JPH0332221B2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention involves attaching a semiconductor wafer to an adhesive tape and attaching an annular mounting frame to the adhesive tape around the semiconductor wafer. The present invention relates to a mounting device for holding semiconductor wafers.

<Prior Art> As this type of semiconductor wafer mounting device, there is a device as disclosed in Japanese Patent Application No. 304777/1983. Below, the schematic configuration of this device will be explained in the 12th section.
This will be explained with reference to the figures and FIG.

Semiconductor wafers A are sequentially sent out from the wafer loader 200 in FIG. 12 and are carried to a wafer alignment mechanism 202 on a conveyor belt 201 as shown in FIG. Semiconductor wafer A
When the wafer A reaches a predetermined position of the wafer alignment mechanism 202, the rotary table 203 is raised and the semiconductor wafer A is transferred onto the rotary table 203. Then, by moving the pair of center alignment plates 204 from both sides of the elevated rotary table 203 so as to sandwich the semiconductor wafer A,
The center of semiconductor wafer A is aligned with the center of rotary table 203.

When the center alignment of semiconductor wafer A is completed,
With the suction mechanism of the rotary table 203 operating and holding the semiconductor wafer A by suction, the rotary table 2
03 rotates and the optical sensor 205 detects the orientation flat of the semiconductor wafer A, thereby aligning the semiconductor wafer A so that the orientation flat faces in a specified direction.

When the alignment is completed, the reversing fork 206 having a U-shaped tip enters the back side of the semiconductor wafer A on the rotary table 203. Then, as the rotary table 203 descends with the suction released, the semiconductor wafer A is transferred to the inverted fork 206.
It will be transferred to. The reversing fork 206 holds the semiconductor wafer A by suction and inverts it, thereby transferring the aligned semiconductor wafer A onto the wafer pasting table 207 shown in FIG.

On the other hand, after the mounting frame F is positioned on the positioning stage 208, it is transported to the wafer pasting stage 207 by a transport mechanism (not shown). placed on top.

After the semiconductor wafer A and the frame F are set in this way, the pasting roller unit 209 and the peeling roller unit 21 around which the adhesive tape B is wound are placed.
The adhesive tape B is attached to the semiconductor wafer A and the frame F at the same time by moving together with the wafer attachment stage 207 side.

Next, the adhesive tape cutting mechanism 211 descends and cuts the adhesive tape B stuck to the frame F into a circular shape, and then only the peeling roller unit 210 returns to its original position, thereby removing the residue from the frame F. Peel off the tape. The mount frame from which the residual tape has been peeled off is taken out from the pasting stage 207 and stored in the cassette of the unloader section 212.

<Problems to be Solved by the Invention> However, the conventional device described above has the following problems.

In other words, the conventional semiconductor wafer mounting device is
Since the adhesive tape B is attached to the semiconductor wafer A and the mounting frame F at the same time, due to variations in the heights of the upper surfaces of the semiconductor wafer A and the mounting frame B on the attachment stage,
When adhesive tape is attached, there is a problem in that air pockets are likely to form between the semiconductor wafer A and the adhesive tape B, and between the mounting frame F and the adhesive tape B. This type of air entry may cause the semiconductor wafer A to be damaged in the subsequent scribing process.
When scribing, the cut and separated chips may come off unexpectedly, and the scribing depth may vary, causing inconveniences.

By the way, regarding the attachment specifications of the semiconductor wafer, the position of the orientation flat of the semiconductor wafer with respect to the reference plane of the mounting frame may be specified. For example, the semiconductor wafer may be attached with the orientation flat facing the reference surface of the mounting frame, or the semiconductor wafer may be attached with the orientation flat positioned in the opposite direction to the reference surface. There is a designation such as adding. In this way, no matter how the position of the orientation flat is specified, the positional relationship between the mounting frame and the semiconductor wafer remains constant (for example, the center of the mounting frame and the semiconductor wafer are It is desirable to align the two (so that their centers match) and attach them to the adhesive tape.

Incidentally, in the conventional device described above, the rotary table 2
After aligning the center of the semiconductor wafer A with a pair of center alignment plates 204 on 03,
Since the orientation flat is aligned and then the semiconductor wafer A is pasted and transferred to the stage 207 by the reversing fork 206, the position of the semiconductor wafer A is adjusted regardless of the orientation flat position. The semiconductor wafer A can be transferred so that the center is at a predetermined position on the attachment stage 207, and therefore the positional relationship between the mounting frame and the semiconductor wafer becomes constant.

The present invention has been made in view of the above circumstances, and provides a mounting device for semiconductor wafers that is less likely to cause air pockets between the semiconductor wafer and the adhesive tape or between the mounting frame and the adhesive tape. is intended to provide.

Another object of the present invention is to provide a semiconductor wafer mount in which the semiconductor wafer and the mounting frame can be attached to an adhesive tape in the correct positional relationship, no matter how the direction of the orientation flat is specified. The goal is to provide equipment.

<Means for Solving the Problems> The configuration of a semiconductor wafer mounting apparatus according to the present invention will be described below with reference to FIG. however,
FIG. 1 specifically shows the configuration of the present invention for easy understanding, and the present invention is not limited to what is shown in FIG.

Reference numeral 1 denotes a wafer alignment mechanism that aligns a semiconductor wafer A on which an orientation flat OF is formed so that the orientation flat OF is in a specified direction. The wafer alignment mechanism 1 includes, for example, a pulse motor 1a that rotationally drives the semiconductor wafer A held by suction.
and an optical sensor 1b attached thereto.

