JPH0311695A - Soldering of multiterminal component and mask for cream solder printing - Google Patents
Soldering of multiterminal component and mask for cream solder printingInfo
- Publication number
- JPH0311695A JPH0311695A JP14426589A JP14426589A JPH0311695A JP H0311695 A JPH0311695 A JP H0311695A JP 14426589 A JP14426589 A JP 14426589A JP 14426589 A JP14426589 A JP 14426589A JP H0311695 A JPH0311695 A JP H0311695A
- Authority
- JP
- Japan
- Prior art keywords
- lands
- solder
- cream solder
- soldering
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 82
- 239000006071 cream Substances 0.000 title claims abstract description 50
- 238000005476 soldering Methods 0.000 title claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 210000003739 neck Anatomy 0.000 abstract 2
- 239000000155 melt Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフラットパッケージＩＣやプラスチックリード
レスチップキャリアのような多端子部品をクリームはん
だではんだ付けする方法およびクリームはんだを印刷塗
布するマスクに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for soldering multi-terminal components such as flat package ICs and plastic leadless chip carriers with cream solder, and a mask for printing and applying cream solder.
多端子部品をプリント基板にはんだ付けするにはクリー
ムはんだが適している。従来のクリームはんだでの多端
子部品のはんだ付け方法は、プリント基板のランドと一
致したところにランドと略同−形の穴のあいたマスクを
用い、各ランドに適量のクリームはんだを塗布し、その
上に多端子部品のリードを載置してから加熱を行って、
はんだ付けしていたものである。Cream solder is suitable for soldering multi-terminal components to printed circuit boards. The conventional method for soldering multi-terminal components with cream solder is to use a mask with holes that are roughly the same shape as the lands on the printed circuit board, apply an appropriate amount of cream solder to each land, and then Place the leads of the multi-terminal component on top and heat it.
It was soldered.
しかしながら近時の多端子部品は非常に小形化されてき
ていることからリードが細く、しかもリード間隔が狭く
なっており、この様なリードとはんだ付けするランドも
同様細く、その間隔も狭くなっているため各ランド毎に
クリームはんだを塗布することが非常に難しくなってき
ている。それ故、クリームはんだを並列したランド全部
に渡って一直線に塗布するという「−文字方式」が採用
されるようになった（特開昭６０−５８６００号公報参
照）。However, as modern multi-terminal components have become much smaller, the leads have become thinner and the spacing between them has become narrower, and the lands that are soldered to these leads have also become thinner and the spacing between them has become narrower. Therefore, it is becoming extremely difficult to apply cream solder to each land. Therefore, the ``--letter method'' in which cream solder is applied in a straight line over all of the parallel lands has been adopted (see Japanese Patent Application Laid-Open No. 60-58600).
一文字方式は並列したランド全域と同一長さの長大が穿
設されたマスクを用いたり、或いはデイスペンサーをラ
ンド並列方向に動かして並列したランド上に直線状にク
リームはんだを印刷塗布していた。この様にランド間の
はんだ付け部でない箇所にクリームはんだを塗布しても
クリームはんだは溶融時、隣接したランド上の溶融はん
だに弓っ張られるためブリッヂを形成しないと考えられ
ていたものである。The one-character method uses a mask with a hole of the same length as the entire area of the parallel lands, or moves a dispenser in the land parallel direction to print and apply cream solder in a straight line on the parallel lands. In this way, it was thought that even if cream solder was applied to areas other than the soldering areas between lands, a bridge would not be formed because the cream solder would be stretched over the molten solder on the adjacent lands when it melted. .
しかしながら、実際には一文字方式ではブリッヂの形成
やランド上のはんだ量が少なくて完全なはんだ付けが行
えないという未はんだ等が多発していた。However, in reality, with the single-character method, there were many cases of unsoldering, where bridges were formed and the amount of solder on the lands was too small to complete soldering.
