JPH07151522A - Electronic part inspecting device - Google Patents
Electronic part inspecting deviceInfo
- Publication number
- JPH07151522A JPH07151522A JP5298242A JP29824293A JPH07151522A JP H07151522 A JPH07151522 A JP H07151522A JP 5298242 A JP5298242 A JP 5298242A JP 29824293 A JP29824293 A JP 29824293A JP H07151522 A JPH07151522 A JP H07151522A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- dimensional image
- lead
- holding device
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品製造工程ある
いは電子回路基板製造工程において用いる、電子部品の
リ−ド浮き検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead floating inspection apparatus for electronic components used in an electronic component manufacturing process or an electronic circuit board manufacturing process.
【０００２】[0002]
【従来の技術】ＱＦＰ（クァドフラットパッケ−ジ）部
品のような多数のリ−ドを有する電子部品において、上
方への変形、いわゆる「浮き」のあるリ−ドが存在する
と、接続不良が発生する。このような電子部品は回路基
板に装着する前に発見し、浮きを矯正する等の対策を講
じなければならない。かかる目的のための検査装置とし
て、特開平１−２６５１４４号公報に記載されたものを
挙げることができる。この装置ではリ−ドの平面投影写
像の長短からリ−ド浮きを判定しているが、僅かの寸法
差から正常なリ−ドとそうでないリ−ドを見分けるのは
容易なことではなく、変形量の定量的計測も困難という
問題をかかえている。特開平１−２８４７４４号公報記
載の装置では、光軸を傾斜させた撮像装置と光源の組み
合わせを四方に置き、その光軸をリ−ドが遮る位置に電
子部品を搬送して、リ−ド浮きを検査している。この装
置によれば変形量の計測は正確に行えるが、前提条件と
して電子部品を水平面内で正確に位置決めする必要があ
り、平面計測装置を設けねばならない。特開平３−２０
８４００号公報に紹介された装置では、相対する光源と
光センサを４組、井桁状のハウジングに取り付け、電子
部品の四辺のリ−ドを真横からすかし見て浮きを検査す
る。この装置も変形量を正確に計測でき、四辺を同時に
検査するため所要時間が短いという特徴を有するが、光
源と光センサの間にリ−ドが収まるようなサイズの電子
部品しか扱えないという欠点があった。2. Description of the Related Art In an electronic component having a large number of leads such as a QFP (quad flat package) component, if there is a lead with upward deformation, so-called "floating", connection failure will occur. Occur. Such electronic components must be found before they are mounted on a circuit board, and measures must be taken to correct floating. As an inspection apparatus for this purpose, the one described in JP-A-1-265144 can be mentioned. In this device, the lead floating is determined from the length of the plane projection map of the lead, but it is not easy to distinguish a normal lead and a lead not based on a slight dimensional difference. It has a problem that it is difficult to quantitatively measure the amount of deformation. In the device described in Japanese Patent Application Laid-Open No. 1-284744, a combination of an image pickup device with a tilted optical axis and a light source is placed on four sides, and an electronic component is conveyed to a position where the optical axis is blocked by a lead, and the lead is read. Checking for floating. With this device, the amount of deformation can be measured accurately, but as a prerequisite, it is necessary to accurately position the electronic component in the horizontal plane, and a flat surface measurement device must be provided. Japanese Patent Laid-Open No. 3-20
In the apparatus introduced in Japanese Patent No. 8400, four pairs of light sources and optical sensors facing each other are mounted on a cross-shaped housing, and the leads on the four sides of the electronic component are scanned from right side to inspect the floating. This device also has the characteristic that the amount of deformation can be measured accurately and the required time is short because four sides are inspected at the same time, but it can handle only electronic components of a size that fits the lead between the light source and the optical sensor. was there.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、リ−ドの上
下方向の変形量の定量的計測が可能で、電子部品の保持
位置のばらつきに関しても、電子部品のサイズの差に関
しても、許容度の大きい電子部品検査装置を提供するこ
とを目的とする。The present invention is capable of quantitatively measuring the amount of vertical deformation of a lead, and is tolerant of variations in the holding position of electronic components and differences in the size of electronic components. It is an object of the present invention to provide an electronic component inspection device with high frequency.
【０００４】[0004]
【課題を解決するための手段】第１発明に係わる電子部
品検査装置は、以下の構成を備えている。 ａ．電子部品保持装置。 ｂ．前記電子部品保持装置に保持された電子部品のリ−
ドを異なる角度から撮影する２台のカメラ。 ｃ．前記２台のカメラで得た映像を合成して３次元像を
形成し、その３次元像を解析してリ−ドの変形量を求め
る画像処理装置。An electronic component inspection apparatus according to the first invention has the following configuration. a. Electronic component holding device. b. Electronic component held by the electronic component holding device
Two cameras that take pictures from different angles. c. An image processing apparatus for synthesizing images obtained by the two cameras to form a three-dimensional image, and analyzing the three-dimensional image to obtain a lead deformation amount.
