JPH0730025A - Fan integral type cooling device for heater element - Google Patents

Abstract

PURPOSE:To provide a fan integrated type heater element cooling device having improved cooling efficiency and provided with a fan to cool down a high heater element and unit having the shape and structure which can be mounted in high density. CONSTITUTION:In the title fan integral type heater element cooling device with a heat sink 2 which is arranged on the upper surface of a heater element 1 and having a plurality of heat-radiating fins 2-1 and a cooling fan unit 3 with a motor part 3-1 which is rotated in the center part, at least an auxiliary wiring 3-3 is provided on the lower surface of the motor part of a fan unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device or heat sink for cooling high heat generating elements and high heat generating units, and more particularly to cooling high heat generating elements and high heat generating units such as high density integrated circuit packages. The present invention relates to a fan-integrated heating element cooling device.

[0002]

2. Description of the Related Art A personal computer (personal computer),
High-density integrated circuit packages are used in electronic devices that are relatively small in size, but have many functions and high performance, such as desktop or deskside computers such as workstations. It is a high heat source. In general, such high-density integrated circuit packages are provided with heat radiating fins individually or commonly, and by using natural cooling by natural ventilation or forced cooling by a cooling fan common to the entire device, other elements and units are Is being cooled with.

Recently, some highly integrated LSI packages generate heat of several watts, and the amount of heat generation increases as the clock frequency used increases. In particular, heat generation of 5 to 6 watts or more is generated. There is a circumstance that the above-described ordinary heat sink cannot obtain sufficient cooling for the LSI package to be produced. The cooling fan for forced cooling is, for example, 60 to 80 m for the above-mentioned desktop personal computer.
For an m-square or desk-side computer, a 120-mm-square fan is quite fast.
For example, it is used by rotating at 3000 to 5000 rpm, but it is impossible to use one having a stronger cooling capacity in terms of equipment size, cost and noise.

That is, if the fan is increased in size, the size of the device is increased and the cost is increased, and the noise is also increased, but the cooling capacity is not increased to the extent commensurate with them, and a plurality of fans are connected in series or in parallel. However, the size and cost of the equipment increase accordingly, but the amount of cooling air obtained does not double. In addition, it is difficult to rotate the fan at a higher speed from the viewpoint of noise, and even if a large fan is rotated at a low speed, it is possible to obtain the cooling effect and noise merit that match the demerits of the equipment size and cost. I can't. For this reason, as a result, for example, the above-described high heat generation LSI
Insufficient cooling air flow cannot be supplied to the heat sink of the package.

In order to solve the problem, the high heat generating elements or units included in the device are usually limited to, for example, only a few places. It is possible to dispose a heat sink that is a combination of small cooling fans of about 25 to 40 mm square and send a required amount of cooling air individually to each high heat generating element or heat sink of a unit to locally forcibly cool. It is considered.

FIG. 1 is a front view including a partial cross-section conceptually illustrating the type or type of mounting structure in which such a cooling fan and a heat sink are combined.
An example applied to a heat sink of an LSI package is shown. In the figure, 1 is an LSI package, 2 is a heat sink formed of a material having good thermal conductivity, and 3 is a cooling fan unit. A direct mounting type in which a fan unit 3 is placed on a heat sink 2 as shown in FIG. 1A, and a fan unit in the heat sink 2 as shown in FIG. An embedded mounting type in which 3 is embedded is conceivable.

[0007]

However, in the realization of a heat sink provided with such individual cooling fans for such high heat generating elements and units, the size of the heat sink has been reduced due to the miniaturization and high density mounting of equipment. In terms of shape, structure and the like, which are suitable in terms of aspect and can achieve high cooling efficiency, are still insufficient. In particular, a study on a thin cooling structure applicable to recent high-density mounting equipment is insufficient.

Therefore, the present invention improves the cooling efficiency and, in addition, a heat sink having a fan for cooling a high heat generating element or a high heat generating unit having a shape and a structure which enables high density mounting, that is, a fan. An object is to provide an integrated heating element cooling device. A more specific object of the present invention is to provide a fan-integrated heating element cooling device having a fan structure that enables uniform heat dissipation.

Another specific object of the present invention is to provide a fan-integrated heating element cooling device having a heat sink structure that enables uniform heat dissipation. Still another specific object of the present invention is to provide a fan-integrated heating element cooling device having a fan structure that enables a thin size. Still another specific object of the present invention is to provide a fan-integrated heating element cooling device having a structure in which a heat sink and a fan are arranged side by side, which enables a thin size.

