JPH07330928A - Prepreg, laminate, and multilayered printed circuit board - Google Patents
Prepreg, laminate, and multilayered printed circuit boardInfo
- Publication number
- JPH07330928A JPH07330928A JP12278994A JP12278994A JPH07330928A JP H07330928 A JPH07330928 A JP H07330928A JP 12278994 A JP12278994 A JP 12278994A JP 12278994 A JP12278994 A JP 12278994A JP H07330928 A JPH07330928 A JP H07330928A
- Authority
- JP
- Japan
- Prior art keywords
- glass cloth
- prepreg
- glass
- yarn
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ガラスクロスを基材と
するプリプレグ及び、このプリプレグを用いた積層板、
プリント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg containing glass cloth as a base material, and a laminated board using the prepreg,
The present invention relates to a printed wiring board.
【０００２】[0002]
【従来の技術】近年、プリント配線板は電子機器の高機
能化、軽薄短小化に伴い、多層化、絶縁層の薄型化、高
密度化が急速に進んでいる。このため、プリント配線板
を構成する材料は吸湿耐熱性や高寸法安定性、長期絶縁
信頼性等の品質向上が強く要求されている。2. Description of the Related Art In recent years, printed wiring boards have rapidly become more and more multilayered, thinner insulating layers and higher in density as electronic devices have become more functional, lighter, thinner and smaller. For this reason, the materials constituting the printed wiring board are strongly required to have improved quality such as moisture absorption heat resistance, high dimensional stability and long-term insulation reliability.
【０００３】上記のようなプリント配線板を構成するプ
リプレグとしては、ガラスクロスに熱硬化性樹脂のワニ
スを含浸・乾燥して調製したものが一般に使用されてい
る。そしてプリプレグを複数枚重ねると共に必要に応じ
て金属箔を重ね、これを加熱加圧成形することによって
積層板を作成することができる。またこの積層板の金属
箔をプリント加工等して回路形成することによってプリ
ント配線板に仕上げることができる。さらに、プリント
配線板を内層回路板として、この表面にプリプレグを重
ねると共にさらにその外側に金属箔を重ね、これを加熱
加圧成形することによって多層板を作成することがで
き、この多層板の表面の金属箔をプリント加工等して回
路形成することによって多層プリント配線板に仕上げる
ことができる。As the prepreg constituting the above-mentioned printed wiring board, one prepared by impregnating glass cloth with a varnish of thermosetting resin and drying it is generally used. Then, by laminating a plurality of prepregs, laminating metal foils as required, and heating and pressurizing the metal foils, a laminated plate can be prepared. Further, a printed wiring board can be finished by forming a circuit by subjecting the metal foil of this laminated board to a printing process or the like. Further, a printed wiring board is used as an inner layer circuit board, a prepreg is stacked on this surface, and a metal foil is further stacked on the outer side thereof, and a multilayer board can be prepared by heat-press molding the surface of the multilayer board. A multilayer printed wiring board can be finished by forming a circuit by subjecting the metal foil of (1) to a printing process or the like.
【０００４】図３（ａ）に多層プリント配線板Ａの断面
を示す。図において１は表面に内層回路２を設けた内層
回路板であり、その表面にガラスクロスヤーン３によっ
て構成されるガラスクロス４が熱硬化性樹脂５の層を介
して積層されている。そしてこの多層プリント配線板Ａ
に熱衝撃が作用すると、ガラスクロス４と熱硬化性樹脂
５の層との間の界面に沿って熱応力がｘ矢印の向きに発
生する。この応力は多層プリント配線板Ａの厚み方向
（ｙ矢印）と平面方向（ｚ矢印）のベクトルに分力され
るが、ガラスクロス４の縦糸や横糸を構成するガラスク
ロスヤーン３のガラスクロス４の厚み方向での屈曲（波
形）の曲率が大きい程、弾性率の高いガラスクロス４の
厚み方向（ｙ矢印）への分力が大きくなり、ガラスクロ
ス４と熱硬化性樹脂５の層との間で剥離が発生し易くな
る。FIG. 3A shows a cross section of the multilayer printed wiring board A. In the figure, reference numeral 1 denotes an inner layer circuit board having an inner layer circuit 2 provided on the surface thereof, on which a glass cloth 4 constituted by a glass cloth yarn 3 is laminated via a layer of a thermosetting resin 5. And this multilayer printed wiring board A
When a thermal shock is applied to, thermal stress is generated in the direction of the arrow x along the interface between the glass cloth 4 and the layer of the thermosetting resin 5. Although this stress is divided into a vector in the thickness direction (y arrow) and a plane direction (z arrow) of the multilayer printed wiring board A, the stress of the glass cloth 4 of the glass cloth yarn 3 constituting the warp threads and the weft threads of the glass cloth 4 is increased. The greater the curvature of the bending (waveform) in the thickness direction, the greater the component force of the glass cloth 4 having a high elastic modulus in the thickness direction (y arrow), and the gap between the glass cloth 4 and the thermosetting resin 5 layer. Therefore, peeling easily occurs.
【０００５】このことは積層板Ｂにおいても同じであ
る。すなわち図４（ａ）に積層板Ｂの断面を示す。積層
板Ｂはガラスクロスヤーン３によって構成されるガラス
クロス４を熱硬化性樹脂５の層を介して積層することに
よって形成されており、この積層板Ｂに熱衝撃が作用す
ると、ガラスクロス４と熱硬化性樹脂５の層との間の界
面に沿って熱応力がｘ矢印の向きに発生し、この応力は
積層板Ｂの厚み方向（ｙ矢印）と平面方向（ｚ矢印）の
ベクトルに分力されるが、ガラスクロス４の縦糸や横糸
を構成するガラスクロスヤーン３のガラスクロス４の厚
み方向での屈曲（波形）の曲率が大きい程、弾性率の高
いガラスクロス４の厚み方向（ｙ矢印）への分力が大き
くなり、ガラスクロス４と熱硬化性樹脂５の層との間で
剥離が発生し易くなる。The same applies to the laminated plate B. That is, FIG. 4A shows a cross section of the laminated plate B. The laminated board B is formed by laminating a glass cloth 4 composed of the glass cloth yarn 3 with a layer of thermosetting resin 5 interposed therebetween. Thermal stress is generated in the direction of the arrow x along the interface with the layer of the thermosetting resin 5, and this stress is divided into vectors in the thickness direction (y arrow) and plane direction (z arrow) of the laminated plate B. However, the larger the curvature of the bending (waveform) of the glass cloth yarns 3 constituting the warp threads and the weft threads of the glass cloth 4 in the thickness direction of the glass cloth 4 is, the higher the elastic modulus of the glass cloth 4 in the thickness direction (y The component force to the arrow) becomes large, and peeling easily occurs between the glass cloth 4 and the layer of the thermosetting resin 5.
【０００６】また図３（ｂ）は多層プリント配線板Ａの
ガラスクロス４の断面とガラス成分の疎密の分布を示す
ものであり、ガラスクロス４のガラスクロスヤーン３で
構成される縦糸６と横糸７の交点でガラス成分は密にな
って熱硬化性樹脂５の成分はプアーになり、縦糸６と横
糸７の交点の間でガラス成分は疎になって熱硬化性樹脂
５の成分はリッチになる。そして所定面積当たりの縦糸
６と横糸７の交点の数が多くなる程、縦糸６と横糸７の
交点の間隔が小さくなって、ガラス成分の疎と密の間隔
が小さくなり、ガラス成分の疎と密の変化のピッチが小
さくなる。また縦糸６や横糸７を構成するガラスクロス
ヤーン３の断面形状は一般的に楕円形になっているが、
短径ａと長径ｂの差が小さい楕円形断面であると、ガラ
ス成分の疎と密の差が大きくなる。樹脂とガラスの熱膨
張係数は樹脂のほうが大きいため、ガラス成分の疎と密
の差が大きいと、またガラス成分の疎と密の変化のピッ
チが小さいと、熱衝撃が多層プリント配線板Ａに作用し
たときに、樹脂とガラスの熱膨張係数の差によってガラ
スクロス４と熱硬化性樹脂５の層との間で発生する歪み
応力が大きくなり、ガラスクロス４と熱硬化性樹脂５の
層との間で剥離が発生し易くなる。FIG. 3B shows the cross section of the glass cloth 4 of the multilayer printed wiring board A and the distribution of the density of the glass components. The warp yarn 6 and the weft yarn composed of the glass cloth yarn 3 of the glass cloth 4 are shown. The glass component becomes dense at the intersection of 7 and the component of the thermosetting resin 5 becomes poor, and the glass component becomes sparse between the intersections of the warp yarn 6 and the weft yarn 7, and the component of the thermosetting resin 5 becomes rich. Become. As the number of intersections of the warp yarns 6 and the weft yarns 7 per predetermined area increases, the interval between the intersections of the warp yarns 6 and the weft yarns 7 becomes smaller, and the distance between the glass component and the denser becomes smaller, so that the glass component becomes less dense. The pitch of change in density becomes smaller. The cross-sectional shape of the glass cloth yarn 3 forming the warp yarn 6 and the weft yarn 7 is generally elliptical,
When the cross section has an elliptical cross section in which the difference between the minor axis a and the major axis b is small, the difference between the sparseness and the denseness of the glass components increases. Since the coefficient of thermal expansion between resin and glass is larger for resin, if the difference between the sparse and dense glass components is large, and if the pitch of the change between the sparse and dense glass components is small, thermal shock will be applied to the multilayer printed wiring board A. When it acts, the strain stress generated between the glass cloth 4 and the layer of the thermosetting resin 5 becomes large due to the difference in the coefficient of thermal expansion between the resin and the glass. Peeling easily occurs between them.
