JPH03238132A - Cutting method for extremely five metallic wire - Google Patents
Cutting method for extremely five metallic wireInfo
- Publication number
- JPH03238132A JPH03238132A JP2035256A JP3525690A JPH03238132A JP H03238132 A JPH03238132 A JP H03238132A JP 2035256 A JP2035256 A JP 2035256A JP 3525690 A JP3525690 A JP 3525690A JP H03238132 A JPH03238132 A JP H03238132A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- ultra
- cut
- wire
- fine metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 36
- 229910001111 Fine metal Inorganic materials 0.000 claims description 37
- 239000000463 material Substances 0.000 abstract description 12
- 239000012535 impurity Substances 0.000 abstract description 5
- 239000002390 adhesive tape Substances 0.000 abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract description 2
- 239000010439 graphite Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 27
- 229910052751 metal Inorganic materials 0.000 description 27
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 22
- 229910052737 gold Inorganic materials 0.000 description 12
- 239000010931 gold Substances 0.000 description 12
- 229920001875 Ebonite Polymers 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- -1 roots Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/065—Spherical particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/045—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by other means than ball or jet milling
- B22F2009/046—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by other means than ball or jet milling by cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Wire Processing (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ICチップの電極と外部リードとの接続に際
して使用される接合用のバンブと称されている金属突起
を作るために、バンプの素材となる極細金属線を、一定
の長さに切断するための方法に関する。Detailed Description of the Invention [Industrial Field of Application] The present invention is directed to the production of bumps in order to make metal protrusions called bonding bumps that are used to connect the electrodes of an IC chip with external leads. This invention relates to a method for cutting ultra-fine metal wire as a raw material into a certain length.
ICチップの電極と外部リードとの接続には多様な方法
が採用されている。配線用の極細ワイヤー(ボンディン
グワイヤー)を用いて接続する方法もあるが、チップの
電極とリードとの間にバンプと呼ばれる金属突起を挟ん
で熱圧着する方法も広く行われるようになっている。
TA、 B (Tape Automated Bon
ding)法は後者の代表的な方法として注目されてい
る技術である。この方法は、予めICチップの電極部か
、もしくは゛rABテープ上のリード先端部のいずれか
にバンプを形成しておき、次にICチップ電極部とリー
ドを有するTABテープとが、バンブを介して重ね合わ
さるようにして両者を一括接合するものである。またT
AB法以外にフリップチップ法においても、電極部にバ
ンブの形成されたICチップが使用されている。Various methods are used to connect the electrodes of the IC chip and external leads. There is a method of connecting using ultra-thin wiring wire (bonding wire), but a method of thermocompression bonding by sandwiching a metal protrusion called a bump between the chip electrode and the lead is also becoming widely used.
TA, B (Tape Automated Bon
ding) method is a technique that is attracting attention as a representative method of the latter. In this method, a bump is formed in advance on either the electrode part of the IC chip or the lead tip on the rAB tape, and then the IC chip electrode part and the TAB tape having the lead are connected via the bump. The two are joined together by placing them one on top of the other. Also T
In addition to the AB method, the flip-chip method also uses IC chips with bumps formed on the electrode portions.
このような用途に提供されるバンブのこれまでの作り方
は、メツキによる方法が主体であった。Up until now, the method of making bamboo provided for such uses has mainly been based on the method of making bamboo sticks.
すなわち、ICチップの電極部に直接バンプとなる金属
をメツキするか、または−旦ガラス基盤上等にメツキに
よって形成したバンプをT A、 Bテープ側のリード
先端部に転写する方法が主流となっている。In other words, the mainstream methods are to directly plate the electrodes of the IC chip with metal to serve as bumps, or to transfer bumps formed by plating on a glass substrate or the like to the lead tips of the T A and B tapes. ing.
しかしながら、メツキによる方法は設備が大きくなる上
に、ハンプとして使用する金属の組成に制約を受けると
いう欠点がある。また特にICチップの電極部に直接メ
ンキしてバンプを形成しようとすれば、チップそのもの
がメツキ工程を通過することになって、チップの歩留ま
りを悪化させるということも問題とされていた。However, the plating method requires large equipment and has the disadvantage of being restricted by the composition of the metal used as the hump. In addition, if bumps were to be formed by directly plating the electrode portions of IC chips, the chip itself would have to go through a plating process, which would deteriorate the yield of the chips.
