JPH05218228A - Substrate for electronic component mounting use - Google Patents
Substrate for electronic component mounting useInfo
- Publication number
- JPH05218228A JPH05218228A JP5426992A JP5426992A JPH05218228A JP H05218228 A JPH05218228 A JP H05218228A JP 5426992 A JP5426992 A JP 5426992A JP 5426992 A JP5426992 A JP 5426992A JP H05218228 A JPH05218228 A JP H05218228A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- insulating base
- base material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，加工容易，構造簡単
で，高密度実装が可能な電子部品搭載用基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting electronic parts, which is easy to process, has a simple structure, and enables high-density mounting.
【０００２】[0002]
【従来技術】近年，電子部品の高密度集積化が進んでき
ている。それに伴い，電子部品からの電気信号を受信す
る電子部品搭載用基板の高密度実装化が要求されてい
る。その従来技術として，例えば，実開昭５５−１７６
５７１に開示されたごとき電子部品搭載用基板がある。2. Description of the Related Art In recent years, high-density integration of electronic parts has advanced. Along with this, there is a demand for high-density mounting of electronic component mounting boards that receive electrical signals from electronic components. As the prior art, for example, the actual exploitation 55-176
There is an electronic component mounting substrate as disclosed in 571.
【０００３】上記電子部品搭載用基板は，図８〜１０に
示すごとく，絶縁基材９０１，９０２，９０３からなる
基板本体と，絶縁基材９０１の表面９１に設けられた電
子部品搭載用凹部９５と，上記電子部品搭載用凹部９５
の周囲に設けられたボンディングパッド７と，絶縁基材
９０３の裏面９９に格子状に設けた多数の外部端子８
１，８２，８３とを有する。かかる構造の電子部品搭載
用基板は，リードレスチップキャリアとも称されてい
る。As shown in FIGS. 8 to 10, the electronic component mounting substrate is a substrate body made of insulating base materials 901, 902 and 903, and an electronic component mounting recess 95 provided on a surface 91 of the insulating base material 901. And the electronic component mounting recess 95
And bonding pads 7 provided around the peripheral surface of the insulating base material 903 and a large number of external terminals 8 arranged in a grid pattern on the back surface 99 of the insulating base material 903.
1, 82, and 83. The electronic component mounting substrate having such a structure is also called a leadless chip carrier.
【０００４】そして，図８，９に示すごとく，外部端子
８１〜８３の中，外部端子８１は基板本体の最も外側に
位置し，外部端子８２，８３は電子部品搭載用凹部９５
の下方にあり，外部端子８２は外部端子８１，８３の間
に位置している。上記外部端子８１は，絶縁基材９０１
〜９０３を貫通する１本のスルーホール５１により，接
続回路５７と接続されている。接続回路５７はボンディ
ングパッド７に接続されている（図９）。かかる外部端
子８２は，ブラインドバイアホール５２，５３，及びそ
の間に設けた内層回路６を介して，接続回路５７と接続
されている。外部端子８３は，ブラインドバイアホール
５４，５５，その間に設けた内層回路６を介して，接続
回路５７と接続されている。Then, as shown in FIGS. 8 and 9, among the external terminals 81 to 83, the external terminal 81 is located at the outermost side of the substrate body, and the external terminals 82 and 83 are recessed portions 95 for mounting electronic parts.
, And the external terminal 82 is located between the external terminals 81 and 83. The external terminal 81 is an insulating base material 901.
One through hole 51 penetrating through ˜903 connects to the connection circuit 57. The connection circuit 57 is connected to the bonding pad 7 (FIG. 9). The external terminal 82 is connected to the connection circuit 57 via the blind via holes 52, 53 and the inner layer circuit 6 provided therebetween. The external terminal 83 is connected to the connection circuit 57 via the blind via holes 54, 55 and the inner layer circuit 6 provided therebetween.
【０００５】上記電子部品搭載用凹部９５には，電子部
品４が搭載されている。該電子部品４とボンディングパ
ッド７とは，ボンデングワイヤー４７により接続されて
いる。上記従来の電子部品搭載用基板は，外部端子８１
〜８３が，絶縁基材９の裏面９９に格子状に多数設けら
れている。そのため，上記外部端子を，絶縁基材９０３
の裏面９９全域に設けることができ，電子部品搭載用基
板の高密度実装化を図ることができる。The electronic component 4 is mounted in the electronic component mounting recess 95. The electronic component 4 and the bonding pad 7 are connected by a bonding wire 47. The above-mentioned conventional electronic component mounting board has an external terminal 81.
