JPH0226608Y2 - - Google Patents
Info
- Publication number
- JPH0226608Y2 JPH0226608Y2 JP1985162495U JP16249585U JPH0226608Y2 JP H0226608 Y2 JPH0226608 Y2 JP H0226608Y2 JP 1985162495 U JP1985162495 U JP 1985162495U JP 16249585 U JP16249585 U JP 16249585U JP H0226608 Y2 JPH0226608 Y2 JP H0226608Y2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- carrier plate
- workpiece
- grinding wheels
- grindstones
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000006061 abrasive grain Substances 0.000 claims description 13
- 229910003460 diamond Inorganic materials 0.000 claims description 13
- 239000010432 diamond Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
この考案は、回転する砥石間にワークを搬入
し、両砥石でワークの両面を同時に研削加工する
両頭平面研削盤に関するものである。[Detailed description of the invention] Industrial application field This invention relates to a double-head surface grinder that carries a workpiece between rotating grindstones and simultaneously grinds both sides of the workpiece using both grindstones.
従来の技術
一般に、上記両頭平面研削盤の一例として、第
4図に示す構造のものが知られている。即ち、こ
の両頭平面研削盤は、フレーム1に適宜の駆動機
構(図示せず)によりウオーム等を介して上下方
向に移動可能な一対のクイル2,3を同芯状に、
かつ、上下に対向させて支持すると共に、両クイ
ル2,3内に夫々モータ4,5によりベルト伝導
機構6,7を介して回転駆動される回転主軸8,
9を回転自在に支持し、両回転主軸8,9の対応
する軸端部(図示せず)に夫々砥石台10,11
を設け、両砥石台10,11に夫々研削面が互い
に対向するように砥石12,13を取付け、両砥
石12,13の中間に該砥石12,13の回転主
軸8,9と直交する平面内において回転するキヤ
リヤプレート14を設けてなり、回転する上下の
砥石12,13間にキヤリヤプレート14により
ワークを搬入して該ワークの両面を両砥石12,
13で同時に研削加工するように構成したもので
ある。BACKGROUND ART Generally, as an example of the double-headed surface grinder described above, a structure shown in FIG. 4 is known. That is, this double-head surface grinder has a pair of quills 2 and 3 concentrically movable in the vertical direction via a worm or the like by a suitable drive mechanism (not shown) on a frame 1.
A rotating main shaft 8 is supported vertically and opposed to each other, and is rotatably driven by motors 4 and 5 via belt transmission mechanisms 6 and 7 within both quills 2 and 3, respectively.
9 is rotatably supported, and grindstone heads 10 and 11 are mounted at corresponding shaft ends (not shown) of both rotating main shafts 8 and 9, respectively.
, and the grinding wheels 12 and 13 are mounted on both the grinding wheels 10 and 11 so that their grinding surfaces face each other, and the grinding wheels 12 and 13 are installed between the two grinding wheels 12 and 13 in a plane perpendicular to the rotational axes 8 and 9 of the grinding wheels 12 and 13. A carrier plate 14 is provided to rotate between the upper and lower rotating grindstones 12 and 13, and a workpiece is carried between the rotating upper and lower grindstones 12 and 13 by means of the carrier plate 14, and both surfaces of the workpiece are placed between the two grindstones 12 and 13.
13, the grinding process is performed simultaneously.
ところで、上記両頭平面研削盤に於いて、砥石
12,13を長期間使用したり、砥石12,13
の研削条件が不適当であると、砥石12,13の
研削面に目つぶれや目詰まりが生じ、切れ味が悪
く、発熱量が大きくなり、仕上面に研削割れや研
削焼けを生じる。 By the way, in the above-mentioned double-head surface grinder, the grinding wheels 12 and 13 are used for a long period of time, and the grinding wheels 12 and 13 are
If the grinding conditions are inappropriate, the grinding surfaces of the grinding wheels 12 and 13 become clogged or clogged, resulting in poor sharpness and increased heat generation, resulting in grinding cracks and grinding burns on the finished surfaces.