【０００７】このことは、図４（ｂ）に示すように積層
板Ｂにおいても同じである。This also applies to the laminated board B as shown in FIG. 4 (b).
【０００８】[0008]
【発明が解決しようとする課題】上記のようにガラスク
ロスのガラスクロスヤーンの波形のピッチや、縦糸と横
糸の交点の間隔や、ガラスクロスヤーンの断面の形状等
によって熱衝撃の性能が左右されることが予想される。
そこで、従来から使用されているガラスクロスを表面か
ら観察して、１ｃｍ2当たりの縦糸６と横糸７の交点の
数を計測すると共に縦糸と横糸の一つの交点における重
なり面積を測定した。また従来から使用されているガラ
スクロスの厚み方向での断面を観察して、ガラスクロス
ヤーンの波形の周期ｐを計測すると共にガラスクロスヤ
ーンの断面形状の短径ａと長径ｂの比ａ／ｂを測定し
た。結果を表１に示す。As described above, the thermal shock performance is affected by the pitch of the corrugation of the glass cloth yarn of the glass cloth, the interval between the intersections of the warp yarn and the weft yarn, the cross-sectional shape of the glass cloth yarn, and the like. Expected to occur.
Therefore, a conventionally used glass cloth was observed from the surface, the number of intersections of the warp yarn 6 and the weft yarn 7 per 1 cm 2 was measured, and the overlapping area at one intersection of the warp yarn and the weft yarn was measured. Further, the cross section in the thickness direction of the glass cloth that has been conventionally used is observed to measure the period p of the waveform of the glass cloth yarn, and the ratio a / b of the short diameter a and the long diameter b of the cross sectional shape of the glass cloth yarn is measured. Was measured. The results are shown in Table 1.
【０００９】[0009]
【表１】 [Table 1]
【００１０】従来のガラスクロスは表１にみられる通り
であり、表面の平滑性に乏しく、このために耐熱衝撃性
など耐熱性に問題があったと予想される。本発明は上記
の点に鑑みてなされたものであり、耐熱性を向上させる
ことがでるプリプレグ及び積層板、多層プリント配線板
を提供することを目的とするものである。The conventional glass cloths are as shown in Table 1, and the surface smoothness is poor, and it is expected that there was a problem in heat resistance such as thermal shock resistance. The present invention has been made in view of the above points, and an object of the present invention is to provide a prepreg, a laminate, and a multilayer printed wiring board that can improve heat resistance.
【００１１】[0011]
【課題を解決するための手段】本発明は、ガラスクロス
に熱硬化性樹脂を含浸・乾燥して作成されるプリプレグ
において、ガラスクロスとして、その厚みをＸμｍとす
ると、ガラスクロスの縦糸と横糸の１ｃｍ2 当たりの交
点の数が、 （１３０−Ｘ／２）〜（２３０−Ｘ／２）個／ｃｍ2 のものが使用するようにしたことを特徴とするものであ
る。According to the present invention, in a prepreg made by impregnating and drying a glass cloth with a thermosetting resin, when the thickness of the glass cloth is X μm, the warp and weft of the glass cloth are The number of intersections per 1 cm 2 is (130-X / 2) to (230-X / 2) / cm 2 and the number of intersections is set to be used.
【００１２】また本発明にあって、ガラスクロスとし
て、その厚みをＸμｍとすると、縦糸と横糸の一つの交
点における重なり面積が、Ｘ／３００ｍｍ2 以上のもの
を使用することができる。さらに本発明にあって、ガラ
スクロスとして、縦糸や横糸を構成するガラスクロスヤ
ーンがガラスクロスの厚み方向に偏平な略楕円形の断面
形状をし、且つこの楕円形の短径ａと長径ｂの比（ａ／
ｂ）が０．１以下のものを使用することができる。Further, in the present invention, when the glass cloth has a thickness of X μm, it is possible to use a glass cloth having an overlapping area of X / 300 mm 2 or more at one intersection of the warp yarn and the weft yarn. Further, in the present invention, as the glass cloth, the glass cloth yarns forming the warp threads and the weft threads have a substantially elliptical cross-sectional shape that is flat in the thickness direction of the glass cloth, and the elliptical shape has a minor axis a and a major axis b. Ratio (a /
Those in which b) is 0.1 or less can be used.
【００１３】また本発明にあって、ガラスクロスとし
て、厚みが１７０μｍ以下のガラスクロスの場合には、
ガラスクロスの厚み方向の断面にあらわれるガラスクロ
スヤーンの波形の周期が１．２ｍｍ以上のものを使用す
ることができる。さらに本発明にあって、ガラスクロス
として、厚みが１７０μｍを超えるガラスクロスの場合
には、ガラスクロスの厚み方向の断面にあらわれるガラ
スクロスヤーンの波形の周期が１．８ｍｍ以上のものを
使用することができる。In the present invention, when the glass cloth having a thickness of 170 μm or less is used,
It is possible to use a glass cloth yarn having a corrugated period of 1.2 mm or more, which appears in the cross section in the thickness direction of the glass cloth. Further, in the present invention, when the glass cloth has a thickness of more than 170 μm, a glass cloth yarn having a corrugated period of 1.8 mm or more which appears in the cross section in the thickness direction of the glass cloth is used. You can
【００１４】また、本発明は、上記のプリプレグを用い
て成ることを特徴とする積層板に係るものである。さら
に、本発明は、上記のプリプレグを用いて成ることを特
徴とする多層プリント配線板に係るものである。以下、
本発明を詳細に説明する。The present invention also relates to a laminated board characterized by using the above prepreg. Further, the present invention relates to a multilayer printed wiring board characterized by using the above prepreg. Less than,
The present invention will be described in detail.
【００１５】ガラスクロス４はガラスクロスヤーン３で
構成される縦糸６と横糸７を交差させて織成することに
よって作成されるものであり、本発明では表面が超平滑
性を有するガラスクロス４を開発するために、まず縦糸
６と横糸７の交点の間隔を規制する。すなわち、ガラス
クロス４の厚みがＸμｍのとき、ガラスクロス４の縦糸
６と横糸７の１ｃｍ2 当たりの交点の数が、 （１３０−Ｘ／２）個／ｃｍ2 〜（２３０−Ｘ／２）個
／ｃｍ2 の範囲になるようにガラスクロス４を調製する。縦糸６
と横糸７の交点の数が（２３０−Ｘ／２）個／ｃｍ2 を
超えると、縦糸６と横糸７の間隔が短く、縦糸６や横糸
７を構成するガラスクロスヤーン３のガラスクロス４の
断面での屈曲（波形）の曲率が大きくなる。ガラスクロ
スヤーン３の屈曲（波形）の曲率を小さくしてガラスク
ロス４の表面を超平滑に調製するには、縦糸６と横糸７
の交点の数が（２３０−Ｘ／２）個／ｃｍ2 未満である
必要がある。しかし、縦糸６と横糸７の交点の数が（１
３０−Ｘ／２）個／ｃｍ2 未満であると、クロス組織が
疎になり過ぎて強度に問題が生じると共に樹脂の含浸性
にも問題が生じるおそれがある等の不利が生じるので、
縦糸６と横糸７の交点の数は（１３０−Ｘ／２）個／ｃ
ｍ2 以上であることが必要である。ここで、ガラスクロ
ス４の厚みＸは特に制限されるものではないが、一般的
には下限が２５μｍ、上限が２５０μｍである。The glass cloth 4 is made by weaving the warp yarns 6 and the weft yarns 7 composed of the glass cloth yarn 3 in a crossed manner, and in the present invention, the glass cloth 4 having a super smooth surface is used. For development, first, the spacing between the intersections of the warp yarn 6 and the weft yarn 7 is regulated. That is, when the thickness of the glass cloth 4 is X μm, the number of intersections of the warp yarn 6 and the weft yarn 7 of the glass cloth 4 per 1 cm 2 is (130-X / 2) / cm 2 to (230-X / 2). The glass cloth 4 is prepared so as to be in the range of pieces / cm 2 . Warp 6
When the number of intersections of the weft yarn 7 and the weft yarn 7 exceeds (230-X / 2) / cm 2 , the interval between the warp yarn 6 and the weft yarn 7 is short, and the glass cloth 4 of the glass cloth yarn 3 forming the warp yarn 6 and the weft yarn 7 The curvature of the bending (waveform) in the cross section becomes large. In order to make the surface of the glass cloth 4 super smooth by reducing the curvature of the bending (waveform) of the glass cloth yarn 3, the warp yarn 6 and the weft yarn 7 are used.