On the back surface 99 of the insulating base material 9, a large number of elements are arranged in a grid pattern. Therefore, the external terminals are connected to the insulating base material 903.
Since it can be provided on the entire back surface 99, high density mounting of the electronic component mounting board can be achieved.
【０００６】[0006]
【解決しようとする課題】しかしながら，上記ブライン
ドバイアホール５２〜５５，内層回路６による，接続回
路５７と外部端子８２，８３との接続は，構造上複雑な
ものとなる。即ち，上記外部端子８２，８３は，電子部
品搭載用凹部９５の下方に相当する位置（図１０一点鎖
線枠内）に設けられている。そのため，電子部品搭載用
基板の内部，即ちブラインドバイアホール５２〜５５の
途中に内層回路６を設けなければならない。該内層回路
６を形成する場合には，まず絶縁基材９０２，９０３を
用いて，その各表面に内層回路６を形成しておく。次
に，上記各絶縁基材にブラインドバイアホール５２〜５
５を設ける。その後，上記絶縁基材９０１〜９０３を積
層し，接着する。However, the connection between the connection circuit 57 and the external terminals 82 and 83 by the blind via holes 52 to 55 and the inner layer circuit 6 is structurally complicated. That is, the external terminals 82 and 83 are provided at a position corresponding to the lower part of the electronic component mounting recess 95 (indicated by a chain line in FIG. 10). Therefore, the inner layer circuit 6 must be provided inside the electronic component mounting board, that is, in the middle of the blind via holes 52 to 55. When forming the inner layer circuit 6, first, the insulating base materials 902 and 903 are used to form the inner layer circuit 6 on each surface thereof. Next, the blind via holes 52 to 5 are formed on the insulating base materials.
5 is provided. Then, the insulating base materials 901 to 903 are laminated and adhered.
【０００７】そのため，電子部品搭載用基板の製造工程
数が多く，手間と労力を必要とする。それ故，電子部品
搭載用基板がコスト高となる。また，電子部品搭載用基
板の実装状態が高密度になると，内層回路６の配線パタ
ーンの配置が複雑になる。また，配線パターンの設計自
由度が少なくなる。本発明は，かかる問題点に鑑み，加
工容易，構造簡単で，高密度実装が可能な電子部品搭載
用基板を提供しようとするものである。Therefore, the number of manufacturing steps of the electronic component mounting board is large, and labor and labor are required. Therefore, the cost of the electronic component mounting board becomes high. Further, when the mounting state of the electronic component mounting board becomes high, the layout of the wiring pattern of the inner layer circuit 6 becomes complicated. In addition, the degree of freedom in designing the wiring pattern is reduced. In view of the above problems, the present invention aims to provide an electronic component mounting substrate that is easy to process, has a simple structure, and enables high-density mounting.
【０００８】[0008]
【解決するための手段】本発明は，表面に電子部品搭載
部を有する絶縁基材と，上記電子部品搭載部の周囲に設
けたボンディングパッドと，絶縁基材の裏面に設けた外
部端子と，絶縁基材の外縁部に設けられた貫通スルーホ
ールと，上記ボンディングパッドと貫通スルーホールと
を接続する第１配線パターンと，上記貫通スルーホール
と上記外部端子とを接続する第２配線パターンとを有す
ることを特徴とする電子部品搭載用基板にある。According to the present invention, an insulating base material having an electronic component mounting portion on its surface, bonding pads provided around the electronic component mounting portion, and external terminals provided on the back surface of the insulating base material are provided. A through wiring hole provided on the outer edge of the insulating base material; a first wiring pattern connecting the bonding pad and the through through hole; and a second wiring pattern connecting the through hole and the external terminal. The electronic component mounting board is characterized by having.
【０００９】本発明において最も注目すべきことは，貫
通スルーホールを電子部品搭載部よりも離れた絶縁基材
の外縁部に集合させたこと，及びボンディングパッドと
貫通スルーホールとを接続する第１配線パターンと，貫
通スルーホールと外部端子とを接続する第２配線パター
ンとを設けたことである。What is most noticeable in the present invention is that the through-holes are gathered at the outer edge portion of the insulating base material which is separated from the electronic component mounting portion, and the first connecting pad and the through-hole are connected. That is, the wiring pattern and the second wiring pattern for connecting the through hole and the external terminal are provided.
