JPH07169887A - Ic case fitted with heat sink - Google Patents
Ic case fitted with heat sinkInfo
- Publication number
- JPH07169887A JPH07169887A JP31616393A JP31616393A JPH07169887A JP H07169887 A JPH07169887 A JP H07169887A JP 31616393 A JP31616393 A JP 31616393A JP 31616393 A JP31616393 A JP 31616393A JP H07169887 A JPH07169887 A JP H07169887A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- case
- electrode
- electric power
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はヒートシンク付き集積回
路ケースに関し、特に論理回路ＩＣ等を搭載するための
ヒートシンク付きＩＣケースに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink integrated circuit case, and more particularly to a heat sink IC case for mounting a logic circuit IC or the like.
【０００２】[0002]
【従来の技術】従来ＩＣを搭載した集積ケースはプリン
ト基板に複数実装して使用される。この集積回路ケース
に搭載されているＩＣは、通電により発熱するが、集積
回路ケースの放熱のみではＩＣ内のジャンクション温度
を規定以内に抑えられない時、集積回路ケースの上面に
放熱用のヒートシンクを取り付けるが、この取り付け
は、接着剤等により接着固定している。2. Description of the Related Art Conventionally, a plurality of integrated cases each having an IC mounted thereon are mounted on a printed circuit board for use. The IC mounted in this integrated circuit case generates heat when energized, but when the junction temperature in the IC cannot be suppressed within the specified range only by heat dissipation of the integrated circuit case, a heat sink for heat dissipation is provided on the upper surface of the integrated circuit case. It is attached, but this attachment is fixed by adhesion with an adhesive or the like.
【０００３】また、ＩＣケースの上面へのヒートシンク
の取り付けを、接着剤ではなく押さえ部材により両側か
ら保持するものもある（例えば特開平０１−１１４０５
７号）。There is also a method in which a heat sink is attached to the upper surface of an IC case from both sides by a pressing member instead of an adhesive (for example, Japanese Patent Laid-Open No. 01-11405).
No. 7).
【０００４】[0004]
【発明が解決しようとする課題】この従来のヒートシン
ク付きＩＣケースでは、ＩＣケースと放熱用のヒートシ
ンクが一体構造であるため、より一層の冷却効果を得た
い場合、別に外部等に冷却用モータファンを取り付けて
冷却していた。このため、冷却用モータファンと供給電
源等を別に備える等、高価になる欠点があった。In this conventional IC case with a heat sink, since the IC case and the heat sink for heat dissipation are of an integral structure, if a further cooling effect is desired, a cooling motor fan is separately provided outside. Was attached and cooled. For this reason, there is a drawback that the cooling motor fan and the power supply and the like are separately provided, which makes the device expensive.
【０００５】それ故、本発明は、ＩＣケース本体の上面
に取り付けたヒートシンクを回転させて、より一層の冷
却効率が得られるヒートシンク付きＩＣケースを提供す
ることを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an IC case with a heat sink, in which a heat sink mounted on the upper surface of the IC case body is rotated to obtain further cooling efficiency.
【０００６】[0006]
【課題を解決するための手段】本発明のヒートシンク付
きＩＣケースは上記目的を達成するために、ＩＣとこの
ＩＣへの信号の送受および外部からの電力の供給を行う
リード線とを有するＩＣケース本体と、このＩＣケース
本体上面の中央部に配置されると共に前記リード線と接
続され、外部からの電力を供給する電極と、この電極に
接すると共に前記電力が供給される回転部と、この回転
部の動力により回転し風力を発生するヒートシンクとを
具備している。In order to achieve the above object, an IC case with a heat sink of the present invention has an IC and a lead wire for transmitting and receiving signals to and from the outside and supplying electric power from the outside. A main body, an electrode arranged in the center of the upper surface of the IC case main body and connected to the lead wire, for supplying electric power from the outside, and a rotating part which is in contact with the electrode and which is supplied with the electric power, and the rotating part. And a heat sink that rotates by the power of the unit to generate wind force.
【０００７】[0007]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例を示すヒートシンク付きＩ
Ｃケースの平面図、図２は図１におけるＸ−Ｘ断面図、
図３は本発明のヒートシンクの斜視図である。The present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the present invention with a heat sink I
2 is a plan view of the C case, FIG. 2 is a sectional view taken along line XX in FIG.
FIG. 3 is a perspective view of the heat sink of the present invention.