[0010]

According to the present invention, a heat sink disposed on the upper surface of a heating element and having a plurality of heat radiation fins, and a heat sink disposed on the heat sink,
In addition, in the fan-integrated heat-generating element cooling device of the direct mounting type, which includes a cooling fan unit having a motor portion that rotates in the center, at least one auxiliary blade is provided on the lower surface of the motor portion of the fan unit.

Further, according to the present invention, in a similar fan-integrated type heat-generating element cooling device of the immediately above mounting type, a heat sink is provided with a base surface inclined so as to include an inclination descending toward at least a central portion. The heat pipe is arranged so as to extend from the peripheral portion to the central portion along the inclined base surface. Further, according to the present invention, a heat sink having a plurality of heat dissipating fins arranged on the upper surface of the heating element and excluding at least the central portion, and an intake / exhaust port facing the central portion of the heat sink are provided. And a cover mounted so as to cover the upper surface of the heat sink, and a cooling fan unit arranged in the air intake / exhaust port of the cover and embedded in the central portion of the heat sink. In the embedded fan-integrated heating element cooling device, the driving circuit components of the fan unit are attached to the inner surface of the cover or the inner surface of the heat sink.

Further, according to the present invention, a heat sink disposed on the upper surface of the heating element mounted on the substrate and having a plurality of heat radiation fins, and fixed so as to cover the upper surface of the heat sink, A cover having an extension extending laterally of the heat sink and a fan unit attached to the lower portion of the extension of the cover, and the cooling air is concentrated on the heat sink between the cover and the heat generating element by the rotation of the fan unit. A side-mounted fan-integrated heat-generating element cooling device is also configured to be effectively guided.

[0013]

As described above, since the fan-integrated heating element cooling device according to the present invention is configured, in the direct mounting type in which the fan unit is mounted on the heat sink, the auxiliary unit provided under the motor portion of the fan unit is used. The lower part of the fan unit can be swirled by the blades to eliminate the dead zone that occurs directly below the fan unit.Also, by sloping the base surface of the heat sink toward the center and disposing the heat pipe there, heat is generated. The heat generated in the central portion of the element can be transmitted to the outer peripheral portion to increase the amount of heat radiation and improve the cooling efficiency.

Further, in the embedded type in which the fan unit is embedded in the central part of the heat sink, the rotation controlling circuit component of the fan unit is attached to the inner surface of the heat sink or the cover without being provided above or below the motor. The cooling device can be made thinner as much as the space obtained by the above, or the fan motor can be made vertically long and the diameter can be made smaller to downsize the entire cooling device.

Furthermore, in the side mounting type in which the fan unit is arranged on the side of the assembly of the heat generating element and the heat sink, the fan unit has a closed structure capable of effectively guiding the cooling air to the heat sink, and the internal By arranging a member for effectively guiding the cooling air to the heat generating portion, the cooling device can be formed thin and the cooling efficiency can be improved.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Several embodiments of a fan-integrated heating element cooling device according to the present invention will be described below with reference to the drawings. FIG. 2 is a front sectional view (A) and a top view (B) showing a configuration of a first embodiment of a fan-integrated heating element cooling device according to the present invention, and FIG. 2 (A) is shown in FIG. 2 (B). It is sectional drawing which follows the cutting plane AA. This embodiment is shown in FIG.
(A) has an integrated structure of a directly mounted fan and a heat sink, and 1 is, for example, LS
A high heat generating element such as an I package, 2 is a heat sink formed of a material having good thermal conductivity, 2-1, ... And 2-2, ... Are heat radiation fins of the heat sink 2, and 3 is a high heat generating element. A dedicated small fan unit, 3-1 is a fan motor, 3-2 is a main wing, and 3-3 is an auxiliary wing. The dotted arrows in the figure indicate the flow of cooling air, that is, the air flow. The illustrated air flow is for the suction type (pull method), and the reverse direction for the blow type (push method). Becomes

In the structure in which the fan rotating portion is close to above (or below) the heat sink, such as in the direct mounting type, that is, in the structure in which the fan unit 3 and the heat radiation fins 2-1, ... The portion directly under 3-1 becomes a cooling dead zone, and normally, the high temperature portion concentrated in the central portion is not directly cooled, so that the cooling efficiency is lowered.