【００１０】上記貫通スルーホールは，電子部品搭載用
基板の表面と裏面との間を貫通すると共に第１配線パタ
ーンと第２配線パターンとを電気的に導通させる導体で
ある。貫通スルーホールは，上記外縁部において，１列
に配列させてもよい。また，２列以上に配列させてもよ
い。貫通スルーホールは，電子部品搭載用基板の側面側
に設けられた，半円状外円スルーホールであってもよ
い。上記，絶縁基材の外縁部とは，電子部品搭載用基板
において，電子部品搭載部よりも離れた，絶縁基材の外
周部分近く又は外周をいう。The through-holes are conductors that penetrate between the front surface and the back surface of the electronic component mounting board and electrically connect the first wiring pattern and the second wiring pattern. The through-holes may be arranged in a line at the outer edge. Further, they may be arranged in two or more columns. The through-holes may be semicircular outer circle through-holes provided on the side surface of the electronic component mounting board. The outer edge portion of the insulating base material means, in the electronic component mounting board, near or around the outer peripheral portion of the insulating base material, which is farther from the electronic component mounting portion.
【００１１】上記外部端子は，電子部品搭載用基板の裏
面の全域の任意の位置に設ける。外部端子は，例えば格
子状，渦型状などに配置する。上記絶縁基材は１枚また
は２枚以上である。２枚以上の場合，絶縁基材の内部に
上記第１配線パターンを配置し，第１配線パターン，接
地回路，電源回路などを配線させることができる。The external terminals are provided at arbitrary positions on the entire back surface of the electronic component mounting board. The external terminals are arranged, for example, in a lattice shape or a spiral shape. The insulating base material is one or more. In the case of two or more sheets, the above-mentioned first wiring pattern can be arranged inside the insulating base material and the first wiring pattern, the ground circuit, the power supply circuit, etc. can be wired.
【００１２】また，絶縁基材の材料は，ガラスエポキシ
樹脂，ガラストリアジン樹脂，ガラスポリイミド樹脂等
の合成樹脂基板を用いる。ボンディングパッド及び外部
端子の表面には，Ｎｉ／Ａｕメッキ被膜が施されている
ことが好ましい。また，貫通スルーホールの径は０．４
ｍｍ以下が好ましい。これにより，絶縁基材の外縁部に
貫通スルーホールを多数設けることができ，高密度実装
が可能となる。また，電子部品搭載部は，ザグリ加工等
により凹状を成しておくことが好ましい。絶縁基材の表
面及び裏面には，ボンディングパッド，外部端子及び貫
通スルーホールを除いてソルダーレジストを被覆するこ
とが好ましい。As the material of the insulating base material, a synthetic resin substrate made of glass epoxy resin, glass triazine resin, glass polyimide resin or the like is used. The surfaces of the bonding pad and the external terminal are preferably coated with Ni / Au plating. The diameter of the through hole is 0.4.
mm or less is preferable. As a result, a large number of through-holes can be provided on the outer edge of the insulating base material, which enables high-density mounting. Further, it is preferable that the electronic component mounting portion is formed in a concave shape by counterboring or the like. It is preferable that the front surface and the back surface of the insulating base material are coated with a solder resist except for the bonding pad, the external terminal and the through-hole.
【００１３】[0013]
【作用及び効果】本発明の電子部品搭載用基板において
は，絶縁基材の外縁部に貫通スルーホールを設け，ボン
ディングパッドと外部端子との間を，第１配線パターン
と貫通スルーホールと第２配線パターンとにより接続し
ている。そのため，上記電子部品搭載用基板の表面と裏
面との配線パターンの接続は，絶縁基材に直線状に穿設
した貫通スルーホールにより行えば良く，従来のごとく
形成困難なブラインドバイアホールを設ける必要がな
い。In the electronic component mounting board of the present invention, the through hole is provided at the outer edge of the insulating base material, and the first wiring pattern, the through hole, and the second through hole are provided between the bonding pad and the external terminal. It is connected with the wiring pattern. Therefore, the wiring patterns on the front surface and the back surface of the electronic component mounting board may be connected by through-holes linearly formed in the insulating base material, and blind via holes, which are difficult to form as in the past, need to be provided. There is no.
