JPH0423497A - Structure for shielding case of electronic device - Google Patents
Structure for shielding case of electronic deviceInfo
- Publication number
- JPH0423497A JPH0423497A JP12676990A JP12676990A JPH0423497A JP H0423497 A JPH0423497 A JP H0423497A JP 12676990 A JP12676990 A JP 12676990A JP 12676990 A JP12676990 A JP 12676990A JP H0423497 A JPH0423497 A JP H0423497A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed circuit
- circuit board
- outer periphery
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000011889 copper foil Substances 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
通信の3jij末用電子機器、例えば携帯用電話機等の
筐体の電磁シールド構造に関し、
軽量で取付けが簡単な電子機器用筐体の電磁シールド構
造を提供することを目的とし、プリント基板の外形寸法
より大きいアース用銅箔を中間層としてサンドインチ状
に挟み込んだ積層プリント基板によって構成された電子
機器の本体を、上下両半体からなる樹脂製の筐体内に収
容した電子機器において、前記筐体の少なくとも−方の
半体の内面には全面にわたって金属皮膜が施され、両半
体同士が合体して筐体を構成する際に、両半体の縁部の
全周においてプリント基板の外周からはみ出した銅箔部
分が前記金属皮膜と密着する構成とする。[Detailed Description of the Invention] [Summary] The present invention relates to an electromagnetic shielding structure for a housing of an electronic device used at the end of communication, such as a mobile phone, and provides an electromagnetic shielding structure for a housing for an electronic device that is lightweight and easy to install. With the aim of In the electronic device housed in the housing, the inner surface of at least one half of the housing is coated with a metal coating over the entire surface, and when the two halves are combined to form the housing, the edges of the two halves are coated. The copper foil portion protruding from the outer periphery of the printed circuit board is in close contact with the metal film around the entire circumference of the printed circuit board.
本発明は、通信の端末用電子機器、例えば携帯用電話機
等の筐体の電磁シールド構造に関する。The present invention relates to an electromagnetic shielding structure for a housing of a communication terminal electronic device, such as a mobile phone.
携帯用電話機等の電子機器は、微弱な無線信号を処理す
るため、外部との間に完全な電磁シールドを施して外乱
を遮断する必要がある。このため、従来は、機器本体を
収容する筐体を金属製として筐体自体にシールド機能を
持たせている。Since electronic devices such as mobile phones process weak wireless signals, it is necessary to provide a complete electromagnetic shield between them and the outside to block disturbances. For this reason, conventionally, the casing that houses the device body is made of metal, and the casing itself has a shielding function.
しかし、金属製筐体を使用した場合には製作費が高くな
るばかりでなく、重量が重(なり勝ちであり、携帯の簡
便性が重要な機能特性の一つとなっている携帯用電話機
等の場合には、好ましくない。However, if a metal casing is used, it not only increases manufacturing costs but also tends to be heavy, which is especially true for mobile phones and other devices where portability is one of the important functional characteristics. In some cases, it is not desirable.
本発明はこのような従来技術の問題点を解決し、軽量で
取付けが簡単な電子機器用筐体の電磁シールド構造を提
供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art and provide an electromagnetic shielding structure for an electronic device housing that is lightweight and easy to install.
この目的は、プリント基板の外形寸法より大きいアース
用銅箔を中間層としてサンドインチ状に挟み込んだ積層
プリント基板によって構成された電子機器の本体を、上
下両半体からなる樹脂製の筐体内に収容した電子機器に
おいて、前記筐体の少なくとも一方の半体の内面には全
面にわたって金属皮膜が施され、両半体同士が合体して
筐体を構成する際に、両半体の縁部の全周においてプリ
ント基板の外周からはみ出した銅箔部分が前記金属皮膜
と密着することを特徴とする電子機器の筐体シールド構
造によって達成される。The purpose of this is to place the main body of an electronic device, which is made up of a laminated printed circuit board in which a grounding copper foil larger than the external dimensions of the printed circuit board is sandwiched between the intermediate layers in a sand-inch pattern, into a resin housing consisting of upper and lower halves. In the electronic device housed in the housing, a metal coating is applied to the entire inner surface of at least one half of the housing, and when the two halves are combined to form a housing, the edges of the two halves are coated. This is achieved by a housing shield structure for an electronic device characterized in that a copper foil portion protruding from the outer periphery of the printed circuit board is in close contact with the metal film on the entire periphery.