Reference numeral 2 denotes an adhesive tape transport mechanism that transports the band-shaped adhesive tape B. The adhesive tape transport mechanism 2 includes, for example, a supply reel 2a that supplies the adhesive tape B;
It is composed of a take-up reel 2b for winding up the residual tape, a motor 2c for driving the take-up reel 2b, and the like.

Reference numeral 3 denotes a wafer attaching mechanism that attaches the semiconductor wafer A aligned by the wafer alignment mechanism 1 to the adhesive tape B. The wafer pasting mechanism 3 includes, for example, a pair of upper and lower rollers 3a, 3.
It consists of b, etc.

4 is a frame pasting point P1 that holds the annular mounting frame F that has been aligned in advance.
It is a frame transfer mechanism that transfers up to .

Reference numeral 5 denotes a wafer front edge detection sensor that detects the front edge of the semiconductor wafer A that is being transferred while being attached to the adhesive tape B.

6, by transporting the adhesive tape B by a distance according to the direction of the designated orientation flat OF with reference to the position of the semiconductor wafer A detected by the wafer front edge detection sensor 5,
The center of the semiconductor wafer A is the frame attachment point P
1 is an adhesive tape transport mechanism control means for controlling the adhesive tape transport mechanism 2 so as to stop at a predetermined position.

Reference numeral 7 denotes a frame pasting mechanism for pasting the mounting frame F onto the adhesive tape B at the frame pasting location P1. The frame pasting mechanism 7 is driven by a motor 7a, for example, and attaches the mounting frame F to the mounting frame F through the adhesive tape B.
It is composed of a roller 7b that rotates while contacting the lower surface of the roller.

8 is an adhesive tape cutting mechanism that cuts the adhesive tape B stuck to the mounting frame F into a circular shape. The adhesive tape cutting mechanism 8 is composed of, for example, a rotary blade 8a that is rotated synchronously with the pasting roller 7b, but the cutting may be performed in a separate process from the frame pasting process.

9 is the residual tape after cutting the adhesive tape B.
This is an adhesive tape peeling mechanism that peels B' from the mounting frame F. The adhesive tape peeling mechanism 9 is
For example, when the mount frame MF on which the semiconductor wafer A is mounted transfers from the roller 9a to the roller 9b, the residual tape B' is forcibly drawn downward, thereby transferring the residual tape B' to the mount frame MF. Configured to be peeled off.

<Function> The function of the configuration of the present invention is as follows.

In the wafer alignment mechanism 1, the aligned semiconductor wafer A is pasted on the adhesive tape B in the wafer pasting mechanism 3, and then the frame F is pasted on the adhesive tape B at the frame pasting location P1. When the semiconductor wafer A attached to the adhesive tape B is transferred to the frame attachment point P1, the front edge of the semiconductor wafer A is detected by the wafer front edge detection sensor 5, and the orientation flat OF is designated. Depending on the direction, the amount of feed of the adhesive tape B is controlled by the adhesive tape transport mechanism control means 6 as follows. Reference is made to FIG. 2 below.

Adhesive tape transport mechanism control means 6 given direction designation information of orientation flat OF
In this case, the semiconductor wafer A on the adhesive tape B has an orientation flat toward the front in the direction of travel.
Type A1 where OF is located (hereinafter referred to as leading type), or orientation flat OF with respect to the traveling direction of semiconductor wafer A.
Determine whether type A2 (hereinafter collectively referred to as non-preceding type) is located at the 180° or 90° position, and calculate the corrected transfer amounts ΔX _F and ΔX _R according to the preceding type A1 and non-preceding type A2, respectively. .

Then, the adhesive tape B is moved by the corrected transfer amount Δ The adhesive tape transport mechanism control means 6 controls the adhesive tape transport mechanism 2 so as to correct the transport by _F , ΔX _R.
control.

In other words, in the case of precedent type A1, Fig. 2A
As shown in , it is moved by ΔX _F from position Q1,
It stops when its center O _A1 coincides with a predetermined reference position Q2 for attaching the mounting frame. In addition, in the case of non-preceding type A2, Fig. 2B
As shown in , it is moved by ΔX _R from position Q1,
It stops when its center O _A2 coincides with a predetermined reference position Q2.

That is, a semiconductor wafer A is attached to an adhesive tape B in advance.
is pasted on the preceding type A1 or non-preceding type A.
Regardless of which type of semiconductor wafer A is, it will stop when its respective centers O _A1 and O _A2 come to a predetermined reference position Q2.

<Example> Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIG. 3 is a schematic plan view of a semiconductor wafer mounting apparatus according to an embodiment of the present invention, and FIG. 4 is a front view thereof.

In FIGS. 3 and 4, 11 is a wafer loader, 12 is a wafer vertical transfer section, 13 is a wafer horizontal transfer section, 14 is a wafer alignment section (corresponding to the wafer alignment mechanism 1 in FIG. 1), and 15 is a wafer pasting section. (corresponds to the wafer pasting mechanism 3 in FIG. 1); 16 is a mounting frame pasting part (corresponds to the frame pasting mechanism 7 in FIG. 1);
17 is a mounting frame loader, 18 is a mounting frame alignment section, and 19 is a mounting frame delivery section.

The wafer loader 11 sets a magazine in which semiconductor wafers A are stored in multiple stages, and feeds out the semiconductor wafers A one by one from there, and its structure is the same as the conventional one, so a description thereof will be omitted.
The wafer vertical transfer section 12 transfers the semiconductor wafer A sent out from the wafer loader 11 to the wafer horizontal transfer section 13.
The wafer is sent to the wafer horizontal transfer section 1.
It can be raised and lowered freely for delivery to 3.
Its structure is also the same as the conventional one, so its explanation will be omitted. Two wafer loaders 11 and two wafer vertical transfer sections 12 are provided. The mounting frame loader 17 stores mounting frames F in multiple stages, from which the mounting frames F are taken out one by one, and its structure is the same as the conventional one, so a description thereof will be omitted.

