JPH07335657A - Silicon wafer and its thermal treatment method - Google Patents
Silicon wafer and its thermal treatment methodInfo
- Publication number
- JPH07335657A JPH07335657A JP14563094A JP14563094A JPH07335657A JP H07335657 A JPH07335657 A JP H07335657A JP 14563094 A JP14563094 A JP 14563094A JP 14563094 A JP14563094 A JP 14563094A JP H07335657 A JPH07335657 A JP H07335657A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- silicon wafer
- oxygen
- thermal treatment
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 46
- 239000010703 silicon Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000007669 thermal treatment Methods 0.000 title abstract 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000001301 oxygen Substances 0.000 claims abstract description 53
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 53
- 239000012298 atmosphere Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims description 43
- 239000007789 gas Substances 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 abstract description 20
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 18
- 230000007423 decrease Effects 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000012299 nitrogen atmosphere Substances 0.000 abstract 1
- 230000000644 propagated effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 68
- 239000002344 surface layer Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000005247 gettering Methods 0.000 description 5
- 238000007373 indentation Methods 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、シリコンウェーハの熱
処理方法およびシリコンウェーハに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silicon wafer heat treatment method and a silicon wafer.
【０００２】[0002]
【従来の技術】チョクラルスキー法（以下ＣＺ法とい
う）によって引き上げられたシリコン単結晶を加工して
得られたウェーハに適当な熱処理、たとえば窒素ガス雰
囲気中で１０５０°Ｃ、数十時間の熱処理を施すことに
よってウェーハの表面近傍に低酸素濃度の無欠陥領域が
形成される。イントリンシックゲッタリングは、前記シ
リコンウェーハの内部に分布している高密度の微小欠陥
を利用して、前記ウェーハの表面に付着し内方に拡散し
た重金属不純物などのゲッタリングを行うものである
が、たとえば特開昭６２−４３２７などでは、前記イン
トリンシックゲッタリングよりも更にＯＳＦ密度の低
減、酸化膜耐圧の改善など品質向上を目的とした半導体
ウェーハの熱処理方法が開示されている。この熱処理方
法は、水素などの還元性ガスを含む不活性ガス雰囲気内
でシリコンウェーハに熱処理を施すことにより、ウェー
ハの表面近傍の酸素濃度を更に低下させるとともに、酸
素析出物の低濃度化を図るものである。2. Description of the Related Art A wafer obtained by processing a silicon single crystal pulled by the Czochralski method (hereinafter referred to as the CZ method) is appropriately heat-treated, for example, heat treatment at 1050 ° C. for several tens of hours in a nitrogen gas atmosphere. By this, a defect-free region having a low oxygen concentration is formed near the surface of the wafer. Intrinsic gettering utilizes high-density minute defects distributed inside the silicon wafer to perform gettering of heavy metal impurities or the like that adhere to the surface of the wafer and diffuse inward. For example, Japanese Patent Application Laid-Open No. 62-4327 discloses a heat treatment method for a semiconductor wafer for the purpose of quality improvement such as further reduction of OSF density and improvement of oxide film withstand voltage than the intrinsic gettering. This heat treatment method further reduces the oxygen concentration near the surface of the wafer by subjecting the silicon wafer to heat treatment in an inert gas atmosphere containing a reducing gas such as hydrogen, and also aims to reduce the concentration of oxygen precipitates. It is a thing.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記ウ
ェーハは表面近傍における酸素濃度が低いので、素子形
成領域の機械的強度も低くなっている。従って、デバイ
ス工程においてこのようなウェーハが局所応力や熱応力
を受け、ウェーハの表面近傍に転位が発生した場合、前
記転位を不動態化する不純物酸素が低濃度であるため、
転位の自己増殖、移動によるリーク電流増大などのデバ
イス不良が発生する。その結果、デバイスの歩留りが低
下する。However, since the above wafer has a low oxygen concentration in the vicinity of the surface, the mechanical strength of the element formation region is also low. Therefore, when such a wafer is subjected to local stress or thermal stress in the device process and dislocations occur near the surface of the wafer, the concentration of impurity oxygen that passivates the dislocations is low,
Device defects such as self-propagation of dislocations and increase of leak current due to movement occur. As a result, the device yield is reduced.