プリント基板の銅箔と筐体内面の金属皮膜とによって、
該金属皮膜に対面する方のプリント基板の面に搭載され
た電子回路は電磁的に完全にシールされる。従って、た
とえ微弱な無線信号を処理する場合にも外乱によって妨
害を来すことが防止される。Due to the copper foil on the printed circuit board and the metal coating on the inside of the housing,
The electronic circuit mounted on the surface of the printed circuit board facing the metal film is completely electromagnetically sealed. Therefore, even when processing weak radio signals, disturbances caused by external disturbances can be prevented.
以下、図面に示す好適実施例に基づいて、本発明を更に
詳細に説明する。Hereinafter, the present invention will be explained in more detail based on preferred embodiments shown in the drawings.
第1図は本発明の対象である携帯用電話機の構成を示す
分解斜視図、第2図はその側断面図である。FIG. 1 is an exploded perspective view showing the structure of a portable telephone to which the present invention is applied, and FIG. 2 is a side sectional view thereof.
電子機器の本体は、積層ブリ、ント基板1の両面に搭載
された電子回路(図示省略)によって構成されている。The main body of the electronic device is composed of electronic circuits (not shown) mounted on both sides of a laminated printed board 1.
このプリント基板1を収容する筐体は、樹脂材料によっ
て成形された長方形の平面形状をなす上部半体2と下部
半体3とで構成され、後述するように、プリント基板1
を上下から挟んで、それぞれの外周縁に所定のピッチで
設けられた突起4及びこれに対応する孔5を嵌合させる
ことによって合体し、プリント基板1を実質的に密閉さ
れた空間内に収容する。The casing that houses the printed circuit board 1 is composed of an upper half 2 and a lower half 3 that are molded from a resin material and have a rectangular planar shape.
are put together from above and below, and the printed circuit boards 1 are housed in a substantially sealed space by fitting protrusions 4 and corresponding holes 5 provided at a predetermined pitch on the respective outer peripheries. do.
プリント基板1はいわゆる積層プリント基板であり、そ
の−層にアース用銅箔6がサンドイッチ状に挟まれてい
る。この銅箔6は、例えば0.2mm程度以下の厚さと
、長方形状のプリント基板1の外縁から所定の幅だけは
み出す程度の外形サイズを有し、筐体内に収容された場
合に、そのはみ出した部分が半体2.3の外周縁上に載
るような寸法に設定されている。そして、その外周縁に
は、前記孔5並びに突起4に対応する位置に第3図に示
すような切れ目7を有している。この切れロアの機能に
ついては後述する。The printed circuit board 1 is a so-called laminated printed circuit board, and a grounding copper foil 6 is sandwiched between its negative layer. This copper foil 6 has a thickness of, for example, about 0.2 mm or less and an external size that protrudes from the outer edge of the rectangular printed circuit board 1 by a predetermined width, and when housed in the housing, the protruding The dimensions are such that the part rests on the outer periphery of the half 2.3. The outer peripheral edge thereof has a cut 7 as shown in FIG. 3 at a position corresponding to the hole 5 and projection 4. The function of this cutting lower will be described later.
このプリント基板1の一方の面(第1図及び第2図にお
いては上の面)には、電話機の制御部を構成する電子回
路が搭載され、他方の面(下面)には無線信号処理部が
搭載されているものとする。One surface (the upper surface in FIGS. 1 and 2) of this printed circuit board 1 is equipped with an electronic circuit that constitutes the control section of the telephone, and the other surface (lower surface) is equipped with a wireless signal processing section. It is assumed that this is installed.
この無線信号処理部においては微弱な信号が取り扱われ
るので、外乱を防ぐために電磁的に完全にシールドされ
る必要がある。そこで、本発明においては、無線信号処
理部が対面している下部半体3の内面に、外周縁を含め
た全面にわたって、蒸着等によって、導電性に優れた金
属皮膜8が樹脂表面にコーティングされている。Since this wireless signal processing section handles weak signals, it needs to be completely electromagnetically shielded to prevent disturbances. Therefore, in the present invention, a highly conductive metal film 8 is coated on the resin surface by vapor deposition or the like over the entire inner surface of the lower half body 3 facing the wireless signal processing section, including the outer periphery. ing.