Taking the case of an LSI package as an example, the circuit boards in recent high-density mounting equipment such as personal computers and workstations are densely arranged at narrow intervals. In the case of a structure in which the heat generating element 1, the heat sink 2, and the fan unit 3 which are LSI packages are stacked on each other, the heat sink 2 cannot be formed thick. Therefore, the heat radiation effect from the central portion is deteriorated, and the central portion becomes high in temperature, so that the temperature distribution from the central portion to the peripheral portion of the heating element 1 is not largely changed, that is, it is sufficient to “uniformize the temperature”. There is a problem that it can not be done. In addition, in the case of a ceramic package used for a normal LSI package, compared with an AIN (aluminum nitride) package or the like, the heat conduction characteristic of the ceramic package originally does not sufficiently equalize the heat generation, and the heat generating element 1 It is supposed to further hinder the soaking.

As described above, in the direct-mounting type cooling structure in which soaking is insufficient, the high temperature portion is located in the above-mentioned dead zone, which results in a decrease in cooling efficiency. This embodiment is intended to improve this point, and as a result, auxiliary blades 3-3, ... Are provided below the fan motor 3-1 as shown in FIG. FIG. 3 is an enlarged cross-sectional view of the central portion of the front cross-sectional view of the directly-mounted mounting type cooling structure shown in FIG. 2, in which the air flows (a) and (b) in the pull method and the auxiliary blade 3-
3 and the structure of the fin 2-2 in the central part are shown.

The aileron 3-3, as shown,
For example, it is attached to the bottom of the motor fan 3-1.
In order to diffuse the air in the dead zone well, it should be suspended or extended within the width of the heat sink 2 so that an appropriate space, for example, several mm, is provided between the aileron 3-3 and the base portion of the heat sink 2. In addition, short fins 2-2, ... Are arranged between them in order to maintain the heat radiation effect of the central portion of the heating element 1. FIG. 4 is a bottom view illustrating various shapes of the auxiliary blade 3-3, which are arranged radially from the center of rotation, but are arranged point-symmetrically (1),
In addition to (2), (3), and (7), those that are not necessarily point-symmetrical (6) and those that are provided with only part of them (4), (5)
Etc.

According to this embodiment, the dead zone portion is swirled by the auxiliary blades 3-3, and air is expelled to the outside by the centrifugal force. An air flow (b) is generated in the dead zone of the part, and heat diffusion is promoted. This allows
Along with the air flow (a) drawn from the peripheral portion to the central portion by the fan main blades, the heat dissipation of the heat generating element 1 can be made uniform, the temperature of the element 1 can be made uniform, and the cooling efficiency can be improved. Further, according to the structure of this embodiment, since the fan having a low rotation speed can be used due to the improved cooling efficiency, the noise of the device can be reduced and the life of the entire device can be extended. .

The cooling structure of the present embodiment is particularly effective when used for the pull type, but can also provide some effect to the push type. FIG. 5 is a top view, a front view and a side view showing a configuration of a second embodiment of a fan-integrated heating element cooling device according to the present invention, and FIG. 6 is a front sectional view taken along a section plane AA of FIG. It is a figure. The present embodiment has an integrated structure of a fan and a heat sink mounted directly on top as shown in FIG. 1A, and only the heat sink 2 having a heat radiation fin 2-1 and the fan unit 3 are shown. The heating element 1 is omitted. In the present embodiment, the cooling air is blown to the heat radiation fins 2-1, ... As indicated by the dotted arrow in FIG.
The push method that causes

In this embodiment, the base surface 2-3 of the heat sink 2 has a lower central portion in order to reduce the deterioration of the cooling efficiency due to the dead zone in the above-mentioned directly mounted cooling structure. The heat radiation fins 2-1, ... Are formed so that the heat radiation fins 2-2 in the central portion are longer than those in the peripheral portion. A fluid pressure difference is generated between the central part and the central part, and the cooling air is directed to the central part. At the same time, as shown in FIGS. 5 and 6, for example, in a spiral shape so as to extend along the inclined base surface 2-3 and over the entire surface from the central portion to the peripheral portion. The heat pipe 4 is provided in the. Further, as a mounting method of the heat pipe 4, there are a method in which a groove is provided in advance on the base surface 2-3 of the heat sink 2 and embedded, a method in which the heat pipe 4 is directly placed on the base surface 2-3, and brazing is performed.

FIG. 7 is a top view of a modification of this embodiment,
It is a front view and a side view. In this variant embodiment, the base surface 2-3 of the heat sink 2 is formed by two inclined surfaces 2-3 ', 2-3' and the heat pipe 4
For example, as shown in the figure, a main heat pipe 4-1 is installed at the bottom of a base surface 2-3 ′ having a V-shaped cross section, and from there, the sub pipe is adjusted according to the inclination of the base surface 2-3 ′. The heat pipes 4-2, ... Are connected to each other.