The wafer lateral transfer section 13 is shown in the plan view of FIG.
As shown in the front view of the figure, there is a transfer belt 20 on which a semiconductor wafer A is placed and transferred with the surface on which an IC pattern is formed facing upward;
a pulley 21 that hangs the wafer, and a wafer transfer motor 22 that drives and rotates the pulley 21 (see Fig. 4).
It is equipped with The end portion of the wafer lateral transfer section 13 facing the wafer alignment section 14 is configured to be tiltable. That is, the pulley 21b and the transfer belt 20a are provided on the swing frame 23 that swings around the spindle of the pulley 21a, and the fixed base 24
A piston rod of a tilting air cylinder 25 attached to the swing frame 23 is fixed to the lower part of the swing frame 23.

The wafer alignment unit 14 includes an air cylinder 26 for lifting and lowering, a pulse motor 27 for alignment that is moved up and down by the air cylinder 26, an alignment table 28 attached to the output shaft of the pulse motor 27, and a wafer arrival detection unit. It includes a sensor 29 and an orientation flat detection sensor (hereinafter referred to as an OF detection sensor) 30.

Next, the related structure of the wafer pasting section 15 will be explained based on FIG. 7 (front view) and FIG. 8 (rear view).

The lower machine frame 31 connected to the fixed base 24 has an adhesive tape supply reel 32, a separator take-up reel 33, an adhesive tape guide roller 34, and a mechanism corresponding to the adhesive tape transport mechanism 2 shown in FIG. A residue tape guide roller 35 and a residue tape take-up reel 36 are rotatably mounted, and a motor 37 that drives and rotates the separator take-up reel 33 and a motor 38 that drives and rotates the residue tape take-up reel 36 are attached. There is. Bracket 3 attached to the top surface of fixed base 24
A pasting roller 40 is pivotally supported on the fixed base 24, and a motor 41 that drives this pasting roller 40 is attached to the fixed base 24.
is attached to.

A peeling roller 43 and a residue tape guide roller 44 are rotatably mounted on a mounting frame 42 erected on the fixed base 24 .
A pulse motor 46 for transferring the adhesive tape is mounted on another mounting frame 45 erected in 4, and this pulse motor 46
An adhesive tape transporting roller 47 attached to the output shaft of is provided, and a roller 48 opposing the transporting roller 47 is also provided.

The adhesive tape B is set on the adhesive tape supply reel 32 in a state where it is overlapped with the separator S. When the motors 37 and 38 are driven synchronously, the separator take-up reel 33 and the residue tape take-up reel 36 are driven to rotate. Then, the adhesive tape supply reel 32 is also rotated in synchronization, the adhesive tape B and the separator S are separated, and the separator S is wound up by the separator take-up reel 33. The separated adhesive tape B is wound up as a residual tape via an adhesive tape guide roller 34, a pasting roller 40, a peeling roller 43, a residual tape guide roller 44, a transfer roller 47, a contact roller 48, and a residual tape guide roller 35. It is configured to be wound onto a reel 36.

The wafer pasting section 15 is configured as follows. A pressing roller 49 disposed directly above the pasting roller 40 and parallel to the pasting roller 40 is connected to the upper machine frame 3 connected to the fixed base 24.
It is rotatably attached to the free end side of the swing arm 50 that is swingably supported by the swing arm 1a, and thereby,
The pressing roller 49 is vertically movable directly above the pasting roller 40. This pressing roller 49 is wrapped with a protective film C for protecting the surface (upper surface) of the semiconductor wafer A.

As shown in FIG. 8, a cylindrical shaft 51 is rotatably fitted onto the upper machine frame 31a so as to protrude from the rear surface of the upper machine frame 31a. A swing arm 50 is fixed to a flange portion of this cylinder shaft 51.

A pressing roller 49 is rotatably supported on the free end side of the swinging arm 50, and the pressing roller 49 is rotated by its own weight to a fulcrum 50a, which is the axis of the swinging arm 50.
A pasting roller 40 is pressed around with a moment M ₁ . A balance weight 52 that counteracts this moment M ₁ and applies a moment M ₂ to the swinging arm 50 in the direction of separating the pressing roller 49 from the pasting roller 40 is attached to the threaded portion 53 a of the rod 53 that projects from the swinging arm 50 . They are screwed together and secured by a lock nut 54.

In addition, by slightly breaking the antagonistic state of the two moments M ₁ and M ₂ mentioned above, the substantial pressing force of the pressing roller 49 against the pasting roller 40 is reduced to the swing arm 5.
A tension spring 55 giving a tension of 0 is tensioned between a threaded rod 56 screwed into the protrusion 50b of the swing arm 50 and a spring receiving plate 57. 58 is a lock nut. The spring receiving plate 57 is connected to a double-acting air cylinder 59 fixed in a horizontal position to the back of the upper machine frame 31a.
It is attached to the tip of the piston rod.

As shown in FIG. 7, a protective film supply reel 60, protective film guide rollers 61, 62, 63, and a protective film take-up reel 64 are rotatably attached to the upper machine frame 31a. A motor 65 is attached to drive and rotate the film take-up reel 64.

Protective film C is a protective film supply reel 60
At the same time, the protective film guide roller 61,
Pressing roller 49, protective film guide roller 6
The film is wound in the order of numbers 2 and 63, and is wound on a protective film take-up reel 64.

