JPH04119836A - Metal foil clad laminated sheet and preparation thereof - Google Patents
Metal foil clad laminated sheet and preparation thereofInfo
- Publication number
- JPH04119836A JPH04119836A JP2242233A JP24223390A JPH04119836A JP H04119836 A JPH04119836 A JP H04119836A JP 2242233 A JP2242233 A JP 2242233A JP 24223390 A JP24223390 A JP 24223390A JP H04119836 A JPH04119836 A JP H04119836A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal foil
- prepreg
- resin layer
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 21
- 239000011888 foil Substances 0.000 title claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 57
- 239000011347 resin Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 2
- 229920001567 vinyl ester resin Polymers 0.000 abstract description 2
- 239000004640 Melamine resin Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 7
- 239000002759 woven fabric Substances 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 229920006231 aramid fiber Polymers 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Moulding By Coating Moulds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント配線板に使用する金属箔張積層板と
その製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a metal foil-clad laminate used for printed wiring boards and a method for manufacturing the same.
（従来の技術）
従来、金属箔張積層板（以下、単に積層板という）に用
いられるプリプレグは、基材に樹脂を含浸させて半硬化
状態に作成している。そして、このプリプレグを所定枚
数互いに重ねて、その両面もしくは片面のみに金属箔を
配設し、プレスで加圧、加熱することで、積層板を製造
している。そのため、プリプレグのプレス成形過程にお
いて、プリプレグに含浸していた樹脂が再溶融、硬化し
て、樹脂の溶融流動や硬化収縮などの挙動を示す。(Prior Art) Conventionally, prepregs used for metal foil-clad laminates (hereinafter simply referred to as laminates) are produced in a semi-cured state by impregnating a base material with a resin. A laminate is manufactured by stacking a predetermined number of prepregs on top of each other, disposing metal foil on both sides or only one side, and pressing and heating with a press. Therefore, during the prepreg press molding process, the resin impregnated into the prepreg is remelted and hardened, exhibiting behaviors such as melt flow and curing shrinkage of the resin.
一方、積層板は強化材となる基材と樹脂との複合材であ
り、両者は弾性率や熱膨張率等の物性が異なるため、プ
レス成形時に前述の挙動の影響を受けて、積層板の内部
に残留応力を発生しやすい。On the other hand, a laminate is a composite material made of a base material that serves as a reinforcing material and a resin, and since both have different physical properties such as elastic modulus and coefficient of thermal expansion, the laminate is affected by the above-mentioned behavior during press forming. Residual stress is likely to occur internally.
この残留応力は積層板に反りや寸法変化を発生させ、回
路製造作業または部品組立て作業の際にしばしば種々の
支障をきたしている。This residual stress causes warpage and dimensional changes in the laminate, often causing various problems during circuit manufacturing operations or component assembly operations.
このような支障を解消する方法としては、アニール処理
が考えられる。これは、例えば特開昭５７−２０３５４
８号公報、特開昭５７−２０３５４９号公報に示されて
いるように、プレス成形時に一度ガラス転位温度まで冷
却した後、プレス圧力を下げて再度ガラス転位温度以上
に加熱してアニール処理を行う方法であり、この方法に
よって一度発生した残留応力を除去している。Annealing treatment can be considered as a method to eliminate such problems. This is, for example, JP-A-57-20354
As shown in Publication No. 8 and Japanese Unexamined Patent Publication No. 57-203549, after cooling to the glass transition temperature during press molding, the press pressure is lowered and the material is heated again to the glass transition temperature or higher for annealing treatment. This method removes residual stress once generated.
（発明が解決しようとする課題）
しかし、このアニール処理方法ではプレス成形時間が長
くなり、積層板製造工程の途中でプレス作業が律速とな
って生産効率が低下するという問題があった。また、積
層板に多少のプレス圧が不可避的に加わっているので、
残留応力を完全に除去することはできないという問題が
あった。(Problems to be Solved by the Invention) However, this annealing treatment method has the problem that the press forming time is long, and the press operation becomes rate-limiting in the middle of the laminate manufacturing process, resulting in a decrease in production efficiency. Also, since some press pressure is unavoidably applied to the laminate,
There was a problem that residual stress could not be completely removed.
そこで、本発明は上記問題点に鑑みてなされたもので、
プレス成形中に残留応力が発生しない金属箔張積層板と
その製造方法を提供することを目的としたものである。Therefore, the present invention has been made in view of the above problems.
The object of the present invention is to provide a metal foil-clad laminate that does not generate residual stress during press molding, and a method for manufacturing the same.
