JPH0625999Y2 - Electronic component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention relates to an electronic component supply device used in a rotary type high speed mounting machine or the like.

2. Description of the Related Art FIG. 3 is a perspective view showing an example of a conventional electronic component supply apparatus, in which electronic components are stored in a lower tape having recesses formed at regular intervals and small holes corresponding to the recesses. , An electronic component encapsulating tape in which a lower tape is covered with a covering tape 2, 3 is a tape reel around which the electronic component encapsulating tape 1 is wound, 4 is a frame, 5 is a guide groove provided in the frame 4, and 6 is the frame 4 side 7 is a ratchet fixed to the sprocket 6, 8 is a sprocket
Is a lever rotatably provided around the shaft 9, 1
0 is a pin provided at one end of the lever 8, 11 is a pin 10
The feed claw is swung by the tension elastic body 12 so as to engage with the ratchet 7. Thirteen
Is a detent pawl that engages with the ratchet 7 when a tension elastic body 14 constantly applies a counterclockwise force to the ratchet 7.
Reference numeral 5 is an external drive device, and 16 is a push-up pin that pushes up the lever 8 against the tensile elastic body 17 by the external drive device 15. The structure up to this point is related to the tape feeding mechanism.

Next, the structure regarding the peeling mechanism of the covering tape 2 will be described. 18
Is a timing pulley that rotates in synchronization with the tape feeding mechanism, 19 is a timing belt for transmitting the rotation of the timing pulley 18 to the pinch roller 20, 21 is a rubber roller provided in contact with the pinch roller 20, 2
2 is an electronic component encapsulating tape 1 fed along the guide groove 5.
An edge that regulates from above, 23 is a take-up reel that winds the covering tape 2, 24 is a timing belt that transmits the rotation of the pinch roller 20 to the take-up reel 23,
Reference numeral 25 is a suction nozzle that sucks an electronic component.

The operation of the electronic component supply device configured as described above will be described below.

First, the push-up pin 16 is lifted in the arrow A direction by the external drive device 15, and the lever 8 swings counterclockwise about the shaft 9. Then, the feed claw 11 rotates the ratchet 7 counterclockwise by the swing of the lever 8, and the sprocket 6 fixed to the ratchet 7 rotates counterclockwise accordingly.

At this time, since the sprocket 6 rotates while engaging with the small holes provided in the electronic component sealing tape 1, the electronic component sealing tape 1 is sent out in the direction of the arrow B by a predetermined pitch. Further, when the electronic component sealing tape 1 is sent out in the direction of the arrow B, the return prevention claw 13 engages with the ratchet 7 to position the ratchet 7.

Further, since the timing pulley 18 rotates by a predetermined pitch in the direction of arrow B by the rotation of the sprocket 6, the pinch roller 20 and the rubber roller 21 rotate by the predetermined pitch via the timing belt 19. Along with this, the take-up reel 23 rotates in the direction of arrow C by a predetermined pitch via the timing belt 24. Therefore, the covering tape 2 is forcibly peeled off by a predetermined pitch in the direction of arrow D.
At the same time, the covering tape 2 moves from the edge 22 to the pinch roller 20.
And the rubber roller 21, and is taken up by the take-up reel 23.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the above-described conventional configuration, when the electronic component sealing tape 1 is inserted between the guide groove 5 and the edge 22,
Due to the processing error of the guide groove 5, as shown in FIGS. 4 and 5, a space is always formed in the electronic component encapsulating tape 1 and the lower surface of the edge 22 or in the bottom of the electronic component encapsulating tape 1 and the guide groove 5.

Therefore, when the electronic component supply device is used in the rotary type optical velocity mounting machine, when the electronic component sealing tape 1 is pitch-fed by the external drive device 15, the electronic component sealing tape 1 vibrates in the guide groove 5. .

Then, the electronic component delivered to the lower portion of the suction nozzle 25 tilts in the recess provided in the electronic component encapsulating tape 1 or the electronic component is ejected from the recess provided in the electronic component encapsulating tape 1 as shown in FIG. When a suction nozzle sucks an electronic component due to a component popping out, a suction error may occur.