【０００４】本発明は上記従来の問題点に着目してなさ
れたもので、シリコンウェーハの表面近傍で酸素濃度が
低く、その結果、素子形成領域の機械的強度が低いもの
について、その強度を向上させることができるようなシ
リコンウェーハの熱処理方法およびシリコンウェーハを
提供することを目的としている。The present invention has been made by paying attention to the above-mentioned conventional problems. The oxygen concentration near the surface of a silicon wafer is low, and as a result, the mechanical strength of the element formation region is low, the strength is improved. It is an object of the present invention to provide a silicon wafer heat treatment method and a silicon wafer that can be processed.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明に係るシリコンウェーハの熱処理方法は、表
面近傍の酸素濃度が１０18ａｔｏｍｓ／ｃｍ3 以下のシ
リコンウェーハを、酸素を含むガス雰囲気中において１
０００°Ｃ以上の温度で加熱することにより、前記シリ
コンウェーハの極表面近傍に酸素を導入することを特徴
としている。また、本発明に係るシリコンウェーハは、
表面近傍の酸素濃度が内部の酸素濃度より低く、極表面
近傍における酸素濃度が前記表面近傍の酸素濃度より高
くなっていることを特徴としている。In order to achieve the above object, the method for heat treating a silicon wafer according to the present invention is a method for treating a silicon wafer having an oxygen concentration near the surface of 10 18 atoms / cm 3 or less in a gas atmosphere containing oxygen. 1 in
It is characterized in that oxygen is introduced into the vicinity of the extreme surface of the silicon wafer by heating at a temperature of 000 ° C. or higher. Further, the silicon wafer according to the present invention,
The oxygen concentration near the surface is lower than the oxygen concentration inside, and the oxygen concentration near the pole surface is higher than the oxygen concentration near the surface.
【０００６】[0006]
【作用】上記構成によれば、表面近傍の酸素濃度が１０
18ａｔｏｍｓ／ｃｍ3 以下のシリコンウェーハに対し
て、酸素を含むガス雰囲気中で熱処理を施すことにした
ので、前記ウェーハの極表面近傍に酸素が導入される。
従来、水素などの還元性ガスを含む不活性ガス雰囲気中
でシリコンウェーハに熱処理を施すことにより、前記ウ
ェーハの表面近傍の酸素濃度が低下し、これに伴って機
械的強度が低下した場合であっても、本発明の熱処理を
追加することにより素子形成領域の機械的強度を向上さ
せることができる。According to the above construction, the oxygen concentration near the surface is 10
Since it was decided to perform the heat treatment on a silicon wafer of 18 atoms / cm 3 or less in a gas atmosphere containing oxygen, oxygen is introduced near the extreme surface of the wafer.
Conventionally, when a silicon wafer is heat-treated in an inert gas atmosphere containing a reducing gas such as hydrogen, the oxygen concentration in the vicinity of the surface of the wafer is reduced, and the mechanical strength is reduced accordingly. However, the mechanical strength of the element formation region can be improved by adding the heat treatment of the present invention.
【０００７】本発明による熱処理を施したシリコンウェ
ーハは、極表面近傍における酸素濃度が表面近傍より高
くなっているため、水素などの還元性ガスを含む不活性
ガス雰囲気中で熱処理を施した直後のシリコンウェーハ
よりも極表面層の機械的強度が高い。従って、ウェーハ
が局所応力や熱応力を受けた場合でも転位の広がりが小
さく、デバイス工程におけるリーク電流増大などの不良
発生を低減させることができる。Since the oxygen concentration in the vicinity of the extreme surface of the silicon wafer subjected to the heat treatment according to the present invention is higher than that in the vicinity of the surface, the silicon wafer immediately after the heat treatment in an inert gas atmosphere containing a reducing gas such as hydrogen is The mechanical strength of the extreme surface layer is higher than that of a silicon wafer. Therefore, even when the wafer receives local stress or thermal stress, the dislocation spread is small, and it is possible to reduce the occurrence of defects such as an increase in leak current in the device process.
【０００８】[0008]
【実施例】以下に本発明に係るシリコンウェーハの熱処
理方法の実施例について、図面を参照して説明する。イ
ントリンシックゲッタリングにおいて、シリコンウェー
ハの表面からの酸素の外方拡散を更に促進させるため
に、水素を含む不活性ガス雰囲気内で熱処理を施すが、
本発明は前記熱処理後に更に図１に示す熱処理を加える
ものである。Embodiments of the method for heat treating a silicon wafer according to the present invention will be described below with reference to the drawings. In intrinsic gettering, a heat treatment is performed in an inert gas atmosphere containing hydrogen to further promote outward diffusion of oxygen from the surface of the silicon wafer.
The present invention adds the heat treatment shown in FIG. 1 after the heat treatment.