According to the cooling structure of this embodiment, the heat sink 2 having the inclined base surface 2-3 or 2-3 '.
By pulling the cooling air to the central part of the element, and increasing the wind speed by lowering the resistance of the blowout of the central part, while promoting the heat dissipation of the high temperature in the central part of the element not uniform soaking, Pipe 4 or 4-1
By 4-2, the high temperature in the central portion can be transmitted to the relatively low temperature portion around the element, and the heat generated in the central portion can be dispersed to the surroundings. This further promotes soaking of the heating element 1,
In addition, as the temperature of the outer peripheral portion of the heat sink rises, the amount of heat released to the outside increases, thus improving the cooling efficiency.

As a modification of the base surface 2-3 of the heat sink 2 formed in the cone shape or the pyramid shape in this embodiment, it is formed in a spiral step shape, and the heat pipe 4 is arranged along the step. Alternatively, the heat pipes 4 may be arranged radially along the conical or pyramidal base surface 2-3. Further, the cooling structure of the present embodiment is particularly effective when used in the push system, but can also provide some effect to the pull system.

As described above, in the case of the LSI package, the circuit boards in recent high-density mounting equipment such as workstations are arranged at intervals of, for example, a little over 20 mm. Depending on the situation, there is a limit to the correspondence. For example, the thickness of the LSI package is 5 mm, the thickness of the heat sink is 5 mm, the thickness of the thinnest fan at present is 10 mm, and the IC
Considering that the socket has a protrusion, the combined thickness of the heat sink and cooling fan is about 10 mm, and the total thickness of the combined package is 15 m.
It should be about m. Therefore, an embedded mounting type cooling structure as shown in FIG. 1B is considered.

FIG. 8 is a top view, a front view and a side view showing the structure of such a buried mounting type cooling structure.
Here, 2 is a heat sink, 3 is a fan unit, 5 is a cover, and the heating element 1 is omitted. Figure 9
FIG. 9 is a partially enlarged cross-sectional view in which the central portion of the cross section taken along the section plane AA in FIG. 8 is enlarged. As shown in the drawing, the fan unit 3 is mounted so as to be embedded in the width of the heat sink 2 below the intake / exhaust port 51 formed in the cover 5 that covers the heat sink 2.
The heat radiation fin 2-1 of the heat sink 2 is the fan unit 3
Is arranged around. In the figure, 3-1 is a fan motor, 3-2 is a fan main wing, 31 is a coil, 32 is a magnet, 33 is a fan motor bearing, and 34 is a circuit component and a substrate. A cylindrical member 5-2 is formed in the cover 5 so as to be connected to the intake / exhaust port 5-1 and surrounds the mounted fan unit 3 to guide cooling air, and
A gap between the heat sink 2 and the base surface 2-3 constitutes a throttle mechanism that narrows down the cooling air.

FIG. 9 (A) shows an enlarged cross section of a normal pull-type embedded mounting type cooling structure, in which the cover 5 supports the fan unit 3, for example, the supporting spokes 5-3 ,.
Supported by, for example, as shown in FIG.
It is supported by columns at four corners of the heat sink 2. In the lower part of the fan motor 3-1, the dead zone DZ described above is provided.
And a circuit part for driving the fan motor and the substrate 34 are attached to the fan unit bearing portion on the upper part. FIG. 9B shows an enlarged cross-section of the embedded mounting type cooling structure similar to FIG. 9A, in which the fan unit 3 is the base surface 2- of the heat sink 2.
9 and the circuit components and the board 34 are attached to the lower part of the fan motor 3-1.
It is similar to the structure of (A). As described above, whichever structure is adopted, in the embedded mounting type cooling structure, the circuit component for driving the fan motor and the substrate 34 are mounted on or below the fan motor 3-1.
The thickness of the fan unit is to be increased accordingly.

FIG. 10 is a top view, a front view and a side view showing the configuration of the third embodiment of the fan-integrated heating element cooling device according to the present invention, and FIG. 11 is a sectional view taken along the line A--A in FIG.
FIG. 3 is a partially enlarged cross-sectional view showing an enlarged central portion of a cross section taken along with, showing two structures of a structure (A) in which the fan unit 3 is supported on the cover side and a structure (B) supported on the heat sink side. There is. As is clear from these figures, in this embodiment, the circuit parts for driving the fan motor and the substrate 34 are mounted on the cover 5 as shown in FIG. FIG. 11 (B)
As shown in FIG. 3, the heat sink 2 is mounted on, for example, the base surface. At this time, the hall element 35 for driving the cooling fan is separately mounted on the cover or the heat sink at a position facing the fan motor 3-1.