Note that the part between the pasting roller 40 and the peeling roller 43 is a mounting frame pasting point P1 where the annular mounting frame F is pasted to the adhesive tape B on which the semiconductor wafer A has been pasted.
It is.

FIG. 9 is a front view of the mounting frame pasting section 16, and FIG. 10 is a plan view thereof.

First, the wafer front edge detection sensor 5 shown in FIG.
The detection mechanism 66 for the front end a of the semiconductor wafer A, which corresponds to the above, will be explained.

A front end detection air motor 68 is attached to a stay 67 erected on the fixed base 24, and a photo sensor floodlight 70 is attached to a swing arm 69 attached to the rotating shaft of the front end detection air motor 68.
pcs installed.

The swinging arm 69 is connected to a front end detection air motor 68.
The projector 70 is configured to be switched between a detection position (see chain line) in which the projector 70 is located directly above the transfer path of the semiconductor wafer A and a retracted position (see solid line) by the rotation of .

On the other hand, a first fixed frame 72 horizontally attached to the fixed base 24 via a support member 71 made of H-shaped steel has a light receiver 72 of a photo sensor at a position vertically facing the projector 70 in the detection posture. is attached (see Figure 4).

A horizontal second fixture frame 74 is fixed to the first fixture frame 72 via a support (not shown). 1st
Air cylinders 7 for clamping are installed at the four corners of the fixed machine frame 72.
5 is erected, its piston rod vertically passes through the second fixed machine frame 74, and a vertically movable frame 76 is attached to its upper end.

The vertically movable frame 76 has a first clamp member (not shown), and the second stationary frame 74 has a second clamp member (not shown). Adhesive tape B to which the first clamp member and the second clamp member are laid in a horizontal position with the semiconductor wafer A attached in advance
Adhesive tape B is clamped from both the front and back sides in the annular region around the frame adhesive portion.

Tension air cylinders 77 are installed inside the clamp air cylinders 75 at the four corners of the first fixing machine frame 72.
is erected, and a tensioning cylinder 78 is attached to the upper end of the piston rod.

Between the fixed base 24 and the first fixing machine frame 72, there is an X table 79 that moves along the X direction, which is the transfer direction of the adhesive tape B, and a Y table that moves along the Y direction, which is the width direction of the adhesive tape B. A table 80 is arranged. 81 is an X-direction rail, 82 is an X-table drive pulse motor attached to the lower surface of the fixed base 24, and 83 is a Y-direction rail.

A Y-table drive pulse motor 84 and a bearing 85 are attached to the end of the upper surface of the X-table 79. A screw shaft 86 is rotatably supported by the bearing 85, and one end of the screw shaft 86 is connected to the output shaft of the Y-table drive pulse motor 84. A nut casing 87 holding a nut (not shown) that constitutes a ball screw together with the screw shaft 86 is attached to the upper surface of the Y table 80. Although not shown, the screw shaft 86 and the nut casing 87 are also provided on the X table 79.

Next, the elevating mechanism 89, the turning mechanism 99, and the .theta. rotating mechanism 102 of the frame chuck table 88 which suctions and holds the mounting frame F, which correspond to the frame transfer mechanism 4 shown in FIG. 1, will be explained.

First, the elevating mechanism 89 will be explained.

A frame chuck table lifting motor 90 for raising and lowering the frame chuck table 88 is attached to the lower surface of the Y table 80.
The fixing base 24 protrudes downward through a through hole formed in the fixing base 24 . A column 91 is erected on the upper surface of the Y table 80 , and a vertical screw shaft 92 is supported by the upper and lower end plates of the column 91 . Connected to the output shaft.
A support member 94 is connected to a nut casing 93 that holds a nut (not shown) that constitutes a ball screw together with a screw shaft 92, and a rotating member 96 is fixedly connected to a rotating shaft 95 that is pivotally supported by the support member 94. ing.

A swinging annular frame 97 is fixed to this rotating member 96, and a frame chuck table 8 is attached to an annular plate 98 rotatably fitted to the lower half of the swinging annular frame 97.
8 is fixed. A plurality of vacuum suction ports (not shown) are formed in the frame chuck table 88.

Next, the rotating mechanism 99 of the frame chuck table 88 will be explained. A rotating air motor 100 is attached to the upper surface of the support member 94. A rotating shaft 95 pivotally supported by the same support member 94 connects to the turning air motor 1 via a coupling 101.
It is connected to the output shaft of 00.

Next, the θ rotation mechanism 102 of the frame chuck table 88 will be explained.

A rotating stage base 103 for rotating the microscope is rotatably fitted into the upper half of the swinging annular frame 97. As shown in FIG. 10, a θ rotation mechanism 102 for rotating the annular plate 98 around its center is interposed between the annular plate 98 and the rotating member 96. The θ rotation mechanism 102 includes a swing plate 104 attached to the rotation member 96 so as to be swingable around a vertical axis, a screw shaft 105 pivotally supported by the swing plate 104, and a screw shaft 105 attached to the swing plate 104. θ pulse motor 106 that rotates the screw shaft 105
and a nut 10 screwed onto the screw shaft 105.
7 and a connecting plate 108 that connects the nut 107 to the annular plate 98. A microscope stage stand 110 is connected to the rotating stage stand 103 via a support 109, and two microscopes 111 are attached to this microscope stage stand 110.

Next, the mounting frame alignment section 18
I will explain about it.