【０００８】図１および図２において、ＩＣケース本体
２には、ＩＣ１０への信号の送受並びに電力の供給を行
うためのリード線１が、ＩＣケース本体２の周囲に必要
数備え付けられている。このリード線１の内の１つが電
源（図示せず）の（＋）端子に接続され、もう１つ別の
リード線１がアース端子に接続されている。つまり、こ
のリード線の内少なくとも１組がモータ４ａに電力を供
給するようになっている。1 and 2, the IC case body 2 is provided with a required number of lead wires 1 around the IC case body 2 for transmitting and receiving signals to and from the IC 10. One of the lead wires 1 is connected to the (+) terminal of a power supply (not shown), and the other lead wire 1 is connected to the ground terminal. That is, at least one set of the lead wires supplies power to the motor 4a.
【０００９】また、ＩＣケース本体２の上面中央部に
は、リード線１が接続線９を介して接続され、外部から
の電力を供給する電極３が設けられており、上記リード
線１からの電力が接続線９を介して供給される。Further, the lead wire 1 is connected to the central portion of the upper surface of the IC case body 2 through a connecting wire 9, and an electrode 3 for supplying electric power from the outside is provided. Electric power is supplied via the connecting line 9.
【００１０】この様に構成されたＩＣケースは、リード
線１を通じて、通電することによりＩＣケース本体２内
部のＩＣ１０が動作状態になり発熱する。特に、高速論
理回路等により構成されるＩＣ１０は、消費電力が大き
くなるため、ＩＣケース本体２の放熱だけではＩＣ１０
のジャンクション温度が抑制させず、高温となり正常な
動作ができなくなる。In the IC case constructed as described above, when current is applied through the lead wire 1, the IC 10 inside the IC case body 2 is brought into an operating state and generates heat. In particular, since the IC10 including a high-speed logic circuit consumes a large amount of power, the IC10 main body 2 alone dissipates heat.
The junction temperature will not be suppressed and will become too high to operate normally.
【００１１】これを防止して、正常動作を保つためのヒ
ートシンク５とこのヒートシンク５を回転させてＩＣを
冷却する回転部４がＩＣケース本体２の上面に設けられ
ている。To prevent this, a heat sink 5 for maintaining normal operation and a rotating portion 4 for rotating the heat sink 5 to cool the IC are provided on the upper surface of the IC case body 2.
【００１２】この回転部４は、内部に例えば図２に示し
たモータ４ａを備えている。このモータ４ａは、ＩＣケ
ース本体２の上面に設けられた電極３と接しており、こ
の電極３からモータ４ａに電力が供給されて回転力が与
えられる。The rotating portion 4 has a motor 4a shown in FIG. 2 therein, for example. The motor 4a is in contact with the electrode 3 provided on the upper surface of the IC case body 2, and electric power is supplied from the electrode 3 to the motor 4a to give a rotational force.
【００１３】上記ヒートシンク５は、図３に示したよう
に、下部に円盤８を有し、その中央部に上記回転部４が
装着可能な穴７と、この穴７の外周から円盤８の上部
に、放射状で且つ等間隔に複数枚配置した冷却フィン６
とを有している。本実施例のヒートシンクは、アルミ板
等から成り、これには冷却フィン６が８枚配置されてい
る。また冷却フィン６の枚数は８枚に限られるものでは
なく、ヒートシンク５の形状も円形状に限らず四角形等
の形状でも良い。As shown in FIG. 3, the heat sink 5 has a disk 8 in the lower portion thereof, a hole 7 into which the rotating portion 4 can be mounted, and an upper portion of the disk 8 from the outer periphery of the hole 7 in the center thereof. In addition, a plurality of cooling fins 6 arranged radially at equal intervals
And have. The heat sink of this embodiment is made of an aluminum plate or the like, on which eight cooling fins 6 are arranged. Further, the number of the cooling fins 6 is not limited to eight, and the shape of the heat sink 5 is not limited to a circular shape and may be a square shape or the like.
【００１４】次に上記構成による本発明の動作について
説明する。Next, the operation of the present invention having the above configuration will be described.
