JPH0669615A - Printed wiring board - Google Patents

Abstract

PURPOSE:To enable precision position recognition without irregular reflection of detection light at a resist by providing a non-resist region of a specified area to a periphery of a recognition mark. CONSTITUTION:The title device is a printed wiring board with a recognition mark which recognizes a mounting position of a surface package component by an image and corrects a position. A non-resist region whose area is 2.5 to 19.0 times that of a recognition mark 1 is provided to a periphery of the mark 1 and a resist 2 is formed. When an area of the non-resist region is made at most 2.5 times that of the recognition mark 1, mount accuracy of the surface package component rapidly lowers due to influence of irregular reflection of detection light from the resist 2. Meanwhile, when it is made at least 19.0 times an area of the recognition mark 1, design is interfered with in relation to influence on an adjacent pad and a lower wiring. It is most desirable to make it 3.0 to 7.5 times. By adopting such a means, high precision position recognition can be carried out without generating false recognition due to irregular reflection of the resist 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for automatically mounting surface mounting components by an automatic mounting machine, and more particularly to a recognition mark for recognizing the mounting position of the surface mounting component and correcting the mounting position. The present invention relates to a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, in the case of automatically mounting surface mount components on a printed wiring board, in order to improve the mounting accuracy, as shown in FIG.
A recognition mark 1 as shown in FIG. 10 is provided on a printed wiring board, and a resist 2 is arranged around the recognition mark 1. The recognition mark 1 is used for image recognition by a recognition device arranged on the mounting machine, and the positional displacement in the XY direction and the rotational direction is corrected to perform automatic mounting.

Further, as shown in FIG. 11, two recognition marks 8 for recognizing a board and recognition marks 9 for recognizing a part are arranged on each of the ears (dummy board) of the board and the pad periphery of the mounted part. In some cases. The board recognition mark 8 is used to correct the fixed position deviation of the printed wiring board, and the component recognition mark 9 is used to correct the mounting position of the surface mount component.

The shape of the recognition mark is circular, square, triangular, or the like. The recognition mark may be formed of copper foil, or the copper foil may be solder-plated or gold-plated.

[0005]

However, in such a conventional recognition mark, the recognition mark and the resist and the clearance around the recognition mark, that is, the non-resist area where the resist is not applied are few, and the image recognition is performed. At this time, the detection light is diffusely reflected by the resist around the recognition mark, so that the recognition cannot be performed with high precision, and as a result, the surface mount component cannot be mounted with high positional precision.

The present invention has been made in view of the above problems, and an object thereof is to dispose a recognition mark which enables highly accurate position recognition without irregular reflection of the detection light by the resist during image recognition. To provide a printed wiring board.

[0007]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the means adopted by the present invention is that "a recognition mark for image-recognizing the mounting position of a surface-mounted component and correcting the position is provided. A printed wiring board having the above, wherein a resist is formed by providing a non-resist region 2.5 times to 19.0 times the area of the recognition mark around the recognition mark. Is.

If the area of the non-resist area around the recognition mark is 2.5 times or less than the area of the recognition mark, the diffused reflection of the detection light from the resist at the time of image recognition of the mounting position of the surface mount component will occur. As a result, the mounting accuracy drops sharply. On the other hand, if the area of the non-resist area around the recognition mark is set to be 19.0 times or more the area of the recognition mark, the design is hindered due to the influence on the adjacent pad and the relationship with the wiring below.
Most preferably, it is 3.0 to 7.5 times that can completely prevent these effects.

[0009]

According to the present invention, by adopting the means as described above, the resist around the recognition mark is provided at a position where there is no influence of irregular reflection of the detection light for performing image recognition by the resist. Highly accurate position recognition can be performed without causing recognition errors due to irregular reflection.

【Example】

The present invention will be described in detail below with reference to the embodiments shown in the drawings.

Embodiment 1 FIG. 1 is a partially enlarged plan view schematically showing the shape of a recognition mark according to an embodiment of the present invention, and FIG. 2 is a line A- in FIG.
It is sectional drawing seen along the A line. That is, the resist 2 is arranged around the circular recognition mark 1 with a clearance three times the size of the recognition mark 1. The recognition mark 1 is composed of a pad 3 and a solder plating layer 4, the pad 3 is formed by etching a copper foil on a glass epoxy substrate, and the solder plating layer 4 is formed by plating the pad 3 with solder. .

The recognition mark 1 may be gold-plated instead of solder-plated. Further, the recognition mark 1 may be copper as it is without being plated with metal.