Fixed base 24, H-shaped steel 112, support tube 11
3. A frame alignment table 115 is attached via a dish-shaped member 114. In the inner part of the frame alignment table 115,
Two pins 116 that lock the V-notch of the large-diameter frame to position the large-diameter frame, and a pin 117 that can be freely switched between locking and not locking the V-notch of the small-diameter frame are formed at the tip. An air cylinder 118 with a piston rod is provided. Frame alignment table 11
Two notches 119 are cut into the outer part of 5 towards the inside. Then, the piston rod of the frame positioning air cylinder 120 held on the lower surface of the frame alignment table 115 is connected to the push pin support member 121, and the two frame push pins 122 inserted from below into each notch 119 are pushed in. It is attached to the pin support member 121. 115a is a mark for positioning reference, which is formed on the frame alignment table 115.

A pasting roller 123, which corresponds to the frame pasting mechanism 7 in FIG. An elevating and rotating frame 124 is arranged. A disc cutter 125, which corresponds to the adhesive tape cutting mechanism 8 of FIG. 1, is rotatably supported on the lift-and-lower rotation frame 124. The disc cutter 125 is the pasting roller 1
It is configured to rotate around the vertical axis in the same direction as 23 and to move up and down independently with respect to the pasting roller 123. 126 is a roller/cutter lifting air cylinder attached to the upper surface of the Y table 80, and 127 is a roller/cutter rotating motor.

Next, the operation of this embodiment will be explained.

The air cylinder 59 shown in FIG. 8 is extended in advance. As a result, the spring receiving plate 57 retreats and pulls the protruding piece 50b through the tension spring 55, so that the cylindrical shaft 51 rotates around the fulcrum 50a, and the swinging arm 50 moves downward and the pressing roller 49 contacts the pasting roller 40.

As a result, the pressing force (moment M ₁ ) that the pressing roller 49 exerts on the pasting roller 40 due to its own weight and the separating force (moment M ₂ ) that the balance weight 52 and the tension spring 55 exert on the pressing roller 49 are reduced. When the semiconductor wafer A is not fed in, the pressing roller 49 is almost equal to the pasting roller 4.
It will lightly touch 0.

When a magazine storing semiconductor wafers A in multiple stages is set in the wafer loader 11 and the wafer vertical transfer section 12 is driven, the semiconductor wafers A are fed out from the wafer loader 11 one by one. When the semiconductor wafer A comes to the intersection of the wafer vertical transfer section 12 and the wafer horizontal transfer section 13, the wafer vertical transfer section 12 descends, so that the semiconductor wafer A on the wafer vertical transfer section 12 is received by the wafer horizontal transfer section 13. passed on. When the wafer transfer motor 22 in the wafer lateral transfer section 13 is driven, the semiconductor wafer A
The transfer belt 20 carrying the semiconductor wafer A rotates and sends the semiconductor wafer A to the wafer alignment section 14.

On the other hand, the mounting frames F stacked on the mounting frame loader 17 are transferred one by one onto the frame alignment table 115 of the mounting frame alignment section 18 by a traverser (not shown). The frame positioning air cylinder 120 contracts and the frame push pin 122 moves the frame F inward until its V-notch is locked with the pin 116 or 117 depending on whether it is a large or small diameter frame. Push it in.

During this time, the frame chuck table 88 is moving onto the frame alignment table 115. That is, since the turning air motor 100 in the turning mechanism 99 is driven and the rotating shaft 95 is rotated, the frame chuck table 8
8 and the microscope 111 are rotated together, and the frame alignment table 115
stop on top.

Next, the mark 115a is observed using the microscope 111, and in order to make the relative positional relationship between the mounting frame F and the frame chuck table 88 accurate as specified,
If a deviation occurs in the X direction, drive the X table drive pulse motor 82 to move the X table 79 in the opposite direction to the deviation direction by the same amount as the deviation amount to eliminate the deviation in the X direction. do. If a shift occurs in the Y direction, drive the Y table drive pulse motor 84 to move the Y table 8.
0 in the opposite direction to the deviation direction to eliminate the deviation in the Y direction, and if deviation occurs in the θ direction, the θ rotation mechanism 102
The θ pulse motor 106 in is driven to move the θ pulse motor 106 by the same amount as the shift amount in the opposite direction to the shift direction, thereby eliminating the shift in the θ direction.

Next, the frame chuck table elevating motor 90 in the elevating mechanism 89 is driven to lower the frame chuck table 88, and the frame chuck table 88 is placed on the mounting frame F positioned on the frame alignment table 115.

Then, a vacuum suction is applied to the vacuum suction port formed in the frame chuck table 88 to hold the mounting frame F on the frame chuck table 88 by suction.

When the wafer arrival detection sensor 29 in the wafer alignment section 14 detects the arrival of the semiconductor wafer A, the wafer transfer motor 22 is stopped, and the semiconductor wafer A is moved to the alignment table 2.
It stops just above 8. Next, the lifting air cylinder 26 is extended to move the alignment table 28 above the transfer belt 20a. As a result, the semiconductor wafer A stopped on the transfer belt 20a is transferred onto the alignment table 28. Next, the vacuum chuck of the alignment table 28 is operated to attract and hold the semiconductor wafer A on the alignment table 28. The direction of the orientation flat OF is controlled to match a predetermined direction by the cooperation of the drive of the pulse motor 27 for alignment and the detection operation of the OF detection sensor 30. That is, the pulse motor 27 is rotated counterclockwise, and the pulse motor 27 is stopped when the orientation flat OF is detected by the OF detection sensor 30. Next, rotate the pulse motor 27 clockwise and do the same.
The pulse motor 27 is stopped when the orientation flat OF is detected by the OF detection sensor 30. After determining this clockwise rotation angle θ, the pulse motor 27 is then rotated counterclockwise by θ/2. As a result of the above, the semiconductor wafer A becomes the advance type A1 in which the orientation flat OF faces forward in the transfer direction X. When the pulse motor 27 is further rotated by 180 degrees, the semiconductor wafer A becomes a non-leading (following) type A2 in which the orientation flat OF faces opposite to the forward side in the transfer direction X. In either case,
The direction of the orientation flat OF is perpendicular to the transport direction X. Note that the non-preceding type A2 includes not only those perpendicular to the transfer direction X, but also those parallel to the transfer direction X, as well as those other than the preceding type A1.