【００１５】ＩＣケース本体２は、熱伝導性を持つモー
タ４ａによってヒートシンク５と係合しており、ＩＣケ
ース本体２で発生した熱はモータ４ａを通してヒートシ
ンク５に伝導され、ヒートシンクの冷却フィン６から放
熱され、更に、ＩＣケース本体２の表面からの熱がヒー
トシンクに空気を介して伝導する。The IC case body 2 is engaged with the heat sink 5 by the motor 4a having thermal conductivity, and the heat generated in the IC case body 2 is conducted to the heat sink 5 through the motor 4a, and the cooling fins 6 of the heat sink. The heat is dissipated, and further the heat from the surface of the IC case body 2 is conducted to the heat sink via air.
【００１６】更に、回転部４内のモータ４ａは、ＩＣケ
ース本体２上面の中央部に配置された電極３と電気的に
接続するように固定されているので、電極３から電力が
供給される。そして、この回転部４内のモータ４ａに動
力が与えられ、回転部４に装着されたヒートシンク５が
回転する。このヒートシンクの回転に従って風力が発生
し、ＩＣケース本体２からの熱が放散されるため、より
一層冷却される。Further, since the motor 4a in the rotating portion 4 is fixed so as to be electrically connected to the electrode 3 arranged in the central portion of the upper surface of the IC case body 2, electric power is supplied from the electrode 3. . Then, power is applied to the motor 4a in the rotating unit 4, and the heat sink 5 mounted on the rotating unit 4 rotates. Wind force is generated according to the rotation of the heat sink, and the heat from the IC case body 2 is dissipated, so that it is further cooled.
【００１７】本発明の実施例によれば、冷却フィン６を
備えたヒートシンク５そのものが回転して送風するた
め、別個に冷却用モータファン等を備える必要がない。According to the embodiment of the present invention, since the heat sink 5 itself having the cooling fins 6 rotates and blows air, it is not necessary to separately provide a cooling motor fan or the like.
【００１８】また、前記ヒートシンク５は、円盤の下部
に冷却フィンを有するような構成、あるいは円盤の上部
および下部に冷却フィンを有するような構成でも良い。The heat sink 5 may have a cooling fin on the lower part of the disk or a cooling fin on the upper and lower parts of the disk.
【００１９】[0019]
【発明の効果】以上説明したように、本発明は、ＩＣケ
ースに取り付けたヒートシンクを回転することにより、
より一層の冷却効率を向上させることができる。As described above, according to the present invention, by rotating the heat sink attached to the IC case,
The cooling efficiency can be further improved.
【図１】本発明の一実施例を示すヒートシンク付きＩＣ
ケースの平面図である。FIG. 1 is an IC with a heat sink showing an embodiment of the present invention.
It is a top view of a case.
【図２】図１におけるＸ−Ｘ断面図である。FIG. 2 is a sectional view taken along line XX in FIG.
【図３】本発明の一実施例のヒートシンクの斜視図であ
る。FIG. 3 is a perspective view of a heat sink according to an embodiment of the present invention.
１ リード線 ２ ＩＣケース本体 ３ 電極 ４ 回転部 ４ａ モータ ５ ヒートシンク ６ 冷却フィン ７ 穴 ８ 円盤 ９ 接続線 １０ ＩＣ 1 Lead Wire 2 IC Case Body 3 Electrode 4 Rotating Part 4a Motor 5 Heat Sink 6 Cooling Fin 7 Hole 8 Disc 9 Connection Wire 10 IC
Claims (2)
部からの電力の供給を行うリード線とを有するＩＣケー
ス本体と、 このＩＣケース本体上面の中央部に配置されると共に前
記リード線と接続され、外部からの電力を供給する電極
と、 この電極に接すると共に前記電力が供給される回転部
と、 この回転部の動力により回転し風力を発生するヒートシ
ンクと、 を具備することを特徴とするヒートシンク付きＩＣケー
ス。1. An IC case body having an IC and a lead wire for transmitting and receiving signals to and from the outside and supplying electric power from the outside, and the lead wire which is arranged at a central portion of an upper surface of the IC case body. An electrode that is connected and supplies electric power from the outside, a rotating unit that is in contact with the electrode and that is supplied with the electric power, and a heat sink that is rotated by the power of the rotating unit to generate wind force. IC case with heat sink.