According to the cooling structure of this embodiment, for example, as shown in FIG. 11A showing the structure in which the fan unit 3 is supported on the cover 5 side, the circuit components and the substrate 34 are connected to the fan motor. As shown in FIG. 11B showing the space removed from the upper part of 3-1 and the structure in which the fan unit 3 is supported on the heat sink 2 side, the circuit components and the board 34 are connected to the fan motor 3-. The fan motor 3-1 can be made vertically long and the diameter thereof can be reduced by the space removed from the lower part of 1 to reduce the area of the dead zone DZ shown in FIG. 9 (A). As a result, the cooling efficiency is improved, and therefore, it is possible to obtain the same cooling capacity by the fan having a lower rotation speed, the noise is reduced accordingly, and the life of the device is extended.

FIG. 12 is a top view, a front view and a side view showing the configuration of a modified embodiment of the third embodiment of the fan-integrated heating element cooling device according to the present invention, and FIG. 13 is a sectional view of FIG. FIG. 2 is a partially enlarged sectional view in which a central portion of a section taken along the line AA is enlarged, and shows a structure (A) in which the fan unit 3 is supported on the cover 5 side and a structure (B) in which the fan unit 3 is supported on the heat sink 2 side. Shows two structures. In this modified embodiment, the arrangement of the circuit component and the board 34 and the Hall element 35 is the same as in the case of FIG. 10 and FIG. 11, but as shown in FIG. Of the fan motor 3-1 from the upper portion of the fan motor 3-1, and as shown in FIG.
Fan unit 3 for the space removed from the bottom of 1
By reducing the thickness of the heating element, the entire fan-integrated heating element cooling device can be made thin. As a result, it is possible to use it for a recent high-density mounting type device, and it is possible to expand the applicable range of the fan-integrated heating element cooling device.

As a further modification of this embodiment, although not shown, the circuit parts and the board 34 cover the fan motor supporting spokes 5-3, the case of the fan motor 3-1 or the like. It can also be attached to the radiation fins 2-1 of the heat sink. Further, although the pull type cooling structure is adopted in the illustrated embodiment and its modified embodiment, it is needless to say that the present invention is also applicable to the case where the push method is adopted. Further, wiring is required between the circuit components and the substrate 34 and the fan motor 3-1. However, if ordinary wiring is used, wind resistance is increased. Therefore, for example, a flat so-called flexible wiring is used. The board can be attached to the base surface of the cover or heat sink for wiring.

Next, in the case of an LSI package mounted on the recent high-density mounting equipment as described above, for example, in a case where there is a height limitation such as a shelf or a notebook personal computer having a certain pitch, it is more advanced. High-density mounting has become necessary, and even with the above-mentioned directly mounted cooling structure, and even the embedded cooling structure described above, there are cases where mounting on equipment is not possible, and a thinner cooling structure is required. Has been.

FIG. 14 is a top view (A) and a front sectional view (B) showing the configuration of a fourth embodiment of a fan-integrated heating element cooling device according to the present invention, which is devised to meet such a requirement. ) And FIG. 15 is a perspective view thereof. In this embodiment, the fan unit 3 includes a heating element 1 and a heat sink 2.
And a side mounting type fan-integrated heating element cooling device which is disposed laterally of the assembly and is connected by a cover 5 made of a material having good thermal conductivity.

In this embodiment, the cover 5 made of a material having good thermal conductivity is formed integrally with the heat sink 2 or a portion covering the heat sink 2 fixed by screwing or the like, and extending from that, screwing or fitting. And the like, and has an extension portion having an intake / exhaust port 5-1 to which the fan unit 3 is mounted so as to face each other. The outer side surfaces on three sides of the extended portion are closed by the side surface plates 5-4, ... And the lower portion of the fan unit 3 is also closed by the bottom surface plate 5-5. In addition, 6 is a baffle plate, 7 is a guide, 10 is a substrate on which the heating element 1 such as an LSI package is mounted, 11 is a pin for supplying power to the fan unit 3, and the fan unit 3 is, for example, this power source. It can be fixed to the substrate 10 by a plurality of pins including the supply pin 11.

Since the present embodiment is configured as described above, the cooling air is supplied by the push method, and the airflow indicated by the dotted arrow in FIG. 1, is guided by a suitable baffle plate 6 or a guide 7 as shown in the figure, and is sent to the heat sink 2.
The air will be exhausted from the opposite end.