【００１４】また，そのため，電子部品搭載用基板の実
装状態を高密度にする場合でも，配線パターンの構造が
簡単である。それ故，電子部品搭載用基板の加工が容易
である。また，貫通スルーホールは，絶縁基材の外縁部
にある。そのため，外部端子は，電子部品搭載用基板の
裏面のほぼ全域において，任意の位置に設けることがで
きる。そのため，高密度実装に多数必要な外部端子の設
計に大きな自由度がある。従って，本発明によれば，加
工容易，構造簡単で，高密度実装が可能な電子部品搭載
用基板を提供することができる。Therefore, the structure of the wiring pattern is simple even when the mounting state of the electronic component mounting board is made high. Therefore, it is easy to process the electronic component mounting board. Further, the through-holes are located at the outer edge of the insulating base material. Therefore, the external terminals can be provided at arbitrary positions on almost the entire back surface of the electronic component mounting board. Therefore, there is a great deal of freedom in designing the external terminals that are required for high-density mounting. Therefore, according to the present invention, it is possible to provide an electronic component mounting substrate which is easy to process and has a simple structure and which enables high-density mounting.
【００１５】[0015]
実施例１ 本発明の実施例にかかる電子部品搭載用基板（リードレ
スチップキャリア）につき，図１ないし図３を用いて説
明する。本例の電子部品搭載用基板は，図１に示すごと
く，表面９１に電子部品搭載部９５を有する絶縁基材９
と，電子部品搭載部９５の周囲に設けたボンディングパ
ッド７と，絶縁基材９の裏面９９に設けた外部端子２と
を有する。また，，絶縁基材９の外縁部９２に穿設され
た円形状の貫通スルーホール１と，ボンディングパッド
７と貫通スルーホール１とを接続する第１配線パターン
１７と，貫通スルーホール１と外部端子２とを接続する
第２配線パターン１２とを有する。Example 1 An electronic component mounting substrate (leadless chip carrier) according to an example of the present invention will be described with reference to FIGS. As shown in FIG. 1, the electronic component mounting board of the present example has an insulating substrate 9 having an electronic component mounting portion 95 on a surface 91.
And the bonding pad 7 provided around the electronic component mounting portion 95 and the external terminal 2 provided on the back surface 99 of the insulating base material 9. In addition, the circular through-hole 1 formed in the outer edge portion 92 of the insulating base material 9, the first wiring pattern 17 connecting the bonding pad 7 and the through-through hole 1, the through-hole 1 and the outside It has the 2nd wiring pattern 12 which connects with the terminal 2.
【００１６】上記電子部品搭載部９５は，凹状形をして
いる。その壁面は，銅メッキ９５１で被覆されている。
上記ボンディングパッド７は，図２に示すごとく，電子
部品搭載部９５の周囲に，１列に等間隔に配列されてい
る。上記外部端子２は，図３に示すごとく，絶縁基材９
の裏面９９に格子状に配列されている。貫通スルーホー
ル１は，外部端子２よりも外側において絶縁基材９の外
周端近くに，１列に等間隔に配列されている。The electronic component mounting portion 95 has a concave shape. The wall surface is covered with copper plating 951.
As shown in FIG. 2, the bonding pads 7 are arranged in one row at equal intervals around the electronic component mounting portion 95. The external terminal 2 has an insulating base material 9 as shown in FIG.
Are arranged in a lattice pattern on the back surface 99 of the. The through-holes 1 are arranged outside the external terminal 2 near the outer peripheral edge of the insulating base material 9 in one row at equal intervals.
【００１７】本例の電子部品搭載用基板においては，絶
縁基材９の外縁部９２に貫通スルーホール１を設けてい
る。貫通スルーホール１は，絶縁基材９の表面９１にお
いては，第１配線パターン１７を介してボンディングパ
ッド７と接続されている。一方，絶縁基材９の裏面９９
においては，第２配線パターン１２を介して外部端子２
と接続されている。その他は，従来例と同様である。In the electronic component mounting board of this example, the through-hole 1 is provided in the outer edge portion 92 of the insulating base material 9. The through-hole 1 is connected to the bonding pad 7 via the first wiring pattern 17 on the surface 91 of the insulating base material 9. On the other hand, the back surface 99 of the insulating base material 9
In the external terminal 2 via the second wiring pattern 12.