これらの欠点を解消する方法として、メツキによらない
バンブ形成方法も検討されるようになってきた。本願発
明者らは先に、バンプ用の素材となる金属を出来るだけ
細い線に加工した後、この極細金属線を定尺切断した上
で別々に引き離した状態で溶解・凝固さセ、球形状のバ
ンプを得る方法を提案した(特願平1−320296号
)。作られた球形のバンプは、リード先端部等に熱圧着
して使用される(特願平1−234917号)。このよ
うなバンプとして使用される金属は、これまでは高純度
の金が最も普通であった。金は確かにバンプとして有効
な金属であるが、バンプをメツキで形成するというプロ
セスの制約があったために、他の金属が対象として取り
上げられにくかったという側面もあったと思われる。As a method to overcome these drawbacks, methods of forming bumps that do not involve plating have also been studied. The inventors of the present application first processed the metal that would be the material for the bump into wires as thin as possible, then cut the ultra-fine metal wires to a specified length, separated them separately, and then melted and solidified them into spherical shapes. proposed a method for obtaining bumps (Japanese Patent Application No. 1-320296). The spherical bump thus produced is used by being thermocompression bonded to the tip of the lead, etc. (Japanese Patent Application No. 1-234917). Hitherto, the most common metal used for such bumps has been high purity gold. Although gold is certainly an effective metal for bumps, it seems that there were also restrictions on the process of forming bumps by plating, which made it difficult for other metals to be considered as targets.
これに対してメツキに頼ることなく、任意の金属線片を
溶解してバンプとする新しい方法の実現によって、接合
用部材としてふされしい特性を持った任意の金属をバン
プとして使用する可能性が大きく広がったことになる。On the other hand, by realizing a new method of melting any piece of metal wire to make bumps without relying on plating, it is possible to use any metal with characteristics suitable for a bonding member as bumps. It has expanded greatly.
同しように金を使う場合でも、メツキでバンプを形成す
る場合には、狙った組成の合金を安定して得ることが困
難であったため、純金に近い高純度の金にならざるをえ
tかったが、線片を溶解する方法によれば、線引きの可
能な限り任意の組成を有するバンプを作り上げることが
可能である。金の他に銅や根、並びにそれらをベースと
する各種の合金を、容易にハンプとして成型することが
できるようになった訳である。Similarly, when using gold to form bumps with plating, it was difficult to stably obtain an alloy with the desired composition, so it was necessary to use high-purity gold that was close to pure gold. However, according to the method of melting the wire piece, it is possible to create a bump having any composition as long as it is possible to draw the wire. In addition to gold, copper, roots, and various alloys based on them can now be easily molded into humps.
ところで、この方法でバンプを作成する場合、サイズの
均一なハンプを得るためには、極細金属線の切断長さを
均一にするという点がまず重要である。長さの切断精度
を上げるためには出来るだけ線径の細い素材を使用して
、切断長さを長めに出来る方が有利であることは言うま
でもない。バンプのサイズは一般に直径100ミクロン
を下回る小さなものであるから、使用する素材金属線を
細くしても、切断長さは0.5m以下から長くてもll
量程度の短いものとならざるを得ない。しかも、一般的
にバンブ用に供される金属は軟質のものが多いため、こ
れを極細に加工した金属線は、自重で曲がるなど極めて
変形しやすいものとなる。By the way, when creating bumps using this method, in order to obtain bumps of uniform size, it is first important to make the cutting length of the ultra-fine metal wire uniform. Needless to say, in order to increase the cutting accuracy of the length, it is advantageous to use a material with a wire diameter as small as possible so that the cutting length can be made longer. The size of the bump is generally smaller than 100 microns in diameter, so even if the metal wire used is made thinner, the cutting length will range from 0.5 m or less to longer.
It has to be a short amount of time. Moreover, since the metals generally used for bumps are often soft, metal wires processed into ultra-thin pieces are extremely susceptible to deformation, such as bending under their own weight.
軟質な金属で作られた直径数十ミクロンから細いもので
は10ミクロン程度の極細線は当然腰がないので、曲が
らぬように精度良く送ることのできる装置を実現するの
は大変に困難がある。When it comes to wires made of soft metal with a diameter ranging from several tens of microns to as thin as 10 microns, it is naturally unstable, so it is extremely difficult to create a device that can feed them accurately without bending.