It is necessary that the number of intersections of (2) is less than (230−X / 2) / cm 2 . However, the number of intersections of the warp thread 6 and the weft thread 7 is (1
If it is less than 30-X / 2) pieces / cm 2 , the cross structure becomes too sparse, which causes a problem in strength and also a problem in that the impregnating property of the resin may also occur.
The number of intersections of the warp yarn 6 and the weft yarn 7 is (130-X / 2) / c
It must be m 2 or more. Here, the thickness X of the glass cloth 4 is not particularly limited, but generally, the lower limit is 25 μm and the upper limit is 250 μm.
【００１６】また、縦糸６や横糸７を構成するガラスク
ロスヤーン３のガラスクロス４の断面での屈曲（波形）
の曲率を小さくするために、ガラスクロスヤーン３の波
形の周期を大きくする。ガラスクロスヤーン３の波形の
周期ｐ、すなわち波形の山（あるいは谷）から山（ある
いは谷）までの間隔は、縦糸６の三本間の間隔や横糸７
の三本間の間隔によって決定されるが、この周期ｐが小
さいと波形の曲率が大きくなってガラスクロス４の表面
を超平滑に調製することができない。このために本発明
では、厚みが１７０μｍ以下のガラスクロス４の場合に
は、ガラスクロスヤーン３の波形の周期ｐが１．２ｍｍ
以上のものを使用し、厚みが１７０μｍを超えるガラス
クロス４の場合には、ガラスクロスヤーン３の波形の周
期ｐが１．８ｍｍ以上のものを使用するようにしてい
る。ガラスクロスヤーン３の波形の周期ｐの上限は特に
設定されないが、上記の縦糸６と横糸７の交点の数の設
定によって自ずから規制されることになる。Further, the glass cloth yarn 3 constituting the warp yarn 6 and the weft yarn 7 is bent (corrugated) in the cross section of the glass cloth 4.
In order to reduce the curvature of, the waveform period of the glass cloth yarn 3 is increased. The period p of the waveform of the glass cloth yarn 3, that is, the interval from the peak (or the valley) to the peak (or the valley) of the waveform is the interval between the three warp threads 6 or the weft thread 7.
Although it is determined by the interval between the three lines, when the period p is small, the curvature of the waveform becomes large, and the surface of the glass cloth 4 cannot be adjusted to be extremely smooth. Therefore, in the present invention, in the case of the glass cloth 4 having a thickness of 170 μm or less, the period p of the waveform of the glass cloth yarn 3 is 1.2 mm.
In the case of the glass cloth 4 having a thickness of more than 170 μm, the glass cloth yarn 3 having a corrugation period p of 1.8 mm or more is used. Although the upper limit of the waveform period p of the glass cloth yarn 3 is not particularly set, it is naturally regulated by setting the number of intersections of the warp yarn 6 and the weft yarn 7 described above.
【００１７】さらに、ガラスクロス４の表面を超平滑に
調製するには、縦糸６や横糸７を構成するガラスクロス
ヤーン３の断面形状ができるだけ偏平であることが必要
である。そしてガラスクロスヤーン３はガラスクロス４
の厚み方向に偏平な楕円形の断面形状をしているが、本
発明ではこの楕円形の短径ａと長径ｂの比（ａ／ｂ）が
０．１以下のガラスクロスヤーン３で構成されたガラス
クロス４を用いるものである。短径ａと長径ｂの比（ａ
／ｂ）が０．１を超えるガラスクロスヤーン３では超平
滑なガラスクロス４を得ることはできない。上限は特に
設定されない。Further, in order to prepare the surface of the glass cloth 4 to be extremely smooth, it is necessary that the cross-sectional shape of the glass cloth yarn 3 constituting the warp yarn 6 and the weft yarn 7 is as flat as possible. And the glass cloth yarn 3 is the glass cloth 4
Has a flat elliptical cross-sectional shape in the thickness direction, but in the present invention, the glass cross yarn 3 having a ratio (a / b) of the minor axis a and the major axis b of the ellipse of 0.1 or less is used. The glass cloth 4 is used. Ratio of minor axis a to major axis b (a
If the glass cloth yarn 3 has a / b) value of more than 0.1, it is not possible to obtain a super smooth glass cloth 4. No upper limit is set.
【００１８】また、ガラスクロスヤーン３の断面形状が
偏平であると縦糸６と横糸７が交点において重なり合う
面積が大きくなる。このために本発明では、ガラスクロ
ス４として、その厚みをＸμｍとすると、縦糸６と横糸
７の一つの交点における重なり面積が、Ｘ／３００ｍｍ
2 以上のものを使用するようにしている。上限は特に設
定されない。If the glass cloth yarn 3 has a flat cross-sectional shape, the area where the warp yarn 6 and the weft yarn 7 overlap at the intersection becomes large. Therefore, in the present invention, when the glass cloth 4 has a thickness of X μm, the overlapping area at one intersection of the warp yarn 6 and the weft yarn 7 is X / 300 mm.
I try to use more than one. No upper limit is set.
【００１９】上記の条件を満たすように調製されたガラ
スクロスを用い、このガラスクロスにエポキシ樹脂やフ
ェノール樹脂、ポリイミド樹脂等のワニスを含浸させて
加熱乾燥することによって、プリプレグを作成すること
ができる。そしてこのプリプレグを用いて積層板を製造
することができる。すなわち、プリプレグを複数枚重ね
ると共に必要に応じて銅箔等の金属箔を重ね、これを加
熱加圧成形することによって積層板を作成することがで
きる。またこの積層板の金属箔をプリント加工等して回
路形成することによってプリント配線板に仕上げること
ができる。A prepreg can be prepared by using a glass cloth prepared so as to satisfy the above conditions, impregnating the glass cloth with a varnish of epoxy resin, phenol resin, polyimide resin or the like, and heating and drying. . And a laminated board can be manufactured using this prepreg. That is, a laminate can be prepared by stacking a plurality of prepregs, stacking metal foils such as copper foils as necessary, and heat-pressing the prepregs. Further, a printed wiring board can be finished by forming a circuit by subjecting the metal foil of this laminated board to a printing process or the like.
【００２０】さらに、プリント配線板を内層回路板とし
て、この表面にプリプレグを重ねると共にさらにその外
側に銅箔等の金属箔を重ね、これを加熱加圧成形するこ
とによって多層板を作成することができ、この多層板の
表面の金属箔をプリント加工等して回路形成することに
よって、多層プリント配線板に仕上げることができる。Further, a printed wiring board is used as an inner layer circuit board, a prepreg is laminated on the surface of the printed wiring board, a metal foil such as copper foil is further laminated on the outer surface of the prepreg, and this is heat-pressed to form a multilayer board. It is possible to finish a multilayer printed wiring board by forming a circuit by printing the metal foil on the surface of the multilayer board.