Connected with. Others are the same as the conventional example.
【００１８】本例の電子部品搭載用基板においては，絶
縁基材９の外縁部９２に貫通スルーホール１を設け，ボ
ンディングパッド７と外部端子２との間を，第１配線パ
ターン１７と貫通スルーホール１と第２配線パターン１
２とにより接続されている。そのため，上記電子部品搭
載用基板の表面９１と裏面９９との配線パターンの接続
は，絶縁基材９に直線状に穿設した貫通スルーホール１
により行えば良く，従来のごとく形成困難なブラインド
バイアホールを設ける必要がない。In the electronic component mounting substrate of this example, the through-hole 1 is provided in the outer edge portion 92 of the insulating base material 9, and the first wiring pattern 17 and the through-hole are provided between the bonding pad 7 and the external terminal 2. Hole 1 and second wiring pattern 1
It is connected by 2 and. Therefore, the connection of the wiring pattern between the front surface 91 and the back surface 99 of the electronic component mounting substrate is performed by penetrating the through-hole 1 formed in the insulating base material 9 in a straight line.
It is not necessary to provide a blind via hole which is difficult to form as in the conventional case.
【００１９】そのため，電子部品搭載用基板の実装状態
を高密度にする場合でも，配線パターンの構造が簡単で
ある。即ち，第１配線パターン１７と第２配線パターン
１２との接続には，貫通スルーホール１を設けるのみで
良い。従って，電子部品搭載用基板の加工が容易であ
る。手間がかからない。また，貫通スルーホール１は，
電子部品搭載用基板において電子部品搭載部９５の外縁
部９２にある。外部端子２は，絶縁基材９の裏面９９の
全域の任意の位置に設けてある。そのため，貫通スルー
ホール１及び外部端子２の設計に大きな自由度がある。Therefore, even when the mounting state of the electronic component mounting board is set to a high density, the structure of the wiring pattern is simple. That is, it is only necessary to provide the through-hole 1 for connecting the first wiring pattern 17 and the second wiring pattern 12. Therefore, the processing of the electronic component mounting substrate is easy. It does not take time and effort. In addition, the through hole 1
It is on the outer edge portion 92 of the electronic component mounting portion 95 in the electronic component mounting substrate. The external terminal 2 is provided at an arbitrary position on the entire back surface 99 of the insulating base material 9. Therefore, there is great freedom in designing the through-hole 1 and the external terminal 2.
【００２０】実施例２ 本例の電子部品搭載用基板においては，図４に示すごと
く，貫通スルーホール１０を，２並列に互い違いに配列
されている。この貫通スルーホール１０は，絶縁基材９
の裏面９９において外部端子２と接続している。外部端
子２は，絶縁基材９の裏面９９の全域に配列されてい
る。一方，絶縁基材９の表面においては第１配線パター
ンによりボンディングパッドと接続されている。その他
は実施例１と同様である。本例においても，実施例１と
同様の効果を得ることができる。Embodiment 2 In the electronic component mounting board of this embodiment, as shown in FIG. 4, the through through holes 10 are arranged in parallel in two rows. The through-hole 10 is an insulating base material 9.
Is connected to the external terminal 2 on the back surface 99 of the. The external terminals 2 are arranged all over the back surface 99 of the insulating base material 9. On the other hand, the surface of the insulating base material 9 is connected to the bonding pad by the first wiring pattern. Others are the same as in the first embodiment. Also in this example, the same effect as that of the first embodiment can be obtained.
【００２１】実施例３ 本例の電子部品搭載用基板においては，図５に示すごと
く，実施例１において，絶縁基材９の外周端にも半円状
の貫通スルーホール１１を設けている。貫通スルーホー
ル１１は，絶縁基材９の裏面９９においては第２配線パ
ターン１２０により外部端子２と，絶縁基材９の表面に
おいては第１配線パターンによりボンディングパッドと
接続されている。Example 3 In the electronic component mounting substrate of this example, as shown in FIG. 5, a semicircular through-hole 11 is also provided at the outer peripheral edge of the insulating base material 9 in Example 1. The through-holes 11 are connected to the external terminals 2 on the back surface 99 of the insulating base material 9 by the second wiring pattern 120 and to the bonding pads on the front surface of the insulating base material 9 by the first wiring pattern.