Once the direction of the orientation flat OF is determined, the wafer alignment section 14 is given a command to send out the semiconductor wafer A, and the wafer pasting section 15 is given a command to accept the semiconductor wafer A. Then, the tilting air cylinder 25 in the wafer alignment section 14 is contracted and the pulley 21 at the end
As b descends, the wafer transfer motor 2
2 is driven again, and the semiconductor wafer A is sent out toward the pasting roller 40. On the other hand, the separator take-up reel 3 in the wafer pasting section 15
3 drive motor 37, residue tape take-up reel 3
The drive motor 38 of No. 6, the pulse motor 46, and the drive motor 65 of the protective film take-up reel 64 are driven.

As the separator take-up reel 33 rotates as the motor 37 is driven, the adhesive tape B wound on the adhesive tape supply reel 32 and the separator S are separated from each other, and the separator S is placed on the separator take-up reel 33. After being wound up, the adhesive tape B is supplied to the application roller 40. Since the pasting roller 40 is rotated at a constant speed by the rotation of the motor 41, the adhesive tape B is sent out at a constant speed. Further, the adhesive tape B is forcibly transferred by driving the pulse motor 46.

The semiconductor wafer A is once placed on the pasting roller 40 from the transfer belt 20a, and its leading end is adhered to the adhesive tape B, so that it is fed between the pasting roller 40 and the pressing roller 49. Then, the leading end of the semiconductor wafer A is strongly adhered to the adhesive tape B fed out by the pasting roller 40.

Immediately after that, the semiconductor wafer A is drawn in by the adhesive tape B sent by the pasting roller 40 and enters between the adhesive tape B on the pasting roller 40 and the protective film C on the pressing roller 49. go. This approach of the semiconductor wafer A causes the pressing roller 49 to press the semiconductor wafer A.
can be lifted by the thickness of Pressing roller 4
9 Pressing force due to own weight and balance weight 5
2 and the separation force by the tension spring 55 are almost equal to each other, so that lifting is easily performed. Therefore, the semiconductor wafer A can easily enter between the pasting roller 40 and the pressing roller 49.

As a reaction to the pressing roller 49 being lifted by the thickness of the semiconductor wafer A, the pressing roller 49 presses the semiconductor wafer A through the protective film C against the adhesive tape B supported by the pasting roller 40. In this pressed state, the semiconductor wafer A passes between the pasting roller 40 and the pressing roller 49. The back surface (lower surface) of the semiconductor wafer A is pasted on the adhesive tape B that is fed as the pasting roller 40 rotates, and the front surface (top surface) of the semiconductor wafer A is pasted on the protective film C that is guided by the pressing roller 49. protected by

Further, since the frames F are not attached simultaneously as in the conventional example, the force with which the pressing roller 49 presses the semiconductor wafer A against the adhesive tape B is kept constant, and the semiconductor wafer A
This prevents air from entering between the tape and the adhesive tape B.

Semiconductor wafer A is pasted on adhesive tape B, and the entire semiconductor wafer A is pasted on the pasting roller 40.
When it comes out from between the mount frame and the pressing roller 49 and reaches the mounting frame pasting location P1, the driving of the motors 41, 46, 37, 38, and 65 is stopped.

During this time, adhesive tape B is continuously fed,
A peeling roller 43 from the pasting roller 40,
Residue tape guide roller 44, transfer roller 4
7. The residue tape is wound onto a take-up reel 36 via a contact roller 48 and a residue tape guide roller 35.

On the other hand, the protective film C is continuously fed,
The protective film is wound from the pressing roller 49 onto the protective film take-up reel 64 via the protective film guide rollers 62 and 63.

On the other hand, in response to an acceptance command to the wafer pasting section 15, the front edge detection air motor 68 in the wafer front edge detection mechanism 66 is driven to rotate the swing arm 67, so that the emitter 70 is connected to the light receiver 73.
Directly above and facing each other.

When the adhesive tape B to which the semiconductor wafer A is attached is sent to the wafer attaching section 15 by the rotation of the transfer roller 47, the light emitter 70 and the light receiver 7
A wafer front end detection mechanism 66 consisting of
7, 38, 41, 65 are stopped.

Next, by the same control as explained in FIG. 2, it is determined whether it is the preceding type A1 or the non-preceding type A2, and correspondingly the corrected transfer amounts ΔX _{F and ΔX R are calculated, and the corrected transfer amounts ΔX F} and ΔX _R are calculated accordingly. Quantity ΔX _F ,
ΔX _R only adhesive tape B and semiconductor wafer A
The pulse motor 46 of the transfer roller 47 is driven to further send out the image in the transfer direction X.

Hereinafter, this operation will be explained based on the flowchart shown in FIG.