【００２１】図１（ａ）に上記のようにして調製したガ
ラスクロス４を用いて製造した多層プリント配線板Ａを
示す。このものでは、ガラスクロス４の縦糸６や横糸７
を構成するガラスクロスヤーン３の厚み方向での屈曲
（波形）の曲率が小さく、波形が滑らかになっている。
そして、この多層プリント配線板Ａに熱衝撃が作用する
と、ガラスクロス４と熱硬化性樹脂５の層との間の界面
に沿って熱応力がｘ矢印の向きに発生し、この応力が多
層プリント配線板Ａの厚み方向（ｙ矢印）と平面方向
（ｚ矢印）のベクトルに分力されるが、ガラスクロスヤ
ーン３の屈曲（波形）の曲率が小さいために、ガラスク
ロス４の厚み方向（ｙ矢印）への分力が小さくなると共
に弾性率の低い熱硬化性樹脂５の層の方向（ｚ方向）へ
の分力が大きくなって応力緩和され、ガラスクロス４と
熱硬化性樹脂５の層との間で剥離が発生することを防ぐ
ことができるのである。FIG. 1 (a) shows a multilayer printed wiring board A manufactured using the glass cloth 4 prepared as described above. In this case, the warp yarn 6 and the weft yarn 7 of the glass cloth 4 are used.
The curvature of the bending (waveform) in the thickness direction of the glass cloth yarn 3 constituting the above is small, and the waveform is smooth.
When a thermal shock acts on the multilayer printed wiring board A, thermal stress is generated in the direction of the arrow x along the interface between the glass cloth 4 and the layer of the thermosetting resin 5, and this stress is applied to the multilayer printed board. The components are divided into a vector in the thickness direction (y arrow) of the wiring board A and a vector in the plane direction (z arrow), but since the curvature of the bending (waveform) of the glass cloth yarn 3 is small, the thickness direction of the glass cloth 4 (y The component force in the direction of the layer of the thermosetting resin 5 having a low elasticity and the component force in the direction of the layer of the thermosetting resin 5 having a low elastic modulus (z direction) are increased to relax the stress, and the layer of the glass cloth 4 and the thermosetting resin 5 It is possible to prevent peeling between the two.
【００２２】このことは図２（ａ）に示す積層板Ｂにお
いても同じである。すなわちこの積層板Ｂにあってもガ
ラスクロス４の縦糸６や横糸７を構成するガラスクロス
ヤーン３の厚み方向での屈曲（波形）の曲率が小さく、
波形が滑らかになっている。従ってこの積層板Ｂに熱衝
撃が作用して、ガラスクロス４と熱硬化性樹脂５の層と
の間の界面に沿って熱応力がｘ矢印の向きに発生し、こ
の応力の積層板Ｂの厚み方向（ｙ矢印）と平面方向（ｚ
矢印）の分力は、同様にガラスクロス４の厚み方向（ｙ
矢印）への分力が小さくなると共に弾性率の低い熱硬化
性樹脂５の層の方向（ｚ方向）への分力が大きくなって
応力緩和され、ガラスクロス４と熱硬化性樹脂５の層と
の間で剥離が発生することを防ぐことができるのであ
る。The same applies to the laminated plate B shown in FIG. 2 (a). That is, even in this laminated plate B, the curvature of the bending (waveform) in the thickness direction of the glass cloth yarn 3 forming the warp yarn 6 and the weft yarn 7 of the glass cloth 4 is small,
The waveform is smooth. Therefore, thermal shock acts on the laminated plate B, and thermal stress is generated in the direction of the arrow x along the interface between the glass cloth 4 and the layer of the thermosetting resin 5. Thickness direction (y arrow) and plane direction (z
Similarly, the component force of the arrow is the thickness direction of the glass cloth 4 (y
The component force in the direction of the layer of the thermosetting resin 5 having a low elasticity and the component force in the direction of the layer of the thermosetting resin 5 having a low elastic modulus (z direction) are increased to relax the stress, and the layer of the glass cloth 4 and the thermosetting resin 5 is reduced. It is possible to prevent peeling between the two.
【００２３】図１（ｂ）は上記のようにして調製したガ
ラスクロス４を用いて製造した多層プリント配線板Ａの
ガラスクロス４の断面とガラス成分の疎密の分布を示す
ものであり、上記のようにして調製したガラスクロス４
は縦糸６と横糸７の間隔が大きいために、縦糸６と横糸
７の交点でのガラス成分の密と、この間のガラス成分の
疎の間隔が大きくなり、しかも縦糸６や横糸７を構成す
るガラスヤーン３の偏平度が大きいために、縦糸６と横
糸７の交点でのガラス成分が密になる度合いと、この間
のガラス成分が疎になる度合いとの差が小さくなる。こ
のために、熱衝撃が多層プリント配線板Ａに作用したと
きに、樹脂とガラスの熱膨張係数の差によってガラスク
ロス４と熱硬化性樹脂５の層との間で発生する歪み応力
を小さくすることができ、ガラスクロス４と熱硬化性樹
脂５の層との間で剥離が発生することを防ぐことができ
るものである。FIG. 1 (b) shows the cross section of the glass cloth 4 of the multilayer printed wiring board A manufactured using the glass cloth 4 prepared as described above and the distribution of the density of the glass components. Glass cloth 4 prepared in this way
Since the gap between the warp yarn 6 and the weft yarn 7 is large, the glass component is dense at the intersection of the warp yarn 6 and the weft yarn 7, and the gap between the glass components is large, and the glass constituting the warp yarn 6 and the weft yarn 7 is large. Since the flatness of the yarn 3 is large, the difference between the degree of density of the glass component at the intersection of the warp yarn 6 and the weft yarn 7 and the degree of sparseness of the glass component at this point is small. Therefore, when a thermal shock acts on the multilayer printed wiring board A, the strain stress generated between the glass cloth 4 and the layer of the thermosetting resin 5 due to the difference in thermal expansion coefficient between the resin and the glass is reduced. Therefore, peeling between the glass cloth 4 and the layer of the thermosetting resin 5 can be prevented.
【００２４】このことは、図２（ｂ）に示す積層板Ｂに
おいても同じである。すなわちこの積層板Ｂにあっても
ガラスクロス４は縦糸６と横糸７の間隔が大きいため
に、縦糸６と横糸７の交点でのガラス成分の密と、この
間のガラス成分の疎の間隔が大きくなり、また縦糸６や
横糸７を構成するガラスヤーン３の偏平度が大きいため
に、縦糸６と横糸７の交点でのガラス成分が密になる度
合いと、この間のガラス成分が疎になる度合いとの差が
小さくなる。このために、熱衝撃が多層プリント配線板
Ａに作用したときに、樹脂とガラスの熱膨張係数の差に
よってガラスクロス４と熱硬化性樹脂５の層との間で発
生する歪み応力を小さくすることができ、ガラスクロス
４と熱硬化性樹脂５の層との間で剥離が発生することを
防ぐことができるものである。The same applies to the laminated plate B shown in FIG. 2 (b). That is, even in this laminated plate B, since the glass cloth 4 has a large space between the warp yarn 6 and the weft yarn 7, the denseness of the glass component at the intersection of the warp yarn 6 and the weft yarn 7 and the spacing of the glass component between them are large. In addition, since the glass yarn 3 forming the warp yarns 6 and the weft yarns 7 has a large flatness, the glass component at the intersection of the warp yarns 6 and the weft yarns 7 becomes dense and the glass component between them becomes sparse. The difference between Therefore, when a thermal shock acts on the multilayer printed wiring board A, the strain stress generated between the glass cloth 4 and the layer of the thermosetting resin 5 due to the difference in thermal expansion coefficient between the resin and the glass is reduced. Therefore, peeling between the glass cloth 4 and the layer of the thermosetting resin 5 can be prevented.
【００２５】[0025]
【実施例】次に、本発明を実施例によって例証する。 （実施例１）表２に示す組成でエポキシ樹脂ワニスを調
製した。次に、表３のａのＥガラスのガラスクロスにエ
ポキシ樹脂ワニスを含浸させた後、温度１５０℃、時間
５分間の条件で加熱乾燥して溶剤を除去することによっ
て、樹脂含有率５０重量％、溶融粘度６００ポイズのプ
リプレグを得た。The invention will now be illustrated by the examples. (Example 1) An epoxy resin varnish having the composition shown in Table 2 was prepared. Next, the glass cloth of E glass in Table 3a was impregnated with an epoxy resin varnish, and then dried by heating under the conditions of a temperature of 150 ° C. and a time of 5 minutes to remove the solvent. A prepreg having a melt viscosity of 600 poise was obtained.
