JPH07283189A - Vapor cleaner - Google Patents

Vapor cleaner

Info

Publication number
JPH07283189A
JPH07283189A JP9922794A JP9922794A JPH07283189A JP H07283189 A JPH07283189 A JP H07283189A JP 9922794 A JP9922794 A JP 9922794A JP 9922794 A JP9922794 A JP 9922794A JP H07283189 A JPH07283189 A JP H07283189A
Authority
JP
Japan
Prior art keywords
cleaning
liq
steam
casing
storage tanks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9922794A
Other languages
Japanese (ja)
Inventor
Noritake Shimanoe
憲剛 島ノ江
Kazuhiko Kubota
和彦 窪田
Susumu Otsuka
進 大塚
Kenichi Kamimura
賢一 上村
Yoshihiro Mori
良弘 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP9922794A priority Critical patent/JPH07283189A/en
Publication of JPH07283189A publication Critical patent/JPH07283189A/en
Pending legal-status Critical Current

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  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To efficiently heat a washing liq. in the vapor cleaning, without causing uneven temp. distribution even when this uses a mixed liq. CONSTITUTION:A semiconductor wafer 2 is held with a carrier 4 in an upper space of a casing 1, storage tanks 3a and 3b are disposed in the bottom of the casing 1, washing liqs. S1 and S2 which are components of a washing liq. are separately stored in the tanks 3a and 3b and heaters 5a and 5b are disposed in the tanks 3a and 3b, respectively. The liqs. Sl and S2 are respectively heated to produce vapors by which a semiconductor wafer 2 is cleaned. This makes it practicable to do an adequate vapor production control for each chemical liq., prevent uneven temp. distribution in the mixed liq. and ensure a high- cleanness vapor cleaning.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、被洗浄体表面を蒸気洗
浄するための蒸気洗浄装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a steam cleaning apparatus for cleaning the surface of an object to be cleaned with steam.

【0002】[0002]

【従来の技術】従来、シリコンウェハやマスクなどの半
導体基板の表面には、その加工工程に於いて種々の不純
物が付着しており、それらを除去する洗浄法に蒸気洗浄
法がある(例えば特開平2−177327号・特開平5
−41139号公報)。そのような装置に於いて蒸気を
発生させるための加熱構造にあっては、洗浄液貯留槽の
外部にヒータを取り付けるなどしている。また、特開平
2−185031号公報には、一度発生させた水蒸気を
蒸気ノズルで吹き付ける前に再加熱することが開示され
ている。
2. Description of the Related Art Conventionally, various impurities are attached to the surface of a semiconductor substrate such as a silicon wafer or a mask during the process of processing, and a vapor cleaning method is known as a cleaning method for removing them. Kaihei No. 2-177327 / JP-A-5
-41139 gazette). In the heating structure for generating steam in such an apparatus, a heater is attached to the outside of the cleaning liquid storage tank. Further, JP-A-2-185031 discloses that steam once generated is reheated before being sprayed by a steam nozzle.

【0003】しかしながら、洗浄液に水を含む混合液
(HCL、HF、H22など)を用いる場合には、水溶
液中で対流による温度むらが生じ易く、時間経過で蒸気
の組成が変動する虞がある。また、一度加熱して発生さ
せた蒸気を再加熱すると、再加熱部分を高温に保たなけ
ればならず、蒸気中に微粒子の塵や金属を含み易く、ウ
ェハを汚染する虞がある。
However, when a mixed liquid containing water (HCL, HF, H 2 O 2, etc.) is used as the cleaning liquid, temperature unevenness due to convection easily occurs in the aqueous solution, and the composition of the steam may change over time. There is. Further, when the steam generated by heating once is reheated, the reheated portion has to be kept at a high temperature, and it is easy to contain fine particle dust or metal in the steam, which may contaminate the wafer.

【0004】[0004]

【発明が解決しようとする課題】このような従来技術の
問題点に鑑み、本発明の主な目的は、洗浄液に混合液を
用いた場合でも温度むらを生じることがなくかつ効率良
く加熱し得る蒸気洗浄装置を提供することにある。
In view of the problems of the prior art as described above, the main object of the present invention is to enable efficient heating without causing temperature unevenness even when a mixed solution is used as the cleaning solution. It is to provide a steam cleaning device.

