JPH07183642A - Processing method for substrate - Google Patents

Abstract

PURPOSE:To detect an accurate processing position in a short time without using the CAD system by moving a stage under a condition, in which the processing position of a substrate for specifying the processing position is detected, fixing the stage, and processing the substrate for processing. CONSTITUTION:Fixing both chips onto a stage is performed by matching the angles of a lower left pad of both chips under the microscope and under the FIB equipment, then matching the angles of an upper right pad of both chips to lock. In this condition, as a stage 1 moves, a chip for processing moves under the FIB equipment 4, while a chip for specifying a processing position simultaneously moves under a microscope 5. Next, the chip for specifying the processing position is moved to under the microscope. Upon detection of a processing part 3CA of that circuit pattern 3C, a processing part 2CA of a pattern 2C of the processing chip comes to an irradiating position of a focusing ion of the FIB equipment. This enables an accurate processing position to be detected in a short time without using the CAD system.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing method,
In particular, it relates to detecting the position of the IC correction point in a focused ion beam (FIB) device.

In recent years, with the high integration and high density of ICs, FI
A modification technique for changing the circuit of a device pattern such as an IC or a reticle and improving the characteristics using the B device is indispensable in the manufacturing technology in order to improve the manufacturing yield and reliability.

For example, in order to prevent an electrical short circuit,
It is necessary to perform test processing using FIB equipment and perform accurate processing based on that information.

[0004]

2. Description of the Related Art Conventionally, in a process such as cutting a wiring using a FIB device or adding a coating, a method of specifying a processing position is to input design data into a CAD device,
The mainstream method is to specify the machining position on the CAD device.

FIG. 3 is an explanatory view of a processing method according to a conventional example. In the figure, 1 is the stage of the FIB device, 2 is the processing chip, 2C is the circuit pattern of the processing chip, 2CA is the processed part of the circuit pattern (correction part), 4 is the FIB device, and 6 is CA.
D device, 6C is circuit pattern on CAD device, 6CA is CAD
This is a modified portion of the circuit pattern on the device.

Next, the process of processing will be described with reference to FIG. FIG. 4 is a flow chart of processing according to a conventional example. The design data undergoes data conversion processing as it is modified, and CAD
Data for system startup is created and stored on a CAD disk.

Then, the machining position is designated on the CAD screen from the CAD disk, and the machining process is performed on the stage.

[0008]

Therefore, it takes a long time to convert the design data for starting the CAD system, and the stage movement amount from the CAD system deviates from the actual machining position due to the error of the stage motor. It may happen.

An object of the present invention is to detect an accurate machining position in a short time without using a CAD system.

[0010]

To solve the above-mentioned problems, the processing position specifying substrate having substantially the same circuit pattern as the processing substrate and the processing substrate are overlapped by the parallel movement of the respective circuit patterns. As described above, the apparatus is mounted and fixed on the same stage, the position detecting means for the processing position specifying substrate and the processing means for the processing substrate are provided on the stage, and the stage is moved to move the processing position specifying substrate. This is achieved by a substrate processing method in which the stage is fixed while the processing position is detected and the processing substrate is processed.

[0011]

In the present invention, the processing position specifying IC having the same circuit pattern as the processing substrate (IC) and the processing IC are placed on the same stage, and the processing position specifying IC is detected by the position detecting means (microscope or the like). When the processing position is detected by monitoring, the processing position of the processing IC that moves in parallel comes to the processing point of the device.

As a result, the conventional CAD system start-up data and data conversion processing are not required, the occurrence of human error is suppressed, and the error of the stage motor can be excluded.
In addition, the microscope has a deeper depth of focus than SEM (scanning electron microscope) images and SIMS (secondary ion mass spectrometry) images, so it is possible to observe even the underlying wiring pattern, and it is possible to process only the necessary parts. It will be easier.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an illustration of an embodiment of the present invention. In the figure, on the stage 1, for example, the FIB is on the X axis.
The device 4 and the microscope 5 are provided side by side, and the processing substrate (chip) 2 and the processing position specifying chip 3 are placed on the stage 1 and fixed as follows.

To fix both chips on the stage, for example, align the corners of the lower left pads of both chips under a microscope (position detecting means) and FIB device (processing means), and then adjust the corners of the upper right pads of both chips. Lock together. In this way, both chips are fixed at the position translated in parallel on the X axis without rotation of the figure.

In this state, as the stage 1 moves, the processing chip moves under the FIB device 4 and the processing position specifying chip moves under the microscope 5 at the same time. Next, move the processing position identification chip under the microscope and
When the processing point 3CA of 3 is detected, the processing point 2CA of the circuit pattern 2C of the processing chip comes to the focused ion irradiation position (processing position) of the FIB device.

FIG. 2 is a flow chart for explaining the embodiment. The processing process is simplified as shown in the following three processes. (1) Place the processing chip and the processing position specifying chip on the same stage.

(2) The processing position of the processing chip is designated from the search position of the processing position specifying chip on the stage.
(3) Perform processing on the stage.

In the embodiment, the microscope is used to detect the processing position of the processing position specifying chip, but a CCD camera or the like may be used.

[0019]

According to the present invention, it is possible to detect an accurate machining position in a short time without using a CAD system. Therefore, the data for the CAD system is not necessary and the throughput of the machining process can be improved. Can be improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an embodiment of the present invention.

FIG. 2 is a flowchart illustrating an embodiment.

FIG. 3 is an explanatory view of a processing method according to a conventional example.

FIG. 4 is a flow chart of processing according to a conventional example.

[Explanation of symbols]

 1 Stage of FIB equipment 2 Machining chip 2C Circuit pattern of machining chip 2CA Machining point (correction point) of circuit pattern 3 Machining position specifying chip 3C Machining position specifying chip circuit pattern 3CA Machining position specifying chip circuit pattern Machining location of 4 FIB equipment 5 Microscope 6 CAD equipment 6C Circuit pattern on CAD equipment 6CA Machining location of circuit pattern on CAD equipment

Claims (1)

[Claims] 1. A processing position specifying substrate having substantially the same circuit pattern as that of the processing substrate and the processing substrate are mounted and fixed on the same stage so that the respective circuit patterns are translated and overlapped. A position detecting means for the processing position specifying substrate and a processing means for the processing substrate are provided on the stage, and the stage is moved in a state in which the processing position of the processing position specifying substrate is detected. Fixed,
A method of processing a substrate, which comprises processing the substrate for processing.