【００２６】一方、厚さ０．１ｍｍ、銅箔厚さ３５μｍ
のガラスエポキシ両面銅張積層板の両面の銅箔をプリン
ト配線加工して信号回路を形成し、さらに信号回路の表
面を黒化処理して内層回路板を作成した。そして内層回
路板の表裏両面に上記プリプレグを１枚ずつ重ねると共
に、その外側にそれぞれ厚み１８μｍの銅箔を重ね、こ
れを温度１７０℃、圧力５０ｋｇ／ｃｍ2 、時間７０分
間の成形条件で加熱加圧成形することによって４層板を
作成し、さらにスルーホールメッキ、レジスト等のプリ
ント配線加工をして外層回路を形成することによって、
４層の多層プリント配線板を製造した。On the other hand, the thickness is 0.1 mm and the copper foil thickness is 35 μm.
The copper foils on both sides of the glass epoxy double-sided copper-clad laminate were printed and processed to form a signal circuit, and the surface of the signal circuit was blackened to form an inner layer circuit board. Then, the above prepregs were superposed one by one on both front and back surfaces of the inner layer circuit board, and copper foils each having a thickness of 18 μm were superposed on the outer side thereof, and heated under a molding condition of a temperature of 170 ° C., a pressure of 50 kg / cm 2 , and a time of 70 minutes. By forming a four-layer board by pressure forming, and further through-hole plating, printed wiring processing such as resist, to form the outer layer circuit,
A four-layer multilayer printed wiring board was manufactured.
【００２７】（実施例２）表３のｂのＥガラスクロスを
用いるようにした他は、実施例１と同様にしてプリプレ
グを作成し、さらに多層プリント配線板を製造した。 （実施例３）表３のｃのＥガラスクロスを用いるように
した他は、実施例１と同様にしてプリプレグを作成し、
さらに多層プリント配線板を製造した。Example 2 A prepreg was prepared in the same manner as in Example 1 except that the E glass cloth shown in b of Table 3 was used, and a multilayer printed wiring board was manufactured. (Example 3) A prepreg was prepared in the same manner as in Example 1 except that the E glass cloth of c in Table 3 was used.
Furthermore, a multilayer printed wiring board was manufactured.
【００２８】（実施例４）表３のｄのＥガラスクロスを
用いるようにした他は、実施例１と同様にしてプリプレ
グを作成し、さらに多層プリント配線板を製造した。 （実施例５）表３のｅのＥガラスクロスを用いるように
した他は、実施例１と同様にしてプリプレグを作成し、
さらに多層プリント配線板を製造した。(Example 4) A prepreg was prepared in the same manner as in Example 1 except that the E glass cloth shown in d of Table 3 was used, and a multilayer printed wiring board was manufactured. (Example 5) A prepreg was prepared in the same manner as in Example 1 except that the E glass cloth shown in Table 3e was used.
Furthermore, a multilayer printed wiring board was manufactured.
【００２９】（実施例６）表３のａのＥガラスクロスを
用いて作成したプリプレグ１０ａと、表３のｃのＥガラ
スクロスを用いて作成したプリプレグ１０ｃとを用い、
図５の構成で内層回路板１にプリプレグ１０ａ，１０ｃ
及び銅箔８を重ね、他は実施例１と同様にして多層プリ
ント配線板を製造した。Example 6 Using a prepreg 10a prepared by using the E glass cloth shown in Table 3a and a prepreg 10c prepared by using the E glass cloth shown in Table 3c,
With the structure shown in FIG. 5, the prepregs 10a and 10c are attached to the inner circuit board 1.
A multilayer printed wiring board was manufactured in the same manner as in Example 1 except that the copper foil 8 was overlaid.
【００３０】（実施例７）表３のｂのＥガラスクロスを
用いて作成したプリプレグ１０ｂと、表３のｄのＥガラ
スクロスを用いて作成したプリプレグ１０ｄとを用い、
図６の構成で内層回路板１にプリプレグ１０ｂ，１０ｄ
及び銅箔８を重ね、他は実施例１と同様にして多層プリ
ント配線板を製造した。(Example 7) Using a prepreg 10b prepared by using the E glass cloth of Table 3b and a prepreg 10d prepared by using the E glass cloth of Table 3d,
In the structure shown in FIG. 6, the prepregs 10b and 10d are attached to the inner layer circuit board 1.
A multilayer printed wiring board was manufactured in the same manner as in Example 1 except that the copper foil 8 was overlaid.
【００３１】（比較例１）表３のｆのＥガラスクロスを
用いるようにした他は、実施例１と同様にしてプリプレ
グを作成し、さらに多層プリント配線板を製造した。 （比較例２）表３のｇのＥガラスクロスを用いるように
した他は、実施例１と同様にしてプリプレグを作成し、
さらに多層プリント配線板を製造した。(Comparative Example 1) A prepreg was prepared in the same manner as in Example 1 except that the E glass cloth shown in f of Table 3 was used, and a multilayer printed wiring board was manufactured. (Comparative Example 2) A prepreg was prepared in the same manner as in Example 1 except that E glass cloth of g in Table 3 was used.
Furthermore, a multilayer printed wiring board was manufactured.
【００３２】（比較例３）表３のｈのＥガラスクロスを
用いるようにした他は、実施例１と同様にしてプリプレ
グを作成し、さらに多層プリント配線板を製造した。 （比較例４）表３のｆのＥガラスクロスを用いて作成し
たプリプレグ１０ｆと、表３のｇのＥガラスクロスを用
いて作成したプリプレグ１０ｇとを用い、図７の構成で
内層回路板１にプリプレグ１０ｆ，１０ｇ及び銅箔８を
重ね、後は実施例１と同様にして多層プリント配線板を
製造した。Comparative Example 3 A prepreg was prepared in the same manner as in Example 1 except that the E glass cloth of h in Table 3 was used, and a multilayer printed wiring board was manufactured. (Comparative Example 4) Using the prepreg 10f prepared by using the E glass cloth of f in Table 3 and the prepreg 10g prepared by using the E glass cloth of g in Table 3, the inner layer circuit board 1 having the configuration of FIG. Then, prepregs 10f and 10g and the copper foil 8 were superposed on each other, and thereafter a multilayer printed wiring board was manufactured in the same manner as in Example 1.
【００３３】（比較例５）表３のｇのＥガラスクロスを
用いて作成したプリプレグ１０ｇと、表３のｈのＥガラ
スクロスを用いて作成したプリプレグ１０ｈとを用い、
図８の構成で内層回路板１にプリプレグ１０ｇ，１０ｈ
及び銅箔８を重ね、後は実施例１と同様にして多層プリ
ント配線板を製造した。(Comparative Example 5) Using prepreg 10g prepared by using E glass cloth of g in Table 3 and prepreg 10h prepared by using E glass cloth of h in Table 3,
In the structure of FIG. 8, the inner circuit board 1 has prepregs 10g and 10h.
Then, the copper foil 8 was overlaid, and thereafter a multilayer printed wiring board was manufactured in the same manner as in Example 1.
【００３４】[0034]
【表２】 [Table 2]
【００３５】[0035]
【表３】 [Table 3]
【００３６】上記実施例１乃至７及び比較例１乃至５で
使用したガラスクロスについて、縦糸と横糸の１ｃｍ2
当たりの交点の数、縦糸と横糸の交点における重なり面
積、ガラスクロスヤーンの断面の短径ａと長径ｂの比
（ａ／ｂ）、ガラスクロスヤーンの波形の周期を測定し
た。その結果を表４及び表５に示す。また、上記実施例
１乃至７及び比較例１乃至５で得た４層の多層プリント
配線板について、吸湿耐熱性を測定した。試験は、試料
を４０℃、９０％ＲＨの条件下９６時間放置して吸湿さ
せ、これを２６０℃の半田浴に２０秒間浸漬する方法
と、試料を６０℃、９０％ＲＨの条件下９６時間放置し
て吸湿させ、これを２６０℃の半田浴に２０秒間浸漬す
る方法とについておこない、剥離が発生しないものをＯ
Ｋとした。結果を表４及び表５に示す。尚、分母に試験
数、分子にＯＫ数を示す。Regarding the glass cloth used in Examples 1 to 7 and Comparative Examples 1 to 5, 1 cm 2 of warp and weft
The number of intersections per hit, the overlapping area at the intersections of the warp yarns and the weft yarns, the ratio (a / b) of the minor axis a to the major axis b of the cross section of the glass cloth yarn, and the waveform period of the glass cloth yarn were measured. The results are shown in Tables 4 and 5. Further, the heat resistance against moisture absorption was measured for the four-layered multilayer printed wiring boards obtained in Examples 1 to 7 and Comparative Examples 1 to 5. The test is carried out by leaving the sample to stand for 40 hours at 40 ° C. and 90% RH for 96 hours to absorb moisture, and immersing it in a solder bath at 260 ° C. for 20 seconds, and for 96 hours under the condition of 60 ° C. and 90% RH. Let it stand for moisture absorption and immerse it in a solder bath at 260 ° C for 20 seconds.
