JPH06299313A - Solder plating device for semiconductor lead frame - Google Patents

Abstract

PURPOSE:To provide the solder plating device for semiconductor lead frames capable of lessening the burden of waste liquid treatment equipment. CONSTITUTION:This solder plating device includes an alkaline degreasing treatment device 1 for removing the grease on the surfaces of the semiconductor lead frames, an etching treatment means 3 for subjecting the semiconductor lead frames to an etching treatment, a solder plating treatment member 6 for subjecting the lead frames to a solder plating treatment and washing treatment means 20, 40, 70 for washing the semiconductor lead frames with water after the respective liquid chemical treatments. The washing treatment means 20, 40, 70 are provided with two first and second washing tanks A, B. A water supply and drain route for the first washing tank A and a water supply and drain route for the second washing tank B are respectively separately and independently composed. The concentration waste liquid and dilute waste liquid drained from both washing tanks A, B are treated by the treatment means different respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor lead frame solder plating apparatus for applying a solder plating treatment to the exterior portion of a semiconductor lead frame.

[0002]

2. Description of the Related Art FIG. 2 is a diagram showing the structure of a conventional semiconductor lead frame solder plating apparatus of this type. As shown in the figure, this semiconductor lead frame solder plating apparatus includes an alkali degreasing treatment means 1, a water washing treatment means 2, an etching treatment means 3, a water washing treatment means 4, a pre-dip treatment means 5, and solder plating. Treatment means 6 and washing treatment means 7
And a hot water washing means 8, a blowing means 9, and a drying means 10.

First, the alkaline degreasing treatment means 1 is a treatment means for removing the fat from the lead frame to which the fat adheres during machining or the like. Normally, by dipping the lead frame in a liquid tank containing a degreasing liquid. It is configured to degrease.

Next, the water washing treatment means 2 is a treatment means for removing the degreasing liquid adhered by the degreasing treatment means 1 by washing with water. Specifically, as shown in the figure, the first and second 2
The two washing tanks a and b are provided, new water is supplied to the second washing tank b, the water overflowed in the second washing tank b is introduced into the first washing tank a, and the first washing tank is further washed. The water overflowed in the tank a is configured to be discharged from the device.
All of this wastewater is treated by the wastewater treatment facility.
The lead frame is first immersed in the first washing tank a to be washed with water, and then immersed in the second washing tank b to be further washed with water.

Next, the etching treatment means 3 is a means for performing an etching treatment on the lead frame after being washed with water, and is usually treated by immersing the lead frame in a liquid tank containing an etching liquid for a predetermined time.

Next, the washing treatment means 4 is also the washing treatment means 2
It is a processing means having the same structure as that of (1) and having two water washing tanks a and b, and removing the etching liquid from the lead frame after the etching treatment by water washing.

Next, the pre-dip processing means 5 is a processing means immediately before the solder plating processing, and is constructed so as to be immersed in a liquid tank containing the same acidic liquid as the normal plating liquid. This pre-dip treatment is performed to remove this oxide film and other impurities that adhere to the surface because a very small amount of etching solution that has not been removed by washing forms an oxide film on the surface of the lead frame. In addition, the same solution as the plating solution is used as the pre-dip solution to maintain the concentration of the plating solution at a predetermined value.

Next, the solder plating processing means 6 is a processing means for performing solder plating processing on the exterior portion of the lead frame.
The solder material is used as an anode and the lead frame is used as a cathode in the plating solution so that electricity is applied.

Next, the washing treatment means 7 is also the washing treatment means 2
This is a processing means having the same structure as the above, and having two water washing tanks a and b, and removing the plating liquid attached by the solder plating processing.

The lead frame from which the plating liquid has been removed is washed with hot water by the hot water treatment means 8, blown by the blow treatment means 9, and then dried by the dry treatment means 10.

[0011]

As described above, in the semiconductor lead frame solder plating apparatus, after each chemical treatment (that is, after alkali degreasing treatment, etching treatment, and solder plating treatment), the chemical treatment in the previous step is performed. In order to avoid mixing with the above chemical solution, a washing treatment means is always inserted. Further, when the lead frame is dipped in the water washing tanks a and b in the water washing treatment means, the chemical solution adhering to the lead frame is taken out into the water, so that the ion concentration of the chemical solution in the waste water becomes high.

By the way, conventionally, all the water discharged from the water washing means has been treated as drainage in a drainage treatment facility.

Therefore, if the amount of the chemical solution brought out to the water in the water washing tanks a and b is large, the load of the drainage treatment facility increases, and the initial cost and running cost of the facility increase.

The present invention has been made in view of the above points, and an object thereof is to provide a semiconductor lead frame solder plating apparatus capable of reducing the burden on the drainage treatment facility.

[0015]

In order to solve the above problems, the present invention provides an etching treatment means for performing an etching treatment on at least a semiconductor lead frame, a solder plating treatment means for performing a solder plating treatment, and after each chemical treatment. In a semiconductor lead frame solder plating apparatus including a washing treatment means for washing a semiconductor lead frame with water, the washing treatment means includes a first washing tank for immersing the semiconductor lead frame after the chemical treatment and a first washing tank. A second rinsing tank, which is a second rinsing tank for immersing the immersed semiconductor lead frame again, was provided, and water supply / drain paths for the both rinsing tanks were separately configured.

