS. 1 and 2 show an apparatus used in this embodiment, FIG. 1 is a vertical sectional view, and FIG. 2 is an enlarged sectional view of an essential part.
A heating furnace 2 having a heater 2a and capable of setting a predetermined temperature by a temperature control device (not shown) is provided adjacent to the side of the molding unit 1. A periphery of the molding unit 1 and the heating furnace 2 is sealed by a cover 3, an upper base 4 and a lower base 5 made of quartz glass or stainless steel to form a molding chamber 6.

【0008】上下ベース4,5には、雰囲気ガス供給装
置(図示省略)に接続されたガスノズル7,7aが設置
され、このガスノズル7,7aを介して成形室6内に供
給される窒素ガスにより成形室6内部の酸化を防止して
いる。また、上ベース4の上部には、上型用温度制御棒
駆動機構14が設置されている。
The upper and lower bases 4, 5 are provided with gas nozzles 7, 7a connected to an atmosphere gas supply device (not shown), and by the nitrogen gas supplied into the molding chamber 6 via the gas nozzles 7, 7a. Oxidation inside the molding chamber 6 is prevented. An upper mold temperature control rod drive mechanism 14 is installed on the upper base 4.

【0009】成形室6内には上型部8と下型部9とが配
置されている。上型部8は上ベース4に固定され、下型
部9はプレス軸10の先端に固定されている。プレス軸
10は、下ベース5に固定したハウジング11内で軸受
け12により軸方向へ摺動自在に保持されるとともに、
下型用温度制御棒駆動機構15を介して駆動用シリンダ
13により昇降自在に設置されている。
An upper mold part 8 and a lower mold part 9 are arranged in the molding chamber 6. The upper mold part 8 is fixed to the upper base 4, and the lower mold part 9 is fixed to the tip of the press shaft 10. The press shaft 10 is held slidably in the axial direction by a bearing 12 in a housing 11 fixed to the lower base 5, and
It is installed so that it can be moved up and down by a drive cylinder 13 via a lower mold temperature control rod drive mechanism 15.

【0010】光学素材16およびプレス成形後の光学素
子を載置,搬送するキャリア17は、キャリア搬送用ア
ーム18により保持され、加熱炉2内および上型部8と
下型部9との間を搬送可能に構成されている。
The carrier 17 on which the optical material 16 and the optical element after press-molding are placed and conveyed is held by a carrier conveying arm 18, and is held in the heating furnace 2 and between the upper mold part 8 and the lower mold part 9. It is configured to be transportable.

【0011】上型19は、底部中央から成形面方向に制
御棒移動穴部25が穿設されており、制御棒移動穴部2
5の底部形状53は上型用温度制御棒26の先端形状2
6aと面接触する形状に形成されている。上型19は固
定部材21によりマウント22に保持されており、該マ
ウント22は断熱材23を介して上ベース4に固定ネジ
24で固定されている。
The upper die 19 is provided with a control rod moving hole portion 25 from the center of the bottom portion toward the molding surface, and the control rod moving hole portion 2 is formed.
The bottom shape 53 of 5 is the tip shape 2 of the upper mold temperature control rod 26.
It is formed in a shape that makes surface contact with 6a. The upper die 19 is held by a mount 22 by a fixing member 21, and the mount 22 is fixed to the upper base 4 by a fixing screw 24 via a heat insulating material 23.

【0012】上型19,マウント22,断熱材23およ
び上ベース4には同径の制御棒移動穴部25が形成さ
れ、その内部には上ジョイント28を介して上型用シリ
ンダ27に連結された上型用温度制御棒26が上下動自
在に設置されている。また、上ベース4には冷却水を循
環させる冷却水循環穴29が形成されている。
A control rod moving hole 25 having the same diameter is formed in the upper mold 19, the mount 22, the heat insulating material 23 and the upper base 4, and is connected to an upper mold cylinder 27 through an upper joint 28 inside the control rod moving hole 25. An upper mold temperature control rod 26 is installed so as to be vertically movable. A cooling water circulation hole 29 for circulating cooling water is formed in the upper base 4.