本発明は、ブリッヂや未はんだの発生を抑えることので
きるクリームはんだを用いたはんだ付け方法およびクリ
ームはんだを一文字方式に塗布するマスクを提供するこ
とにある。An object of the present invention is to provide a soldering method using cream solder that can suppress the occurrence of bridges and unsoldered areas, and a mask for applying cream solder in a single character pattern.
本発明者が従来の一文字方式における上述問題点の原因
について鋭意検討を重ねた結果、クリームはんだの溶融
時にランド上のはんだがランド間のはんだを引張るが、
この時、隣り合った二つのランド上のはんだが、そのラ
ンド間のはんだを弓っ張り合い、力の強いランド上のは
んだの方に弓っ張るため、力の強いランド上に多量のは
んだが集まってしまう。しかも、力の強いランド上のは
んだはランド間のはんだばかりでなく、隣接したランド
上のはんだも一緒に引っ張ってしまうためブリッヂを形
成したり、或いは力の弱いランド上のはんだが無くなっ
て未はんだとなることが分かった。そこで本発明者はラ
ンド間のはんだがランド上のはんだに引っ張られる時、
ランド間のはんだが切れやすければ一方のランド上のは
んだだけに引っ張られず隣り合った両方のランド上のは
んだに均等に分かれることに着目して本発明を完成させ
た。The inventor of the present invention has conducted extensive studies on the causes of the above-mentioned problems in the conventional single-letter method, and has found that when the cream solder melts, the solder on the lands pulls the solder between the lands.
At this time, the solder on two adjacent lands stretches the solder between the lands together, and the solder on the land with the stronger force stretches, so a large amount of solder gathers on the land with the stronger force. I end up. Moreover, the solder on the lands with strong force pulls not only the solder between the lands but also the solder on the adjacent lands, forming a bridge, or the solder on the lands with weak force runs out and becomes unsoldered. It turns out that Therefore, the inventor proposed that when the solder between the lands is pulled by the solder on the lands,
The present invention was completed by focusing on the fact that if the solder between the lands is easy to break, it will not be pulled by only the solder on one land but will be divided equally into the solder on both adjacent lands.
本発明は、多端子部品のリードとプリント基板のランド
とをクリームはんだではんだ付けする方法において、並
列したランド全部に連続した帯状にクリームはんだを塗
布するとともに、ランド間のクリームはんだの量をラン
ド上のクリームはんだの量よりも少なくし、該クリーム
はんだを塗布したランド上に多端子部品のリードを載置
してからクリームはんだを加熱溶融することを特徴とす
る多端子部品のはんだ付け方法であり、多端子部品を実
装するプリント基板にクリームはんだを印刷塗布するマ
スクであって、マスクの穴がプリント基板上に並列した
ランド全部に渡る長大であり、しかもランド間となる箇
所にくびれが形成されていることを特徴とするクリーム
はんだ印刷用マスクである。The present invention is a method for soldering the leads of a multi-terminal component and the lands of a printed circuit board with cream solder. A method for soldering a multi-terminal component, which is characterized in that the amount of cream solder is less than the amount above, the lead of the multi-terminal component is placed on the land coated with the cream solder, and then the cream solder is heated and melted. This is a mask that prints and applies cream solder to a printed circuit board on which multi-terminal components are mounted, and the hole in the mask is long and covers all of the lands arranged in parallel on the printed circuit board, and constrictions are formed between the lands. This is a cream solder printing mask characterized by:
本発明では、ランド間にクリームはんだの塗布量が少な
いくびれを形成して、はんだ溶融時、この部分のはんだ
の切れをよくしようとするものであるが、該くびれにつ
いては如何なる形状でもよい。In the present invention, a constriction with a small amount of cream solder applied is formed between the lands so that the solder in this area can be easily cut when the solder melts, but the constriction may have any shape.
以下、図面に基づいて本発明の多端子部品のはんだ付け
方法について説明する。Hereinafter, a method for soldering a multi-terminal component according to the present invention will be explained based on the drawings.