K. The results are shown in Tables 4 and 5. The test number is shown in the denominator and the OK number is shown in the numerator.
【００３７】[0037]
【表４】 [Table 4]
【００３８】[0038]
【表５】 [Table 5]
【００３９】表４及び表５にみられるように、本発明で
規定する条件を満足するガラスクロスを用いて製造した
各実施例のものは、吸湿耐熱性が高く、耐熱衝撃性が優
れることが確認される。 （実施例８）表２に示す組成でエポキシ樹脂ワニスを調
製した。次に、表３のａのＥガラスのガラスクロスにエ
ポキシ樹脂ワニスを含浸させた後、温度１５０℃、時間
５分間の条件で加熱乾燥して溶剤を除去することによっ
て、樹脂含有率４５重量％、溶融粘度６５０ポイズのプ
リプレグを得た。As shown in Tables 4 and 5, each of the examples manufactured using the glass cloth satisfying the conditions specified in the present invention has high moisture absorption heat resistance and excellent thermal shock resistance. It is confirmed. Example 8 An epoxy resin varnish having the composition shown in Table 2 was prepared. Next, the glass cloth of E glass in Table 3a was impregnated with an epoxy resin varnish, and then heated and dried at a temperature of 150 ° C. for a time of 5 minutes to remove the solvent. A prepreg having a melt viscosity of 650 poise was obtained.
【００４０】そしてこのプリプレグを４枚重ねると共
に、その外側にそれぞれ厚み１８μｍの銅箔を重ね、こ
れを温度１７０℃、圧力５０ｋｇ／ｃｍ2 、時間７０分
間の成形条件で加熱加圧成形することによって、ガラス
エポキシ両面銅張り積層板を製造した。 （実施例９）表３のｂのＥガラスクロスを用いるように
した他は、実施例８と同様にしてプリプレグを作成し、
さらにガラスエポキシ両面銅張り積層板を製造した。Then, four prepregs were superposed on each other, and copper foils each having a thickness of 18 μm were superposed on the outer side of the prepreg, and the prepreg was heated and pressed under the molding conditions of a temperature of 170 ° C., a pressure of 50 kg / cm 2 , and a time of 70 minutes. A glass epoxy double-sided copper clad laminate was manufactured. (Example 9) A prepreg was prepared in the same manner as in Example 8 except that the E glass cloth shown in Table 3b was used.
Further, a glass epoxy double-sided copper clad laminate was manufactured.
【００４１】（実施例１０）表３のｃのＥガラスクロス
を用いるようにした他は、実施例８と同様にしてプリプ
レグを作成し、さらにガラスエポキシ両面銅張り積層板
を製造した。 （実施例１１）表３のｄのＥガラスクロスを用いるよう
にした他は、実施例８と同様にしてプリプレグを作成
し、さらにガラスエポキシ両面銅張り積層板を製造し
た。Example 10 A prepreg was prepared in the same manner as in Example 8 except that the E glass cloth shown in c of Table 3 was used, and a glass epoxy double-sided copper-clad laminate was manufactured. (Example 11) A prepreg was prepared in the same manner as in Example 8 except that the E glass cloth shown in d of Table 3 was used, and a glass epoxy double-sided copper clad laminate was manufactured.
【００４２】（実施例１２）表３のｅのＥガラスクロス
を用いるようにした他は、実施例８と同様にしてプリプ
レグを作成し、さらにガラスエポキシ両面銅張り積層板
を製造した。 （実施例１３）表３のａのＥガラスクロスを用いて作成
したプリプレグ１０ａと、表３のｃのＥガラスクロスを
用いて作成したプリプレグ１０ｃとを用い、図９の構成
でプリプレグ１０ａ，１０ｃ及び銅箔８を重ね、他は実
施例８と同様にしてガラスエポキシ両面銅張り積層板を
製造した。Example 12 A prepreg was prepared in the same manner as in Example 8 except that the E glass cloth shown in e of Table 3 was used, and a glass epoxy double-sided copper clad laminate was manufactured. (Example 13) Using the prepreg 10a prepared by using the E glass cloth shown in a of Table 3 and the prepreg 10c prepared by using the E glass cloth shown in c of Table 3, the prepregs 10a and 10c having the structure shown in FIG. And copper foil 8 were overlaid, and otherwise the glass epoxy double-sided copper-clad laminate was manufactured in the same manner as in Example 8.
【００４３】（実施例１４）表３のｂのＥガラスクロス
を用いて作成したプリプレグ１０ｂと、表３のｄのＥガ
ラスクロスを用いて作成したプリプレグ１０ｄとを用
い、図１０の構成でプリプレグ１０ｂ，１０ｄ及び銅箔
８を重ね、他は実施例８と同様にしてガラスエポキシ両
面銅張り積層板を製造した。(Example 14) Using the prepreg 10b prepared by using the E glass cloth shown in Table 3b and the prepreg 10d prepared by using the E glass cloth shown in Table 3d, the prepreg having the structure shown in FIG. A glass-epoxy double-sided copper-clad laminate was manufactured in the same manner as in Example 8 except that 10b and 10d and the copper foil 8 were stacked.
【００４４】（比較例６）表３のｆのＥガラスクロスを
用いるようにした他は、実施例８と同様にしてプリプレ
グを作成し、さらにガラスエポキシ両面銅張り積層板を
製造した。 （比較例７）表３のｇのＥガラスクロスを用いるように
した他は、実施例８と同様にしてプリプレグを作成し、
さらにガラスエポキシ両面銅張り積層板を製造した。(Comparative Example 6) A prepreg was prepared in the same manner as in Example 8 except that the E glass cloth shown in f of Table 3 was used, and a glass epoxy double-sided copper clad laminate was manufactured. (Comparative Example 7) A prepreg was prepared in the same manner as in Example 8 except that E glass cloth of g in Table 3 was used.
Further, a glass epoxy double-sided copper clad laminate was manufactured.
【００４５】（比較例８）表３のｈのＥガラスクロスを
用いるようにした他は、実施例８と同様にしてプリプレ
グを作成し、さらにガラスエポキシ両面銅張り積層板を
製造した。 （比較例９）表３のｆのＥガラスクロスを用いて作成し
たプリプレグ１０ｆと、表３のｇのＥガラスクロスを用
いて作成したプリプレグ１０ｇとを用い、図１１の構成
でプリプレグ１０ｆ，１０ｇ及び銅箔８を重ね、他は実
施例８と同様にしてガラスエポキシ両面銅張り積層板を
製造した。(Comparative Example 8) A prepreg was prepared in the same manner as in Example 8 except that the E glass cloth of h in Table 3 was used, and a glass epoxy double-sided copper clad laminate was manufactured. (Comparative Example 9) Using the prepreg 10f made using the E glass cloth of f in Table 3 and the prepreg 10g made using the E glass cloth of g in Table 3, the prepregs 10f and 10g having the configuration of FIG. 11 were used. And copper foil 8 were overlaid, and otherwise the glass epoxy double-sided copper-clad laminate was manufactured in the same manner as in Example 8.
【００４６】（比較例１０）表３のｇのＥガラスクロス
を用いて作成したプリプレグ１０ｇと、表３のｈのＥガ
ラスクロスを用いて作成したプリプレグ１０ｈとを用
い、図１２の構成でプリプレグ１０ｇ，１０ｈ及び銅箔
８を重ね、他は実施例８と同様にしてガラスエポキシ両
面銅張り積層板を製造した。(Comparative Example 10) A prepreg 10g prepared by using the E glass cloth of g in Table 3 and a prepreg 10h prepared by using the E glass cloth of h in Table 3 were used to prepare the prepreg in the configuration of FIG. A glass epoxy double-sided copper-clad laminate was produced in the same manner as in Example 8 except that 10 g and 10 h and the copper foil 8 were stacked.
【００４７】上記実施例８乃至１４及び比較例６乃至１
０で得た積層板について、吸湿耐熱性試験及びＰＣＴ試
験をおこなった。吸湿耐熱性試験は、試料を６０℃、９
０％ＲＨの条件下１４４時間放置して吸湿させ、これを
２６０℃の半田浴に３０秒間浸漬しておこない、またＰ
ＣＴ試験は、１２１℃で１２０分間処理した試料を２６
０℃の半田浴に３０秒間浸漬しておこない、剥離が発生
しないものをＯＫとした。結果を表６及び表７に示す。
尚、分母に試験数、分子にＯＫ数を示す。Examples 8 to 14 and Comparative Examples 6 to 1
The moisture absorption heat resistance test and the PCT test were performed on the laminated plate obtained in No. 0. The moisture absorption heat resistance test was conducted at 60 ° C.