【0013】下型20も上型19と同様に、底部中央か
ら成形面方向に制御棒移動穴部30が穿設され、制御棒
移動穴部30の底部形状53は下型用温度制御棒31の
先端形状31aと面接触する形状に形成されている。ま
た、下型20は上型19と同様に、固定部材21,マウ
ント22および断熱材23を介してプレス軸10に固定
ネジ24で固定されている。プレス軸10には、上ベー
ス4と同様にマウント22および断熱材23と同径な制
御棒移動穴30が形成され、その内部には下ジョイント
32を介して下型用シリンダ33に連結された下型用温
度制御棒31が上下動自在に設置されている。
Similarly to the upper mold 19, the lower mold 20 is also provided with a control rod moving hole 30 from the center of the bottom toward the molding surface, and the bottom shape 53 of the control rod moving hole 30 has a lower mold temperature control rod 31. It is formed in a shape that comes into surface contact with the tip end shape 31a. Further, the lower mold 20 is fixed to the press shaft 10 with the fixing screw 24 via the fixing member 21, the mount 22 and the heat insulating material 23, similarly to the upper mold 19. Similar to the upper base 4, the press shaft 10 is formed with a control rod moving hole 30 having the same diameter as the mount 22 and the heat insulating material 23, and is connected to the lower die cylinder 33 via a lower joint 32 inside thereof. A lower mold temperature control rod 31 is installed so as to be vertically movable.

【0014】前記上下型用シリンダ27,33はそれぞ
れ制御バルブ34,35を介して空圧源36に接続され
ている。また、同制御バルブ34,35の制御はコント
ローラー41により行われる。上型19および下型20
は、それぞれ上型熱電対42,上型用温度制御器39お
よび上型ヒーター37と下型熱電対43,下型用温度制
御器40および下型ヒーター38とによって一定温度に
制御されている。
The upper and lower die cylinders 27 and 33 are connected to a pneumatic pressure source 36 via control valves 34 and 35, respectively. The controller 41 controls the control valves 34 and 35. Upper mold 19 and lower mold 20
Are controlled to a constant temperature by an upper mold thermocouple 42, an upper mold temperature controller 39 and an upper heater 37, and a lower mold thermocouple 43, a lower mold temperature controller 40 and a lower heater 38, respectively.

【0015】以上の構成からなる装置を用いての金型温
度冷却方法は、まず成形室6内に下ベース5のノズル7
から窒素ガス等を供給し、成形室6内部の酸素濃度を低
下させる。次に、ヒーター2a,上型ヒーター37およ
び下型ヒーター38により、加熱炉2,上型19および
下型20を所定の温度に加熱する。
In the mold temperature cooling method using the apparatus having the above structure, first, the nozzle 7 of the lower base 5 is placed in the molding chamber 6.
Nitrogen gas or the like is supplied to reduce the oxygen concentration inside the molding chamber 6. Next, the heating furnace 2, the upper die 19 and the lower die 20 are heated to a predetermined temperature by the heater 2a, the upper die heater 37 and the lower die heater 38.

【0016】この状態において、キャリヤ17内に光学
素材16を載置してキャリヤ搬送アーム18にて加熱炉
2内に搬送し、ヒーター2aにより光学素材16を成形
可能状態になるまで加熱軟化する。この時、上型19お
よび下型20の温度は、熱電対42,43によって常に
モニターされ、その情報を基に温度制御器39,40で
上下型ヒーター37,38のパワーを調整し、常に一定
温度となる様に制御されている。
In this state, the optical material 16 is placed in the carrier 17 and is carried into the heating furnace 2 by the carrier carrying arm 18, and the optical material 16 is heated and softened by the heater 2a until it becomes a moldable state. At this time, the temperatures of the upper die 19 and the lower die 20 are constantly monitored by the thermocouples 42 and 43, and the temperature controllers 39 and 40 adjust the powers of the upper and lower die heaters 37 and 38 based on the information, and are always constant. It is controlled to reach the temperature.

【0017】次に、キャリヤ搬送用アーム18を前進さ
せてキャリア17とともに光学素材16を上型19と下
型20との間に搬送する。そして、下型20をシリンダ
13によりプレス軸10を介して上昇させて押圧成形す
る。続いて、少なくとも上下どちらかの制御バルブ34
または35をコントローラ41からの指令により切り換
え、常に毎サイクル同じタイミングで上下型用温度制御
棒駆動シリンダ27,33の少なくともどちらかを動作
させ、上下型用温度制御棒26,31の当接面と上下型
19,20の内部当接面とを面接触させる。
Next, the carrier carrying arm 18 is advanced to carry the optical material 16 together with the carrier 17 between the upper mold 19 and the lower mold 20. Then, the lower mold 20 is raised by the cylinder 13 via the press shaft 10 to perform press molding. Then, at least one of the upper and lower control valves 34
Alternatively, 35 is switched in accordance with a command from the controller 41, and at least one of the upper and lower mold temperature control rod drive cylinders 27 and 33 is always operated at the same timing in each cycle so that the contact surfaces of the upper and lower mold temperature control rods 26 and 31 are changed. The inner contact surfaces of the upper and lower molds 19 and 20 are brought into surface contact.