（課題を解決するための手段）
すなわち、上記の目的を達成するため、請求項１の発明
は、第１図に示すように、基板を包含した完全硬化状態
の樹脂層１と、この樹脂層１の両側に設けた半硬化状態
の樹脂層２とからなるプリプレグ３を、所定の枚数互い
に重ね合わせ、この重ね合わせたプリプレグ３の両側面
もしくは片側面のみに金属箔を配設し、これを所定の条
件下で加圧加熱することにより一体化した金属箔張積層
板の構造である。(Means for Solving the Problems) That is, in order to achieve the above object, the invention of claim 1, as shown in FIG. A predetermined number of prepregs 3 consisting of semi-cured resin layers 2 provided on both sides of the prepreg 1 are stacked on top of each other, and metal foil is provided on both sides or only one side of the stacked prepregs 3. It has a structure of metal foil-clad laminates that are integrated by pressurizing and heating under predetermined conditions.
請求項２の発明は、請求項１の金属箔張積層板において
、半硬化状態の樹脂層２の厚みを、プリプレグ３の厚み
の１〜２０％に寸法設定したことを特徴とするものであ
る。The invention according to claim 2 is characterized in that, in the metal foil-clad laminate according to claim 1, the thickness of the semi-cured resin layer 2 is set to 1 to 20% of the thickness of the prepreg 3. .
また、請求項３の発明は、上記基オね樹脂層１２の材料
としてそれぞれカラス布、エポキシ樹脂を用いたことを
特徴とする。Further, the invention according to claim 3 is characterized in that the base resin layer 12 is made of a crow cloth and an epoxy resin, respectively.
さらに、請求項４の発明は、基材に樹脂１を含浸させた
加熱し完全硬化させた後、再び樹脂２を含浸させて半硬
化させてプリプレグ３を得、このプリプレグ３を所定の
枚数互いに重ね、このプリプレグ３の両面もしくは片面
のみに金属箔を配設し、これをプレスで加圧加熱して成
形することを特徴とする金属箔張積層板の製造方法であ
る。Furthermore, in the invention of claim 4, the base material is impregnated with resin 1, heated and completely cured, and then impregnated with resin 2 again and semi-cured to obtain prepreg 3. This method of manufacturing a metal foil-clad laminate is characterized in that metal foil is placed on both sides or only one side of the prepreg 3, and the prepregs are pressurized and heated to form the prepregs.
（作用）
前述したように積層板は、基＋４と樹脂１，２との複合
材であるため、プレス成形時の樹脂流動および硬化収縮
の影響により残留応力が発生する。(Function) As described above, since the laminate is a composite material of base +4 and resins 1 and 2, residual stress is generated due to resin flow during press molding and curing shrinkage.
したがって、基材に樹脂１を含浸硬化させる工程で、樹
脂１を十分硬化させてアニール処理を行なえば、その後
のプレス成形において残留応力が発生しなくなる。Therefore, if the resin 1 is sufficiently cured and annealed in the step of impregnating and curing the base material with the resin 1, no residual stress will be generated in the subsequent press molding.
この場合、積層板を製品として仕上げるには、複数のプ
リプレグ３同士を相互に接着することが不可欠となり、
完全硬化した樹脂層１の両面に半硬化状態の樹脂層２を
設ける必要がある。このような理由から、この半硬化の
樹脂層２は、接着に必要な厚みを有しておれば十分であ
り、これを満たすためには請求項２の発明に係る樹脂層
２の厚みは、プリプレグ３の厚みの１〜２０％の範囲に
限定される。In this case, in order to finish the laminate as a product, it is essential to bond the multiple prepregs 3 together,
It is necessary to provide semi-cured resin layers 2 on both sides of the completely cured resin layer 1. For these reasons, it is sufficient that the semi-cured resin layer 2 has a thickness necessary for adhesion, and in order to satisfy this, the thickness of the resin layer 2 according to the invention of claim 2 is as follows. It is limited to a range of 1 to 20% of the thickness of the prepreg 3.
上記構造のプリプレグ３を用いた本発明の積層板では、
樹脂１料の選択範囲が大きくなるため、設計自由度を高
めることかできる。例えば、半硬化の樹脂層２もしくは
完全硬化の樹脂層１として即成化型樹脂材料を用いるこ
とができ、また両樹脂層１．２の双方ともに即硬化型樹
脂制料を用いることができる。さらに、半硬化の樹脂層
２の厚みが等しい条件で、その層の樹脂を低温硬化型と
することも可能である。In the laminate of the present invention using the prepreg 3 having the above structure,
Since the selection range of the resin material becomes larger, the degree of freedom in design can be increased. For example, a quick-curing resin material can be used as the semi-cured resin layer 2 or the fully-cured resin layer 1, and a quick-curing resin material can be used for both resin layers 1.2. Furthermore, under the condition that the thickness of the semi-cured resin layer 2 is the same, it is also possible to make the resin of the layer a low-temperature curing type.
