JPH0612920B2 - Image sensor - Google Patents

Description

The present invention relates to a small-sized image sensor for reading image information on a document by arranging a single or a plurality of sensors in the same size as a facsimile transmission document, for example. Cost reduction and price reduction.

[Conventional technology]

In recent years, the technological progress of photoelectric conversion devices such as facsimile OCR has been remarkable, and in the midst of this, document contact type image sensors have been developed and put into practical use in order to miniaturize the devices such as facsimile and OCR.

FIG. 4 is a side sectional view showing a model of a conventional image sensor, in which 1 is a light emitting element and 2 is a light emitting element.
Is a light receiving element, 3 is located on the light receiving element 2, and is a rod lens array for forming a one-to-one erecting equal-magnification image.
A light transmitting plate positioned on the rod lens array 3, 5 is an original, 6 is a platen roller for sending the original, 7 is a frame for fixing the light emitting element substrate 8, the light receiving element substrate 9, the rod lens array 3 and the light transmitting plate 4. is there.

Next, the operation will be described.

The original 5 conveyed by the platen roller 6 is a light transmitting plate 4.
Go over. At this time, the light emitted from the light emitting element 1 produces reflected light on the original 5, which is reflected by the rod lens array 3
The image becomes an erecting equal-magnification image, is received by the light receiving element 2, and is converted into an electric signal. The document is read by continuously carrying the document.

In the assembly of this image sensor, the light emitting element 1 made of, for example, an LED is fixed to the light emitting element substrate 8 made of, for example, a glass epoxy substrate by soldering, and the light emitting element substrate 8 is fixed to the frame 7 by screws or the like. Attach and fix. Further, for example, an IC chip having the light receiving element 2 formed by the monolithic IC technique is fixed to the light receiving element substrate 9 made of, for example, a ceramic substrate with an adhesive, and the light receiving element substrate 9 is attached and fixed to the frame 7 with screws or the like. . Next, the rod lens array 3 and the light transmitting plate 4 are attached and fixed to the frame 7 with screws or the like.

[Problems to be solved by the invention]

Since the conventional image sensor is configured as described above, the light emitting element substrate 8 and the light receiving element substrate 9 must be separately fixed to the frame 7, which in turn hinders miniaturization, and requires a large number of assembling steps. There was a problem that it could not be priced.

The present invention has been made to solve the above problems, and an object of the present invention is to obtain an image sensor which can be further downsized, can be easily assembled, and can be reduced in cost.

[Means for solving problems]

In the image sensor according to the present invention, the light emitting element and the light receiving element are formed on the same substrate, and an optical path changing means for changing the traveling direction of the light from the light emitting element to reach the original is provided. It is provided between the transparent plate and the transparent plate.

[Action]

In the present invention, the traveling direction of the light of the light emitting element is changed by the optical path changing means so that the light reaches the document.
Since the light emitting element and the light receiving element are formed on the same substrate, the mounting space in the frame case may be small, the device can be made smaller, and the assembly can be performed with a smaller number of steps.

〔Example〕

 The drawings of the embodiments of the present invention will be described below.

FIG. 1 is a side sectional view of an image sensor according to an embodiment of the present invention. In the figure, 1 is a light emitting element including, for example, an LED chip, 2 is a light receiving element including, for example, an IC chip formed by a monolithic IC technique, 10 Is a substrate made of, for example, ceramics, and an LED chip serving as the light emitting element 1 and an IC chip serving as the light receiving element 2 are fixed on the substrate with an adhesive. A rod lens array 3 is located on the light receiving element 2 and forms a one-to-one erecting equal-magnification image,
Reference numeral 4 is a light transmitting plate located on the rod lens array 3, 5 is a document, 6 is a platen roller for the document, 11 is a mirror for changing the optical path of the light emitting element 1, 7 is a substrate 10, rod lens array 3, and light transmitting plate 4 is a frame for fixing the mirror 4 and the mirror 11.

In the semiconductor memory device having such a configuration, the light emitting element 1
Since the light receiving element 2 and the chip of the light receiving element 2 are mounted on the same substrate 10, the light emitting element 1 and the light receiving element 2 are formed in a smaller area.
Can be provided, and the device can be downsized and the number of assembling steps can be reduced. At this time, the light emitted from the light emitting element 1 is the original 5
The mirror 11 for changing the optical path to reach the frame 7
Since it is fixed to, the performance of the semiconductor memory device is not damaged.

2 and 3 each show an image sensor according to another embodiment of the present invention, in which the same reference numerals as those in FIG. 1 denote the same elements. The embodiment shown in FIGS. 2 and 3 includes light shielding plates 12 and 12a made of another material and a part of the frame 7 between the light emitting element 1 and the light receiving element 2, respectively.
By this, it is possible to prevent the performance of the image sensor from being deteriorated when the light emitted from the light emitting element 1 enters the light receiving element 2 as it is.

In the above embodiment, the mirror 11 is used as the optical path changing means.
If the frame 7 is, for example, an aluminum extruded product, the aluminum surface serves as a reflection surface and can serve as an optical path changing means. Therefore, the mirror 11 is not provided. Good.

Further, although the case where the chips of the light emitting element 1 and the light receiving element 2 are mounted on the substrate 10 is shown, the light receiving element 2 is formed on the substrate 10 using amorphous silicon, and then the chip of the light emitting element 1 is mounted. However, the same effect as that of the above-described embodiment may be obtained.

〔The invention's effect〕

As described above, according to the present invention, the light emitting element and the light receiving element are formed on the same substrate, and the optical path changing means of the light emitting element is provided between the light emitting element and the light transmitting plate. It can be miniaturized and easy to assemble,
It has the effect of lowering the price.

[Brief description of drawings]

1 is a side sectional view showing an image sensor according to an embodiment of the present invention, FIGS. 2 and 3 are side sectional views showing an image sensor according to another embodiment of the present invention, and FIG. It is a side surface sectional view showing an image sensor. In the figure, 1 is a light emitting element, 2 is a light receiving element, 5 is a document,
Reference numeral 10 is a substrate, 11 is a mirror, and 12 and 12a are light shielding plates. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (3)

[Claims] 1. A light emitting element and a light receiving element are provided in a frame case, light from the light emitting element is reflected by a document on a light transmitting plate, and the reflected light is received by the light receiving element to obtain the document. In the image sensor for reading, the light emitting element and the light receiving element are provided on the same substrate, and an optical path changing means for changing the traveling direction of the light from the light emitting element to reach the original is provided. An image sensor provided between an element and the light transmitting plate. 2. The image sensor according to claim 1, wherein the optical path changing means is an inner surface of a frame case made of a mirror or aluminum. 3. A light shielding plate for preventing the light of the light emitting element from being directly received by the light receiving element between the light emitting element and the light receiving element. The image sensor according to item 1 or 2.