【0018】この動作により、上下型19,20の中央
部の熱を熱伝導により奪い取ることで、従来の空冷に比
べて短時間かつバラツキ無く上下型19,20の温度を
冷却する。従って、冷却工程の時間が短くなり、成形サ
イクルの短縮化が図れるとともに、上下型用温度制御棒
駆動シリンダ27,33の動作バラツキを管理すること
で常に同一の成形品質を確保できる。
By this operation, the heat of the central portions of the upper and lower dies 19 and 20 is removed by heat conduction, so that the temperatures of the upper and lower dies 19 and 20 can be cooled in a shorter time and with less variation than the conventional air cooling. Therefore, the time of the cooling process is shortened, the molding cycle can be shortened, and the same molding quality can be always ensured by managing the operation variations of the upper and lower mold temperature control rod drive cylinders 27 and 33.

【0019】押圧成形が終了した後、下型20を下降し
て離型し、搬送用アーム18により成形された光学素子
を成形室から取り出す。この後、前工程で上下型19,
20内部に当接した上下型用温度制御棒26,31は元
の位置に戻される。すると、上下型用温度制御棒26,
31の外周面と制御棒移動穴部25,30内周面との接
触により、上下型用温度制御棒26,31の熱が奪わ
れ、上ベース4またはプレス軸10と同じ温度まで冷却
される。
After the press molding is completed, the lower mold 20 is lowered and released, and the optical element molded by the carrying arm 18 is taken out from the molding chamber. After this, the upper and lower molds 19,
The upper and lower mold temperature control rods 26 and 31 contacting the inside of 20 are returned to their original positions. Then, the temperature control rods 26 for upper and lower molds,
Due to the contact between the outer peripheral surface of 31 and the inner peripheral surfaces of the control rod moving hole portions 25 and 30, heat of the upper and lower mold temperature control rods 26 and 31 is removed, and the upper base 4 or the press shaft 10 is cooled to the same temperature. .

【0020】本実施例によれば、上下型用温度制御棒が
上下型用シリンダと連結して制御されることで、上下型
用温度制御棒の移動タイミングおよび移動スピードの制
御が容易にでき、成形プレス中の冷却制御を再現性良く
行うことができる。
According to this embodiment, since the upper and lower mold temperature control rods are connected to and controlled by the upper and lower mold cylinders, it is possible to easily control the moving timing and moving speed of the upper and lower mold temperature control rods. Cooling control during the molding press can be performed with good reproducibility.

【0021】[0021]

【実施例2】図3は本実施例で用いる装置の要部拡大断
面図である。本実施例は、前記実施例1における上型用
温度制御棒駆動機構14および下型用温度制御棒駆動機
構15が異なるもので、他の構成は同一な構成部分から
なり、同一構成部分には同一番号を付してその説明を省
略する。上型50および下型51は、前記実施例1と同
様な制御棒移動穴部25,30および底部形状53が形
成されるとともに、それぞれ空気抜け孔52が穿設され
ている。
[Embodiment 2] FIG. 3 is an enlarged sectional view of an essential part of an apparatus used in this embodiment. In this embodiment, the upper mold temperature control rod drive mechanism 14 and the lower mold temperature control rod drive mechanism 15 in the first embodiment are different, and the other components are the same. The same numbers are assigned and the description thereof is omitted. The upper mold 50 and the lower mold 51 are formed with the control rod moving hole portions 25 and 30 and the bottom shape 53 similar to those in the first embodiment, and are also provided with air vent holes 52, respectively.

【0022】上型部8には、上型50,マウント22,
断熱材23および上ベース4に同径の制御棒移動穴部2
5が形成され、かつ上ベース4には前記制御棒移動穴部
25とつながる給排口44が設置されている。また、制
御棒移動穴部25の内部には上型用温度制御棒45が上
下動自在に嵌合されている。
The upper mold part 8 includes an upper mold 50, a mount 22,
The control rod moving hole 2 having the same diameter as the heat insulating material 23 and the upper base 4.
5 is formed, and the upper base 4 is provided with a supply / discharge port 44 connected to the control rod moving hole 25. An upper mold temperature control rod 45 is vertically movably fitted inside the control rod moving hole portion 25.