そこで、砥石12,13の研削面に目つぶれや
日詰まりが生じた場合、研削面上層部の擦り減つ
た砥粒や、砥粒間の隙間或いは気孔に詰まつた切
粉を取り除き、該研削面に新しい砥粒を露出させ
る為のドレツシング作業を行う必要がある。 Therefore, when the grinding surfaces of the grinding wheels 12 and 13 become clogged or clogged, the worn out abrasive grains on the upper layer of the grinding surface and the chips clogged in the gaps or pores between the abrasive grains are removed, and the grinding surface is removed. It is necessary to perform a dressing operation to expose new abrasive grains on the surface.
従来のドレツシング作業は、ドレツサー装置を
用いて行われる。このドレツサー装置は第4図に
示すように、先端上下にダイヤモンドチツプ1
5,15を固着した棒状のダイヤモンドドレツサ
ー16をフレーム1に回動自在に設け、該ダイヤ
モンドドレツサー16のダイヤモンドチツプ1
5,15を砥石12,13の研削面間に挟入し、
砥石12,13を回転させながらダイヤモンドド
レツサー16を回動してダイヤモンドチツプ1
5,15を砥石12,13の半径方向に移動さ
せ、砥石12,13の研削面上層部の擦り減つた
砥粒、或いは目詰まりした切粉をダイヤモンドチ
ツプ15,15で削り落とし、新しい砥粒を露出
するようにしている。 Conventional dressing operations are performed using dresser equipment. As shown in Figure 4, this dresser device has one diamond chip on the top and bottom of the tip.
A rod-shaped diamond dresser 16 to which diamond chips 5 and 15 are fixed is rotatably provided on the frame 1.
5 and 15 are inserted between the grinding surfaces of the grindstones 12 and 13,
Diamond chip 1 is removed by rotating the diamond dresser 16 while rotating the grindstones 12 and 13.
5 and 15 in the radial direction of the grinding wheels 12 and 13, the worn out abrasive grains or clogged chips on the upper layer of the grinding surfaces of the grinding wheels 12 and 13 are scraped off with the diamond chips 15 and 15, and new abrasive grains are removed. I'm trying to expose that.
考案が解決しようとする問題点
ところで、上記の如きダイヤモンドドレツサー
16を用いたドレツシング作業に於いて、ダイヤ
モンドドレツサー16を上下の砥石12,13の
研削面間に挟入させるには、上下の砥石12,1
3を上下方向に上昇及び下降して大きく移動させ
る必要があり、その為、非常に手間並びに時間を
要してドレツシング作業の能率が悪かつた。Problems to be Solved by the Invention By the way, in dressing work using the diamond dresser 16 as described above, in order to insert the diamond dresser 16 between the grinding surfaces of the upper and lower grinding wheels 12 and 13, Upper and lower whetstones 12,1
3 had to be raised and lowered in the vertical direction to move the dressing over a large distance, which required a lot of effort and time, and the efficiency of the dressing work was poor.
問題点を解決するための手段
この考案は上記問題点に鑑みて提案されたもの
で、キヤリヤプレートの上下面外周縁に所定の幅
寸法でダイヤモンド砥粒等を電着させて当該部分
にドレツサー砥石を形成し、キヤリヤプレートに
ドレツシング機能を装備したことを特徴とする。Means for Solving the Problems This idea was proposed in view of the problems mentioned above. Diamond abrasive grains or the like are electrodeposited in a predetermined width on the outer periphery of the upper and lower surfaces of the carrier plate, and a dresser is applied to the corresponding parts. It is characterized by forming a grindstone and equipping the carrier plate with a dressing function.
作 用
ワークをキヤリヤプレートに装着しない状態で
上下の砥石間にキヤリヤプレートを挟み、両砥石
を回転させると共にキヤリヤプレートを回転させ
ると、両砥石の研削面表層部の擦り減つた砥粒或
いは目詰まりした切粉はキヤリヤプレートの上下
面外周縁に形成したドレツサー砥石によつて削り
落とされ、両砥石の研削面には新しい砥粒が露出
する。Function When the carrier plate is sandwiched between the upper and lower grinding wheels without a workpiece attached to the carrier plate, and the carrier plate is rotated at the same time as both grinding wheels are rotated, the worn out abrasive grains on the surface layer of the grinding surfaces of both grinding wheels are removed. Alternatively, the clogged chips are ground off by dresser grindstones formed on the outer periphery of the upper and lower surfaces of the carrier plate, and new abrasive grains are exposed on the grinding surfaces of both grindstones.