したがって、このようなバンブ素材用極細金属線を、一
定ピンチでの送り機構を有する既存の切断機で精度良く
切断しようとする場合には、複数の極細金属線を束ねる
かテープ上に平行に配置するかして、送りに支障の無い
ように処置した後に切断することが必要である。先の特
願平1−320296号の方法は、このような考え方に
基づいている。Therefore, when attempting to accurately cut such ultra-fine metal wires for bump materials with an existing cutting machine that has a feeding mechanism with a constant pinch, it is necessary to bundle multiple ultra-fine metal wires or arrange them in parallel on a tape. Therefore, it is necessary to cut the material after taking measures to ensure that it does not interfere with feeding. The method of the previous Japanese Patent Application No. 1-320296 is based on this idea.
この方法は原理的には極めて有効なものであるが、大規
模生産を前提とする工業的な見地からすると、さらに簡
便かつ効率的な切断方法の確立も強く期待されていた。Although this method is extremely effective in principle, from an industrial standpoint based on large-scale production, there have been strong expectations for the establishment of a simpler and more efficient cutting method.
本発明の目的とするところは、ハンプ製造用として50
ミクロン以下程度の極細径に線引きされている金等の軟
質の素材金属線を、不純物として接着剤や配列用桐材の
混入する余地の無いような手段によって、能率良くしか
も高い切断精度で多量に目的とする11重以下好ましく
は0.6u以下の線片に切断できる切断方法を提供する
ことにある。The object of the present invention is to use 50
A large amount of soft material metal wire such as gold, which is drawn to an ultra-fine diameter of about microns or less, is cut efficiently and with high cutting accuracy using a method that leaves no room for the adhesive or paulownia material for alignment to be mixed in as impurities. It is an object of the present invention to provide a cutting method capable of cutting wire pieces of 11 layers or less, preferably 0.6u or less.
本発明は、平坦な基盤の上に複数本の極細金属線を平行
に配列した後、一定間隔で刃先の並んだ切断用治具を用
いて前記極細金属線を切断し、微小定尺の極細金属線片
を製造することを特徴とする極細金属線の切断方法であ
る。The present invention involves arranging a plurality of ultra-fine metal wires in parallel on a flat base, and then cutting the ultra-fine metal wires using a cutting jig with cutting edges lined up at regular intervals. This is a method for cutting ultra-fine metal wire, characterized by manufacturing metal wire pieces.
極細金属線を能率的に切断するためには、複数本の極細
金属線を同時に切断していくか、または1木ずつを切断
するのであれば切断速度の極端に早い方法を採用しなけ
ればならないことは明白である。本発明においては、バ
ンプ素刊の極細金属線は予め複数本を束ねるか平行に配
置しておいて、これらを同時に切断していく方法による
ことを前提とした。ただし平行配列するために極細金属
線の全長に渡って被覆材、接着剤、テープ等を用いると
、後にこれらが極細金属線と一緒に切断されて区分けに
手間取るようになる。この点を避けるために、本発明で
は、平行配列する極細金属線の両端部だけに被覆材か接
着剤かテープ等の固定材を用いるにとどめ、これらの両
端部に支持される極細金属線の中間部分には一切の固定
材を使用しないようにした。In order to efficiently cut ultra-fine metal wires, it is necessary to cut multiple ultra-fine metal wires at the same time, or to cut individual trees one by one, a method with extremely high cutting speed must be used. That is clear. The present invention is based on the premise that a plurality of ultra-fine metal wires for bumping are bundled in advance or arranged in parallel, and then cut at the same time. However, if a coating material, adhesive, tape, etc. is used over the entire length of the ultra-fine metal wires in order to arrange them in parallel, these will be cut together with the ultra-fine metal wires, making it difficult to separate them. In order to avoid this problem, in the present invention, a fixing material such as a covering material, adhesive, or tape is used only at both ends of the parallel-arranged ultra-fine metal wires, and the ultra-fine metal wires supported by these ends are fixed. No fixing material was used in the middle part.