Means for Solving the Problems In order to solve the above problems, the present invention provides a bottom of a guide groove from a position of a peeling device to a suction position for sucking an electronic component,
An elastic member that presses the electronic component sealing tape against the peeling device is provided, and the thickness of the portion of the elastic member that sucks the electronic component is smaller than the length from the bottom of the guide groove to the peeling device.

With this configuration, when the electronic component sealing tape is pitch-fed by the feeding device, the peeling device and the elastic member position the electronic component sealing tape in the vertical direction.

Embodiment FIG. 1 and FIG. 2 are side views of essential parts showing an electronic component supply device according to an embodiment of the present invention, in which 1 is an electronic component encapsulating tape, 2 is a covering tape, 5 is a guide groove, and 22 is Edges and 25 are suction nozzles.

Up to this point, the configuration is the same as that of the conventional electronic component supply device, and thus detailed description thereof is omitted.

26 is an elastic member provided at the bottom of the guide groove 5,
The elastic member 26 provided below the suction position where the suction nozzle 25 sucks the electronic component is formed to have a space with the bottom of the guide groove 5. 27 is an elastic member 26
Is a countersunk screw for attaching to the bottom of the guide groove 5.

Therefore, when the electronic component sealing tape 1 is pitch-fed in the direction of the arrow E, the electronic component sealing tape 1 is restricted by the lower surface of the edge 22 and the upper surface of the elastic member 26, so that the tape feeding mechanism vibrates the electronic component sealing tape 1. When the suction nozzle 25 further descends in the direction of arrow F to suck the electronic component, the elastic member 26 bends the impact force when the tip of the suction nozzle 25 contacts the surface of the electronic component in the direction of arrow G. Can be relaxed.

As described above, according to this embodiment, the elastic member 26 for pressing the electronic component sealing tape 1 against the edge 22 is provided at the bottom of the guide groove 5 from the position of the edge 22 to the suction position for sucking the electronic component, and the elastic member is provided. By making the thickness of the portion of 26 that adsorbs the electronic component smaller than the length from the bottom of the guide groove 5 to the edge 22, it is possible to eliminate the vibration of the electronic component encapsulating tape 1 due to the tape feeding mechanism. The electronic component does not fly out from the recess provided in the component sealing tape 1, and when the suction nozzle 25 sucks the electronic component, the impact force of the suction nozzle 25 on the electronic component can be mitigated. It is possible to eliminate chipping and cracking of parts.

Advantageous Effects of Invention The present invention provides an elastic member for pressing the electronic component sealing tape against the peeling device at the bottom of the guide groove from the position of the peeling device to the suction position for sucking the electronic component, and sucks the electronic component of the elastic member. Since the thickness of the portion is smaller than the length from the bottom of the guide groove to the peeling device, when the electronic component sealing tape is pitch-fed by the feeding device, the recess provided in the electronic component sealing tape guided by the guide groove Electronic parts will not pop out from inside,
When the suction nozzle sucks an electronic component, the electronic component can be securely sucked without causing a suction error.

[Brief description of drawings]

1 and 2 are side views of essential parts showing an electronic component supplying device according to an embodiment of the present invention, FIG. 3 is a perspective view showing an example of a conventional electronic component supplying device, and FIG. FIG. 5 is a side view of an essential part showing an example of a conventional electronic component supplying device, FIG. 5 is a front view of an essential part showing an example of a conventional electronic part supplying device, and FIG. Is. 1 ... Electronic component encapsulating tape, 2 ... Covering tape 5 ... Guide groove, 15 ... External drive device 25 ... Adsorption nozzle, 26 ... Elastic member 27 ... Plate screw

Claims (1)

[Scope of utility model registration request] 1. A delivery device for storing electronic components in a carrier tape having recesses formed at regular intervals and for feeding an electronic component encapsulating tape formed by coating the carrier tape with a covering tape at predetermined pitches, and the feeder. A peeling device that peels the coating tape from the transport tape in synchronization with the operation of the device, a winding device that winds the coating tape peeled from the transport tape, and guides the electronic component sealing tape to the feeding device. An elastic member that includes a guide groove is provided at a bottom portion of the guide groove from a position of the peeling device to a suction position for sucking an electronic component, and an elastic member that presses the electronic component sealing tape against the peeling device is provided, and an electronic component of the elastic member. The electronic part is characterized in that the thickness of the part that adsorbs is smaller than the length from the bottom of the guide groove to the peeling device. Supply device.