以上のような樹脂設計を製造条件に応じて選択すること
により、基材に樹脂１を含浸させる工程およびプレス工
程における製造時間を大幅に短縮することができる。By selecting the resin design as described above according to the manufacturing conditions, the manufacturing time in the step of impregnating the base material with the resin 1 and the pressing step can be significantly shortened.
本発明で用いる樹脂の種類としては、フェノル樹脂、エ
ポキシ樹脂、ポリイミド樹脂が好適であるが、そのほか
に不飽和ポリエステル樹脂、メラミン樹脂、ビニルエス
テル樹脂等を用いることができる。また、基材の種類と
しては、紙、ガラス繊維織布、ガラス繊維不織布が好適
であるが、そのほかにポリエステル繊維織布、ポリエス
テル繊維不織布、アラミド繊維織布、アラミド繊維不織
布等を用いることかできる。Preferred types of resins used in the present invention include phenolic resins, epoxy resins, and polyimide resins, but unsaturated polyester resins, melamine resins, vinyl ester resins, and the like can also be used. In addition, as for the type of base material, paper, glass fiber woven fabric, and glass fiber nonwoven fabric are suitable, but in addition, polyester fiber woven fabric, polyester fiber nonwoven fabric, aramid fiber woven fabric, aramid fiber nonwoven fabric, etc. can be used. .
（実施例） 以下に、本発明の一実施例を第２図により説明する。(Example) An embodiment of the present invention will be described below with reference to FIG.
本例では、基材４の１料としてはガラス繊維織布を用い
、樹脂５の＋ａ料としてはエポキシ樹脂を用いた。そし
て、ボイドを巻き込まないように基第４４に樹脂５を適
量含浸させ、乾燥機で樹脂５を完全硬化させた。その後
、再ひこの両面に樹脂を含浸させ乾燥機で半硬化させて
プリプレグ７を８枚以上作成した。この場合、半硬化さ
せた樹脂層６の厚みは、プリプレグ７の厚みの７％とし
、プリプレグ７の厚みは０． ２ｍｍとした。また樹脂
分は５０ｖ○１％とした。In this example, a glass fiber woven fabric was used as the material for the base material 4, and an epoxy resin was used as the +a material for the resin 5. Then, an appropriate amount of the resin 5 was impregnated into the base 44 so as not to involve voids, and the resin 5 was completely cured in a dryer. Thereafter, both sides of the refill were impregnated with resin and semi-cured in a dryer to produce 8 or more prepregs 7. In this case, the thickness of the semi-cured resin layer 6 is 7% of the thickness of the prepreg 7, and the thickness of the prepreg 7 is 0. It was set to 2 mm. Further, the resin content was 50v◯1%.
このプリプレグ７を８枚相互に積層し、その両面に図示
しない銅箔を配設した。次いで、これをプレス圧力１０
ｋｇ ｆ ／ｃｍ２．温度１７０°Ｃて１時間加圧加
熱し、その後冷却して積層板を得た。この積層板の加熱
処理後の寸法変化率を、１ｔ（１１定したところ、０．
０１％以下であった。また、積層板には反りなどの変形
か生ぜず、回路製造時および部品組立て時において何等
の支障もなく円滑な作業を行なうことかできた。Eight sheets of this prepreg 7 were laminated one on top of the other, and copper foil (not shown) was provided on both sides. Next, this was pressed at a pressure of 10
kgf/cm2. The mixture was heated under pressure at a temperature of 170°C for 1 hour, and then cooled to obtain a laminate. The dimensional change rate of this laminate after heat treatment was determined to be 1t (11) and 0.
It was less than 0.01%. Further, the laminated board did not undergo any deformation such as warping, and work could be carried out smoothly without any problems during circuit manufacturing and component assembly.
（発明の効果）
以上説明したように、請求項１，４の発明によれば、基
材に樹脂を含浸して完全硬化させ、さらに樹脂を含浸さ
せて半硬化させて得られたプリプレグを用いたため、樹
脂設計の自由度か広がり、製造時間短縮による生産効率
の向上を図ることができ、かつ製造時に残留応力を発生
させることがなく、反り特性および用法安定性に優れた
積層板とその製造方法を得ることができた。(Effects of the Invention) As explained above, according to the inventions of claims 1 and 4, a prepreg obtained by impregnating a base material with a resin and completely curing it, and further impregnating it with a resin and semi-curing it is used. As a result, it is possible to increase flexibility in resin design, improve production efficiency by shortening manufacturing time, and produce laminates that do not generate residual stress during manufacturing and have excellent warping characteristics and stability in usage. I was able to find a way.