しかしながら、極細金属線をこのような仕方で配列する
ことにしたために、この配列された極細金属線を一定長
さに切断するのに、一端から順次切断していく方法は必
然的に採用できなくなった。However, because we decided to arrange the ultra-fine metal wires in this way, it became impossible to cut the arranged ultra-fine metal wires to a certain length by cutting them sequentially from one end. Ta.
両端部の支持によって配列が成立しているだけだから、
片側だけでも端部を切り離してしまうと、配列は瞬時に
バラバラに乱れてしまうことになるからである。これと
同様の不都合は、基盤上面の平坦度が不十舅な場合にも
当然生してしまうから、基盤の上面は平坦でかつ微細な
ゴミ等のない清浄な状態で使用すべきである。このよう
な不安定な状態で配列された極細金属線を一定長さに切
断するためムこは、すべての切断を同時に行ってしまう
方法が有効である。Because the arrangement is only established by support at both ends,
This is because if the end portions are cut off even on one side, the arrangement will instantly become disorganized. A similar problem naturally occurs when the top surface of the substrate is not sufficiently flat, so the top surface of the substrate should be flat and clean without any fine dust or the like. In order to cut the ultra-thin metal wires arranged in such an unstable manner into a constant length, it is effective to cut all the wires at the same time.
そこで本発明では、平行配列された極細金属線の中間部
全長を、同時に切断できる方法について種々検討を行っ
た。その結果、円盤状もしくは直線状の刃先を持つ複数
の刃物を重ね合わせた特殊な切断用治具を採用すること
によって、目的を容易に達成出来ることが確認せられる
に至った。Therefore, in the present invention, various studies have been conducted on methods that can simultaneously cut the entire length of the intermediate portion of ultra-fine metal wires arranged in parallel. As a result, it was confirmed that the purpose could be easily achieved by employing a special cutting jig made by stacking multiple blades with disc-shaped or linear cutting edges.
すなわち、前述のよ・うに硬質ゴム等の平坦な基盤上に
張り渡した極細金属細線に対して、円盤状もしくは直線
状を呈し目的とする金属線片の長さに合わせて一定間隔
で刃先の並んだ切断治具を用いることによって、極細金
属線は、短時間の間に望みの長さに切断される。In other words, as mentioned above, an ultra-fine metal wire stretched over a flat base of hard rubber or the like is shaped like a disk or a straight line, and the cutting edge is inserted at regular intervals according to the length of the target metal wire piece. By using side-by-side cutting jigs, ultrafine metal wires can be cut to desired lengths in a short period of time.
次に本発明を実施する場合に注意すべき点に関し説明す
る。Next, points to be noted when implementing the present invention will be explained.
素材の極細金属線を平坦な基盤上に配列する際には、配
列された線同士の平行が保たれていないと、切断した線
片の長さ誤差を大きくする原因となる。また極細金属線
を基盤上に二層以上の多層を為すように配列するのは切
口が変形するなどしてやはり切断精度を損ねるので、極
細金属線を束ねて配列するような場合も含め、あまりに
多くの本数を重ねることは避ける必要がある。When arranging ultra-fine metal wires on a flat base, if the arranged wires are not kept parallel to each other, this will cause a large error in the length of the cut wire pieces. In addition, arranging ultra-fine metal wires in multiple layers of two or more on a base will deform the cut end and impair cutting accuracy, so it is important to avoid excessive It is necessary to avoid stacking too many pieces.
本発明法の場合はいずれの場合でも、切断用冶具は1本
の極細金属線の長さ方向のどの位置もが同時に刃先に接
触するようにすることが必要である。極細金属線の長さ
方向位置によって刃先の触れる時期が異なると、最初の
刃先が金線を切断したと同時にその線全体が跳ね上がっ
て、正常な切断はできなくなってしまう点に注意が必要
である。In any case in the method of the present invention, the cutting jig must be in contact with the cutting edge at any position along the length of one ultra-fine metal wire at the same time. It must be noted that if the timing of the contact of the cutting edge differs depending on the lengthwise position of the ultra-fine metal wire, the entire wire will jump up as soon as the first cutting edge cuts the gold wire, making it impossible to cut normally. .