【０００５】第２発明に係わる電子部品検査装置は、以
下の構成を備えている。 ａ．電子部品保持装置。 ｂ．前記電子部品保持装置に保持された電子部品のリ−
ドを異なる角度から観察 するための２系統の光学系。 ｃ．前記２系統の光学系を経由する像を、片方づつ１台
のカメラに入射させる光路切替装置。 ｄ．前記カメラに入射した片方づつの像を合成して３次
元像を形成し、その３次元像を解析してリ−ドの変形量
を求める画像処理装置。An electronic component inspection apparatus according to the second invention has the following configuration. a. Electronic component holding device. b. Electronic component held by the electronic component holding device
Two optical systems for observing images from different angles. c. An optical path switching device that makes an image passing through the two optical systems enter one camera, one by one. d. An image processing apparatus for forming a three-dimensional image by synthesizing the respective images incident on the camera, and analyzing the three-dimensional image to obtain a lead deformation amount.
【０００６】[0006]
【作用】電子部品保持装置に保持された電子部品は、異
なる角度から撮影され、あるいは異なる角度から観察さ
れ、二通りの像を生じる。その像を合成して３次元像を
形成し、その３次元像の解析により、どのリ−ドに浮き
が発生しているか、変形量はいくらかを知る。The electronic component held by the electronic component holding device is photographed from different angles or observed from different angles, and produces two images. The images are combined to form a three-dimensional image, and by analysis of the three-dimensional image, it is possible to know which lead has floating and what the deformation amount is.
【０００７】[0007]
【実施例】図１により第１発明を説明する。１は４辺に
リ−ド２の列を有するＱＦＰ形電子部品である。電子部
品検査装置１０の電子部品保持装置１１は、吸引ノズル
１２により電子部品１を吸着保持するものであって、図
示しない移動装置により空間内を移動し、電子部品１の
ピックアンドプレ−スを行う。移動装置としては、ロ−
タリ−インデックステ−ブル、直角座標型ロボット、多
関節型ロボット等を用いることができる。吸引ノズル１
２は電子部品保装置本体から下方に進出可能である。吸
引ノズル１２の、先端より少し上の位置には背景板１３
を固定する。背景板１３は、電子部品１の背後に均一な
明度・色調の背景をつくり、電子部品１の認識を容易に
する役割を担う。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The first invention will be described with reference to FIG. Reference numeral 1 is a QFP type electronic component having a row of leads 2 on four sides. The electronic component holding device 11 of the electronic component inspection device 10 sucks and holds the electronic component 1 by the suction nozzle 12, and moves in the space by a moving device (not shown) to pick and place the electronic component 1. To do. As a mobile device,
A tally index table, a Cartesian coordinate type robot, an articulated robot, etc. can be used. Suction nozzle 1
2 can move downward from the main body of the electronic component holder. The background plate 13 is located at a position slightly above the tip of the suction nozzle 12.
To fix. The background plate 13 forms a background of uniform brightness and color behind the electronic component 1 and plays a role of facilitating the recognition of the electronic component 1.
【０００８】１４はリング状の照明装置である。照明装
置１４の内径は、背景板１３の通過を許す、あるいは吸
引ノズル１２に吸着された電子部品１の下方からの観察
を可能にする寸法になっている。照明装置１４は、電子
部品保持装置１１と共に移動装置に保持されるか、ある
いは電子部品保持装置１１から独立して固定位置に支持
される。照明装置１４は内面一面に多数の発光体１５を
有し、電子部品１を斜め下方から照らす。発光体１５と
しては発光ダイオ−ドを用いることができる。発光ダイ
オ−ドは、同色のものをもって、あるいは異なる色のも
ののとり合わせをもって、群とする。Reference numeral 14 is a ring-shaped lighting device. The inner diameter of the illuminating device 14 is dimensioned to allow the background plate 13 to pass therethrough or allow the electronic component 1 adsorbed by the suction nozzle 12 to be observed from below. The illumination device 14 is held together with the electronic component holding device 11 in a moving device, or is supported at a fixed position independently of the electronic component holding device 11. The lighting device 14 has a large number of light emitters 15 on the entire inner surface, and illuminates the electronic component 1 obliquely from below. A light emitting diode can be used as the light emitter 15. The light emitting diodes are grouped with the same color or with a combination of different colors.
