JPH04278560A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To make the selection from semiconductor pellets precisely and rapidly by substituting the electrical testing method for the conventional visual inspection method. CONSTITUTION:A meshy film resistor 3 is provided on the surface protective film 2 of a semiconductor chip 13. Next, the resistance value of the film resistor 3 is measured during the in-process inspection step so that the nonconformities such as flaws 10, cracks 11, etc., may be detected to make the selection from semiconductor pellets.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing semiconductor devices, and more particularly to a method for selecting semiconductor chips.

0002

2. Description of the Related Art In a conventional semiconductor device sorting method, as shown in FIG. 3, each needle-like electrode 7 is connected to each bonding pad portion 6 in a wafer state, and the characteristics of a semiconductor chip 13 are inspected. do. Thereafter, the semiconductor chips are separated into individual semiconductor chips through a dicing process, and a visual inspection is performed using a microscope to remove semiconductor chips with poor external appearance, such as scratches 10, cracks 11, and attached foreign matter 12. The remaining semiconductor chips with good appearance are then subjected to an assembly process and a sorting process to be completed as a final semiconductor device.

0003

[Problems to be Solved by the Invention] In this conventional semiconductor device manufacturing method, a large number of man-hours are required to select semiconductor chips with good appearance, which increases the cost of the semiconductor device and shortens the delivery time. It has become a hindrance. Furthermore, there is a problem in that there is an extremely high risk that semiconductor chips with poor appearance may be mixed in due to human error in the appearance inspection process.

0004

[Means for Solving the Problems] A method for manufacturing a semiconductor device according to the present invention includes a mesh-shaped film resistor on a surface of a semiconductor chip except for a bonding pad portion on a surface protection film, and a pair of inspections on the film resistor. and a step of bringing a needle electrode into contact with the pair of test pads to measure the resistance of the film resistor and sorting the semiconductor chips.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of a wafer used to explain one embodiment of the present invention. On the surface protective film 2 of a semiconductor chip 1 used in a semiconductor device, resistive films having a constant thickness and width are arranged in a lattice pattern at equal intervals on one surface excluding the bonding pad portion 6 to form a mesh-like film resistor. A body 3 is provided. A pair of test pads 4 and 5 are provided on diagonal lines of such a square film resistor. At the same time as connecting the needle electrode 7 to the bonding pad portion 6 and performing a characteristic test,
By connecting other needle electrodes 8 and 9 to the test pads 4 and 5 and measuring the resistance value between the test pads 4 and 5,
It becomes possible to electrically and instantaneously remove semiconductor chips 1 that have defects in appearance inspection, such as scratches 10, cracks 11, foreign matter adhesion 12, etc. on the surface protection film 2, which cannot be removed only by characteristic inspection.

FIG. 2 is a schematic diagram of the membrane resistor used in this example. The resistance value of 2N (N≧2) resistive films arranged at equal intervals and intersecting in a mesh pattern is defined as r [Ω] per side of each mesh, and the resistance value is set between the test pads 4 and 5 at both ends. If a current I [A] flows when a voltage V volt is applied to the

[0008]

That is, the resistance value R between the test pads 4 and 5 is determined by the number of intersections (N squared). Therefore, by increasing the number of intersections and narrowing the interval between the resistors, it becomes possible to more sensitively detect appearance inspection failure modes such as scratches, cracks, and foreign matter adhesion.

0010

As explained above, the present invention provides a mesh film resistor on the surface of a semiconductor chip used in a semiconductor device, excluding the bonding pad portion, on the surface of the surface protection film, and test pads on both ends thereof. By this, bonding
At the same time as connecting the pad part and the needle-like electrode and performing a characteristic test, connect another needle-like electrode to the test pad part,
By testing the resistance value between inspection pads, defects such as scratches, cracks, and foreign matter adhesion on the surface protective film of semiconductor chips can be electrically and instantaneously detected, simplifying the semiconductor chip selection process. This has the effect of making it possible to achieve high resolution or high precision.

[Brief explanation of the drawing]

FIG. 1 is a plan view used to explain one embodiment of the present invention.

FIG. 2 is a schematic diagram used to explain one embodiment of the present invention.

FIG. 3 is a plan view used to explain the prior art.

[Explanation of symbols]

1 Semiconductor chip 2　　　　Surface protective film 3 Film resistor 4,5 Inspection pad 6 Bonding pad 7, 8, 9 Needle electrode 10 Scratches 11 Crack 12. Adhering foreign matter 13 Wafer

Claims (1)

[Claims] 1. A step of providing a mesh-like film resistor on a surface of a surface protection film of a semiconductor chip excluding a bonding pad portion, and a pair of test pads on the film resistor, and a step of providing a pair of test pads on the film resistor, A method for manufacturing a semiconductor device, comprising the step of selecting the semiconductor chips by measuring the resistance of the film resistor by bringing a needle-like electrode into contact with the film resistor.