【0005】[0005]

【課題を解決するための手段】このような目的は、本発
明によれば、ケーシングの上部空間に保持された被洗浄
体を蒸気洗浄するための洗浄液の蒸気を発生する蒸気発
生部を該ケーシングの下部に有する蒸気洗浄装置であっ
て、前記蒸気発生部が、前記洗浄液を構成する複数種の
薬液を別個に貯留するべく互いに独立して設けられた複
数の貯留槽と、前記各貯留槽の前記各薬液を個々に蒸発
させるべく前記各貯留槽毎に設けられた加熱手段とを有
することを特徴とする蒸気洗浄装置を提供することによ
り達成される。
According to the present invention, such an object is to provide a steam generating portion for generating a steam of a cleaning liquid for cleaning the object held in the upper space of the casing with the casing. In the vapor cleaning device having a lower portion, the vapor generating unit, a plurality of storage tanks provided independently of each other to separately store a plurality of types of chemical liquids constituting the cleaning liquid, and each of the storage tanks. This is achieved by providing a vapor cleaning apparatus characterized by comprising heating means provided for each of the storage tanks so as to individually vaporize each of the chemical liquids.

【0006】[0006]

【作用】このようにすれば、洗浄液を混合液で構成した
場合に個々の薬液毎に加熱することができ、混合液から
なる洗浄液を一度に加熱した場合に個々の薬液毎に生じ
るむらの発生を防止することができる。
With this configuration, when the cleaning liquid is composed of a mixed liquid, it can be heated for each individual chemical liquid, and when the cleaning liquid composed of the mixed liquid is heated at one time, unevenness occurs for each individual chemical liquid. Can be prevented.

【0007】[0007]

【実施例】以下、本発明の好適実施例を添付の図面につ
いて詳しく説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

【0008】図1は、本発明が適用された蒸気洗浄装置
を示す模式的縦断面図である。本装置では、図に示され
るように全面を覆われた容器状のケーシング1の上部空
間に被洗浄体としての半導体基板2が保持され、ケーシ
ング1の底面には、複数(図では2つ)の貯留槽3a・
3bが凹設されて設けられている。なお、半導体基板2
は、図の紙面の表裏方向に例えば25枚並列に並べられ
ており、骨組み構造にて長尺のかご状に形成されたキャ
リア4により支持されている。
FIG. 1 is a schematic vertical sectional view showing a steam cleaning apparatus to which the present invention is applied. In this apparatus, as shown in the figure, a semiconductor substrate 2 as an object to be cleaned is held in the upper space of a container-shaped casing 1 whose entire surface is covered, and a plurality of (two in the figure) are provided on the bottom surface of the casing 1. Storage tank 3a
3b is provided as a recess. The semiconductor substrate 2
For example, 25 sheets are arranged side by side in the front-back direction on the paper surface of the figure, and are supported by a carrier 4 formed in a long cage shape with a frame structure.

【0009】各貯留槽3a・3bには、半導体基板2を
蒸気洗浄するための洗浄液を構成する各薬液S1・S2
がそれぞれ貯留されている。洗浄液は、例えば水を含む
混合液(HCL、HF、H22など)であって良く、各
水溶液毎にまたは任意に組み合わせた混合液単位毎に分
けられて、貯留される。実施例では貯留槽3a・3bを
2槽設けた例が示されているが、3槽以上設けることは
何ら問題なく、混合液の各薬液の種類に合わせた数の貯
留槽を設けるようにしても良い。
In each of the storage tanks 3a and 3b, the chemical liquids S1 and S2 that form a cleaning liquid for cleaning the semiconductor substrate 2 with steam are used.
Are stored respectively. The cleaning liquid may be, for example, a mixed liquid containing water (HCL, HF, H 2 O 2 or the like), and is stored by being divided for each aqueous solution or each mixed liquid unit. In the embodiment, an example in which two storage tanks 3a and 3b are provided is shown. However, there is no problem in providing three or more storage tanks, and the number of storage tanks corresponding to the type of each chemical solution of the mixed solution is provided. Is also good.