【０００９】１６、１７はカメラである。カメラとして
は工業用テレビカメラを使用する。１８、１９は電子部
品保持装置１１の中心からの垂線に関し点対称の位置に
設けられた台座で、カメラ１６、１７を、それぞれ電子
部品１を斜め下から仰ぎ見るような形に取り付けてい
る。カメラ１６、１７はいずれも電子部品１の全景を視
野におさめる。Reference numerals 16 and 17 denote cameras. An industrial TV camera is used as the camera. Reference numerals 18 and 19 denote pedestals provided at positions symmetrical with respect to a vertical line from the center of the electronic component holding device 11, and the cameras 16 and 17 are attached to the electronic component 1 so that the electronic component 1 is looked up obliquely from below. Each of the cameras 16 and 17 holds the entire view of the electronic component 1 in view.
【００１０】２０は撮像部制御装置で、カメラ１６、１
７と照明装置１４を制御する。２１は画像処理装置であ
る。２２は電子部品検査装置１０全体の動作を司る制御
装置である。Reference numeral 20 denotes an image pickup unit control device, which is a camera 16, 1
7 and the lighting device 14 are controlled. Reference numeral 21 is an image processing apparatus. Reference numeral 22 denotes a control device that controls the overall operation of the electronic component inspection device 10.
【００１１】電子部品検査装置１０の動作は次のように
なる。まず電子部品保持装置１１が図示しない部品供給
装置から電子部品１をピックアップし、照明装置１４の
上方に位置決めする。適当な照明条件のもとで、カメラ
１６、１７が電子部品１の像を異なる角度から撮影す
る。２方向からの像は画像処理装置２１で合成され、３
次元像となる。その３次元像を画像処理装置２１で解析
し、どのリ−ド２に浮きが発生しているかを知り、変形
量を計測する。リ−ド２の変形が許容範囲内の電子部品
１はそのまま図示しない回路基板に装着するが、リ−ド
２の変形が許容範囲を超えているものは装着作業に移行
することなく矯正工程にまわす。なお画像処理装置２１
は、リ−ド２の上下方向の変形だけでなく、水平方向の
変形、また電子部品１の位置ずれ、角度ずれも計測す
る。The operation of the electronic component inspection apparatus 10 is as follows. First, the electronic component holding device 11 picks up the electronic component 1 from a component supply device (not shown) and positions it above the lighting device 14. Under appropriate lighting conditions, the cameras 16 and 17 capture images of the electronic component 1 from different angles. The images from the two directions are combined by the image processing device 21 and
It becomes a three-dimensional image. The three-dimensional image is analyzed by the image processing device 21, and it is known which lead 2 is floating, and the deformation amount is measured. The electronic component 1 in which the deformation of the lead 2 is within the permissible range is mounted on the circuit board (not shown) as it is, but when the deformation of the lead 2 exceeds the permissible range, the electronic component 1 is subjected to the correction process without shifting to the mounting work. Turn around. The image processing device 21
Measures not only the vertical deformation of the lead 2 but also the horizontal deformation, the positional deviation and the angular deviation of the electronic component 1.
【００１２】電子部品検査装置１０において、電子部品
１のリ−ド２が常に一定高さに置かれるものとすれば、
カメラ１６、１７のレンズは固定焦点にしておけば良い
が、何らかの理由によりリ−ド２の高さを変えて観測せ
ざるを得ないような場合にはズ−ムレンズを用いるか、
カメラ全体を光軸方向に移動させる駆動装置を設け、撮
像部制御装置２０で合焦操作を行うことになる。また必
要とあらば台座１８、１９に電動式のものを用い、カメ
ラ１６、１７の仰角を変え、視野をずらすことも可能で
ある。In the electronic component inspection apparatus 10, if the lead 2 of the electronic component 1 is always placed at a constant height,
The lenses of the cameras 16 and 17 may be fixed in focus, but if for some reason the height of the lead 2 must be changed for observation, use a zoom lens, or
A driving device that moves the entire camera in the optical axis direction is provided, and the imaging unit control device 20 performs the focusing operation. If necessary, electric mounts can be used for the pedestals 18 and 19 and the elevation angles of the cameras 16 and 17 can be changed to shift the fields of view.