【0023】下型部9にも、上型部8と同様に制御棒移
動穴部30が形成され、かつプレス軸10には前記制御
棒移動穴部30とつながる給排口44が設置されてい
る。また、制御棒移動穴部30の内部には下型用温度制
御棒46が上下動自在に嵌合されている。前記各給排口
44はそれぞれ制御バルブ48,49を介して空圧源3
6と真空源47とに接続されている。制御バルブ48お
よび49の制御はコントローラー41により行われる。
Similar to the upper mold part 8, the lower mold part 9 is also formed with a control rod moving hole part 30, and the press shaft 10 is provided with a supply / discharge port 44 connected to the control rod moving hole part 30. There is. Further, a lower mold temperature control rod 46 is vertically movably fitted inside the control rod moving hole portion 30. Each of the supply / discharge ports 44 is connected to the air pressure source 3 via the control valves 48, 49.
6 and a vacuum source 47. The controller 41 controls the control valves 48 and 49.

【0024】以上の構成から成る装置を用いての金型温
度冷却方法は、押圧工程までが前記実施例1と同様であ
り、その説明を省略する。押圧工程に続いて、少なくと
も上下どちらかの制御バルブ48または49をコントロ
ーラー41からの指令により切り換え、上下型用温度制
御棒45,46を上昇または下降させてその当接面を上
下型50,51の内部当接面に面接触させることによ
り、上下型50,51の中央部の熱を熱伝導により奪い
取り冷却するとる。
The mold temperature cooling method using the apparatus having the above structure is the same as that of the first embodiment up to the pressing step, and the description thereof will be omitted. Subsequent to the pressing step, at least one of the upper and lower control valves 48 or 49 is switched by a command from the controller 41, and the temperature control rods 45 and 46 for the upper and lower dies are raised or lowered so that the contact surfaces thereof are the upper and lower dies 50 and 51. It is assumed that the heat of the central portions of the upper and lower molds 50, 51 is taken away by heat conduction to cool the upper and lower molds 50, 51 by making surface contact with the inner contact surface of the.

【0025】押圧成形が終了した後、下型20を下降し
て離型し、搬送用アーム18により成形品を成形室から
取り出す。この後、前記の制御バルブ48または49を
真空源47に切り換えることで、温度制御棒45,46
を上下型50,51から離す。温度制御棒45,46の
外周面は制御棒移動穴部25,30の内周面と接触する
ことで熱が奪われ、前記実施例1と同様に冷却される。
After the press molding is completed, the lower mold 20 is lowered and released, and the molded product is taken out from the molding chamber by the transfer arm 18. After that, by switching the control valve 48 or 49 to the vacuum source 47, the temperature control rods 45, 46 are
Is separated from the upper and lower molds 50 and 51. The outer peripheral surfaces of the temperature control rods 45 and 46 come into contact with the inner peripheral surfaces of the control rod moving hole portions 25 and 30 to remove heat, and are cooled as in the first embodiment.

【0026】本実施例によれば、上下型用温度制御棒の
駆動を正圧および負圧を利用して行うことで、温度制御
棒の駆動機構を単純化することができる。
According to the present embodiment, the temperature control rod driving mechanism for the upper and lower molds can be simplified by driving the temperature control rod for the upper and lower molds using positive pressure and negative pressure.

【0027】[0027]

【実施例3】図4は本実施例で用いる装置の要部拡大断
面図である。本実施例は、前記実施例1における上型用
温度制御棒駆動機構14および下型用温度制御棒駆動機
構15が異なるもので、他の構成は同一な構成部分から
なり、同一構成部分には同一番号を付してその説明を省
略する。
[Embodiment 3] FIG. 4 is an enlarged sectional view of an essential part of an apparatus used in this embodiment. In this embodiment, the upper mold temperature control rod drive mechanism 14 and the lower mold temperature control rod drive mechanism 15 in the first embodiment are different, and the other components are the same. The same numbers are assigned and the description thereof is omitted.