【0010】また、各貯留槽3a・3bには、加熱手段
としてのヒータ5a・5bが設けられている。ヒータ5
a・5bは、図2に示されるように、貯留槽3a・3b
の底面に立設して互いに間隔をあけて並列に配設された
板状のガラス管内またはテフロン板内に電熱線を受容し
てなる。これら電熱線は各貯留槽3a・3b毎にまとめ
られて図示されない電熱制御装置に電気的に接続されて
いる。また、ガラス管を用いる場合には材質を石英ガラ
ス製にし、その外表面を耐薬液性を高めるべくテフロン
加工すると良い。なお、ヒータ5a・5bの形状を、図
の紙面の表裏方向に延在する壁状に形成しても良いが、
その場合には各ヒータ5a・5b間に洗浄液Sが容易に
回り込めるように、各ヒータ5の下部に貫通孔を設ける
と良い。
Further, the storage tanks 3a and 3b are provided with heaters 5a and 5b as heating means. Heater 5
a and 5b are storage tanks 3a and 3b, as shown in FIG.
The heating wires are received in plate-shaped glass tubes or Teflon plates which are erected on the bottom surface of the plate and are arranged in parallel with each other with a space therebetween. These heating wires are collected for each storage tank 3a and 3b and electrically connected to an electric heating control device (not shown). When a glass tube is used, it is preferable that the material is made of quartz glass and the outer surface of the glass tube is treated with Teflon to improve chemical resistance. The heaters 5a and 5b may be formed in a wall shape extending in the front and back directions on the paper surface of the drawing.
In that case, a through hole may be provided at the bottom of each heater 5 so that the cleaning liquid S can easily flow between the heaters 5a and 5b.

【0011】このようにして構成された蒸気洗浄装置に
あっては、半導体基板2を蒸気洗浄する際には、各貯留
槽3a・3b内の各薬液S1・S2をヒータ5により加
熱して、各薬液の蒸気を図の破線の矢印に示されるよう
に発生させる。各薬液S1・S2の蒸気は、ケーシング
1内を上昇するに連れて互いに混ざり合い、前記した組
成の洗浄液の蒸気となって半導体基板2に達する。な
お、前記した組成の混合液を用いることにより、金属や
パーティクル(付着粒子)を好適に取り除くことができ
る。さらに、蒸気中に含まれる金属は液中よりも1桁以
上少ない量であり、極めて清浄な液による洗浄を行うこ
とができる。
In the vapor cleaning apparatus thus constructed, when the semiconductor substrate 2 is vapor-cleaned, the chemicals S1 and S2 in the storage tanks 3a and 3b are heated by the heater 5, The vapor of each chemical solution is generated as shown by the dashed arrow in the figure. The vapors of the chemical liquids S1 and S2 are mixed with each other as they rise in the casing 1, and reach the semiconductor substrate 2 as vapors of the cleaning liquid having the above-described composition. By using the mixed solution having the above composition, metal and particles (adhered particles) can be suitably removed. Further, the amount of metal contained in the vapor is one digit or more smaller than that in the liquid, and the cleaning can be performed with an extremely clean liquid.

【0012】また、ミストの飛散を防止するべく、洗浄
液S1・S2を沸騰させないように温度を例えば95℃
以下に制御する。なお、貯留槽3a・3b内の適所に温
度センサを配置しておくことにより、上記制御が可能で
あり、さらに温度を変化させて蒸発量を制御することも
可能である。また、薬液毎に温度制御することにより、
薬液毎に最適な蒸気の発生を行わせることができ、各薬
液の量を最小限することができる。
Further, in order to prevent the mist from scattering, the temperature is set to 95 ° C. so that the cleaning liquids S1 and S2 are not boiled.
It controls below. The above control can be performed by disposing a temperature sensor in an appropriate place in each of the storage tanks 3a and 3b, and the evaporation amount can be controlled by further changing the temperature. Also, by controlling the temperature for each chemical,
Optimal vapor generation can be performed for each chemical liquid, and the amount of each chemical liquid can be minimized.