【００２２】また，上記外周端よりも内側においては，
実施例１と同様の貫通スルーホール１が設けられ，第２
配線パターン１２により，外部端子２と接続されてい
る。その他は実施例１と同様である。本例においては，
絶縁基材９の外周端にも貫通スルーホールを設けている
ので，より高密度に外部端子を設けることができる。本
例においても，実施例１と同様の効果を得ることができ
る。Further, inside the outer peripheral edge,
A through through hole 1 similar to that of the first embodiment is provided, and
The wiring pattern 12 is connected to the external terminal 2. Others are the same as in the first embodiment. In this example,
Since the through-holes are also provided at the outer peripheral edge of the insulating base material 9, the external terminals can be provided at a higher density. Also in this example, the same effect as that of the first embodiment can be obtained.
【００２３】実施例４ 本例の電子部品搭載用基板においては，図６に示すごと
く，絶縁基材９１０，９１１，９１２を積層したもの
で，電子部品搭載用基板の内部に，接地回路３１と電源
回路３２とを設けている。上記接地回路３１は，電子部
品搭載部９５の銅メッキ９５１と貫通スルーホール１０
１の銅メッキとを接続している。Example 4 In the electronic component mounting board of this example, as shown in FIG. 6, insulating base materials 910, 911 and 912 are laminated, and a grounding circuit 31 and a ground circuit 31 are provided inside the electronic component mounting board. The power supply circuit 32 is provided. The ground circuit 31 includes the copper plating 951 of the electronic component mounting portion 95 and the through-holes 10.
1 and copper plating are connected.
【００２４】上記電源回路３２は，貫通スルーホール１
０２と接続されている。該貫通スルーホール１０２は第
１配線パターン１７を介して電源用のボンディングパッ
ド７と接続している。その他は，実施例１と同様であ
る。本例においても，実施例１と同様の効果を得ること
ができる。The power supply circuit 32 has a through-hole 1
02 is connected. The through-hole 102 is connected to the power supply bonding pad 7 via the first wiring pattern 17. Others are the same as in the first embodiment. Also in this example, the same effect as that of the first embodiment can be obtained.
【００２５】実施例５ 本例の電子部品搭載用基板は，図７に示すごとく，絶縁
基材９１３，９１４を積層したもので，電子部品搭載用
基板の内部にも第１配線パターン１７０を設けている。
即ち，上記電子部品搭載用基板は，表面９１に電子部品
搭載部９５を設けた下側の絶縁基材９１４と，上記電子
部品搭載部９５の開口部よりも更に大きい開口部９５５
を設けた上側の絶縁基材９１３とを有する。Example 5 The electronic component mounting substrate of this example is a laminate of insulating base materials 913 and 914 as shown in FIG. 7, and the first wiring pattern 170 is provided inside the electronic component mounting substrate. ing.
That is, the electronic component mounting substrate has a lower insulating base material 914 provided with the electronic component mounting portion 95 on the surface 91, and an opening 955 larger than the opening of the electronic component mounting portion 95.
And the insulating base material 913 on the upper side.
【００２６】上記電子部品搭載部９５及び開口部９５５
の周囲には，ボンディングパッド７０，７１を設けてい
る。絶縁基材９１３，９１４の外縁部９２には，円形状
の貫通スルーホール１を穿設している。ボンディングパ
ッド７０，７１と貫通スルーホール１とは，第１配線パ
ターン１７０，１７１を介してそれぞれ接続されてい
る。その他は実施例１と同様である。The electronic component mounting portion 95 and the opening 955 are provided.
Bonding pads 70 and 71 are provided on the periphery of the. A circular through hole 1 is formed in the outer edge portion 92 of the insulating base materials 913 and 914. The bonding pads 70 and 71 and the through-hole 1 are connected via the first wiring patterns 170 and 171 respectively. Others are the same as in the first embodiment.
【００２７】本例の電子部品搭載用基板は，第１配線パ
ターン１７０，１７１を２層の絶縁基材９１３，９１４
の間に配置されている。そのため，上記第１配線パター
ンをより高密度に配置することができる。本例において
も，実施例１と同様の効果を得ることができる。In the electronic component mounting substrate of this example, the first wiring patterns 170 and 171 are formed into two layers of insulating base materials 913 and 914.