この電話機を組み立てるには、第1図に示すように、上
下両半体2.3の間にプリント基板1を配置し、その銅
箔6のはみ出し部分を両半体2゜3の外周縁の間に挟み
こむ。そして銅箔6に設けられた切れロアを通じて、第
4図に示すように、上部半体2の突起4と下部半体3の
孔5とを嵌合させれば、銅箔6は容易に変形して突起4
と共に孔5内に入り込む。これによって、プリント基板
1の銅箔6と下部半体3の金属皮膜8とは密着し、プリ
ント基板1の下面に搭載された無線信号処理部はこれら
銅箔6と金属皮膜8とで形成された空間内に完全に密閉
され、外部に対して完全にシールドされる。To assemble this telephone, as shown in Fig. 1, the printed circuit board 1 is placed between the upper and lower halves 2. Put it in between. Then, by fitting the protrusion 4 of the upper half body 2 and the hole 5 of the lower half body 3 through the cut lower provided in the copper foil 6, as shown in FIG. 4, the copper foil 6 can be easily deformed. and protrusion 4
It also enters the hole 5. As a result, the copper foil 6 of the printed circuit board 1 and the metal film 8 of the lower half 3 are brought into close contact, and the wireless signal processing section mounted on the lower surface of the printed circuit board 1 is formed of the copper foil 6 and the metal film 8. It is completely enclosed within the enclosed space and completely shielded from the outside.
第5図に示す例では、銅箔6と金属皮膜8とを密着させ
るための別の手段として、上部半体2の外周縁を二重の
外壁9と内壁10とで構成し、両壁の間に下部半体3の
外周縁を形成する側壁11を挟み込み、これに伴ってプ
リント基板1の銅箔6を側壁11に施された金属皮膜8
に全面接触させている。そして、両半体2,3同士を更
に接触させた場合に、前記外壁9に設けた爪9aが側壁
】1に設けた係止部11aに係合して、両者が一体化さ
れるようになっている。この例によれば、銅箔6と金属
皮膜8との接触面積が大幅に増加し、更に完全な導通が
得られる。In the example shown in FIG. 5, as another means for bringing the copper foil 6 and the metal film 8 into close contact, the outer peripheral edge of the upper half body 2 is constructed with a double outer wall 9 and an inner wall 10, and both walls are The side wall 11 forming the outer peripheral edge of the lower half body 3 is sandwiched between them, and the copper foil 6 of the printed circuit board 1 is attached to the metal film 8 applied to the side wall 11.
is in full contact with. When the two halves 2 and 3 are further brought into contact with each other, the claws 9a provided on the outer wall 9 engage with the locking portions 11a provided on the side wall 1, so that the two halves are integrated. It has become. According to this example, the contact area between the copper foil 6 and the metal film 8 is significantly increased, and more complete conduction can be obtained.
第6図に示す例では、下部半体3の外周縁に波型の凹凸
12を設けると共に、上部半体2の方にはこれを補完す
る形状の波型(図示省略)を設けている。そしてプリン
ト基板1の銅箔6には、その外周縁に前記波型凹凸12
に対応するように、L字型の切れ目13を設けている。In the example shown in FIG. 6, a wave-shaped unevenness 12 is provided on the outer peripheral edge of the lower half body 3, and a wave pattern (not shown) having a complementary shape is provided on the upper half body 2. The copper foil 6 of the printed circuit board 1 has the wave-shaped unevenness 12 on its outer periphery.
An L-shaped cut 13 is provided to correspond to the above.