The operation starts from step S1 in response to a command signal for accepting the semiconductor wafer A. In step S1, the pulse motor 46 is driven to start feeding the semiconductor wafer A to the mounting frame attachment location P1. In step S2, the front end detection air motor 68 in the wafer front end detection mechanism 66 is driven to swing the swinging arm 69 to switch the light projector 70 to a detection posture facing the light receiver 73. In step S3, the front end a of the semiconductor wafer A is detected by the light receiver 73, and when detected, the process proceeds to step S4, where the pulse motor 46 is stopped and the feeding of the semiconductor wafer A is temporarily stopped. Next, step S5
Then, it is determined whether the semiconductor wafer A is a leading type A1 or a non-leading type A2 with respect to its orientation flat OF. If it is the preceding type A1, the process advances to step S6 and the counter register R is
The number of pulses n _F corresponding to the corrected transfer amount ΔX _F is set. Next, in step S7, the pulse motor 46 is driven again to advance the semiconductor wafer A. 1 from counter register R in step S8
The pulse count is counted down, and it is determined in step S9 whether the contents of the counter register R have reached "0". While the value does not reach "0", the process returns to step S7 and the semiconductor wafer A continues to advance. When the contents of the counter register R reach "0", the process advances to step S10 and the pulse motor 46 is stopped. By this,
The semiconductor wafer A of the preceding type A1 is stopped with its center O _A1 aligned with a predetermined reference position Q2. In step S11, the front end detection air motor 6
Swinging arm 6 having a floodlight 70 by reversing 8
9 to return to the home position.

Orientation flat at step S5
When it is determined that OF is of the non-preceding type A2, the process proceeds to step S12, where the number of pulses _nR corresponding to the corrected transfer amount _ΔXR is set in the counter register R. The subsequent operations are the same as the previous one at steps S7 to S11. As a result, non-preceding type A
The center O _A2 of the second semiconductor wafer A is also stopped at a predetermined reference position Q2.

Note that it is the mounting frame F that returns the swinging arm 69 to its original position and assumes the retracted position.
This is to prevent the lowering of the frame chuck table 88, which holds the frame chuck by suction, from becoming obstructed.

After the center O _A of the semiconductor wafer A coincides with the predetermined reference position Q2 at the mounting frame attachment point P1, when the clamp air cylinder 75 is contracted, the vertically movable frame 76 moves downward, and accordingly , the adhesive tape B is strongly clamped by the first clamp member in the vertically movable frame 76 and the second clamp member in the second fixed machine frame 74.

When the tensioning air cylinder 77 is extended and the tensioning cylinder 78 is raised, the adhesive tape B is directed in a direction perpendicular to the tape surface (upward) in the circumferential area immediately inside the clamp portion of the adhesive tape B. Push it out and apply tension to the adhesive tape B.

During this time, the frame chuck table lifting motor 90 is driven in the opposite direction to raise the frame chuck table 88. And the turning mechanism 9
Since the turning air motor 100 at 9 is driven in the opposite direction and the rotating shaft 95 is reversed, the frame chuck table 88 and the microscope 111 are turned integrally to a position almost above the mounting frame attachment point P1. The mounting frame F that has been adsorbed is located.

Next, the IC pattern of the semiconductor wafer A is observed using the microscope 111, and the relative positional relationship between the IC pattern of the semiconductor wafer A on the adhesive tape B and the frame chuck table 88 is made accurate as specified. In order to eliminate the deviation in the X direction, the Y direction, or the θ direction,
The table drive pulse motor 82, the Y table drive pulse motor 84, or the θ pulse motor 10 is controlled.

The frame chuck table elevating motor 99 is driven to lower the frame chuck table 88, and the lower surface of the mounting frame F, which is being held by suction, is placed on the adhesive tape B which is tensioned by the tensioning cylinder 78. A slight dimension from the top surface of semiconductor wafer A (for example,
The lowering of the frame chuck table 88 is stopped at a position separated upward by about 0.5 mm).

When the roller/cutter lifting air cylinder 126 is driven, the pasting roller 123 comes into contact with the lower surface of the adhesive tape B via the lifting rotation frame 124.
Adhesive tape B is pressed against the lower surface of the mounting frame F, which is held by suction on the frame chuck table 88. Note that the disc cutter 125 is separated from the lower surface of the adhesive tape B.

Next, the roller/cutter rotation motor 127 is driven to rotate the pasting roller 123 pressing the adhesive tape B against the mounting frame F. As a result, the adhesive tape B is clamped by the first clamp member and the second clamp member, and is given a strong and uniform tension over the entire circumference by the tension applying cylinder 78.
is pasted onto the mounting frame F while being squeezed by the pasting roller 123. The cutter lifting cylinder 128 is driven, and the disc cutter 125 comes into contact with the adhesive tape B already pasted on the mounting frame F by the pasting roller 123, and the frame chuck table 8
Mounting frame F held by suction on 8
Cut the adhesive tape B that has already been applied while placing it under the cutter.

Along with the stop of the roller/cutter rotation motor 127 upon completion of two rotations of the vertical rotation frame 124,
At the same time as the roller/cutter lifting air cylinder 126 is contracted, the cutter lifting cylinder 128 is also contracted. As a result, the pasting roller 12
3 separates from the mounting frame F, and the disc cutter 125 separates from the mounting frame F.

The tensioning air cylinder 77 contracts, and the tensioning cylinder 78 descends. Then, the clamping air cylinder 75 contracts, and the first clamping member rises and separates from the second clamping member.

Next, each motor 41, 46, 37,
38 and 65 are driven, and the adhesive tape B to which the semiconductor wafer A and frame F are attached is sent out together with the residual tape, and the residual tape is transferred from the peeling roller 43 to the residual tape guide roller S
Since it is bent back in a large square shape, the residue table is forcibly peeled off from the frame F (corresponding to the operation of the adhesive tape peeling mechanism 9 in FIG. 1). This allows the mount frame MF
is made.

The mount frame MF, which is separating from the peeling roller 44, is received by the belt 129 of the mount frame delivery section 19 on the lower side, and is prevented from being drawn downward by the residual tape.