It is located between. Therefore, the first wiring patterns can be arranged with higher density. Also in this example, the same effect as that of the first embodiment can be obtained.
【図１】実施例１の電子部品搭載用基板の断面図。FIG. 1 is a sectional view of an electronic component mounting board according to a first embodiment.
【図２】実施例１の電子部品搭載用基板の一部平面図。FIG. 2 is a partial plan view of the electronic component mounting board according to the first embodiment.
【図３】実施例１の電子部品搭載用基板の一部裏面図。FIG. 3 is a partial rear view of the electronic component mounting board according to the first embodiment.
【図４】実施例２の電子部品搭載用基板の一部裏面図。FIG. 4 is a partial rear view of the electronic component mounting board according to the second embodiment.
【図５】実施例３の電子部品搭載用基板の一部裏面図。FIG. 5 is a partial rear view of the electronic component mounting board according to the third embodiment.
【図６】実施例４の電子部品搭載用基板の断面図。FIG. 6 is a cross-sectional view of an electronic component mounting board according to a fourth embodiment.
【図７】実施例５の電子部品搭載用基板の断面図。FIG. 7 is a cross-sectional view of an electronic component mounting board according to a fifth embodiment.
【図８】従来例の電子部品搭載用基板の一部断面図。FIG. 8 is a partial cross-sectional view of a conventional electronic component mounting substrate.
【図９】従来例の電子部品搭載用基板の一部平面図。FIG. 9 is a partial plan view of a conventional electronic component mounting board.
【図１０】従来例の電子部品搭載用基板の裏面図。FIG. 10 is a rear view of a conventional electronic component mounting substrate.
１，１０，１１，１０１，１０２．．．貫通スルーホー
ル， １２，１２０．．．第２配線パターン， １７，１７０，１７１．．．第１配線パターン， ２．．．外部端子， ７．．．ボンディングパッド， ９，９１０，９１１，９１２，９１３，９１４．．．絶
縁基材，1, 10, 11, 101, 102. ． ． Through through hole, 12, 120. ． ． Second wiring pattern, 17, 170, 171. ． ． First wiring pattern, 2. ． ． External terminal, 7. ． ． Bonding pad, 9, 910, 911, 912, 913, 914. ． ． Insulating base material,
Claims (1)
と，上記電子部品搭載部の周囲に設けたボンディングパ
ッドと，絶縁基材の裏面に設けた外部端子と，絶縁基材
の外縁部に設けられた貫通スルーホールと，上記ボンデ
ィングパッドと貫通スルーホールとを接続する第１配線
パターンと，上記貫通スルーホールと上記外部端子とを
接続する第２配線パターンとを有することを特徴とする
電子部品搭載用基板。1. An insulating base material having an electronic component mounting portion on its surface, bonding pads provided around the electronic component mounting portion, external terminals provided on the back surface of the insulating base material, and an outer edge portion of the insulating base material. And a first wiring pattern for connecting the bonding pad and the through through hole, and a second wiring pattern for connecting the through through hole and the external terminal. Substrate for mounting electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5426992A JPH05218228A (en) | 1992-02-04 | 1992-02-04 | Substrate for electronic component mounting use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5426992A JPH05218228A (en) | 1992-02-04 | 1992-02-04 | Substrate for electronic component mounting use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05218228A true JPH05218228A (en) | 1993-08-27 |
Family
ID=12965860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5426992A Pending JPH05218228A (en) | 1992-02-04 | 1992-02-04 | Substrate for electronic component mounting use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05218228A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283336A (en) * | 1994-04-05 | 1995-10-27 | Toppan Printing Co Ltd | Chip carrier |
| JP2002334951A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Substrate for semiconductor element mounting and semiconductor package |
| JP2002334948A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package, substrate for semiconductor element mounting and method of manufacturing them |
| JP2002334949A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package and method of manufacturing substrate for semiconductor element mounting |
-
1992
- 1992-02-04 JP JP5426992A patent/JPH05218228A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002334951A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Substrate for semiconductor element mounting and semiconductor package |
| JP2002334948A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package, substrate for semiconductor element mounting and method of manufacturing them |
| JP2002334949A (en) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | Semiconductor package and method of manufacturing substrate for semiconductor element mounting |
| JPH07283336A (en) * | 1994-04-05 | 1995-10-27 | Toppan Printing Co Ltd | Chip carrier |
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