【０００９】ＣＺ法によって引き上げられたシリコン単
結晶をスライス、研磨加工してなるシリコンウェーハ
に、水素などの還元性ガスを含む不活性ガス雰囲気内で
熱処理を施すことにより、前記ウェーハの表面近傍の酸
素濃度は１０18ａｔｏｍｓ／ｃｍ3 以下に低下する。こ
のような水素熱処理を施されたシリコンウェーハに、図
１に示すように２０％の酸素を含む窒素ガス雰囲気内
で、１１００°Ｃの温度で２時間の熱処理を加え、シリ
コンウェーハの極表面近傍に酸素を導入し、機械的強度
の改善を図る。By subjecting a silicon wafer obtained by slicing and polishing a silicon single crystal pulled by the CZ method to a heat treatment in an inert gas atmosphere containing a reducing gas such as hydrogen, a wafer near the surface of the wafer can be obtained. The oxygen concentration drops to 10 18 atoms / cm 3 or less. As shown in FIG. 1, a silicon wafer that has been subjected to such a hydrogen heat treatment is subjected to a heat treatment at a temperature of 1100 ° C. for 2 hours in a nitrogen gas atmosphere containing 20% oxygen, and the vicinity of the extreme surface of the silicon wafer. Introduce oxygen to improve mechanical strength.
【００１０】図２および図３は、シリコンウェーハの表
面から厚さ方向における酸素濃度の変化について、２次
イオン質量分析によって求めた結果を示す図である。前
記ウェーハの表面層の深さは約２０μｍ、極表面層は表
面から３〜４μｍの部分である。シリコンウェーハを水
素熱処理した後、本発明による熱処理を施した場合は、
極表面層に酸素が導入されるため、図２に示すように表
面の酸素濃度が高くなる。ただし、表面の酸素濃度は内
部の酸素濃度より低い。表面から深さ３〜４μｍにかけ
て酸素濃度は次第に低下し、この点を過ぎると、すなわ
ち極表面層から表面層に入ると酸素濃度は再び上昇して
内部の酸素濃度に到達する。これに対して前記水素熱処
理の直後におけるシリコンウェーハの酸素濃度は、図３
に示すように表面層の部分で次第に低下し、表面で最も
低くなっている。FIG. 2 and FIG. 3 are diagrams showing the results of the change in oxygen concentration in the thickness direction from the surface of the silicon wafer, obtained by secondary ion mass spectrometry. The depth of the surface layer of the wafer is about 20 μm, and the extreme surface layer is a portion 3 to 4 μm from the surface. When the silicon wafer is subjected to hydrogen heat treatment and then subjected to the heat treatment according to the present invention,
Since oxygen is introduced into the extreme surface layer, the oxygen concentration on the surface becomes high as shown in FIG. However, the oxygen concentration on the surface is lower than the oxygen concentration on the inside. The oxygen concentration gradually decreases from the surface to a depth of 3 to 4 μm, and beyond this point, that is, when entering from the extreme surface layer to the surface layer, the oxygen concentration rises again and reaches the internal oxygen concentration. On the other hand, the oxygen concentration of the silicon wafer immediately after the hydrogen heat treatment is shown in FIG.
As shown in, the surface layer gradually lowers and becomes the lowest on the surface.