【００１３】次に図２に基づき第２発明を説明する。第
１発明と共通の構成要素には前と同じ符号を付し、説明
を略す。電子部品検査装置３０は移動ハウジング３１を
有する。移動ハウジング３１は図示しない直角座標型移
動装置により空間内を移動するものであり、この中に電
子部品保持装置１１及び照明装置１４が配置されてい
る。３２、３３は電子部品１の全景を異なる角度から観
察するための２系統の光学系であって、同じく移動ハウ
ジング３１に配置されている。光学系３２、３３は電子
部品保持装置１１の中心からの垂線に関し対称位置にあ
り、いずれも、電子部品１を斜め下から仰ぎ見るレンズ
３４と、レンズ３４から出た光を屈折させるプリズム３
５、３６、３７を有する。プリズム３７により水平に方
向転換させられた光は移動ハウジング３１の中央の傾斜
鏡３８に当り、垂直に方向を変えてカメラ３９に入射す
る。傾斜鏡３８は、光学系３２、３３の各々に対応し
て、垂線に対し４５°の角度をなす反射面を両側に備え
ており、水平方向にシフトすることにより一方の光学系
を経由した像のみをカメラ３９に入射させる。傾斜鏡３
８と、そのシフト装置４０が光路切替装置４１を構成す
る。光路切替装置４１はカメラ３９、照明装置１４と共
に撮像部制御装置２０により制御され、移動ハウジング
３１の移動装置は電子部品保持装置１１と共に制御装置
２２により制御される。Next, the second invention will be described with reference to FIG. The same components as those in the first aspect of the invention are designated by the same reference numerals, and the description thereof will be omitted. The electronic component inspection device 30 has a movable housing 31. The moving housing 31 is moved in the space by a rectangular coordinate type moving device (not shown), and the electronic component holding device 11 and the illuminating device 14 are arranged therein. Reference numerals 32 and 33 denote two optical systems for observing the entire view of the electronic component 1 from different angles, which are also arranged in the moving housing 31. The optical systems 32 and 33 are located symmetrically with respect to a vertical line from the center of the electronic component holding device 11, and both of them have a lens 34 that looks up the electronic component 1 obliquely from below and a prism 3 that refracts light emitted from the lens 34.
5, 36, 37. The light that is horizontally redirected by the prism 37 strikes the tilting mirror 38 at the center of the moving housing 31, changes its direction vertically, and enters the camera 39. The tilting mirror 38 is provided with reflecting surfaces on both sides corresponding to each of the optical systems 32 and 33 and forming an angle of 45 ° with respect to the perpendicular, and by shifting in the horizontal direction, an image passing through one of the optical systems is passed. Only the camera 39 is made incident. Tilting mirror 3
8 and the shift device 40 thereof constitute an optical path switching device 41. The optical path switching device 41 is controlled by the imaging unit control device 20 together with the camera 39 and the illumination device 14, and the moving device of the moving housing 31 is controlled by the control device 22 together with the electronic component holding device 11.
【００１４】電子部品検査装置３０の動作は次のように
なる。移動ハウジング３１を図示しない部品供給装置の
上に移動させ、電子部品保持装置１１に電子部品１をピ
ックアップさせる。照明装置１４の上に電子部品１を位
置決めし、まず光学系３２でとらえた像をカメラ３９に
入射させる。その像は画像処理装置２１の中の記憶部に
記憶される。次に傾斜鏡３８をシフトし、光学系３３で
とらえた電子部品１の像をカメラ３９に入射させる。そ
の像と記憶部に貯えていた像を合成し、電子部品１の３
次元像を得る。後は第１発明と同様、３次元像を画像処
理装置２１で解析し、どのリ−ド２に浮きが発生してい
るかを知り、変形量を計測する。リ−ド２の変形が許容
範囲内であれば電子部品１を装着工程に送り、リ−ド２
の変形が許容範囲を超えていれば装着作業に移行するこ
となく矯正工程にまわす。画像処理装置２１がリ−ド２
の水平方向の変形、また電子部品１の位置ずれ、角度ず
れをも計測することは第１発明の場合と変わらない。The operation of the electronic component inspection device 30 is as follows. The moving housing 31 is moved onto a component supply device (not shown), and the electronic component holding device 11 picks up the electronic component 1. The electronic component 1 is positioned on the lighting device 14, and the image captured by the optical system 32 is first made incident on the camera 39. The image is stored in the storage unit in the image processing device 21. Next, the tilt mirror 38 is shifted so that the image of the electronic component 1 captured by the optical system 33 is made incident on the camera 39. The image and the image stored in the storage unit are combined, and the electronic component 1 3
Get a three-dimensional image. After that, as in the first invention, the three-dimensional image is analyzed by the image processing device 21 to know in which lead 2 the floating occurs, and the deformation amount is measured. If the deformation of the lead 2 is within the allowable range, the electronic component 1 is sent to the mounting process, and the lead 2
If the deformation of is beyond the allowable range, it is sent to the correction process without shifting to the mounting work. Image processing device 21 is lead 2
The horizontal deformation, measurement of the positional deviation, and angular deviation of the electronic component 1 are the same as in the case of the first invention.