[0016]

[Function] The concentrated drainage liquid discharged from the first washing tank and the second
The diluted effluent discharged from the water washing tank can be efficiently treated separately.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a diagram showing one configuration example of a semiconductor lead frame solder plating apparatus of the present invention. In the figure, the parts denoted by the same reference numerals as those in FIG. 2 indicate the same or corresponding parts. As shown in FIG. 1, this semiconductor lead frame solder plating apparatus has an alkaline degreasing treatment means 1, a water washing treatment means 20, an etching treatment means 3, and a water washing treatment means 40.
And pre-dip processing means 5 and solder plating processing means 6
A washing treatment means 70, a hot water washing means 8, a blow treatment means 9, and a drying treatment means 10.

Also in this embodiment, as in the prior art example shown in FIG. 2, the alkaline degreasing means 1 first removes the grease adhering to the surface of the lead frame,
Next, the degreasing liquid adhering to the lead frame is washed with water by the water washing treatment means 20, and then the etching treatment is performed by the etching treatment means 3, and then the etching liquid attached to the lead frame is washed with water by the water washing treatment device 40. Then, the outer plating of the lead frame is subjected to the solder plating treatment by the solder plating treatment means 6 through the pre-dip treatment means 5, the plating solution adhering to the lead frame is removed by the water washing treatment means 7, and then the hot water washing treatment is performed. Means 8
After being washed with hot water and blown by the blow processing means 9, it is dried by the drying processing means 10.

The semiconductor lead frame solder plating apparatus according to this embodiment is different from the conventional example shown in FIG. 2 in the structure of the three washing treatment means 20, 40, 70.

In this embodiment, the washing treatment means 2
The washing tanks that make up 0, 40, and 70 are the first and second washing tanks, respectively.
Of the washing tanks A and B, and fresh water is separately supplied to the first washing tank A and the second washing tank B.
It was decided to separately treat the drainage liquids that overflowed and discharged. That is, the water supply / drain paths of the two washing tanks A and B are made independent.

The discharged liquid overflowing from the first water-washing tank A and discharged (that is, the discharged liquid having a large amount of chemical solution taken out and having a high ion concentration because the lead frame after the chemical solution treatment is first washed with water) is concentrated It is treated as a liquid by a concentrated drainage treatment means. That is, the concentrated effluent is treated by solidifying it with a concentrating device or the like.

On the other hand, the drainage liquid overflowing and discharged from the second washing tank B (that is, the lead frame which has already been washed once in the first washing tank A is washed again with the diluted ion concentration Low effluent) is treated as a diluted effluent by a diluted effluent treatment means separately from the concentrated effluent. That is, the diluted waste liquid is processed by flowing it into the conventional waste liquid treatment equipment. In other words, since it is decided to process only the diluted system waste liquid with the conventional waste liquid treatment equipment, the load of the waste fluid treatment equipment is considerably reduced, the initial cost and running cost of the equipment are reduced, and the equipment scale is reduced. Can be achieved.

[0023]

As described above in detail, according to the semiconductor lead frame solder plating apparatus of the present invention, the rinsing tank of the rinsing processing means is divided into the first and second rinsing tanks and each is independent. Since the water is allowed to flow, the concentrated drainage discharged from the first flush tank is treated by an efficient concentrated drainage treatment means different from the conventional drainage treatment equipment, and the second
Only diluted effluent drained from the water washing tank can be treated by the conventional effluent treatment equipment, which can reduce the initial cost and running cost of the effluent treatment equipment. Can be miniaturized.

[Brief description of drawings]

FIG. 1 is a diagram showing one configuration example of a semiconductor lead frame solder plating apparatus of the present invention.

FIG. 2 is a diagram showing a configuration of a conventional semiconductor lead frame solder plating apparatus.

[Explanation of symbols]

 1 Alkali degreasing treatment means 3 Etching treatment means 5 Predip treatment means 6 Solder plating treatment means 8 Hot water washing treatment means 9 Blow treatment means 10 Drying treatment means 20, 40, 70 Water washing treatment means A First water washing tank B Second Wash tank

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenichi Suzuki 11-1 Haneda Asahi-cho, Ota-ku, Tokyo Inside EBARA CORPORATION

Claims (1)

[Claims] 1. A semiconductor lead comprising at least an etching treatment means for performing an etching treatment on a semiconductor lead frame, a solder plating treatment means for performing a solder plating treatment, and a washing treatment means for washing the semiconductor lead frame with water after each chemical treatment. In the frame solder plating apparatus, the water washing treatment means includes a first water washing tank for immersing the semiconductor lead frame after the chemical solution treatment and a second water washing tank for immersing the semiconductor lead frame immersed in the first water washing tank again. Two
A semiconductor lead frame solder plating device characterized in that a water washing tank is provided, and water supply / drain paths for both water washing tanks are separately configured.