FIG. 16 is a top view showing the structure of a first modification of this embodiment, and FIG. 17 is a perspective view thereof. The first modified example has the same configuration as the side-mounted fan-integrated heating element cooling device shown in FIGS. 14 and 15, and the same reference numerals are given to the same components. Is attached. In addition, in this modified example, one or more side plates 5-4 of the fan unit are provided with openings 8 ... As illustrated, for example. The openings 8, ... Are provided on the back side of the fan unit 3, that is, on the side far from the heat sink 2, and the wind pressure increases on the back side of the fan unit 3 which is blocked by letting air escape. To reduce the pressure loss of the fan and reduce the burden, resulting in
It will be possible to secure a sufficient air volume.

Further, in this embodiment, the cover 5 can cover only the upper surface of the heat sink 2.
Also, except for the side parts for the intake and exhaust ports, the heat sink 2
The sides of can be blocked. FIG. 18 is a perspective view showing a configuration of a second modified example of the present embodiment having a cover 5 ′ that implements them, and the side plates 5′-4 and 5′-4 of the cover 5 ′ are used to form the heat sink 2. Both side surfaces of the fan unit 3 excluding the opposite end are closed.

Further, in the case of the present embodiment shown in FIG. 14, a cavity-up type in which a semiconductor chip is attached to the upper surface of the element is used as the heating element 1, but the semiconductor chip is attached to the lower surface of the element. In the case of the installed cavity down type element, if the cooling air is made to flow also to the short pin side of the heat transfer path from the chip, only the heat sink 2 side provided on the cap of the element 1 is cooled. The cooling efficiency can be improved as compared with the case of passing the wind. FIG. 19 is a top view (A) and a front sectional view (B) showing a configuration of a third modified example of this embodiment for that purpose. In the third modified embodiment, a guide 7'having a wedge-shaped cross section is provided so that the air flow can be divided vertically.
And the ventilation holes 9 are provided in the bottom plate 5-5 of the fan unit. As a result, an air flow is formed as indicated by the dotted arrow in the figure.

FIG. 20 is a top view (A) and a front sectional view (B) showing the structure of a fourth modification of the present embodiment. Here, as a heat sink, FIGS.
A disk-shaped heat sink 2'having laminated heat radiation fins is used instead of the rectangular heat sink shown in FIG. The cover 5 is fitted and fixed to both sides of the disc-shaped heat sink 2 ', and for example, as shown in FIG. 21 showing an enlarged portion B of FIG. 20, both sides of the edge of the cover 5 are covered. Providing a plurality of downward hooks 5-6,
The cover 5 can be detachably attached by inserting the cover 5 from above and engaging with the edge of the heat sink 2 '. This facilitates maintenance and inspection of the fan unit 3 by removing the cover 5.

FIG. 22 is a top view (A) and a front sectional view (B) showing the structure of a fifth modification of this embodiment, and FIG. 23 is a perspective view thereof. In this modified embodiment, an intake / exhaust port 5-1 'is provided on the bottom plate 5-5 of the fan unit, instead of the intake port on the upper surface of the cover shown in FIGS. , Air is introduced from the gap between the fan unit and the substrate 10 to suck and exhaust the air 5.
It is designed to inhale from 1 '. In this case, since the air is taken in from the lower part of the fan, the baffle plate (6) is unnecessary. Thus, an air flow is generated as shown by the dotted arrow in FIGS. 22 and 23. In this case, the pressure loss at the intake port is higher than that shown in FIGS. 14 to 15, but the flow in the fan unit 3 is smooth.

24 to 26 are respectively the radiation fins 2- of the heat sink 2 used in this embodiment.
It is the top view and front view which show the example of the arrangement shape of 1, ... As shown in the drawing, by disposing the heat dissipating fins 2-1 not only over the entire area of the heat sink 2 but also just above the heat generating portion of the element 1,
The pressure loss due to the heat sink can be reduced and the wind speed can be secured. In addition, the guide walls 2-on both sides of the heat sink 2.
4, 2-4 are provided (FIGS. 24 and 25), and the element 1 is used.
The guide walls 2-5 and 2-5 for guiding to the heat generating part of (2) are provided (FIG. 26) to prevent the cooling air from being exhausted to the side through the portion where the heat radiation fins are not arranged, and at the local side. The cooling fins 2-1 can be effectively guided to improve cooling efficiency.

In the above description of the present embodiment, the shape of the heat radiation fin of the heat sink is a pin type or a laminated type, but in the side mounting type cooling structure like this example, Not limited to these, various shapes including a plate type can be effectively used. Further, as the cooling method, the push method in which the air discharged from the fan is blown against the heat sink is adopted, but the pull method in which the wind passing through the heat sink is sucked in can also be adopted.

