JPH053242A - Chip removing apparatus - Google Patents

Abstract

PURPOSE:To remove a chip from a wafer sheet by making the tips of push-up pins pierce through the wafer sheet from its rear without damaging the chip. CONSTITUTION:When the tips of push-up pins 15 are made to pierce through a wafer sheet 33 from its rear in order to remove a chip 31 which is bonded to the surface of the wafer sheet 33 from the wafer sheet 33, fine vibration along the axial direction is given to the push-up pins 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip peeling device for penetrating the tip of a push-up pin from the back surface of a wafer sheet to push up and peel off a chip attached to the front surface of the wafer sheet. The present invention relates to a chip peeling device capable of peeling.

[0002]

2. Description of the Related Art Next, a conventional chip peeling apparatus will be described with reference to FIG. 2A and 2B are views for explaining a conventional chip peeling device. FIG. 2A is a schematic side sectional view showing the structure of the device, and FIG. 2B is a chip from a wafer sheet. It is a principal part side sectional view which shows the peeled state.

As shown in FIG. 1 (a), a conventional chip peeling apparatus is an XY which is freely moved in a horizontal plane by being driven by a controller 11 and an XY table driving device (not shown) connected to the controller 11. A table 12 and an elevating device 13 for elevating the piston rod 13a in the vertical direction under the control of the control device 11.
And a pedestal with the back surface fixed to the upper end surface of the piston rod 13a.
14, a plurality of push-up pins 15 suspended from the flat surface of the pedestal 14 in the shape of a sword and having a sharp tip directed upward,
The collet 16 is configured to include a collet 16 which is driven by a collet driving device (not shown) connected to the above to freely move in the space.

The surface of a wafer sheet adhered to the wafer frame 32, for example, a wafer sheet 33 formed by applying a thin adhesive agent to a polyolefin film having a thickness of 70 to 100 μm by the chip peeling device configured as described above. A method of peeling the plurality of chips 31 attached in the matrix arrangement will be described.

Before operating the chip peeling apparatus, as a preparation, the wafer frame 32 having the chips 31 attached to the wafer sheet 32 is placed on the horizontal surface of the XY table 12 having the wide opening 12a as described above. To do.

When the control device 11 is turned on after such preparation, the control device 11 moves the XY table 12 via the XY table drive device, and the chip 31 to be peeled first is the push-up pin 15. X when you reach the position directly above
The movement of the Y table 12 is temporarily stopped.

In this state, the control device 11 raises its piston rod 13a in the vertical direction via the elevating device 13, and the push-up pin 15 hung vertically on the pedestal 14 moves as shown in FIG. The chip 31 attached to the front surface of the wafer sheet 33 is penetrated from the back surface of the wafer sheet 33 and pushed up to be peeled off. Then, the piston rod 13a is temporarily stopped at a position where the chip 31 moves up from the initial position by about 100 μm.

Then, the control device 11 moves the collet 16 via the collet driving device, and the collet 16 vacuum-sucks the chip 31 whose back surface is supported by the tip of the push-up pin 15 to a predetermined position ( This chip 31 is moved to (not shown).

After that, the control device 11 returns the push-up pin 15 to the initial position via the elevating device 13 and moves the XY table 12 via the XY table drive device to perform the next peeling work, that is, 2 It will move to the peeling work of the second chip.

[0010]

By the way, it is ideal that the chip 31 is peeled from the wafer sheet 33 while the chip 31 is always kept horizontal as shown in FIG. 3 (a). is there.

However, in reality, depending on the sharpness of the tip of the push-up pin 15 and the state of the wafer sheet 33, the push-up pin 15 at the left end of the paper surface is shown in FIG.
Although it completely penetrates, the push-up pin 15 on the right end
Occasionally, the gas hardly enters the wafer sheet 33.

When such a situation occurs, the push-up pin
15 is a chip that is hard and does not deform, but its tip is in contact with a flat surface.
Bend 31 and tip 31 that cannot withstand this bend
A crack A is generated in the slab and it is damaged.

The present invention has been made to solve such a problem, and an object thereof is to provide a chip peeling apparatus capable of peeling a chip from a wafer sheet without damaging the chip.

Incidentally, FIG. 3 is an enlarged side sectional view of an essential part, which schematically shows a peeled state of the chip from the wafer sheet.

[0015]

As shown in FIG. 1, the purpose is to penetrate the tip of the push-up pin 15 from the back surface of the wafer sheet 33 and push up the chip 31 attached to the front surface of the wafer sheet 33. In the chip peeling device for peeling, when the push-up pin 15 penetrates the wafer sheet 33, the push-up pin 15 is slightly vibrated in the axial direction thereof.

[0016]

As shown in FIG. 1, the chip peeling apparatus of the present invention is
When the push-up pin 15 penetrates the wafer sheet 33, the push-up pin 15 is slightly vibrated in its axial direction.

Therefore, since the speed at which the push-up pin 15 pushes up the wafer sheet 33 is increased by the speed due to the slight vibration, the sharpness of the tip is improved, and the penetration of the wafer sheet 33 makes a slight penetration into the wafer sheet 33. The push-up pin 15
Penetrates the wafer sheet 33 smoothly.