As mentioned earlier, the corrected transfer amount ΔX _F ,
ΔX _R may be one that sends the adhesive tape B in the same direction as the direction X in which it was transferred toward the mounting frame attachment location P1, or may send it in the opposite direction. Furthermore, either one of the corrected transfer amounts ΔX _F and ΔX _R may be “0”. Further, in the above embodiment, the transfer of the semiconductor wafer A is temporarily stopped when the light receiver 73, which is a sensor for detecting the front end of the semiconductor wafer, is operated, but this temporary stop may be eliminated and the transfer may be continued. .

<Effects of the invention> According to the present invention, the following effects are achieved.

That is, the semiconductor wafer mounting device according to the present invention passes a semiconductor wafer aligned so that the orientation flat is in a specified direction between a wafer sticking mechanism composed of a pair of upper and lower rollers. The semiconductor wafer is affixed to the strip-shaped adhesive tape by affixing the semiconductor wafer to the strip-shaped adhesive tape, and in this state, the semiconductor wafer is transferred to a predetermined position at the frame affixing point, while the mounting frame, which has been positioned in advance, is attached to the semiconductor wafer at the frame affixing point. The mounting frame is attached to the adhesive tape by holding it close to the wafer and pushing up the portion of the adhesive tape facing the mounting frame with a rotating roller and rotating the rotating roller. In this way, since the semiconductor wafer and the mounting frame are individually attached to the adhesive tape, even if the thickness of the semiconductor wafer and the mounting frame are different, the semiconductor wafer and the adhesive tape can be attached like in conventional equipment. This eliminates the inconvenience of air pockets between the mounting frame and the adhesive tape, prevents chips from falling off during the subsequent scribing process, and allows for uniform scribing depth. This provides remarkable effects that cannot be obtained with conventional devices.

Moreover, according to the semiconductor wafer mounting device of the present invention, the front end of the semiconductor wafer transferred while attached to the strip-shaped adhesive tape is detected, and the orientation flag of the semiconductor wafer is adjusted based on that position. The transfer amount of the adhesive tape is controlled according to the specified direction of the orientation flat, so no matter what position the semiconductor wafer is placed on the orientation flat, the center of each semiconductor wafer can be attached to the frame. It can be aligned at a predetermined position. As a result, the mounting frame held at the frame attachment point and the semiconductor wafer attached to the adhesive tape can be attached so that they always have a constant positional relationship, so this type of mounting device Versatility can be increased.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an example of the configuration of the present invention, and FIGS. 2A and 2B are explanatory diagrams of its operation. 3 to 11 relate to an embodiment of the semiconductor wafer mounting device of the present invention, in which FIG. 3 is a schematic plan view of the whole, FIG. 4 is a front view thereof, and FIG. 5 is a wafer lateral transfer. 6 is a front view thereof, FIG. 7 is a front view of the wafer attachment section, FIG. 8 is a rear view thereof, FIG. 9 is a front view of the frame attachment section, and FIG. The figure is the plan view,
FIG. 11 is a flowchart for explaining the operation. Further, FIG. 12 is a perspective view showing a schematic structure of a conventional semiconductor wafer mounting device, and FIG. 13 is a perspective view showing a schematic structure of a wafer positioning section in the conventional device shown in FIG. A...Semiconductor wafer, A1...Advanced type semiconductor wafer, A2...Non-advanced type semiconductor wafer, a...Front end of semiconductor wafer, B...Adhesive tape, F...Mounting frame, OF...Orient Station flat, MF...Mount frame, X...Transfer direction, 1...Wafer alignment mechanism, 2...Adhesive tape transfer mechanism, 3...Wafer pasting mechanism, 4...Frame transfer mechanism, 5...
Wafer front edge detection sensor, 6...Adhesive tape transfer mechanism control means, 7...Frame pasting mechanism, 8...
...Adhesive tape cutting mechanism, 9...Adhesive tape peeling mechanism.

Claims (1)

[Claims] 1. A wafer alignment mechanism that aligns a semiconductor wafer sent out from a wafer loader in a direction specified by orientation flat direction designation information, and an adhesive tape that transports a strip-shaped adhesive tape. It consists of a transfer mechanism and a pair of rollers arranged vertically in contact with each other via the adhesive tape, and the semiconductor wafer discharged from the wafer alignment mechanism is passed between the pair of rollers. a wafer sticking mechanism that sticks the back side of a semiconductor wafer to a band-shaped adhesive tape; and a wafer leading edge detection sensor that detects the front end of the semiconductor wafer transferred from the wafer sticking mechanism while being stuck to the band-shaped adhesive tape. The center of the semiconductor wafer is aligned with the frame by moving the strip-shaped adhesive tape a distance according to the direction designation information of the orientation flat based on the position of the semiconductor wafer detected by the wafer leading edge detection sensor. Adhesive tape transport mechanism control means for controlling the adhesive tape transport mechanism so as to stop at a predetermined position of the attachment point; holding a previously positioned annular mounting frame and transporting it to the frame attachment point; a frame transfer mechanism that holds a mounting frame in an upper position close to a semiconductor wafer stopped and stuck to an adhesive tape at a frame attachment point; and a frame transfer mechanism in a position close to the mounting frame at the frame attachment point. a frame pasting mechanism for pasting a mounting frame onto the adhesive tape by rotating the rotating roller while pushing up opposing parts of the adhesive tape with a rotating roller; An adhesive tape cutting mechanism that cuts the tape into a circular shape inside the periphery of the mounting frame; and an adhesive tape peeling mechanism that peels off the residual tape from the mounting frame after cutting the adhesive tape. Features of semiconductor wafer mounting equipment.