JPH0487623U - - Google Patents

Info

Publication number
JPH0487623U
JPH0487623U JP10781690U JP10781690U JPH0487623U JP H0487623 U JPH0487623 U JP H0487623U JP 10781690 U JP10781690 U JP 10781690U JP 10781690 U JP10781690 U JP 10781690U JP H0487623 U JPH0487623 U JP H0487623U
Authority
JP
Japan
Prior art keywords
chip
multilayer ceramic
electrodes
type multilayer
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10781690U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10781690U priority Critical patent/JPH0487623U/ja
Publication of JPH0487623U publication Critical patent/JPH0487623U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図はそれぞれ本考案の一実施
例によるチツプ形積層セラミツクコンデンサの平
断面図および側断面図、第３図および第４図はそ
れぞれ本考案の他の実施例によるチツプ形積層セ
ラミツクコンデンサの平断面図および側断面図、
第５図および第６図はそれぞれ従来技術によるチ
ツプ形積層セラミツクコンデンサの一例の平断面
図および側断面図である。 １……内部電極、２……セラミツク誘電体膜、
３……外部電極、４……セラミツク素子、５……
凹部、Ｌ……長さ、Ｗ……幅、Ｔ……厚さ。 1 and 2 are respectively a plan sectional view and a side sectional view of a chip-shaped multilayer ceramic capacitor according to one embodiment of the present invention, and FIGS. 3 and 4 are respectively a chip-shaped multilayer ceramic capacitor according to another embodiment of the present invention. Planar cross-sectional view and side cross-sectional view of a ceramic capacitor,
5 and 6 are a plan sectional view and a side sectional view, respectively, of an example of a chip-type multilayer ceramic capacitor according to the prior art. 1... Internal electrode, 2... Ceramic dielectric film,
3... External electrode, 4... Ceramic element, 5...
Recess, L...length, W...width, T...thickness.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に内部電極を印刷したセラミツク誘電体膜
を、対向電極を形成する様に複数枚積層し、両端
の内部電極取り出し面に導電性ペーストにて外部
電極を形成したチツプ形積層セラミツクコンデン
サにおいて、セラミツク素子表面と外部電極表面
とがほぼ同一面上に配置されていることを特徴と
するチツプ形積層セラミツクコンデンサ。 In chip-type multilayer ceramic capacitors, multiple ceramic dielectric films with internal electrodes printed on their surfaces are laminated to form counter electrodes, and external electrodes are formed with conductive paste on the internal electrode extraction surfaces at both ends. A chip-type multilayer ceramic capacitor characterized in that the element surface and the external electrode surface are arranged on almost the same plane.
JP10781690U 1990-10-15 1990-10-15 Pending JPH0487623U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10781690U JPH0487623U (en) 1990-10-15 1990-10-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10781690U JPH0487623U (en) 1990-10-15 1990-10-15

Publications (1)

Publication Number Publication Date
JPH0487623U true JPH0487623U (en) 1992-07-30

Family

ID=31854505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10781690U Pending JPH0487623U (en) 1990-10-15 1990-10-15

Country Status (1)

Country Link
JP (1) JPH0487623U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044921A (en) * 2003-07-25 2005-02-17 Murata Mfg Co Ltd Laminated ceramic electronic component and manufacturing method thereof
JP2013183028A (en) * 2012-03-01 2013-09-12 Ibiden Co Ltd Electronic component built-in wiring board, chip capacitor, and manufacturing method of electronic component built-in wiring board
JP2016111316A (en) * 2014-12-05 2016-06-20 太陽誘電株式会社 Multilayer ceramic electronic component
JP2018046131A (en) * 2016-09-14 2018-03-22 太陽誘電株式会社 Multilayer ceramic capacitor
JP2021090071A (en) * 2021-03-03 2021-06-10 太陽誘電株式会社 Multilayer ceramic capacitor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044921A (en) * 2003-07-25 2005-02-17 Murata Mfg Co Ltd Laminated ceramic electronic component and manufacturing method thereof
JP4547876B2 (en) * 2003-07-25 2010-09-22 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component
JP2013183028A (en) * 2012-03-01 2013-09-12 Ibiden Co Ltd Electronic component built-in wiring board, chip capacitor, and manufacturing method of electronic component built-in wiring board
JP2016111316A (en) * 2014-12-05 2016-06-20 太陽誘電株式会社 Multilayer ceramic electronic component
JP2018110248A (en) * 2014-12-05 2018-07-12 太陽誘電株式会社 Laminated ceramic electronic component
JP2018110249A (en) * 2014-12-05 2018-07-12 太陽誘電株式会社 Laminated ceramic electronic component
JP2018113451A (en) * 2014-12-05 2018-07-19 太陽誘電株式会社 Laminated ceramic electronic component
JP2018046131A (en) * 2016-09-14 2018-03-22 太陽誘電株式会社 Multilayer ceramic capacitor
JP2021090071A (en) * 2021-03-03 2021-06-10 太陽誘電株式会社 Multilayer ceramic capacitor

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