したがって、刃先の高さは一定レベルに揃っていること
が必要である。さらに、円筒状の切断用治具を用いる場
合には治具の軸線が極細金属線の長さ方向と平行を保つ
ように、また平板状の切断用治具の場合には平坦な基盤
の上面と切断用治具の刃先が為す平面とが互いに平行で
あるか、少なくとも極細金属線の長さ方向と切断用治具
の刃先の並んでいる方向との平行を維持するように、そ
れぞれ配慮することが必要である。Therefore, it is necessary that the height of the cutting edge be at a constant level. Furthermore, when using a cylindrical cutting jig, make sure that the axis of the jig remains parallel to the length direction of the ultra-fine metal wire, and when using a flat cutting jig, make sure that the top surface of the flat base Care should be taken to ensure that the plane formed by the cutting jig and the cutting jig are parallel to each other, or at least maintain parallelism between the length direction of the ultra-fine metal wire and the direction in which the cutting jig's cutting jig is lined up. It is necessary.
本発明法においては、切断すべき極細金属線をまず平坦
な基盤の面上に切断しよ・うとする本数だレノ並べて配
列する。配列を固定するためには、極細金属線の両端部
分だけに接着剤、テープ、被覆材等を用いるにとどめ、
極細金属線中間部分にはこれらの配列補助材を一切使用
しないようにした。In the method of the present invention, the ultrafine metal wires to be cut are first arranged on the surface of a flat base in the same number as the number to be cut. To fix the arrangement, only use adhesive, tape, coating material, etc. on both ends of the ultra-fine metal wires.
These alignment aids were not used at all in the middle part of the ultra-fine metal wire.
このため、切断された後の極細金属線片の中には配列補
助材が混入することがなく、後工程の溶解において不純
物が悪影響を及ぼす心配を不要のものとすることができ
た。For this reason, the alignment aid does not get mixed into the ultra-fine metal wire pieces after they are cut, and there is no need to worry about impurities having an adverse effect on melting in the subsequent process.
さらに、円盤状もしくは直線状の複数の刃先を有する切
断用治具によって、極細金属線は中間部全長が同時に切
断されてしまうため、両端部のみを固定する簡単な方法
で配列しておくだけで、定長さの極細金属線片を同時多
量に製作することができるわけである。Furthermore, since the entire middle part of the ultra-fine metal wire is cut at the same time by a cutting jig with multiple disc-shaped or straight cutting edges, it is necessary to arrange the wire using a simple method that only fixes both ends. This means that a large number of ultra-fine metal wire pieces of a fixed length can be manufactured at the same time.
また、切断すべき極細金属線を配列する平坦な基盤とし
ては、硬質ゴムや各種のプラスチック等、緻密で、ある
程度の弾力性があって刃物より軟らかい素材を使用する
ことが望ましく、これによって刃先を必要以上に傷つけ
ることなく、切断用治具を長期に渡って繰り返し使用す
ることが可能となる。In addition, as a flat base on which to arrange the ultra-fine metal wires to be cut, it is desirable to use a material that is dense, has a certain degree of elasticity, and is softer than a knife, such as hard rubber or various plastics. The cutting jig can be used repeatedly over a long period of time without causing unnecessary damage.
以下、本発明を実施例に従ってさらに詳しく説明する。 Hereinafter, the present invention will be explained in more detail according to examples.
実施例1
第1図は、本発明にしたがった第一の実施例の概要を示
す模式図である。素材の極細金属線1として直径30μ
mの金線を、平坦な基盤3として使用した硬質ゴム板の
上面に平行に配列した上、両端部に粘着テープ2を貼り
付けることによって1
固定した。この硬質ゴム板の一端から、円盤状の刃先1
1を0.55mmピンチで並へて固定した円筒状の切断
用治具10を、刃先が硬質ゴムの上面になぞるようにし
て他端まで移動させることにより、硬質ゴム上の極細金
線を1mm長さの線片に切断した。Example 1 FIG. 1 is a schematic diagram showing an outline of a first example according to the present invention. The diameter of the ultra-fine metal wire 1 is 30μ.
M gold wires were arranged in parallel on the upper surface of a hard rubber plate used as a flat base 3, and fixed by adhering adhesive tape 2 to both ends. From one end of this hard rubber plate, a disc-shaped cutting edge 1
By moving the cylindrical cutting jig 10, which was fixed with 0.55 mm pinches to the other end so that the cutting edge traced the upper surface of the hard rubber, cut the ultra-fine gold wire on the hard rubber by 1 mm. Cut into length wire pieces.