【0028】上型部8には、空気抜け孔52を有する上
型50,マウント22,断熱材23および上ベース4に
同径の制御棒移動穴部25が形成され、該制御棒移動穴
部25には隙間無くかつ冷却水循環部55を有する上型
用温度制御棒65が摺動自在に挿入されている。また、
冷却水循環部55には冷却水給水口56と冷却水排水口
57とを通し、図示されていない冷却水循環器により一
定温度に温度制御された冷却水58が循環されている。
In the upper die portion 8, a control rod moving hole portion 25 having the same diameter is formed in the upper die 50 having the air vent hole 52, the mount 22, the heat insulating material 23 and the upper base 4, and the control rod moving hole portion is formed. An upper mold temperature control rod 65 having a cooling water circulating portion 55 is slidably inserted into the space 25. Also,
The cooling water circulation unit 55 has a cooling water supply port 56 and a cooling water drain port 57, and circulates cooling water 58 whose temperature is controlled to a constant temperature by a cooling water circulator (not shown).

【0029】上型用温度制御棒65の端部は、ガイド6
1,ボールネジ62,ベルト63およびサーボモータ6
4により駆動する保持部60で保持されている。前記サ
ーボモータ64はコントローラー41により制御されて
いる。下型部9も前述した上型部8と同様な構成であ
り、同一番号を付してその説明を省略する。
The end portion of the upper mold temperature control rod 65 has a guide 6
1, ball screw 62, belt 63 and servo motor 6
It is held by a holding unit 60 which is driven by 4. The servo motor 64 is controlled by the controller 41. The lower mold part 9 also has the same structure as the upper mold part 8 described above, and the same reference numerals are given and the description thereof is omitted.

【0030】以上の構成から成る装置を用いての金型温
度冷却方法は、押圧工程までが前記実施例1と同様であ
り、その説明を省略する。押圧工程に続いて、少なくと
も上下どちらかのサーボモーター64をコントローラー
41からの指令により回動させ、ベルト63を介してボ
ールネジ62を内蔵する保持部60を上下動させる。こ
の動作により上下型用温度制御棒65,66は制御棒移
動穴部25,30内を面接触しながら型成型面方向に摺
動する。
The mold temperature cooling method using the apparatus having the above-mentioned structure is the same as that of the first embodiment up to the pressing step, and the description thereof will be omitted. Subsequent to the pressing step, at least one of the upper and lower servo motors 64 is rotated by a command from the controller 41, and the holding unit 60 containing the ball screw 62 is moved up and down via the belt 63. By this operation, the temperature control rods 65 and 66 for the upper and lower dies slide in the direction of the die molding surface while making surface contact with the inside of the control rod moving holes 25 and 30.

【0031】この際、上下型用温度制御棒65,66は
熱電対42,43で測定される型温度により、挿入速度
や挿入位置をコントローラー41によって制御されなが
ら移動する。挿入速度を早くするか、または挿入位置を
深くすることにより冷却速度を早めることができる。ま
た、上下型用温度制御棒65,66の内部の冷却水循環
部55には温度制御された冷却水58が循環し、一定温
度に冷却されている。
At this time, the upper and lower mold temperature control rods 65 and 66 move while the insertion speed and the insertion position are controlled by the controller 41 according to the mold temperatures measured by the thermocouples 42 and 43. The cooling speed can be increased by increasing the insertion speed or deepening the insertion position. Further, the temperature-controlled cooling water 58 circulates in the cooling water circulation portion 55 inside the upper and lower mold temperature control rods 65 and 66, and is cooled to a constant temperature.

【0032】押圧成形が終了した後、下型20を下降し
て離型し、搬送用アーム18により成形品を成形室から
取り出す。この後、前記のサーボモーター64を逆転さ
せ、上下型用温度制御棒65,66を型から離す。
After the press molding is completed, the lower mold 20 is lowered and released, and the molded product is taken out of the molding chamber by the transfer arm 18. After that, the servo motor 64 is rotated in the reverse direction, and the upper and lower mold temperature control rods 65 and 66 are separated from the mold.

【0033】本実施例によれば、上下型用温度制御棒の
移動速度および位置をサーボモーターによりデジタル的
に制御することで、冷却速度およびタイミングを前記各
実施例以上に正確に管理することができる。
According to this embodiment, the cooling speed and timing can be controlled more accurately than in the above embodiments by digitally controlling the moving speed and position of the upper and lower temperature control rods by the servomotor. it can.