Allow to stand for 144 hours under 0% RH to absorb moisture, and soak this in a solder bath at 260 ° C for 30 seconds.
The CT test was performed on the sample treated at 121 ° C. for 120 minutes for 26 hours.
It was immersed in a solder bath at 0 ° C. for 30 seconds, and the one in which peeling did not occur was defined as OK. The results are shown in Tables 6 and 7.
The test number is shown in the denominator and the OK number is shown in the numerator.
【００４８】[0048]
【表６】 [Table 6]
【００４９】[0049]
【表７】 [Table 7]
【００５０】表６及び表７にみられるように、本発明で
規定する条件を満足するガラスクロスを用いて製造した
各実施例のものは、耐熱衝撃性が優れることが確認され
る。As can be seen from Tables 6 and 7, it is confirmed that the examples manufactured using the glass cloth satisfying the conditions specified in the present invention have excellent thermal shock resistance.
【００５１】[0051]
【発明の効果】上記のように本発明は、ガラスクロスに
熱硬化性樹脂を含浸・乾燥して作成されるプリプレグに
おいて、ガラスクロスとして、その厚みをＸμｍとする
と、ガラスクロスの縦糸と横糸の１ｃｍ2 当たりの交点
の数が、 （１３０−Ｘ／２）〜（２３０−Ｘ／２）個／ｃｍ2 のものを使用するようにしたので、縦糸や横糸の間隔が
長くなって縦糸や横糸を構成するガラスクロスヤーンの
屈曲（波形）の曲率が小さくなってガラスクロスヤーン
の波形が滑らかになり、熱衝撃が作用した際の応力のガ
ラスクロスの厚み方向への分力が小さくなって、ガラス
クロスと熱硬化性樹脂の層との間で剥離が発生すること
を防ぐことができるものであり、しかも縦糸と横糸の交
点でのガラス成分の密と、この間のガラス成分の疎の間
隔が大きくなって、熱衝撃が作用したときに樹脂とガラ
スの熱膨張係数の差によってガラスクロスと熱硬化性樹
脂の層との間で発生する歪み応力を小さくすることがで
き、ガラスクロスと熱硬化性樹脂の層との間で剥離が発
生することを防ぐことができるものである。As described above, according to the present invention, in a prepreg made by impregnating and drying a glass cloth with a thermosetting resin, when the thickness of the glass cloth is X μm, the warp and weft of the glass cloth are Since the number of intersections per 1 cm 2 is (130-X / 2) to (230-X / 2) / cm 2 , the intervals between the warp yarns and the weft yarns are increased, and the warp yarns and the weft yarns are lengthened. The curvature of the bending (waveform) of the glass cloth yarn that constitutes the component becomes small, the waveform of the glass cloth yarn becomes smooth, and the component force of the stress when a thermal shock acts in the thickness direction of the glass cloth becomes small, It is possible to prevent the occurrence of peeling between the glass cloth and the thermosetting resin layer, moreover, the denseness of the glass component at the intersection of the warp and the weft, and the sparse spacing of the glass component between them. Big The strain stress generated between the glass cloth and the thermosetting resin layer due to the difference in the coefficient of thermal expansion between the resin and the glass when a thermal shock acts can be reduced. It is possible to prevent the occurrence of peeling from the resin layer.
【００５２】また本発明は、ガラスクロスとして、その
厚みをＸμｍとすると、縦糸と横糸の一つの交点におけ
る重なり面積が、Ｘ／３００ｍｍ2 以上のものを使用す
るようにしたので、縦糸と横糸の交点の面積を大きくし
てガラス成分の密と疎の差を小さくすることができ、熱
衝撃が作用したときに樹脂とガラスの熱膨張係数の差に
よってガラスクロスと熱硬化性樹脂の層との間で発生す
る歪み応力を小さくして、ガラスクロスと熱硬化性樹脂
の層との間で剥離が発生することを防ぐことができるも
のである。Further, in the present invention, assuming that the glass cloth has a thickness of X μm, the overlapping area at one intersection of the warp yarn and the weft yarn is X / 300 mm 2 or more. The area of the intersection can be increased to reduce the difference between the denseness and the sparseness of the glass components, and the difference between the thermal expansion coefficient of the resin and the glass when the thermal shock acts causes the difference between the glass cloth and the layer of the thermosetting resin. The strain stress generated between the layers can be reduced to prevent peeling between the glass cloth and the thermosetting resin layer.
【００５３】さらに本発明は、ガラスクロスとして、縦
糸や横糸を構成するガラスクロスヤーンがガラスクロス
の厚み方向に偏平な略楕円形の断面形状をし、且つこの
楕円形の短径ａと長径ｂの比（ａ／ｂ）が０．１以下の
ものを使用するようにしたので、ガラスクロスヤーンの
偏平度が大きく、縦糸と横糸の交点でのガラス成分が密
になる度合いと、この間のガラス成分が疎になる度合い
との差を小さくすることができるものであり、熱衝撃が
作用したときに樹脂とガラスの熱膨張係数の差によって
ガラスクロスと熱硬化性樹脂の層との間で発生する歪み
応力を小さくすることができ、ガラスクロスと熱硬化性
樹脂の層との間で剥離が発生することを防ぐことができ
るものである。Further, in the present invention, as the glass cloth, the glass cloth yarns constituting the warp threads and the weft threads have a substantially elliptical cross-sectional shape flat in the thickness direction of the glass cloth, and the elliptical shape has a minor axis a and a major axis b. Since the glass cloth yarn having a ratio (a / b) of 0.1 or less is used, the flatness of the glass cloth yarn is large, and the glass component at the intersection of the warp yarn and the weft yarn is dense, and the glass between them. It is possible to reduce the difference between the degree to which the components become sparse and occurs between the glass cloth and the thermosetting resin layer due to the difference in the coefficient of thermal expansion between the resin and glass when a thermal shock is applied. The strain stress applied to the glass cloth can be reduced, and peeling between the glass cloth and the thermosetting resin layer can be prevented.
【００５４】加えて本発明は、ガラスクロスとして、厚
みが１７０μｍ以下のガラスクロスの場合には、ガラス
クロスの厚み方向の断面にあらわれるガラスクロスヤー
ンの波形の周期が１．２ｍｍ以上のものを、厚みが１７
０μｍを超えるガラスクロスの場合には、ガラスクロス
の厚み方向の断面にあらわれるガラスクロスヤーンの波
形の周期が１．８ｍｍ以上のものを用いるようにしたの
で、ガラスクロスヤーンの厚み方向での屈曲（波形）の
曲率が小さくなってガラスクロスヤーンの波形が滑らか
になり、熱衝撃が作用した際の応力のガラスクロスの厚
み方向への分力が小さくなって、ガラスクロスと熱硬化
性樹脂の層との間で剥離が発生することを防ぐことがで
きるものである。In addition, according to the present invention, in the case of a glass cloth having a thickness of 170 μm or less, the glass cloth yarn having a waveform period of 1.2 mm or more which appears in the cross section in the thickness direction of the glass cloth, Thickness is 17
In the case of a glass cloth having a thickness of more than 0 μm, a glass cloth yarn having a corrugated period of 1.8 mm or more, which appears in the cross section in the thickness direction of the glass cloth, is used, so that the bending of the glass cloth yarn in the thickness direction ( Waveform) has a smaller curvature, the waveform of the glass cloth yarn becomes smoother, the component force of the stress when a thermal shock acts on the thickness of the glass cloth becomes smaller, and the layer of glass cloth and thermosetting resin It is possible to prevent the occurrence of peeling between and.
【図１】本発明に係る多層プリント配線板の一例を示す
ものであり、（ａ）は一部の断面図、（ｂ）は断面図と
ガラスの疎−密の関係を示す図である。1A and 1B show an example of a multilayer printed wiring board according to the present invention, in which FIG. 1A is a partial cross-sectional view, and FIG. 1B is a view showing a cross-sectional view and a sparse-dense relationship of glass.
【図２】本発明に係る積層板の一例を示すものであり、
（ａ）は一部の断面図、（ｂ）は断面図とガラスの疎−
密の関係を示す図である。FIG. 2 shows an example of a laminated board according to the present invention,
(A) is a partial cross-sectional view, (b) is a cross-sectional view and sparse glass-
It is a figure which shows a close relationship.