【0013】[0013]

【発明の効果】このように本発明によれば、互いに独立
した複数の貯留槽を設けており、蒸気洗浄用の洗浄液を
互いに異なる組成の薬液に分けてそれぞれを各貯留槽に
貯留し、それぞれに設けた加熱手段により加熱して蒸発
させることにより、各薬液に応じた適切な蒸発制御を行
うことができ、混合薬液からなる洗浄液を部分加熱した
場合などの洗浄むらを生じることなく、蒸気洗浄による
高清浄な洗浄を効率良く行うことができる。
As described above, according to the present invention, a plurality of storage tanks independent from each other are provided, and the cleaning liquid for steam cleaning is divided into chemical liquids having different compositions and stored in the respective storage tanks. By heating and evaporating by the heating means provided in, it is possible to perform appropriate evaporation control according to each chemical liquid, and to perform steam cleaning without causing uneven cleaning when the cleaning liquid consisting of mixed chemical liquid is partially heated. Highly clean cleaning can be efficiently performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明が適用された蒸気洗浄装置を示す模式的
縦断面図。
FIG. 1 is a schematic vertical sectional view showing a steam cleaning apparatus to which the present invention is applied.

【図2】蒸気洗浄装置の洗浄液貯留槽の部分拡大断面
図。
FIG. 2 is a partially enlarged sectional view of a cleaning liquid storage tank of the steam cleaning device.

【符号の説明】[Explanation of symbols]

1 ケーシング 2 半導体基板 3a・3b 貯留槽 4 キャリア 5a・5b ヒータ 1 Casing 2 Semiconductor Substrate 3a / 3b Storage Tank 4 Carrier 5a / 5b Heater

───────────────────────────────────────────────────── フロントページの続き (72)発明者 上村 賢一 光市大字島田3434番地 新日本製鐵株式会 社光製鐵所内 (72)発明者 森 良弘 光市大字島田3434番地 新日本製鐵株式会 社光製鐵所内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Kenichi Uemura, Komitsu-shi, Shimada 3434, Shin-Nippon Steel Co., Ltd.Inside of Komatsu Works (72) Inventor, Yoshihiro Mori, Koichi-shi, Shimada 3434, Nippon Steel Stock Association Inside the Shoko Ironworks

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ケーシングの上部空間に保持された被洗
浄体を蒸気洗浄するための洗浄液の蒸気を発生する蒸気
発生部を該ケーシングの下部に有する蒸気洗浄装置であ
って、 前記蒸気発生部が、前記洗浄液を構成する複数種の薬液
を別個に貯留するべく互いに独立して設けられた複数の
貯留槽と、前記各貯留槽の前記各薬液を個々に蒸発させ
るべく前記各貯留槽毎に設けられた加熱手段とを有する
ことを特徴とする蒸気洗浄装置。
1. A steam cleaning apparatus having a steam generator for generating steam of a cleaning liquid for cleaning the object to be cleaned held in an upper space of the casing in a lower portion of the casing, wherein the steam generator is , A plurality of storage tanks provided independently of each other to separately store a plurality of types of chemical liquids constituting the cleaning liquid, and provided for each storage tank to individually vaporize the chemical liquids of the storage tanks And a heating means provided therein.
JP9922794A 1994-04-12 1994-04-12 Vapor cleaner Pending JPH07283189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9922794A JPH07283189A (en) 1994-04-12 1994-04-12 Vapor cleaner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9922794A JPH07283189A (en) 1994-04-12 1994-04-12 Vapor cleaner

Publications (1)

Publication Number Publication Date
JPH07283189A true JPH07283189A (en) 1995-10-27

Family

ID=14241789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9922794A Pending JPH07283189A (en) 1994-04-12 1994-04-12 Vapor cleaner

Country Status (1)

Country Link
JP (1) JPH07283189A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6212789B1 (en) 1998-06-19 2001-04-10 Canon Sales Co., Inc. Semiconductor device manufacturing system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6212789B1 (en) 1998-06-19 2001-04-10 Canon Sales Co., Inc. Semiconductor device manufacturing system

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