切断後の金線片は平底の黒鉛坩堝中に互いに接触しない
ように置き、高周波加熱することによって、不純物の無
い清浄でサイズの揃ったバンプ用金球を得ることができ
た。The cut gold wire pieces were placed in a flat-bottomed graphite crucible so as not to touch each other, and by high-frequency heating, it was possible to obtain clean, impurity-free gold balls for bumps of uniform size.
実施例2 本実施例の概念を示す第2図に従って説明する。Example 2 This embodiment will be explained with reference to FIG. 2, which shows the concept of this embodiment.
平坦な基盤3として用いた硬質ゴム板の両端には、一定
間隔で小突起5が設けられており、極細金属線はこの両
端の小突起50間を交互に通ずことによって、一定ピツ
チで配列されるようにした。Small protrusions 5 are provided at regular intervals on both ends of the hard rubber plate used as the flat base 3, and the ultrafine metal wires are arranged at a constant pitch by passing alternately between the small protrusions 50 at both ends. I made it so that it would be done.
本実施例においては、極細金属線としては直径25μm
の金線を用いた。極細金属線が小突起5に沿って折り返
し曲げられる部分には、少量の接着剤を塗布して仮固定
を行った。In this example, the ultrafine metal wire has a diameter of 25 μm.
gold wire was used. A small amount of adhesive was applied to the portion where the ultrafine metal wire was folded back and bent along the small protrusion 5 for temporary fixation.
2
剃刀の刃16を多数重ね合わせ、刃先部分が平面状にな
るように作られた切断用治具15を使って、この極細金
線の切断を行った。剃刀の刃の間隔は0.4mmとなる
ようにした。金線1を張った硬質ゴム板3の上方から、
この切断用治具15を水平を保ちながら下降させ、極細
金線の全長がほぼ同時に切断されるように接触させた。2. This ultra-fine gold wire was cut using a cutting jig 15 made of a large number of razor blades 16 stacked one on top of the other so that the cutting edge portion was flat. The spacing between the razor blades was set to 0.4 mm. From above the hard rubber plate 3 covered with gold wire 1,
This cutting jig 15 was lowered while keeping it horizontal, and brought into contact with the ultrafine gold wire so that the entire length of the wire was cut almost simultaneously.
切断後の定尺の金線片は実施例1の場合と同様の方法で
溶解し、バンプ用の清浄な微細金球を作製することがで
きた。The cut gold wire piece of fixed length was melted in the same manner as in Example 1, and clean fine gold balls for bumps could be produced.
実施例3
第3図において多数の極細金属線l (直径25μmの
金線)は、束ねて両端を接着剤で固められている。これ
を平坦な基盤4のポリプロピレン板の上にたるみの無い
ように寝かせ、両端の接着剤で固められた部分に粘着テ
ープ2をつけて基盤に固定した。Example 3 In FIG. 3, a large number of ultrafine metal wires l (gold wires with a diameter of 25 μm) are bundled and both ends are fixed with adhesive. This was placed on a polypropylene plate of a flat base 4 so as not to sag, and the adhesive tape 2 was attached to the parts hardened with adhesive at both ends to fix it to the base.
実施例1で使用したのと同じ、1mmピッチで複数の円
盤状の刃先11を重ね合わせた切断用治具工0を回転さ
せながら、束ねた極細金線を固定したポリプロピレン板
の上方から水平を保ったまま下降させた。While rotating the cutting jig 0, which is the same as that used in Example 1 and has a plurality of disc-shaped cutting edges 11 stacked on top of each other at a pitch of 1 mm, a horizontal plane was cut from above the polypropylene plate to which the bundled ultra-fine gold wire was fixed. I lowered it while holding it.
切断後の定尺の金線片は実施例1の場合ど同様の方法で
溶解し、バンプとして使用するのに最適な微細金球を作
製することができた。The cut gold wire piece of fixed length was melted in the same manner as in Example 1, and fine gold spheres suitable for use as bumps could be produced.