[0045]

As described above, according to the fan-integrated heat-generating element cooling device of the present invention, the fan-type mounted type in which the fan unit is mounted on the heat sink, and the embedded type in which the fan unit is embedded in the central part of the heat sink. And, while effectively utilizing the advantage of the lateral mounting type in which the fan unit is disposed on the lateral side of the assembly of the heating element and the heat sink, the cooling efficiency is increased, and the structure is made thinner.
For example, it becomes possible to meet the recent demands for high-density packaging equipment such as personal computers and workstations.

[Brief description of drawings]

FIG. 1 is a front view including a partial cross section conceptually illustrating a mold of a mounting structure in which a cooling fan and a heat sink are combined.

FIG. 2 is a front sectional view (A) and a top view (B) showing a configuration of a first embodiment of a fan-integrated heating element cooling device according to the present invention.

FIG. 3 is an enlarged sectional view of a central portion of the front sectional view of the cooling structure in FIG.

FIG. 4 is a bottom view illustrating various shapes of auxiliary wings.

FIG. 5 is a top view, a front view and a side view showing a configuration of a second embodiment of a fan-integrated heating element cooling device according to the present invention.

6 is a front cross-sectional view taken along the section plane AA of FIG.

FIG. 7 is a top view, a front view, and a side view of a modified example of the second embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 8 is a top view, a front view and a side view showing a configuration of a second embodiment of a fan-integrated heating element cooling device according to the present invention.

9 is a partially enlarged cross-sectional view in which the central portion of the cross section taken along the section plane AA in FIG. 8 is enlarged.

FIG. 10 is a top view, a front view and a side view showing a configuration of a third embodiment of a fan-integrated heating element cooling device according to the present invention.

11 is a partially enlarged cross-sectional view in which a central portion of a cross section taken along the section plane AA in FIG. 10 is enlarged.

FIG. 12 is a top view, a front view and a side view showing the configuration of a modified embodiment of the third embodiment of the fan-integrated heating element cooling device according to the present invention.

13 is a partially enlarged cross-sectional view in which a central portion of a cross section taken along the section plane AA in FIG. 12 is enlarged.

FIG. 14 is a top view (A) and a front sectional view (B) showing a configuration of a fourth embodiment of a fan-integrated heating element cooling device according to the present invention.

FIG. 15 is a perspective view showing the configuration of a fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 16 is a top view showing the configuration of a first modification of the fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 17 is a perspective view showing the configuration of a first modification of the fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 18 is a perspective view showing the configuration of a second modification of the fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 19 is a top view (A) and a front sectional view (B) showing a configuration of a third modification of the fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 20 is a top view (A) and a front sectional view (B) showing a configuration of a fourth modified example of the fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 21 is a partially enlarged view showing a portion B of FIG. 18 in an enlarged manner.

FIG. 22 is a top view (A) and a front sectional view (B) showing a configuration of a fifth modification of the fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

FIG. 23 is a perspective view of a fifth modification of the fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

24A and 24B are a top view and a front view showing an example of an arrangement shape of heat dissipation fins of a heat sink in a fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

25A and 25B are a top view and a front view showing an example of an arrangement shape of heat dissipation fins of a heat sink in a fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

26A and 26B are a top view and a front view showing an example of an arrangement shape of heat dissipation fins of a heat sink in a fourth embodiment of the fan-integrated heating element cooling device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Heating element 2 ... Heat sink 2-1, 2-2 ... Radiating fin 2-3, 2-3 '... Base surface 2-4, 2-5 ... Guide wall 3 ... Fan unit 3-1 ... Fan motor 3- 2 ... Main wing 3-3 ... Auxiliary wing 4, 4-1, 4-2 ... Heat pipe 5, 5 '... Cover 5-1 ... Intake port 5-2 ... Cylindrical member 5-3 ... Support spoke 5-4, 5'-4 ... Side plate 5-5 ... Bottom plate 5-6 ... Hook 6 ... Baffle plate 7 ... Guide 8 ... Opening 9 ... Ventilation hole 10 ... Board 11 ... Power supply pin 31 ... Coil 32 ... Magnet 33 ... Bearing 34 ... Circuit parts and substrate 35 ... Hall element

Claims (17)