前述のようにプリント基板1を上下半体2.3の間にサ
ンドインチ状に挾み込めば、互いに補完的な形状をなす
上下の波型凹凸12の間に銅箔6が挟まれ、切れ目13
の助けによって銅箔6は波型に対応して上下に変形し、
第7図に示すように、下部半体3の金属皮膜8に密着す
る。なお、この場合には、プリント基板1.上下半体2
,3はその四隅に設けられたねし孔14を通じてねじに
よって一体的に固定される。If the printed circuit board 1 is sandwiched between the upper and lower halves 2.3 in a sandwich-like manner as described above, the copper foil 6 will be sandwiched between the upper and lower corrugated concavities and convexities 12 that have mutually complementary shapes. 13
With the help of, the copper foil 6 is deformed up and down corresponding to the wave pattern,
As shown in FIG. 7, it is in close contact with the metal coating 8 of the lower half body 3. In this case, printed circuit board 1. Upper and lower halves 2
, 3 are integrally fixed with screws through tapped holes 14 provided at their four corners.
なお、いずれの例においても、四隅部分の変形を容易に
するために、第8図に示すように、銅箔8の角を落とす
共に適宜本数及び長さの切れ目15を入れることが望ま
しい。In any case, in order to facilitate the deformation of the four corners, it is desirable to cut the corners of the copper foil 8 and make cuts 15 of an appropriate number and length, as shown in FIG.
以上詳述したように、本発明によれば、積層プリント基
板の一つの層としてアース用銅箔を積層し、その外周縁
をプリント基板の外にはみ出させ、装置の組立ての際に
、これを、樹脂製筐体の内面に施された金属皮膜と密着
させて、プリント基板の一方の面に搭載された電子回路
を被覆して電磁的に完全にシールドする。樹脂製の筐体
を使用できるので、製造が容易であると共に、軽量とな
る。As described in detail above, according to the present invention, a grounding copper foil is laminated as one layer of a laminated printed circuit board, the outer periphery of the copper foil is made to protrude outside the printed circuit board, and this is removed when assembling the device. The electronic circuit mounted on one side of the printed circuit board is completely shielded electromagnetically by being brought into close contact with the metal film applied to the inner surface of the resin case. Since a resin casing can be used, manufacturing is easy and lightweight.
また、組立てと同時にシールド加工が行われるので、製
造工数が少なくてすむ。Furthermore, since shield processing is performed at the same time as assembly, the number of manufacturing steps can be reduced.
第1図は、本発明の一実施例にかかる電子機器の構成を
示す分解斜視図、
第2図は、同じく側断面図、
第3図は、銅箔の外周縁に設けられる十文字型の切れ目
を示す平面図、
第4図は、筐体の保合領域の部分拡大断面図、第5図は
、本発明の他の実施例における筐体の外周縁の断面図、
第6図は、本発明の更に別の実施例における筐体の外周
縁の部分拡大斜視図、
第7図は、同じく断面図、
第8図は、本発明に使用される銅箔の好ましい形態を示
す平面図である。
1−プリント基板
2−上部半体
3−下部半体
係合突起
係合孔
銅箔
切れ目
一金属皮膜
外壁
0・−内壁
1−側壁
2−波型凹凸
3.14−切れ口FIG. 1 is an exploded perspective view showing the configuration of an electronic device according to an embodiment of the present invention, FIG. 2 is a side sectional view, and FIG. 3 is a cross-shaped cut provided on the outer periphery of the copper foil. FIG. 4 is a partially enlarged sectional view of the retaining area of the casing, FIG. 5 is a sectional view of the outer periphery of the casing in another embodiment of the present invention, and FIG. FIG. 7 is a partially enlarged perspective view of the outer periphery of the casing in yet another embodiment of the invention; FIG. 7 is a cross-sectional view; FIG. . 1 - Printed circuit board 2 - Upper half 3 - Lower half engaging projection engaging hole Copper foil cut - Metal coating outer wall 0 - inner wall 1 - side wall 2 - corrugated unevenness 3.14 - cut
Claims (3)
6)を中間層としてサンドイッチ状に挟み込んだ積層プ
リント基板(1)によって構成された電子機器の本体を
、上下両半体(2,3)からなる樹脂製の筐体内に収容
した電子機器において、前記筐体の少なくとも一方の半
体(3)の内面には全面にわたって金属皮膜(8)が施
され、両半体(2,3)同士が合体して筐体を構成する
際に、両半体(2,3)の縁部の全周においてプリント
基板の外周からはみ出した銅箔部分(6)が前記金属皮
膜(8)と密着することを特徴とする電子機器の筐体シ
ールド構造。1. Grounding copper foil larger than the external dimensions of the printed circuit board (
6) is housed in a resin casing consisting of upper and lower halves (2, 3), in which the main body of the electronic device is constituted by a laminated printed circuit board (1) sandwiched between layers as an intermediate layer, The inner surface of at least one half (3) of the housing is coated with a metal coating (8) over the entire surface, and when the two halves (2, 3) are combined to form a housing, both halves (2, 3) A housing shield structure for an electronic device, characterized in that a copper foil portion (6) protruding from the outer periphery of a printed circuit board around the entire edge of the body (2, 3) is in close contact with the metal film (8).