【0034】[0034]

【発明の効果】以上説明した様に、本発明に係る光学素
子成形装置の金型温度冷却方法とその装置によれば、金
型よりも温度が低く、気体よりも熱伝導の良い温度制御
棒を金型に面接触させることにより金型の熱を奪い取る
事で、金型温度の冷却制御の応答性,再現性および効率
を大幅に改善することができ、成形サイクルタイムの短
縮および成形品質の管理が容易となる。
As described above, according to the mold temperature cooling method for the optical element molding apparatus and the apparatus therefor according to the present invention, the temperature control rod is lower in temperature than the mold and has better heat conduction than gas. By taking the heat of the mold by bringing the mold into surface contact with the mold, the response, reproducibility and efficiency of mold temperature cooling control can be greatly improved, shortening the molding cycle time and improving the molding quality. Easy to manage.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1を示す縦断面図である。FIG. 1 is a vertical sectional view showing a first embodiment.

【図2】実施例1を示す要部拡大断面図である。FIG. 2 is an enlarged cross-sectional view of a main part showing the first embodiment.

【図3】実施例2を示す要部拡大断面図である。FIG. 3 is an enlarged sectional view of an essential part showing a second embodiment.

【図4】実施例3を示す要部拡大断面図である。FIG. 4 is an enlarged sectional view of an essential part showing a third embodiment.

【符号の説明】[Explanation of symbols]

1 成形部 2 加熱炉 6 成形室 8 上型部 9 下型部 10 プレス軸 11 ハウジング 13 駆動用シリンダ 14 上型用温度制御棒駆動機構 15 下型用温度制御棒駆動機構 16 光学素材 17 キャリア 18 キャリア搬送用アーム 19 上型 20 下型 1 Molding Part 2 Heating Furnace 6 Molding Room 8 Upper Mold Part 9 Lower Mold Part 10 Press Shaft 11 Housing 13 Driving Cylinder 14 Upper Mold Temperature Control Rod Driving Mechanism 15 Lower Mold Temperature Control Rod Driving Mechanism 16 Optical Material 17 Carrier 18 Carrier transfer arm 19 Upper model 20 Lower model

【手続補正書】[Procedure amendment]

【提出日】平成6年5月26日[Submission date] May 26, 1994

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】発明の名称[Name of item to be amended] Title of invention

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【発明の名称】 光学素子成装置の金型温度
冷却方法とその装置
Mold temperature cooling method of the optical element forming the form system [Title of the Invention] The apparatus

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 加熱軟化させたガラス素材を成形室内に
配置した金型により押圧して光学素子を成形する装置に
おいて、少なくとも一方の金型に、該金型よりも温度の
低い温度制御部材を面接触させて金型を冷却することを
特徴とする光学素子成形装置の金型温度冷却方法。
1. An apparatus for molding an optical element by pressing a heat-softened glass material with a mold disposed in a molding chamber, wherein at least one mold is provided with a temperature control member having a temperature lower than that of the mold. A mold temperature cooling method for an optical element molding apparatus, which comprises contacting the surfaces to cool the mold.
【請求項2】 底部中央から成形面方向に穴部が穿設さ
れた金型と、前記穴部と面接触する面形状を有して摺動
自在に嵌合された温度制御部材と、該温度制御部材を移
動させる駆動機構とを具備したことを特徴とする光学素
子成形装置の金型温度冷却装置。
2. A mold having a hole formed in the molding surface direction from the center of the bottom, a temperature control member having a surface shape in surface contact with the hole and slidably fitted therein, A mold temperature cooling device for an optical element molding device, comprising a drive mechanism for moving a temperature control member.
JP22794593A 1993-08-20 1993-08-20 Cooling of mold of molding machine for optics and device therefor Withdrawn JPH0761826A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22794593A JPH0761826A (en) 1993-08-20 1993-08-20 Cooling of mold of molding machine for optics and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22794593A JPH0761826A (en) 1993-08-20 1993-08-20 Cooling of mold of molding machine for optics and device therefor

Publications (1)

Publication Number Publication Date
JPH0761826A true JPH0761826A (en) 1995-03-07

Family

ID=16868744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22794593A Withdrawn JPH0761826A (en) 1993-08-20 1993-08-20 Cooling of mold of molding machine for optics and device therefor

Country Status (1)

Country Link
JP (1) JPH0761826A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006240943A (en) * 2005-03-04 2006-09-14 Olympus Corp Apparatus and method for hot press molding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006240943A (en) * 2005-03-04 2006-09-14 Olympus Corp Apparatus and method for hot press molding

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