[Claims] 1. A heat sink provided on an upper surface of a heat generating element and having a plurality of heat radiation fins, and a cooling fan unit provided on an upper portion of the heat sink and having a centrally rotating motor section. A fan-integrated heating element cooling device provided with the fan unit, wherein the fan unit has at least one auxiliary blade provided on the lower surface of the motor portion so as to extend within the width on the heat sink side. 2. The fan-integrated heating element cooling device according to claim 1, wherein the heat radiation fins of the heat sink facing the auxiliary vanes are formed to be short within a range in which the auxiliary vanes rotate. 3. The fan-integrated heating element cooling device according to claim 1, wherein at least one auxiliary blade is arranged radially from the fan rotation shaft. 4. A heat sink, which is disposed on the upper surface of the heat generating element and has a plurality of heat radiation fins, and a cooling fan unit, which is disposed above the heat sink and has a motor section that rotates in the center. In a fan-integrated heating element cooling device provided with the heat sink, a base surface is formed so as to be inclined so as to include an inclination descending toward at least a central portion, and the heat sink is provided on the inclined base surface, An apparatus having heat dissipation fins which are sequentially formed higher toward a portion, and a heat pipe which is disposed along the inclined base surface and extends from the peripheral portion to the central portion. 5. The fan-integrated heating element cooling device according to claim 4, wherein the inclined base surface of the heat sink is formed into a conical or pyramidal shape, and the heat pipe is spiral from the central portion to the peripheral portion. Device that extends to. 6. The fan-integrated heating element cooling device according to claim 4, wherein the inclined base surface of the heat sink is formed by two inclined surfaces intersecting on a line including a central portion, and the heat pipe is , An apparatus having one main pipe arranged along the line, and a plurality of sub-pipes arranged from the peripheral portion toward the main pipe along the two inclined surfaces. 7. The fan-integrated heating element cooling device according to claim 4, wherein a heat pipe is embedded in the base surface of the heat sink. 8. A heat sink having a plurality of heat dissipating fins disposed on an upper surface of the heat generating element and excluding at least a fan mounting portion on a base surface, and a position facing the fan mounting portion of the heat sink. A cover having an intake / exhaust port on the top surface of the heat sink, and a fan mounted part of the heat sink located below the intake / exhaust port of the cover. A fan-integrated heating element cooling device including a cooling fan unit, wherein the driving circuit component of the fan unit is attached to at least one of the inner surface of the cover and the inner surface of the heat sink. 9. The fan-integrated heat-generating element cooling device according to claim 8, wherein a flat wiring board for electrically connecting between the drive circuit component of the fan unit and the fan unit is provided on the inner surface of the cover and A device attached to at least one of the inner surfaces of a heat sink. 10. A heat sink disposed on the upper surface of a heating element mounted on a substrate and having a plurality of heat radiation fins, and fixed so as to cover the upper surface of the heat sink,
A cover having an extension extending laterally of the heat sink and a fan unit attached to a lower portion of the extension of the cover are provided, and cooling air is supplied to the heat sink between the cover and the heat generating element by rotation of the fan unit. A fan-integrated heating element cooling device designed to guide the heat. 11. The fan-integrated heat-generating element cooling device according to claim 10, wherein an extension and exhaust port of the cover is provided and an outer side of the extension of the cover except the heat sink side is closed. A device that has a bottom plate that covers the bottom of the face plate and fan unit. 12. The fan-integrated heating element cooling device according to claim 11, wherein a baffle plate and an air flow, which are attached to the inner surface of the extension part of the cover and hang down between the heat sink and the fan unit, are attached to the heat sink. A device that has a guide that guides the heat radiation fins. 13. The fan-integrated heating element cooling device according to claim 12, wherein the guide has a shape capable of dividing the cooling air into upper and lower parts, and a ventilation hole is provided in a bottom plate under the fan unit. Equipment. 14. The fan-integrated heating element cooling device according to claim 10, further comprising a side plate that covers an outer side of the extension of the cover excluding the heat sink side and a bottom plate that covers a lower portion of the fan unit, An apparatus in which an intake / exhaust port is provided in the bottom plate, and intake / exhaust is performed through a gap between the bottom plate and the substrate. 15. The fan-integrated heating element cooling device according to claim 10, wherein the heat sink has a circular shape,
And the cover further comprises hooks on opposite sides of the edge for releasably engaging the heatsink edge. 16. The fan-integrated heat-generating element cooling device according to claim 10, wherein the heat-dissipating fins of the heat sink are locally disposed immediately above the heat-generating portion of the heat-generating element. 17. The fan-integrated heating element cooling device according to claim 16, wherein a guide wall is provided at least in a portion of the heat sink where the heat radiation fins are not provided so as to guide the cooling air to the heat radiation fins. Equipment.