周縁には係合孔(5)が、他方の半体(2)の外周縁に
は該係合孔(5)に嵌合可能な突起(6)が設けられ、
プリント基板の銅箔(6)の外周縁にはこれらの互いに
嵌合可能な突起(4)と係合孔(5)に対応する位置に
十文字の切れ目(7)が設けられている請求項1に記載
の筐体シールド構造。2. An engagement hole (5) is provided on the outer periphery of the half body (3) on which the metal coating (8) is applied, and an engagement hole (5) is provided on the outer periphery of the other half body (2). A matable protrusion (6) is provided;
Claim 1: A cross-shaped cut (7) is provided on the outer peripheral edge of the copper foil (6) of the printed circuit board at a position corresponding to the projection (4) and the engagement hole (5) that can be fitted into each other. The housing shield structure described in .
凹凸(12)を有し、プリント基板の銅箔(6)の外周
縁が該波型に対応して容易に変形可能にL字型の切れ目
(13)を有している請求項1に記載の筐体シールド構
造。3. The outer periphery of each half (2, 3) has corrugated irregularities (12) that complement each other, and the outer periphery of the copper foil (6) of the printed circuit board can be easily deformed to correspond to the corrugated shape. The housing shield structure according to claim 1, wherein the housing shield structure has an L-shaped cut (13).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12676990A JPH0423497A (en) | 1990-05-18 | 1990-05-18 | Structure for shielding case of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12676990A JPH0423497A (en) | 1990-05-18 | 1990-05-18 | Structure for shielding case of electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0423497A true JPH0423497A (en) | 1992-01-27 |
Family
ID=14943473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12676990A Pending JPH0423497A (en) | 1990-05-18 | 1990-05-18 | Structure for shielding case of electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0423497A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5703761A (en) * | 1995-09-07 | 1997-12-30 | Siemens Aktiengesellschaft | Shielding for flat modules |
US6763576B2 (en) | 2001-05-10 | 2004-07-20 | Parker-Hannifin Corporation | Manufacture of electronics enclosure having a metallized shielding layer |
US6809254B2 (en) | 2001-07-20 | 2004-10-26 | Parker-Hannifin Corporation | Electronics enclosure having an interior EMI shielding and cosmetic coating |
JP2005513805A (en) * | 2001-12-20 | 2005-05-12 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Housing device used in electrical equipment |
JP2013140865A (en) * | 2012-01-04 | 2013-07-18 | Hitachi Automotive Systems Ltd | Housing and electronic control device |
JP2015508942A (en) * | 2012-03-01 | 2015-03-23 | オートリブ ディベロップメント エービー | Electronic unit having a PCB and two housing parts |
-
1990
- 1990-05-18 JP JP12676990A patent/JPH0423497A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5703761A (en) * | 1995-09-07 | 1997-12-30 | Siemens Aktiengesellschaft | Shielding for flat modules |
US6763576B2 (en) | 2001-05-10 | 2004-07-20 | Parker-Hannifin Corporation | Manufacture of electronics enclosure having a metallized shielding layer |
US6809254B2 (en) | 2001-07-20 | 2004-10-26 | Parker-Hannifin Corporation | Electronics enclosure having an interior EMI shielding and cosmetic coating |
JP2005513805A (en) * | 2001-12-20 | 2005-05-12 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Housing device used in electrical equipment |
JP2013140865A (en) * | 2012-01-04 | 2013-07-18 | Hitachi Automotive Systems Ltd | Housing and electronic control device |
JP2015508942A (en) * | 2012-03-01 | 2015-03-23 | オートリブ ディベロップメント エービー | Electronic unit having a PCB and two housing parts |
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