JPH0539648Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Field of the Invention> This invention relates to a mounting structure for electronic components applied to power supplies and the like.

<Prior art and its problems> Generally, in a power supply device equipped with heat-generating electronic components such as power transistors, heat is dissipated from a part of the chassis made of aluminum, iron, etc. in order to improve the heat dissipation effect of the electronic components. A method of fixing the above-mentioned electronic components by using a plate is often used.

As an example, conventionally, as shown in FIG.
A lead terminal 104 of an electronic component 104 that generates heat is attached to a printed wiring board 103 that is fixed with a
A is soldered and connected to the mounted member M such as a control panel.
The electronic component 104 is fixed to the other piece 101b of the chassis 101 via an insulating sheet 105, which serves as a mounting surface for the chassis 101.

However, with the above configuration, the electronic component 104 is attached to the other piece 101b of the chassis 101 and fixed to the attached member M.
When one piece 101a of 1 is deflected in the direction of arrow F, the printed wiring board 103 is also displaced in response to this, and the relative set interval with the electronic component 104 changes, causing an abnormality in the lead terminal 104a. There is a problem that tensile or compressive force is applied, causing the wire to break in this part.

<Purpose of the invention> This invention was made to solve the above problems, and the purpose is to provide a mounting structure for electronic parts that has good heat dissipation performance for heat-generating electronic parts and has high vibration and shock resistance. do.

<Structure and effects of the invention> The mounting structure for electronic components according to this invention consists of bending a flat metal plate into an L-shape to form an L-shaped chassis.
The other piece is fixed to the member to be attached, and one piece of the other piece is erected in a free state to the member to be attached, and a printed wiring board is fixed to one part of this L-shaped chassis with its plane substantially parallel to the above-mentioned member. A cut and raised piece is formed integrally with the other piece of the chassis by cutting and separating it from the other piece, and a heat generating electronic component is fixed to this cut and raised piece, and its lead terminal is soldered to the above printed wiring board. It is characterized by the fact that it is attached.

According to the above structure, the L-shaped chassis is formed by bending a flat metal plate into an L-shape, the other part is fixed to the member to be attached, and one part of the chassis is left standing freely on the member to be attached. Since the printed wiring board was fixed to one part of this L-shaped chassis with its plane almost parallel to the other, if one part of the chassis bends and deforms when subjected to vibration or impact while the chassis is attached, the printed wiring board will be damaged. The substrate 103 also moves in response to the one piece of the chassis.

On the other hand, since the heat-generating electronic components were fixed to a cut-and-raised piece integrally formed on one side of the chassis, and the lead terminals thereof were brazed to the printed wiring board, the relative relationship with the printed wiring board was fixed. There is no displacement, and no abnormal tensile or compressive force is applied to the lead terminal.

Therefore, it is possible to provide an electronic component mounting structure with high vibration resistance and shock resistance without fear of breaking the lead terminal.

Furthermore, since the cut and raised pieces are formed by being cut and raised separately from the other pieces of the chassis, effective use of metal materials can be achieved.

Furthermore, since the heat-generating electronic component is fixed to the cut and raised piece, the heat dissipation performance of the heat-generating electronic component is good.

<Description of Embodiment> An embodiment of this invention will be described below with reference to the drawings.

FIG. 1 shows an example in which the electronic component mounting structure according to this invention is applied to a power supply device.

In the figure, 1 is a chassis, which is made of a metal plate with good thermal conductivity such as aluminum or iron.
It is bent into an L shape. 2 is a printed wiring board, and circuit components such as electrolytic capacitors 3
is attached, and one piece 1a of the chassis 1
It is fixed with a screw body 4 or the like. Reference numeral 5 denotes a printed wiring board attachment projection formed on the chassis 1. Reference numeral 6 denotes a heat-generating electronic component, such as a power transistor, as one of the circuit components, and its lead terminal 6a is brazed to the printed wiring board 2 with solder or the like. As shown in FIGS. 2 and 3, the chassis 1 is provided with a cut-and-raised piece 7 along the other piece 1b so as to be mechanically separated from the other piece 1b. The power transistor 6 is tightly fixed on the cut and raised piece 7 with a screw body 8 or the like. Reference numeral 9 denotes a mounting screw for fixing the other piece 1b of the chassis 1 to a member M to be mounted such as a control panel.

In the above configuration, since the power transistor 1 is fixed to the cut and raised piece 7 of the chassis 1, heat during operation is effectively dissipated through the chassis 1.
Heat dissipation is improved and a heat sink is not required.

In particular, since the cut-and-raised piece 7 is separated from the other piece 1b of the chassis 1, which constitutes the mounting surface to the mounted member M such as a control panel, vibrations and vibrations occur in the mounted state.
Even if one piece 1a of the chassis 1 is bent and deformed in the direction of arrow F due to an impact, the cut and raised piece 7 can also respond in the same direction. For this reason, unreasonable stress is not concentrated on the lead terminal 6a of the power transistor 6 or the connection and fixing portion thereof, and the fear of wire breakage can be eliminated.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example in which the electronic component mounting structure according to the invention is applied to a power supply device, FIGS. 2 and 3 are perspective views and top views showing the chassis of the power supply device, and FIG. FIG. 2 is a perspective view showing a conventional electronic component mounting structure. DESCRIPTION OF SYMBOLS 1... Chassis, 1a... One piece, 1b... Other piece, 2... Printed wiring board, 6... Electronic component, 6a... Lead terminal, 7... Cut and bent piece, M...
...Attachment member.

Claims (1)

[Scope of utility model registration request] An L-shaped chassis in which the other part of a flat metal plate bent in an L-shape is fixed to a member to be attached, and one part of the plate is erected in a free state with respect to the member to be attached, and one piece of this L-shaped chassis. a printed wiring board fixed to the part with its plane substantially parallel to the part; a cut-and-raised piece cut and separated from the other part of the chassis and formed integrally with the one-piece part; 1. A mounting structure for an electronic component, comprising: a heat generating electronic component which is fixed and whose lead terminals are brazed to the printed wiring board.