【００１５】[0015]
【発明の効果】本発明では、２台のカメラまたは２系統
の光学系を用いて電子部品の３次元像を形成し、その３
次元像を解析してリ−ドの浮きを計測するものであるか
ら、浮き量の定量的計測が可能であることは勿論、電子
部品がカメラまたは光学系の視野内にあれば３次元像の
合成が可能なので、電子部品の位置のばらつき、また電
子部品のサイズの差に対する許容度が大きく、電子部品
の水平面に対する傾きもある程度許容できる。これらが
あいまって、利用可能範囲の広い電子部品検査装置とな
った。According to the present invention, two cameras or two optical systems are used to form a three-dimensional image of an electronic component.
Since the floating of the lead is measured by analyzing the three-dimensional image, it is possible to quantitatively measure the floating amount. Of course, if the electronic component is within the visual field of the camera or optical system, the three-dimensional image Since synthesizing is possible, there is a large tolerance for variations in the positions of electronic components and differences in the sizes of electronic components, and the inclination of the electronic components with respect to the horizontal plane is also acceptable to some extent. Together, these become a wide range of electronic component inspection equipment.
【図１】第１発明を示す概略構成図である。FIG. 1 is a schematic configuration diagram showing a first invention.
【図２】第２発明を示す概略構成図である。FIG. 2 is a schematic configuration diagram showing a second invention.
１ 電子部品 ２ リ−ド １０ 電子部品検査装置 １１ 電子部品保持装置 １６ カメラ １７ カメラ ２１ 画像処理装置 ３２ 光学系 ３３ 光学系 ３９ カメラ ４１ 光路切替装置 DESCRIPTION OF SYMBOLS 1 electronic component 2 lead 10 electronic component inspection device 11 electronic component holding device 16 camera 17 camera 21 image processing device 32 optical system 33 optical system 39 camera 41 optical path switching device
Claims (2)
ドを異なる角度から撮影する２台のカメラ。 ｃ．前記２台のカメラで得た映像を合成して３次元像を
形成し、その３次元像を解析してリ−ドの変形量を求め
る画像処理装置。1. An electronic component inspection apparatus having the following configuration. a. Electronic component holding device. b. Electronic component held by the electronic component holding device
Two cameras that take pictures from different angles. c. An image processing apparatus for synthesizing images obtained by the two cameras to form a three-dimensional image, and analyzing the three-dimensional image to obtain a lead deformation amount.
ドを異なる角度から観察するための２系統の光学系。 ｃ．前記２系統の光学系を経由する像を、片方づつ１台
のカメラに入射させる光路切替装置。 ｄ．前記カメラに入射した片方づつの像を合成して３次
元像を形成し、その３次元像を解析してリ−ドの変形量
を求める画像処理装置。2. An electronic component inspection device having the following configuration. a. Electronic component holding device. b. Electronic component held by the electronic component holding device
Two optical systems for observing images from different angles. c. An optical path switching device that makes an image passing through the two optical systems enter one camera, one by one. d. An image processing apparatus for forming a three-dimensional image by synthesizing the respective images incident on the camera, and analyzing the three-dimensional image to obtain a lead deformation amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5298242A JPH07151522A (en) | 1993-11-29 | 1993-11-29 | Electronic part inspecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5298242A JPH07151522A (en) | 1993-11-29 | 1993-11-29 | Electronic part inspecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07151522A true JPH07151522A (en) | 1995-06-16 |
Family
ID=17857081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5298242A Pending JPH07151522A (en) | 1993-11-29 | 1993-11-29 | Electronic part inspecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07151522A (en) |
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|---|---|---|---|---|
| JP2003504607A (en) * | 1999-07-13 | 2003-02-04 | ビーティ エルウィン エム | Apparatus and method for three-dimensional inspection of electronic components |
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-
1993
- 1993-11-29 JP JP5298242A patent/JPH07151522A/en active Pending
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| JP2008078399A (en) * | 2006-09-21 | 2008-04-03 | Yamaha Motor Co Ltd | Component recognition method, component recognition apparatus, surface mounting apparatus, and component inspection apparatus |
| JP2010507079A (en) * | 2006-10-16 | 2010-03-04 | フラウンホッファー−ゲゼルシャフト ツァー フェーデルング デア アンゲバンテン フォルシュング エー ファー | Apparatus and method for non-contact detection of 3D contours |
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