プリント基板上に並列した多数のランド２・・・上にク
リームはんだ３を連続した帯状に塗布する。Cream solder 3 is applied in a continuous strip onto a large number of lands 2 arranged in parallel on a printed circuit board.
この場合、当然クリームはんだはランド間４にも塗布さ
れることになる。ランド間に塗布されたクリームはんだ
は、くびれ５が形成されており、ランド間はランド上の
クリームはんだよりも塗布量が少なくなっている（第１
図）。この様にしてクリームはんだが塗布されたランド
上に多端子部品６のリード７・・・を載置する（第２図
）。多端子部品が搭載されたプリント基板をリフロー炉
、蒸気加熱炉、熱風装置等の加熱装置で加熱を行い、ク
リームはんだを溶融させる。クリームはんだは半溶融状
態の時、ランド間のクリームはんだは両側のランド上で
溶融したはんだに引っ張られ、くび５−
６
れの部分から分離するようになる（第３図）。さらに温
度が上がって、はんだが完全に溶融すると、ランド間に
あったはんだは表面張力でランド上のはんだに引っ張ら
れ、毛細管作用でランドとリードの間に十分侵入してブ
リッヂや未はんだのないはんだ付けが行われる（第４図
）。In this case, the cream solder is naturally applied to the land spaces 4 as well. The cream solder applied between the lands has a constriction 5, and the amount of cream solder applied between the lands is smaller than that on the lands (first
figure). The leads 7 of the multi-terminal component 6 are placed on the lands coated with cream solder in this manner (FIG. 2). The printed circuit board on which multi-terminal components are mounted is heated with a heating device such as a reflow oven, steam heating furnace, or hot air device to melt the cream solder. When the cream solder is in a semi-molten state, the cream solder between the lands is pulled by the molten solder on the lands on both sides and separates from the constriction (Fig. 3). When the temperature rises further and the solder completely melts, the solder between the lands is pulled by the solder on the land due to surface tension, and the capillary action penetrates sufficiently between the lands and the leads, resulting in soldering without bridges or unsoldered areas. is carried out (Figure 4).
本発明において、ランド間のクリームはんだがランド上
のクリームはんだより少ない状態とは、第１．２．９図
のように帯状の両側にＶノツチを入れたもの、第５図の
ように楕円形を連結したもの、第６図のように山形を連
結したもの、或いは第７図のように帯状の上面に溝を入
れたもの等であるが、本発明は上記塗布例に限らず、ラ
ンド間のクリームはんだの量を少なくする形状であれば
如何なる形状のものでも採用できる。In the present invention, the state in which the amount of cream solder between the lands is less than the amount of cream solder on the lands means a state in which V-notches are inserted on both sides of a strip as shown in Figure 1.2.9, or an elliptical shape as shown in Figure 5. The present invention is not limited to the above-mentioned application examples; Any shape can be used as long as it reduces the amount of cream solder.
次に本発明を実施するもう一つの発明のクリームはんだ
印刷用マスクについて説明する。Next, a cream solder printing mask according to another invention that implements the present invention will be described.
第８図は本発明のクリームはんだ印刷用マスクの拡大斜
視図である。マスク８には長穴９が穿設されている。該
長穴はプリント基板上に並列した多数のランド、即ち多
端子部品の一辺に設置されたリードが載置されるランド
全域に渡る長さになっている。また長穴の軸方向両側に
はＶ字状の多数の突起１０・・・が形成されている。該
突起の形成位置はマスクをプリント基板のランド上に置
いた時、ランド間４の略中心となるところである。第８
図に示すマスクでクリームはんだを印刷塗布するとクリ
ームはんだは第９図の如くプリント基板１の多数のラン
ド２・・・とランド間４・・・上に、しかもランド間に
くびれ５がある状態で塗布される。FIG. 8 is an enlarged perspective view of the cream solder printing mask of the present invention. A long hole 9 is bored in the mask 8. The elongated hole has a length extending over the entire area of a large number of lands arranged in parallel on the printed circuit board, that is, the lands on which the leads installed on one side of the multi-terminal component are placed. Further, a large number of V-shaped projections 10 are formed on both sides of the elongated hole in the axial direction. The formation position of the protrusion is approximately at the center of the land gap 4 when the mask is placed on the land of the printed circuit board. 8th
When the cream solder is printed and applied using the mask shown in the figure, the cream solder has constrictions 5 on the many lands 2... and between the lands 4... of the printed circuit board 1, as shown in Fig. 9. applied.