TAB法等で必要となるハンプを溶解法で製造する場合
に必要となるバンブ累月金属の定尺極細金属線片を、不
純物の混入が起こらないようにして多量に切断できるよ
うになり、後工程で極細金属線片を溶解する場合の不純
物除去作業が不要となったので、バンプの能率的な製造
が可能になった。It is now possible to cut a large amount of standard-sized ultra-fine metal wire pieces of bump metal, which are required when manufacturing humps required by the TAB method etc. by melting, without contaminating impurities. This eliminates the need for impurity removal work when melting ultrafine metal wire pieces during the process, making it possible to efficiently manufacture bumps.
第1図は本発明の第一の実施例を示す模式図、第2図は
本発明の第二の実施例を示す模式図、第3図は本発明の
第三の実施例を示す模式図である。
1・・・極細金属線、2・・・粘着テープ、3.4・・
・平坦な基盤、5・・・小突起、10・、・円筒状の切
断用治具、
11・・・円盤状の刃先、
15・・・平板状の切断用治具、
16・・・直線状の刃先。Fig. 1 is a schematic diagram showing a first embodiment of the present invention, Fig. 2 is a schematic diagram showing a second embodiment of the invention, and Fig. 3 is a schematic diagram showing a third embodiment of the invention. It is. 1... Ultrafine metal wire, 2... Adhesive tape, 3.4...
・Flat base, 5...Small protrusion, 10...Cylindrical cutting jig, 11...Disc-shaped cutting edge, 15...Flat-shaped cutting jig, 16...Straight line shaped cutting edge.
Claims (1)
た後、一定間隔で刃先の並んだ切断用治具を用いて前記
極細金属線を切断し、微小定尺の極細金属線片を製造す
ることを特徴とする極細金属線の切断方法。After arranging a plurality of ultra-fine metal wires in parallel on a flat base, the ultra-fine metal wires are cut using a cutting jig with cutting edges lined up at regular intervals to produce ultra-fine metal wire pieces of minute regular length. A method for cutting an ultra-fine metal wire.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2035256A JPH03238132A (en) | 1990-02-15 | 1990-02-15 | Cutting method for extremely five metallic wire |
PCT/JP1990/001591 WO1991008850A1 (en) | 1989-12-07 | 1990-12-06 | Method of manufacturing minute metallic balls uniform in size |
KR1019910700856A KR960000332B1 (en) | 1989-12-07 | 1990-12-06 | Method of manufacturing minute metallic balls or minute alloy balls |
EP91900363A EP0457920B1 (en) | 1989-12-07 | 1990-12-06 | Method of manufacturing minute metallic balls uniform in size |
DE69032249T DE69032249T2 (en) | 1989-12-07 | 1990-12-06 | METHOD FOR PRODUCING TINY METALLIC BALLS OF EVEN SIZE |
SG1996001996A SG44543A1 (en) | 1989-12-07 | 1990-12-06 | Method of forming fine metal spheres of uniform size |
MYPI91000131A MY105358A (en) | 1990-02-15 | 1991-01-28 | Method of forming fine metal spheres of uniform size. |
US08/596,694 US5761779A (en) | 1989-12-07 | 1996-02-05 | Method of producing fine metal spheres of uniform size |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2035256A JPH03238132A (en) | 1990-02-15 | 1990-02-15 | Cutting method for extremely five metallic wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03238132A true JPH03238132A (en) | 1991-10-23 |
Family
ID=12436739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2035256A Pending JPH03238132A (en) | 1989-12-07 | 1990-02-15 | Cutting method for extremely five metallic wire |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH03238132A (en) |
MY (1) | MY105358A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106694757A (en) * | 2016-12-20 | 2017-05-24 | 重庆比阳产品设计有限公司 | Iron wire cutting machine |
JP2020117371A (en) * | 2019-01-25 | 2020-08-06 | 東京特殊電線株式会社 | Wire rod for roll-winding lead wire, and manufacturing method of lead wire |
-
1990
- 1990-02-15 JP JP2035256A patent/JPH03238132A/en active Pending
-
1991
- 1991-01-28 MY MYPI91000131A patent/MY105358A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106694757A (en) * | 2016-12-20 | 2017-05-24 | 重庆比阳产品设计有限公司 | Iron wire cutting machine |
JP2020117371A (en) * | 2019-01-25 | 2020-08-06 | 東京特殊電線株式会社 | Wire rod for roll-winding lead wire, and manufacturing method of lead wire |
Also Published As
Publication number | Publication date |
---|---|
MY105358A (en) | 1994-09-30 |
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