JPH02254787A - Mounting of electronic component onto surface mounting substrate - Google Patents
Mounting of electronic component onto surface mounting substrateInfo
- Publication number
- JPH02254787A JPH02254787A JP7634189A JP7634189A JPH02254787A JP H02254787 A JPH02254787 A JP H02254787A JP 7634189 A JP7634189 A JP 7634189A JP 7634189 A JP7634189 A JP 7634189A JP H02254787 A JPH02254787 A JP H02254787A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- pad
- solder
- electrodes
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title description 3
- 238000005476 soldering Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 26
- 238000000034 method Methods 0.000 abstract description 10
- 230000001939 inductive effect Effects 0.000 abstract 2
- 239000006071 cream Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子部品のうち、例えばセラミックスコンデ
ンサのような部品本体に電極をもつ受動部品であるチッ
プ部品の表面実装用基板への実装方法の改良に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a method for mounting a chip component, which is a passive component having an electrode on the component body, such as a ceramic capacitor, on a surface mounting board, among electronic components. Regarding the improvement of
（従来の技術）
近年の電子工業分野において特にエレクトロニクス製品
は一段と多様化、高機能化、小形化が進んでおりそれに
伴い電子部品もリード付部品から面実装タイプへの部品
へと移行している。(Conventional technology) In recent years, electronic products in the electronics industry in particular have become more diversified, more sophisticated, and more compact, and as a result, electronic components have also shifted from leaded components to surface-mounted components. .
特に高密度実装が要求される近年、小形微小、薄形のチ
ップ部品が用いられることが多くなってきている。従来
この部品を実装し接続するプリント基板上のパッドは、
チップ部品の電極部をおおうのに（取り付けるのに）充
分な面積をもっており、パッドにメタルマスクを用いて
クリームはんだを印刷し、その上にチップ部品の電極を
置き、クリームはんだを溶融するりフローソルダリング
を行っている。Particularly in recent years, where high-density packaging is required, small, minute, and thin chip components are increasingly being used. Conventionally, the pads on the printed circuit board where this component is mounted and connected are
It has enough area to cover (attach) the electrode part of the chip component, print cream solder on the pad using a metal mask, place the electrode of the chip component on top of it, and melt or flow the cream solder. Performing soldering.
高密度実装のため小形微小化してきたチップ部品をマニ
ュアルにて、プリント基板に載せるには非常に時間がか
かりマニュアルでは、生産性に対応しかねるため自動化
により部品を搭載して、生産性を向上させている。Manually mounting chip components, which have become smaller and smaller due to high-density mounting, on a printed circuit board is extremely time-consuming and manual methods cannot keep up with productivity, so parts are mounted using automation to improve productivity. I'm letting you do it.
（発明が解決しようとする課！ｆｉ）
しかしながら、生産性が上りチップ部品の採用数が多く
なればなる程、接続用バッド上にて発生するツームスト
ーン（Ｔｏｍｂ−ｓｔｏｎｅ ）現象即ち、チップ部品
が一対のパッドのいずれか片側にて立ち上り目視にて観
察できるほどのはんだ付不良が多く発生してきている。(The problem that the invention aims to solve!fi) However, as productivity increases and the number of chip components used increases, the tombstone phenomenon that occurs on the connection pads, that is, the chip components Many soldering defects have occurred on either side of a pair of pads that can be visually observed.
ツームスト−ン現象は次のようにして発生する。The tombstone phenomenon occurs as follows.
第２図は電子部品チップ１をその電極１′、同１″が実
装基板２のはんだ付け用のバッド３に乗るように配置し
予めバッド３に印刷されていたクリームはんだを加熱溶
融したときの図である。説明の便宜上右側のパッドにの
みはんだがある場合を示している。はんだが溶融して電
極１′に付着するとはんだの表面張力により電子部品チ
ップ１をバッド３の上で立ち上げようとするモーメント
Ｍ。Figure 2 shows the result when an electronic component chip 1 is placed so that its electrodes 1' and 1'' are placed on the soldering pad 3 of the mounting board 2, and the cream solder printed on the pad 3 is heated and melted. This figure shows the case where there is solder only on the pad on the right side for convenience of explanation. When the solder melts and adheres to the electrode 1', the surface tension of the solder causes the electronic component chip 1 to rise on the pad 3. The moment M.
が作用する。この他、立ち上りに抵抗する方向で、電子
部品の自重によるモーメントＭ１と表面張力によるモー
メントＭ２が作用する。従ってＭ、＞Ｍ、、＋Ｍ、にな
ると電子部品チップ１はバッド３の上で立ち上る。従っ
て、電子部品の自重が軽くなる程立ち上り易くなること
は明らかである。acts. In addition, a moment M1 due to the weight of the electronic component and a moment M2 due to surface tension act in a direction that resists the rise. Therefore, when M,>M, ,+M, the electronic component chip 1 stands up on the pad 3. Therefore, it is clear that the lighter the weight of the electronic component, the easier it is to stand up.
また、バッド３の位置Ｐより右側の寸法が大きくなる種
電極１′との間に付着するはんだの量が多くなるためモ
ーメントＭ、が大きくなる。Furthermore, since the amount of solder that adheres between the pad 3 and the seed electrode 1' whose size on the right side is larger than the position P increases, the moment M increases.