本発明によれば、ランド間上に塗布されたクリームはん
だは溶融時、その両側のランドに均等に分けられるため
、ランド間にブリッヂを形成したり、ランド上のはんだ
が極端に少なくなって未はんだとなる等のはんだ付け不
良が皆無となるという信頼あるはんだ付けが行えるもの
である。According to the present invention, when the cream solder applied between the lands is melted, it is evenly distributed to the lands on both sides of the lands. Reliable soldering can be performed without any soldering defects such as soldering.
第１〜４図は本発明の多端子部品のはんだ付け方法の手
順を説明する図、第５〜７図はランド上のクリームはん
だの塗布例、第８図は本発明のクリームはんだ印刷用マ
スク拡大斜視図、第９図は第８図のマスクでクリームは
んだを印刷したプリント基板の拡大斜視図である。Figures 1 to 4 are diagrams explaining the steps of the method for soldering multi-terminal components of the present invention, Figures 5 to 7 are examples of applying cream solder on lands, and Figure 8 is a mask for printing cream solder of the present invention. 9 is an enlarged perspective view of a printed circuit board on which cream solder is printed using the mask of FIG. 8.
Claims (2)
クリームはんだではんだ付けする方法において、並列し
たランド全部に連続した帯状にクリームはんだを塗布す
るとともに、ランド間のクリームはんだの量をランド上
のクリームはんだの量よりも少なくし、該クリームはん
だを塗布したランド上に多端子部品のリードを載置して
からクリームはんだを加熱溶融することを特徴とする多
端子部品のはんだ付け方法。(1) In the method of soldering the leads of a multi-terminal component and the lands of a printed circuit board with cream solder, cream solder is applied in a continuous band to all the parallel lands, and the amount of cream solder between the lands is applied to the lands. A method for soldering a multi-terminal component, comprising: placing the lead of the multi-terminal component on a land coated with the cream solder, and then heating and melting the cream solder.
んだを印刷塗布するマスクであって、マスクの穴がプリ
ント基板上に並列したランド全部に渡る長穴であり、し
かもランド間となる箇所にくびれが形成されていること
を特徴するクリームはんだ印刷用マスク。(2) A mask for printing and applying cream solder to a printed circuit board on which multi-terminal components are mounted, and the hole in the mask is an elongated hole spanning all the lands arranged in parallel on the printed circuit board, and there is a constriction between the lands. A cream solder printing mask characterized by the formation of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14426589A JPH0311695A (en) | 1989-06-08 | 1989-06-08 | Soldering of multiterminal component and mask for cream solder printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14426589A JPH0311695A (en) | 1989-06-08 | 1989-06-08 | Soldering of multiterminal component and mask for cream solder printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0311695A true JPH0311695A (en) | 1991-01-18 |
Family
ID=15358073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14426589A Pending JPH0311695A (en) | 1989-06-08 | 1989-06-08 | Soldering of multiterminal component and mask for cream solder printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311695A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662365A (en) * | 2019-09-25 | 2020-01-07 | 安徽熙泰智能科技有限公司 | Micro-display wire welding method and wire welding equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61150398A (en) * | 1984-12-25 | 1986-07-09 | 株式会社東芝 | Soldering of flat package and mask therefor |
-
1989
- 1989-06-08 JP JP14426589A patent/JPH0311695A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61150398A (en) * | 1984-12-25 | 1986-07-09 | 株式会社東芝 | Soldering of flat package and mask therefor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662365A (en) * | 2019-09-25 | 2020-01-07 | 安徽熙泰智能科技有限公司 | Micro-display wire welding method and wire welding equipment |
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