For this reason, the chip peeling apparatus of the present invention, as shown in FIG.
Can be peeled off while being held in a horizontal state.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A chip peeling apparatus according to an embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a view for explaining a chip peeling device of an embodiment of the present invention, and FIG. 1 (a) is a side sectional view of a main part of the chip peeling device of the first embodiment of the present invention,
FIG. 2B is a side sectional view of the main part of the chip peeling apparatus of the second embodiment of the present invention, and FIG. 3C is a schematic view of the state of the wafer sheet when the chips are peeled in the first embodiment. FIG. 3D is an enlarged side sectional view of an essential part, and FIG. 3D is an enlarged side sectional view of an essential part schematically showing the state of the wafer sheet when the chip is peeled off in the second embodiment.

In the present specification, the same reference numerals are given to the same parts and the same materials throughout the drawings. The chip peeling apparatus according to the first embodiment of the present invention shown in FIG. 3A is constructed based on the conventional chip peeling apparatus described with reference to FIG.

That is, in the chip peeling device of the first embodiment, an AC voltage is applied from an oscillator (not shown) instead of the pedestal 14 of the conventional chip peeling device, for example, about 10 μm in the thickness direction. It is configured by mounting a PZT type vibrator 21 which vibrates at a frequency of about 40 KHz.

On the back side, the piston rod of the lifting device 13
The push-up pin is attached to the surface of the vibrator 21 fixed to the upper end surface of 13a.
Of course, 15 are hung vertically. In the chip peeling device of the first embodiment having such a configuration, the control device 11 thereof activates the oscillator together with the activation of the elevating device 13 so that the push-up pin 15 which has started to rise together with the piston rod 13a moves in the axial direction thereof. Make a slight vibration.

Thus, the push-up pin 15 can be peeled from the wafer sheet 33 while holding the chip 31 in the horizontal state as described above. Further, the chip peeling apparatus of the second embodiment has a suction mechanism having a suction table 22 capable of vacuum sucking the wafer sheet 33 from the back surface as shown in FIG. It has been configured.

This suction mechanism is made of a breathable material, for example, a sintered metal formed by sintering small metal balls into a sponge shape, and has an insertion hole 22a through which the push-up pin 15 can freely move in and out. The suction table 22 provided, the vacuum container 23 in which the lifting and lowering device 13 in which the vibrator 21 having the push-up pin 15 suspended by using the suction table 22 as a ceiling plate is fixed to the piston rod 13a is housed, and the inside of the vacuum container 23 are It is configured to include an exhaust device 24 for exhausting, and an electromagnetic valve 25 controlled by the control device 11 to connect and disconnect the inside of the vacuum container 22 and the atmosphere.

The chip peeling device of the second embodiment of the present invention thus constructed has the function of the chip peeling device of the first embodiment and the suction table which is the ceiling plate of the vacuum container 23.
It also has a function of securely vacuum-adsorbing the wafer sheet 33 on the horizontal surface of 22.

Therefore, when the push-up pin 15 penetrates the wafer sheet 33 and separates the chips 31, if the vacuum chamber 23 is decompressed by the exhaust device 24, the wafer sheet 33 is surely attracted to the suction table 22 by surface suction. Will be fixed.

As a result, when the chip 31 is peeled off by the push-up pin 15, the swelling phenomenon of the wafer sheet 33 as shown in FIG. 7C occurs in the conventional chip peeling apparatus and the chip peeling apparatus of the first embodiment. Will disappear as shown in Fig. 4 (d).

Thus, the chip peeling apparatus of the second embodiment can peel the chip 31 from the wafer sheet 33 in a more stable state as compared with the chip peeling apparatus of the first embodiment.

Before moving the wafer frame 32 to which the wafer sheet 33 is attached, operate the solenoid valve 25,
Needless to say, the atmosphere is introduced into the vacuum container 23.

[0030]

As described above, the present invention makes it possible to provide a chip peeling device capable of peeling a chip from a wafer sheet without damaging the chip.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a chip peeling apparatus according to an embodiment of the present invention,

FIG. 2 is a diagram for explaining a conventional chip peeling device,

FIG. 3 is an enlarged side sectional view of an essential part schematically showing a peeled state of a chip from a wafer sheet.

[Explanation of symbols]

11 is a control device, 12 is the XY table, 12a is an opening, 13 is the lifting device, 13a is a piston rod, 14 is the pedestal, 15 is the push-up pin, 16 is a collet, 21 is the oscillator, 22 is a suction table, 23 is a vacuum container, 24 is the exhaust system, 25 is a solenoid valve, 31 is a chip, 32 is the wafer frame, 33 indicates a wafer sheet, respectively.

Claims (2)

[Claims] 1. A chip peeling device for penetrating a tip of a push-up pin (15) from the back surface of a wafer sheet (33) and pushing up and peeling a chip (31) attached to the surface of the wafer sheet (33). A chip peeling apparatus characterized in that, when the push-up pin (15) penetrates the wafer sheet (33), the push-up pin (15) is slightly vibrated in the axial direction thereof. 2. The chip peeling apparatus according to claim 1, wherein a wafer sheet (33) is provided on the surface of the suction means (22) made of a breathable material, the back surface (22a) of which is exposed in a space depressurized to atmospheric pressure or less.
A vacuum chip peeling device.