【００１１】本発明の熱処理を施したシリコンウェーハ
の品質について、Ｓ．Ｍ．Ｈｎ，Ｊ．Ａｐｐｌ．Ｐｈｙ
ｓ．４６，１８６９（１９７５）などに示されているイ
ンデンテーション法を用いて評価した。すなわち図４に
示すように、マイクロビッカースかたさ試験機の圧子１
に荷重１０ｇｆを加えて熱処理済みのシリコンウェーハ
２に圧痕をつけ、転位を発生させた上、窒素ガス雰囲気
内で９００°Ｃで１時間熱処理を加え、転位を増殖させ
た。その後エッチング液に浸漬し、ライトエッチを施し
た後、転位の広がり（ｒｏｓｅｔｔｅ ｅｘｔｅｎｔ）
を測定した。図５は＜１００＞方向に成長したＣＺ法に
よるシリコンウェーハにおける転位の広がりを模式的に
示す説明図である。図中の点線は転位を示し、転位は圧
痕３を中心として四方に広がっている。転位の広がりの
数値は（Ｈ1 ＋Ｈ2 ）／２で算出され、結晶の相対的な
機械的強度を表す。この評価方法で水素熱処理前のＣＺ
ウェーハ、水素熱処理を施したＣＺウェーハ、本発明に
よる熱処理後のＣＺウェーハの３種類について転位の長
さを測定し、転位の広がりを算出したところ、下記の結
果が得られた。 （１）水素熱処理前のＣＺウェーハ ： １０．６μｍ （２）水素熱処理を施したＣＺウェーハ ：１２４．８μｍ （３）本発明による熱処理後のＣＺウェーハ： １２．３μｍ 本発明による熱処理を施した場合、転位の広がりは水素
熱処理を施したＣＺウェーハの約１／１０となり、水素
熱処理前のＣＺウェーハの数値に近づく。これらの数値
から本発明によって機械的強度が改善されていることが
分かる。Regarding the quality of the silicon wafer subjected to the heat treatment of the present invention, S. M. Hn, J. Appl. Phy
s. 46,1869 (1975) and the like. That is, as shown in FIG. 4, indenter 1 of the micro Vickers hardness tester
Was applied with a load of 10 gf to make indentations on the heat-treated silicon wafer 2 to generate dislocations, and then heat treatment was performed at 900 ° C. for 1 hour in a nitrogen gas atmosphere to propagate the dislocations. After that, the substrate is dipped in an etching solution and subjected to light etching, and then dislocation spread (rosette extent)
Was measured. FIG. 5 is an explanatory view schematically showing the dislocation spread in a silicon wafer grown in the <100> direction by the CZ method. The dotted line in the figure indicates a dislocation, and the dislocation spreads in all directions centering on the indentation 3. The number of dislocation broadenings is calculated as (H 1 + H 2 ) / 2 and represents the relative mechanical strength of the crystal. CZ before hydrogen heat treatment by this evaluation method
The following results were obtained when the dislocation length was measured and the dislocation spread was calculated for three types of wafers, a CZ wafer subjected to hydrogen heat treatment and a CZ wafer after heat treatment according to the present invention. (1) CZ wafer before hydrogen heat treatment: 10.6 μm (2) CZ wafer after hydrogen heat treatment: 124.8 μm (3) CZ wafer after heat treatment according to the present invention: 12.3 μm When heat treatment according to the present invention is performed The spread of dislocations is about 1/10 of that of the CZ wafer that has been subjected to the hydrogen heat treatment, which is close to the value of the CZ wafer before the hydrogen heat treatment. From these numerical values, it can be seen that the present invention improves the mechanical strength.
【００１２】何らかの原因で転位がウェーハに導入され
たとき、酸素は不純物として働き、転位を不動態化する
ので、シリコンウェーハの結晶の機械的強度に寄与す
る。従って、極表面層の酸素濃度が著しく低いシリコン
ウェーハに対して本発明による熱処理を加えると、表面
近傍の酸素濃度が増し、特にウェーハの中で重要なＩＣ
製作領域の機械的強度を改善することができる。When dislocations are introduced into the wafer for some reason, oxygen acts as an impurity and passivates the dislocations, thus contributing to the mechanical strength of the crystal of the silicon wafer. Therefore, when the heat treatment according to the present invention is applied to a silicon wafer having an extremely low oxygen concentration in the extreme surface layer, the oxygen concentration in the vicinity of the surface is increased, and particularly in an important IC in the wafer.
The mechanical strength of the fabrication area can be improved.
【００１３】本発明の熱処理方法は、水素熱処理を施し
たＣＺウェーハの他、イントリンシックゲッタリングの
熱処理温度が高い、または熱処理時間が長いなどの理由
でウェーハ表面近傍の酸素濃度が極端に低い場合のイン
トリンシックゲッタリング済みウェーハや、ＦＺウェー
ハに対して適用することができる。The heat treatment method of the present invention is applied to the case where the oxygen concentration near the wafer surface is extremely low due to a high heat treatment temperature of intrinsic gettering or a long heat treatment time in addition to the CZ wafer subjected to the hydrogen heat treatment. The present invention can be applied to the intrinsic gettered wafers and the FZ wafers.