また、請求項２の発明では、半硬化状態の樹脂層の厚み
をプリプレグの厚みの０．０１〜０．２倍の寸法とした
ため、半硬化状態の樹脂の厚みか過大となることなく、
所要の接着力を確保することができた。In addition, in the invention of claim 2, since the thickness of the semi-cured resin layer is set to be 0.01 to 0.2 times the thickness of the prepreg, the thickness of the semi-cured resin does not become excessive.
It was possible to secure the required adhesive strength.
さらに、請求項３の発明では、基月をガラス布、樹脂を
エポキシ樹脂により形成したため、樹脂含浸工程やプレ
ス工程での作業時間を従来に比べて大幅に短縮すること
ができた。Furthermore, in the invention of claim 3, since the base material is formed of glass cloth and the resin is formed of epoxy resin, the working time in the resin impregnation step and the pressing step can be significantly shortened compared to the conventional method.
第１図は本発明の金属箔張積層板に使用するプリプレグ
を示す断面図、第２図は本発明の実施例による金属箔張
積層板に使用するプリプレグを示す断面図である。
１．５・・・完全硬化の樹脂（層）
２．６・・・半硬化の樹脂（層）
３７・・プリプレグ
４・・・・・・・・・基材
第
図FIG. 1 is a sectional view showing a prepreg used in a metal foil-clad laminate according to the present invention, and FIG. 2 is a sectional view showing a prepreg used in a metal foil-clad laminate according to an embodiment of the invention. 1.5...Fully cured resin (layer) 2.6...Semi-cured resin (layer) 37...Prepreg 4...Base material diagram
Claims (4)
けた半硬化状態の樹脂層とからなる複数枚のプリプレグ
を重ね合わせ、その両面もしくは片面のみに金属箔を配
設し加圧加熱することにより一体化したことを特徴とす
る金属箔張積層板。1. Multiple sheets of prepreg consisting of a fully cured resin layer containing the base material and a semi-cured resin layer on both sides are stacked together, metal foil is placed on both sides or only one side, and the prepreg is heated under pressure. A metal foil-clad laminate characterized by being integrated.
〜２０％を占めることを特徴とする請求項１記載の金属
箔張積層板。2. The thickness of the resin layer in the above semi-cured state is 1 of the thickness of the prepreg.
The metal foil-clad laminate according to claim 1, characterized in that the content of the metal foil clad laminate is 20%.
エポキシ樹脂より形成したことを特徴とする請求項１ま
たは２記載の金属箔張積層板。3. 3. The metal foil-clad laminate according to claim 1, wherein the base material is made of glass cloth, and the resin layer is made of epoxy resin.
再び樹脂を含浸させて半硬化させて得られた複数枚のプ
リプレグを重ね合わせ、その両面もしくは片面のみに金
属箔を配設し、プレスで加圧加熱して成形することを特
徴とする金属箔張積層板の製造方法。4. After impregnating the base material with resin and heating it to completely cure it,
A metal foil characterized by stacking a plurality of prepregs obtained by impregnating resin again and semi-curing, disposing metal foil on both sides or only one side, and molding the prepreg by applying pressure and heating in a press. Method for manufacturing tension laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242233A JPH04119836A (en) | 1990-09-12 | 1990-09-12 | Metal foil clad laminated sheet and preparation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242233A JPH04119836A (en) | 1990-09-12 | 1990-09-12 | Metal foil clad laminated sheet and preparation thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04119836A true JPH04119836A (en) | 1992-04-21 |
Family
ID=17086215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2242233A Pending JPH04119836A (en) | 1990-09-12 | 1990-09-12 | Metal foil clad laminated sheet and preparation thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04119836A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002265646A (en) * | 2001-03-13 | 2002-09-18 | Sumitomo Bakelite Co Ltd | Prepreg and method for producing the same |
| JP2014231566A (en) * | 2013-05-29 | 2014-12-11 | パナソニック株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
-
1990
- 1990-09-12 JP JP2242233A patent/JPH04119836A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002265646A (en) * | 2001-03-13 | 2002-09-18 | Sumitomo Bakelite Co Ltd | Prepreg and method for producing the same |
| US6569513B2 (en) | 2001-03-13 | 2003-05-27 | Sumitomo Bakelite Company Limited | Prepreg and process for manufacturing same |
| JP2014231566A (en) * | 2013-05-29 | 2014-12-11 | パナソニック株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
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