実施例
第1図はこの考案を第4図の両頭平面研削盤に
適用した一例を示すもので、第4図と同一符号の
ものは第4図と同一或いは類似内容のものを示
し、異なる点は上下の砥石12,13の研削面の
ドレツシング機能を備えるダイヤモンドドレツサ
ー16を削除すると共に、上記ドレツシング機能
をキヤリヤプレート14に付加させたことであ
る。即ち、キヤリヤプレート14には、第2図及
び第3図に示すように、上下面外周縁に所定の寸
法でダイヤモンド砥粒等をワークがキヤリヤプレ
ート14から突出する寸法より肉薄の層状に電着
させて当該部分にドレツサー砥石17,18が形
成されている。Embodiment Fig. 1 shows an example in which this invention is applied to the double-head surface grinder shown in Fig. 4. Items with the same reference numerals as in Fig. 4 indicate the same or similar content as in Fig. 4, and differences are noted. The diamond dresser 16, which has a dressing function for the grinding surfaces of the upper and lower grindstones 12 and 13, is removed, and the dressing function is added to the carrier plate 14. That is, as shown in FIGS. 2 and 3, the carrier plate 14 is coated with diamond abrasive grains or the like in a predetermined dimension on the outer periphery of the upper and lower surfaces in a layer that is thinner than the dimension in which the workpiece protrudes from the carrier plate 14. Dresser grindstones 17 and 18 are formed on the corresponding portions by electrodeposition.
以上がこの考案の構成で、この考案の両頭平面
研削盤にあつては研削動作は従来と同様であり、
その説明は省略する。 The above is the configuration of this invention, and the grinding operation of the double-head surface grinder of this invention is the same as the conventional one.
The explanation will be omitted.
次に、この考案の両頭平面研削盤による砥石1
2,13のドレツシング作業について説明する。 Next, the grinding wheel 1 made by the double-headed surface grinder of this invention
The dressing operations 2 and 13 will be explained.
先ず、キヤリヤプレート14へのローデイング
を中断して該キヤリヤプレート14を空にする。
次いで、上下の砥石12,13をクイル2,3に
より夫々下降及び上昇して両砥石12,13間で
キヤリヤプレート14を挟む。しかる後、両砥石
12,13を回転させると共に、キヤリヤプレー
ト14を回転させ、更に、上クイル2,3を下降
及び上昇して両砥石12,13に所定量の切込み
を与える。すると、砥石12,13の研削面表層
部の擦り減つた砥粒或いは目詰まりした切粉はキ
ヤリヤプレート14の上下面外周縁に形成したド
レツサー砥石17,18によつて容易に削り落と
され、上記砥石12,13の研削面には新しい砥
粒が露出し、ドレツシング作業が完了する。 First, loading onto the carrier plate 14 is interrupted and the carrier plate 14 is emptied.
Next, the upper and lower grindstones 12 and 13 are lowered and raised by the quills 2 and 3, respectively, to sandwich the carrier plate 14 between the two grindstones 12 and 13. Thereafter, both the grindstones 12 and 13 are rotated, the carrier plate 14 is also rotated, and the upper quills 2 and 3 are lowered and raised to give both the grindstones 12 and 13 a predetermined depth of cut. Then, worn abrasive grains or clogged chips on the surface layer of the grinding surfaces of the grinding wheels 12 and 13 are easily scraped off by the dresser grinding wheels 17 and 18 formed on the outer periphery of the upper and lower surfaces of the carrier plate 14. New abrasive grains are exposed on the grinding surfaces of the grindstones 12 and 13, and the dressing operation is completed.
尚、以上説明は縦型両頭平面研削盤について述
べているが、この考案はこれに限定されるもので
はなく、横型両頭平面研削盤にも容易に適用可能
である。 Although the above description has been made regarding a vertical double-head surface grinder, this invention is not limited thereto, and can easily be applied to a horizontal double-head surface grinder.