【図３】従来の多層プリント配線板の一例を示すもので
あり、（ａ）は一部の断面図、（ｂ）は断面図とガラス
の疎−密の関係を示す図である。3A and 3B show an example of a conventional multilayer printed wiring board, FIG. 3A is a partial cross-sectional view, and FIG. 3B is a view showing a cross-sectional view and a sparse-dense relationship of glass.
【図４】従来の積層板の一例を示すものであり、（ａ）
は一部の断面図、（ｂ）は断面図とガラスの疎−密の関
係を示す図である。FIG. 4 shows an example of a conventional laminated plate, (a)
Is a partial cross-sectional view, and (b) is a view showing the cross-sectional view and the sparse-dense relationship of glass.
【図５】実施例６の層構成を示す概略図である。FIG. 5 is a schematic view showing a layer structure of Example 6.
【図６】実施例７の層構成を示す概略図である。FIG. 6 is a schematic diagram showing a layer structure of Example 7.
【図７】比較例４の層構成を示す概略図である。7 is a schematic diagram showing a layer structure of Comparative Example 4. FIG.
【図８】比較例５の層構成を示す概略図である。8 is a schematic diagram showing a layer structure of Comparative Example 5. FIG.
【図９】実施例１３の層構成を示す概略図である。FIG. 9 is a schematic diagram showing a layer structure of Example 13.
【図１０】実施例１４層構成を示す概略図である。FIG. 10 is a schematic view showing a layer structure of Example 14.
【図１１】比較例９の層構成を示す概略図である。11 is a schematic view showing a layer structure of Comparative Example 9. FIG.
【図１２】比較例１０の層構成を示す概略図である。12 is a schematic diagram showing a layer structure of Comparative Example 10. FIG.
１ 内層回路板 ２ 内層回路 ３ ガラスクロスヤーン ４ ガラスクロス ５ 熱硬化性樹脂 ６ 縦糸 ７ 横糸 1 inner layer circuit board 2 inner layer circuit 3 glass cloth yarn 4 glass cloth 5 thermosetting resin 6 warp yarn 7 weft yarn
フロントページの続き (72)発明者 相楽 隆 大阪府門真市大字門真1048番地松下電工株 式会社内Continued Front Page (72) Inventor Takashi Soraku 1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.
Claims (7)
燥して作成されるプリプレグにおいて、ガラスクロスと
して、その厚みをＸμｍとすると、ガラスクロスの縦糸
と横糸の１ｃｍ2 当たりの交点の数が、 （１３０−Ｘ／２）〜（２３０−Ｘ／２）個／ｃｍ2 のものが使用されて成ることを特徴とするプリプレグ。1. In a prepreg made by impregnating and drying a glass cloth with a thermosetting resin, when the thickness of the glass cloth is X μm, the number of intersections of the warp and weft of the glass cloth per 1 cm 2 is , (130-X / 2) to (230-X / 2) pieces / cm 2 are used.
燥して作成されるプリプレグにおいて、ガラスクロスと
して、その厚みをＸμｍとすると、縦糸と横糸の一つの
交点における重なり面積が、Ｘ／３００ｍｍ2 以上のも
のが使用されて成ることを特徴とするプリプレグ。2. In a prepreg made by impregnating and drying a glass cloth with a thermosetting resin, when the thickness of the glass cloth is X μm, the overlapping area at one intersection of the warp yarn and the weft yarn is X / 300 mm. A prepreg characterized by comprising two or more things.
燥して作成されるプリプレグにおいて、ガラスクロスと
して、縦糸や横糸を構成するガラスクロスヤーンがガラ
スクロスの厚み方向に偏平な略楕円形の断面形状をし、
且つこの楕円形の短径ａと長径ｂの比（ａ／ｂ）が０．
１以下のものが使用されて成ることを特徴とするプリプ
レグ。3. A prepreg prepared by impregnating a glass cloth with a thermosetting resin and drying the glass cloth, wherein the glass cloth yarn constituting warp yarns and weft yarns has a substantially elliptical shape flat in the thickness direction of the glass cloth. Make a cross-sectional shape,
Moreover, the ratio (a / b) of the minor axis a and the major axis b of this ellipse is 0.
A prepreg characterized in that one or less is used.
燥して作成されるプリプレグにおいて、ガラスクロスと
して、厚みが１７０μｍ以下のガラスクロスの場合に
は、ガラスクロスの厚み方向の断面にあらわれるガラス
クロスヤーンの波形の周期が１．２ｍｍ以上のものが使
用されて成ることを特徴とするプリプレグ。4. A prepreg prepared by impregnating a glass cloth with a thermosetting resin and drying the glass cloth, which is a glass cloth having a thickness of 170 μm or less, which appears in a cross section in the thickness direction of the glass cloth. A prepreg characterized by using a cross yarn having a waveform period of 1.2 mm or more.
燥して作成されるプリプレグにおいて、ガラスクロスと
して、厚みが１７０μｍを超えるガラスクロスの場合に
は、ガラスクロスの厚み方向の断面にあらわれるガラス
クロスヤーンの波形の周期が１．８ｍｍ以上のものが使
用されて成ることを特徴とするプリプレグ。5. A prepreg made by impregnating a glass cloth with a thermosetting resin and drying the glass cloth, when the glass cloth has a thickness of more than 170 μm, the glass appears in the cross section in the thickness direction of the glass cloth. A prepreg characterized by using a cross yarn having a waveform period of 1.8 mm or more.
いて成ることを特徴とする積層板。6. A laminated board comprising the prepreg according to any one of claims 1 to 5.
いて成ることを特徴とする多層プリント配線板。7. A multilayer printed wiring board comprising the prepreg according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12278994A JP2992441B2 (en) | 1994-06-03 | 1994-06-03 | Prepreg and laminated board, multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12278994A JP2992441B2 (en) | 1994-06-03 | 1994-06-03 | Prepreg and laminated board, multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07330928A true JPH07330928A (en) | 1995-12-19 |
| JP2992441B2 JP2992441B2 (en) | 1999-12-20 |
Family
ID=14844663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12278994A Expired - Fee Related JP2992441B2 (en) | 1994-06-03 | 1994-06-03 | Prepreg and laminated board, multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2992441B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002055603A1 (en) * | 2001-01-10 | 2002-07-18 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| JP2008087342A (en) * | 2006-10-02 | 2008-04-17 | Sumitomo Bakelite Co Ltd | Laminate sheet |
| JP2013129827A (en) * | 2011-11-25 | 2013-07-04 | Sumitomo Bakelite Co Ltd | Prepreg, laminated board, multilayer printed wiring board, and semiconductor device |
-
1994
- 1994-06-03 JP JP12278994A patent/JP2992441B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002055603A1 (en) * | 2001-01-10 | 2002-07-18 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| KR100832193B1 (en) * | 2001-01-10 | 2008-05-23 | 히다치 가세고교 가부시끼가이샤 | Thermosetting Resin Composition, and Prepreg, Laminate for Circuit Board, and Printed Circuit Board Each Made Therewith |
| US7538150B2 (en) | 2001-01-10 | 2009-05-26 | Hitachi Chemical Company, Ltd | Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin |
| KR100965025B1 (en) * | 2001-01-10 | 2010-06-21 | 히다치 가세고교 가부시끼가이샤 | Thermosetting Resin Composition, and Prepreg, Laminate for Circuit Board, and Printed Circuit Board Each Made Therewith |
| KR101240786B1 (en) * | 2001-01-10 | 2013-03-07 | 히타치가세이가부시끼가이샤 | Thermosetting Resin Composition, and Prepreg, Laminate for Circuit Board, and Printed Circuit Board Each Made Therewith |
| KR101355673B1 (en) * | 2001-01-10 | 2014-01-27 | 히타치가세이가부시끼가이샤 | Thermosetting Resin Composition, and Prepreg, Laminate for Circuit Board, and Printed Circuit Board Each Made Therewith |
| JP2008087342A (en) * | 2006-10-02 | 2008-04-17 | Sumitomo Bakelite Co Ltd | Laminate sheet |
| JP2013129827A (en) * | 2011-11-25 | 2013-07-04 | Sumitomo Bakelite Co Ltd | Prepreg, laminated board, multilayer printed wiring board, and semiconductor device |
| KR20140097170A (en) * | 2011-11-25 | 2014-08-06 | 스미토모 베이클리트 컴퍼니 리미티드 | Prepreg, laminated board, multilayer printed wiring board, and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2992441B2 (en) | 1999-12-20 |
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