【００１４】[0014]
【発明の効果】以上説明したように本発明は、水素など
の還元性ガス雰囲気中での熱処理により、ウェーハ表面
近傍の酸素濃度が低く、その結果、素子形成領域の機械
的強度が低下したＣＺウェーハあるいはＦＺウェーハに
対して、酸素を含むガス雰囲気中で熱処理を施し、前記
ウェーハの極表面近傍に酸素を導入するものである。極
表面層の酸素濃度が低すぎると局所応力や熱応力による
転位の広がりが大きくなり、従来はデバイス工程におい
てリーク電流増大などの不良が発生していたが、本発明
の熱処理を追加することにより前記問題を解決すること
ができ、歩留りが向上する。また、本発明による熱処理
を施したシリコンウェーハは、前記水素ガス雰囲気中で
熱処理を施した従来のシリコンウェーハよりも極表面層
の機械的強度が高いため、応力による転位の広がりが小
さい。As described above, according to the present invention, the oxygen concentration in the vicinity of the wafer surface is low due to the heat treatment in a reducing gas atmosphere such as hydrogen, and as a result, the mechanical strength of the element formation region is lowered. The wafer or FZ wafer is subjected to heat treatment in a gas atmosphere containing oxygen to introduce oxygen into the vicinity of the extreme surface of the wafer. When the oxygen concentration of the extreme surface layer is too low, the dislocation spread due to local stress and thermal stress becomes large, and conventionally, defects such as increase in leak current occurred in the device process, but by adding the heat treatment of the present invention, The above problems can be solved, and the yield is improved. Further, since the silicon wafer that has been subjected to the heat treatment according to the present invention has a higher mechanical strength of the extreme surface layer than the conventional silicon wafer that has been subjected to the heat treatment in the hydrogen gas atmosphere, the dislocation spread due to stress is small.
【図１】本発明による熱処理のプロファイルを示す図で
ある。FIG. 1 is a diagram showing a profile of heat treatment according to the present invention.
【図２】本発明による熱処理を施したシリコンウェーハ
について、厚さ方向の酸素濃度の変化を示す図である。FIG. 2 is a diagram showing changes in oxygen concentration in the thickness direction of a silicon wafer that has been heat-treated according to the present invention.
【図３】水素ガス雰囲気中での熱処理を施した従来のシ
リコンウェーハについて、厚さ方向の酸素濃度の変化を
示す図である。FIG. 3 is a diagram showing changes in oxygen concentration in the thickness direction of a conventional silicon wafer that has been heat-treated in a hydrogen gas atmosphere.
【図４】インデンテーション法の説明図で、本発明によ
る熱処理を施したシリコンウェーハに圧痕をつける工程
を示す。FIG. 4 is an explanatory diagram of an indentation method and shows a step of making an indent on a silicon wafer that has been heat-treated according to the present invention.
【図５】圧痕をつけたシリコンウェーハにおける転位の
広がりを模式的に示す説明図である。FIG. 5 is an explanatory view schematically showing the dislocation spread in a silicon wafer having an indentation.
１ 圧子 ２ シリコンウェーハ ３ 圧痕 1 indenter 2 silicon wafer 3 indentation
Claims (2)
／ｃｍ3 以下のシリコンウェーハを、酸素を含むガス雰
囲気中において１０００°Ｃ以上の温度で加熱すること
により、前記シリコンウェーハの極表面近傍に酸素を導
入することを特徴とするシリコンウェーハの熱処理方
法。1. The oxygen concentration near the surface is 10 18 atoms.
/ Cm 3 or less of the silicon wafer is heated at a temperature of 1000 ° C. or more in a gas atmosphere containing oxygen, oxygen is introduced into the vicinity of the extreme surface of the silicon wafer, the heat treatment method of the silicon wafer .
り低く、極表面近傍における酸素濃度が前記表面近傍の
酸素濃度より高くなっていることを特徴とするシリコン
ウェーハ。2. A silicon wafer, wherein the oxygen concentration near the surface is lower than the oxygen concentration inside, and the oxygen concentration near the extreme surface is higher than the oxygen concentration near the surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14563094A JP3458342B2 (en) | 1994-06-03 | 1994-06-03 | Silicon wafer manufacturing method and silicon wafer |
| TW084112414A TW363226B (en) | 1994-06-03 | 1995-11-22 | Heat treatment method for silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14563094A JP3458342B2 (en) | 1994-06-03 | 1994-06-03 | Silicon wafer manufacturing method and silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07335657A true JPH07335657A (en) | 1995-12-22 |
| JP3458342B2 JP3458342B2 (en) | 2003-10-20 |
Family
ID=15389455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14563094A Expired - Lifetime JP3458342B2 (en) | 1994-06-03 | 1994-06-03 | Silicon wafer manufacturing method and silicon wafer |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3458342B2 (en) |
| TW (1) | TW363226B (en) |
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1994
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-
1995
- 1995-11-22 TW TW084112414A patent/TW363226B/en not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| JP3458342B2 (en) | 2003-10-20 |
| TW363226B (en) | 1999-07-01 |
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