考案の効果
以上説明したように、この考案はキヤリヤプレ
ートの上下面外周縁部にダイヤモンド砥粒等をワ
ークがキヤリヤプレートから突出する寸法より肉
薄の層状に電着して接着させて当該部分にドレツ
サー砥石を形成しキヤリヤプレートにドレツシン
グ機能を付加させたから、両者を別設する必要が
なく機構が簡単で装置価格は低廉となる。Effects of the device As explained above, this device electrodeposits diamond abrasive grains, etc. on the outer periphery of the upper and lower surfaces of the carrier plate in a layer thinner than the dimension in which the workpiece protrudes from the carrier plate, and adheres it to the corresponding area. Since the dressing function is added to the carrier plate and the dresser grinding wheel is formed in the grinding wheel, there is no need to install both separately, the mechanism is simple, and the cost of the device is low.
本案装置によれば、ドレツシング砥石は肉薄に
形成されているのでワークの研削加工には何等の
支障がなく、ドレツシング作業はワークを装着し
ない状態で上下砥石をドレツサ砥石面に当接する
だけ僅かに移動すれば良く、ドレツシング作業の
作業性向上並びに作業時間の短縮化、及び研削盤
の稼動率の向上が図れる。また、この考案はワー
クの通過軌跡の近くをドレツシングするのでドレ
ツシングの精度が良く、ワークの加工精度の向上
が図れる。 According to the proposed device, since the dressing grindstone is formed thinly, there is no problem in grinding the workpiece, and during dressing work, the upper and lower grindstones are slightly moved so as to come into contact with the dressing wheel surface without a workpiece attached. This can improve the workability of the dressing work, shorten the work time, and improve the operating rate of the grinder. Furthermore, since this invention performs dressing near the trajectory of the workpiece, the dressing accuracy is good and the processing accuracy of the workpiece can be improved.
第1図はこの考案の一実施例を示す図面、第2
図はこの考案に用いられるキヤリヤプレートの平
面図、第3図は第2図のA−A線に於ける拡大断
面図、第4図は従来例を示す図面である。
1……フレーム、2,3……クイル、8,9…
…回転主軸、12,13……砥石、14……キヤ
リヤプレート、17,18……ドレツサー砥石。
Figure 1 is a drawing showing an embodiment of this invention;
The figure is a plan view of a carrier plate used in this invention, FIG. 3 is an enlarged sectional view taken along the line A--A in FIG. 2, and FIG. 4 is a drawing showing a conventional example. 1...Frame, 2,3...Quill, 8,9...
... Rotating main shaft, 12, 13... Grinding wheel, 14... Carrier plate, 17, 18... Dresser grinding wheel.
Claims (1)
この両砥石間にキヤリヤプレートによりワークを
搬入して該ワークの両面を同時に上記両砥石で研
削加工する両頭平面研削盤に於いて、 上記キヤリヤプレートの上下面外周縁に所定の
巾寸法でダイヤモンド砥粒等をワークがキヤリヤ
プレートから突出する寸法より肉薄の層状に電着
させて当該部分にドレツサー砥石を形成したこと
を特徴とする両頭平面研削盤。[Scope of claim for utility model registration] Grinding wheels are arranged with their grinding surfaces facing each other,
In a double-head surface grinder that carries a workpiece between the two grinding wheels using a carrier plate and simultaneously grinds both surfaces of the workpiece with the two grinding wheels, a predetermined width dimension is placed on the outer periphery of the upper and lower surfaces of the carrier plate. A double-head surface grinder characterized in that diamond abrasive grains or the like are electrodeposited in a layer that is thinner than the dimension in which the workpiece protrudes from the carrier plate to form a dresser grindstone in that part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985162495U JPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985162495U JPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6272047U JPS6272047U (en) | 1987-05-08 |
JPH0226608Y2 true JPH0226608Y2 (en) | 1990-07-19 |
Family
ID=31089808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985162495U Expired JPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0226608Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10142400B4 (en) * | 2001-08-30 | 2009-09-03 | Siltronic Ag | Improved local flatness semiconductor wafer and method of making the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49137188U (en) * | 1973-03-08 | 1974-11-26 | ||
JPS60103654U (en) * | 1983-12-21 | 1985-07-15 | 光洋機械工業株式会社 | Shaping and sharpening device for grinding wheel in double-head surface grinder |
-
1985
- 1985-10-23 JP JP1985162495U patent/JPH0226608Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6272047U (en) | 1987-05-08 |
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