Next, FIG. 3 is a partially enlarged plan view showing another recognition mark of the present invention, which is an embodiment in which the recognition mark 1 has a cross shape and the resist 2 has a quadrangular shape. In the present invention, the recognition mark 1 and the resist 2 may have a circular shape, a quadrangular shape, a triangular shape, a cross shape or the like, and the recognition mark and the resist 2 may have different shapes.

Next, FIG. 4 is a partially enlarged plan view showing still another recognition mark of the present invention. Two recognition marks 1 having different shapes are formed, and the two recognition marks are surrounded by The resist 2 is formed with a clearance about three times the size of the two recognition marks. When performing image recognition by the recognition device, one of the two recognition marks is selected and used.

If one of the two recognition marks is excessively etched due to etching during the manufacture of the printed wiring board and the accuracy is poor, the other recognition mark can be used. In addition, when two positions are arranged on each of the ears of the board (dummy board section) or the pad periphery of the mounted component, different recognition marks can be used at the two locations. The number of recognition marks may be three or more.

Embodiment 2 FIG. 5 is a partially enlarged plan view showing another embodiment of the present invention, and FIG. 6 is a sectional view taken along the line BB of FIG.
An inner layer copper foil portion 6 is formed below the recognition mark 1.
Therefore, if the inner layer copper foil portion 6 around the recognition mark 1 is blackened so as to look black, the recognition mark 1 and the recognition mark are printed because the circumference of the recognition mark 1 becomes black when the image is recognized by the recognition device. Brightness and darkness with respect to the wiring board (glass epoxy substrate) are clear, and recognition can be performed with high accuracy. The inner layer copper foil portion 6 looks dark brown without blackening treatment, so that the effect of preventing irregular reflection is achieved to a certain extent.

Embodiment 3 FIG. 7 is a partially enlarged plan view showing another embodiment of the present invention, and FIG. 8 is a sectional view taken along the line CC of FIG.
That is, the pattern 7 is formed between the recognition mark 1 and the resist 2.
Is provided.

When the outer layer substrate and the inner layer substrate are thermocompressed with each other through a prepreg and then the outer layer copper foil is etched to form patterns, lands and pads, the recognition mark 1 is recognized as being excessively etched by the etching solution. The mark shape may vary.

In this embodiment, since the pattern 7 is provided around the recognition mark 1, it is possible to change the flow direction of the etching liquid that the pattern 7 flows toward the recognition mark 1, and the recognition by the etching liquid is possible. The excessive etching of the mark 1 can be protected. That is, it is possible to eliminate variations in the outer shape and the surface of the recognition mark 1 at the time of manufacturing the substrate, and it is possible to create a highly accurate recognition mark.

[0020]

As described above, according to the present invention, when image recognition is performed by the recognition device arranged in the component mounting machine, there is no influence of irregular reflection due to the resist around the recognition mark, and the image recognition can be performed accurately. You can

Therefore, highly accurate position recognition becomes possible,
Highly accurate surface mount components can be mounted. Further, it is possible to cope with the recent narrowing of the pitch of the QFP and the increase in the number of pins, and it is possible to carry out high-density mounting of surface mount components.

[Brief description of drawings]

FIG. 1 is a partially enlarged plan view showing a recognition mark of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a partially enlarged plan view showing another recognition mark of the present invention.

FIG. 4 is a partially enlarged plan view showing another recognition mark of the present invention.

FIG. 5 is a partially enlarged plan view showing another recognition mark of the present invention.

6 is a sectional view taken along line BB of FIG.

FIG. 7 is a partially enlarged plan view showing another recognition mark of the present invention.

FIG. 8 is a sectional view taken along the line CC of FIG.

FIG. 9 is a partially enlarged plan view showing a conventional recognition mark.

FIG. 10 is a sectional view taken along line D-D in FIG.

FIG. 11 is a plan view of a conventional example in which a conventional recognition mark is used for board recognition and component recognition.

[Explanation of symbols]

 1 recognition mark 2 resist 3 pad 4 solder plating layer 5 printed wiring board 6 inner layer copper foil part 7 pattern 8 board recognition mark 9 component recognition mark 10 board ear (dummy board part)

Claims (1)

[Claims] 1. The image recognition of the mounting position of the surface mount component,
A printed wiring board having a recognition mark for position correction, wherein a resist is formed around the recognition mark by providing a non-resist region 2.5 to 19.0 times the area of the recognition mark. A printed wiring board characterized by.