その中央部に前記回転部を装着させる穴と、この穴の外
周から前記板上に複数枚配置した冷却フィンを有するこ
とを特徴とする請求項１記載のヒートシンク付きＩＣケ
ース。2. The heat sink has a plate at the bottom,
The IC case with a heat sink according to claim 1, further comprising: a hole for mounting the rotating portion in a central portion thereof, and a plurality of cooling fins arranged on the plate from an outer periphery of the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31616393A JPH07169887A (en) | 1993-12-16 | 1993-12-16 | Ic case fitted with heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31616393A JPH07169887A (en) | 1993-12-16 | 1993-12-16 | Ic case fitted with heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07169887A true JPH07169887A (en) | 1995-07-04 |
Family
ID=18073989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31616393A Pending JPH07169887A (en) | 1993-12-16 | 1993-12-16 | Ic case fitted with heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07169887A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309439B1 (en) | 1995-06-13 | 2001-10-30 | K + S Aktiengesellschaft | Coated fertilizer granules |
| US8228675B2 (en) * | 2007-12-18 | 2012-07-24 | Sandia Corporation | Heat exchanger device and method for heat removal or transfer |
| US9207023B2 (en) | 2007-12-18 | 2015-12-08 | Sandia Corporation | Heat exchanger device and method for heat removal or transfer |
| US9507391B2 (en) | 2011-11-28 | 2016-11-29 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Heat sink with orientable fins |
| US9795961B1 (en) | 2010-07-08 | 2017-10-24 | National Technology & Engineering Solutions Of Sandia, Llc | Devices, systems, and methods for detecting nucleic acids using sedimentation |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255000A (en) * | 1985-09-04 | 1987-03-10 | 松下電器産業株式会社 | Heat sink apparatus |
| JPH0613512A (en) * | 1992-06-25 | 1994-01-21 | Hitachi Ltd | Semiconductor sealing package and cooling method thereof |
-
1993
- 1993-12-16 JP JP31616393A patent/JPH07169887A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255000A (en) * | 1985-09-04 | 1987-03-10 | 松下電器産業株式会社 | Heat sink apparatus |
| JPH0613512A (en) * | 1992-06-25 | 1994-01-21 | Hitachi Ltd | Semiconductor sealing package and cooling method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309439B1 (en) | 1995-06-13 | 2001-10-30 | K + S Aktiengesellschaft | Coated fertilizer granules |
| US8228675B2 (en) * | 2007-12-18 | 2012-07-24 | Sandia Corporation | Heat exchanger device and method for heat removal or transfer |
| US9207023B2 (en) | 2007-12-18 | 2015-12-08 | Sandia Corporation | Heat exchanger device and method for heat removal or transfer |
| US9795961B1 (en) | 2010-07-08 | 2017-10-24 | National Technology & Engineering Solutions Of Sandia, Llc | Devices, systems, and methods for detecting nucleic acids using sedimentation |
| US9507391B2 (en) | 2011-11-28 | 2016-11-29 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Heat sink with orientable fins |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2938704B2 (en) | Integrated circuit package | |
| US6702000B2 (en) | Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus | |
| JPH0677679A (en) | Method and apparatus for mounting of electric element on circuit board | |
| JP2002134973A (en) | Heat sink device and electronic equipment | |
| JPH08255858A (en) | Cooling system of electronic package | |
| JPH09321477A (en) | Heat generating body cooling device | |
| JP2003031744A (en) | Semiconductor device | |
| JP2845833B2 (en) | heatsink | |
| JPH07169887A (en) | Ic case fitted with heat sink | |
| JPH0661390A (en) | Cooling structure of semiconductor integrated circuit element, semiconductor integrated circuit element cooling board provided therewith, and computer semiconductor integrated circuit element cooling structure provided therewith | |
| JPH07106721A (en) | Printed circuit board and heat radiating method | |
| JPH09213849A (en) | Cooler of liquid-cooled heat sink | |
| JPH06318486A (en) | Ic part mounting pin socket and collective socket | |
| JPH06244575A (en) | Radiator | |
| JP2000124371A (en) | Cooling structure for electric apparatus | |
| JP2919313B2 (en) | Printed wiring board and its mounting method | |
| JP2765242B2 (en) | Integrated circuit device | |
| JPH0730026A (en) | Semiconductor sealing package and cooling method therefor | |
| JP3013612B2 (en) | Semiconductor device | |
| JP4258797B2 (en) | Fan motor cooling device | |
| JP3509287B2 (en) | Brushless DC motor | |
| JPH08316385A (en) | Heat dissipation component of package for pin grid array | |
| CN218162031U (en) | Motor casing with novel structure | |
| JP2001274299A (en) | Heat sink and electronic device using the same | |
| JPH1168367A (en) | Cooling structure of heat releasing element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19961203 |