第３図は縦１．６龍、横０．８ ａｍのチップ部品を図
（ａ）のように配置して、左側バッドにのみクリームは
んだを印刷してパッドの寸法を種々変えてツームストー
ン現象の発生の有無を観測したデータを図（ｂ）に示し
たものである。配置は、両側バッド中心間の距離をチッ
プ部品の長辺（１，６ｍｍ ）と等しくとり、その方向
のバッド辺長Ｃを０．４ Ｌｌｌｒｍから１．４１−ま
で０．２ ａｍ刻みに変え、他の辺長ｄを０．８１又は
１．２關としたものを各４組、計４８組を同一基板上に
作成した。Figure 3 shows the tombstone effect by arranging chip parts with a length of 1.6 mm and a width of 0.8 mm as shown in Figure (a), printing cream solder only on the left pad, and varying the dimensions of the pads. Figure (b) shows the data obtained by observing the presence or absence of occurrence. The arrangement is such that the distance between the pad centers on both sides is equal to the long side (1.6 mm) of the chip component, and the pad side length C in that direction is changed from 0.4 Lllrm to 1.41- in 0.2 am increments. A total of 48 sets, 4 sets each having the other side lengths d of 0.81 or 1.2, were fabricated on the same substrate.
図（ｂ）はこうして作成された基板を加熱してはんだを
溶融した場合に、ツームストーン現象を呈したものの数
を各バッド辺長毎に計数し、その辺長を有するものの総
数に対する割合として示したものである０図（ｂ）はこ
のような実験を２回行ったデータをプロットしたもので
ある。Figure (b) shows the number of tombstones exhibiting the tombstone phenomenon when the board thus created is heated to melt the solder, counted for each side length, and expressed as a percentage of the total number of solders with that side length. Figure 0 (b) is a plot of data from two such experiments.
本データでは辺長Ｃが１．０ ＋ｕを越えると（バッド
が電極よりはみ出した部分の長さＣ′が０．５朋を越え
ると）ツームストーン現象が現れることを示している。This data shows that a tombstone phenomenon occurs when the side length C exceeds 1.0 +u (when the length C' of the portion of the pad protruding from the electrode exceeds 0.5 mm).
実際の実装方法においては、両方のパッドにはんだが印
刷されるので、本実験例のような高率で発生することは
ないが、リフローソルダリング時に両パッドに発生する
はんだの表面張力の不均衡により、電子部品チップの一
端が浮き上った状態ではんだ付けされるはんだ付け不良
が発生する。In the actual mounting method, solder is printed on both pads, so this does not occur at a high rate as in this experimental example, but the imbalance in the surface tension of the solder that occurs on both pads during reflow soldering. As a result, a soldering defect occurs in which the electronic component chip is soldered with one end raised.
本発明の目的は、上記従来技術の問題点に鑑みて、パッ
ドを電子部品の長手方向において電極先端からはみ出さ
ないように設は且つ幅方向には成る程度電極より広くし
てはんだの固着力を確保し、以てツームストーン現象が
発生しない電子部品の実装方法を提供することにある。In view of the problems of the prior art described above, an object of the present invention is to set the pad so that it does not protrude from the tip of the electrode in the longitudinal direction of the electronic component, and to make it wider than the electrode in the width direction so as to increase the solder adhesion. It is an object of the present invention to provide a method for mounting electronic components that ensures that the tombstone phenomenon does not occur.
（課題を解決するための手段）
本発明は、上記の目的を達成するために次の手段構成を
有する。(Means for Solving the Problems) The present invention has the following means configuration to achieve the above object.
即ち、本発明の電子部品の実装方法は、表面実装用基板
上に、実装すべき電子部品チップの両端の電極に対応さ
せて、はんだ付け用パッドを、電子部品の長手方向にお
いては電子部品チップ電極先端からはみ出さず且つ幅方
向では電子部品チップ電極幅より両側各１１以下の範囲
で広くなる位置および寸法関係で設け、このはんだ付け
用パッドに電子部品を上記位置関係で配置し加熱しては
んだ付けすることを特徴とする表面実装用基板への電子
部品の実装方法である。That is, in the electronic component mounting method of the present invention, soldering pads are placed on a surface mounting substrate in correspondence with the electrodes at both ends of the electronic component chip to be mounted, and in the longitudinal direction of the electronic component chip. The soldering pad is provided at a position and dimension that does not protrude from the tip of the electrode and is wider than the electronic component chip electrode width by 11 or less on each side in the width direction, and the electronic component is placed on this soldering pad in the above positional relationship and heated. This is a method for mounting electronic components on a surface mounting board, which is characterized by soldering.
（作 用） 以下、作用について述べる。(for production) The action will be described below.
上記構成から明らかなように、本発明方法においては、
実装基板上のパッドが電子部品チップの長手方向で電極
先端からはみ出していないのでこの部分にははんだが付
着しないから電子部品チップを引き起そうとする表面張
力（第２図のＭ３）が発生しない。As is clear from the above configuration, in the method of the present invention,
Since the pad on the mounting board does not protrude from the tip of the electrode in the longitudinal direction of the electronic component chip, no solder adheres to this part, so surface tension (M3 in Figure 2) that tries to pull up the electronic component chip does not occur. .
一方、を極の幅方向には電極の両側に１ ＋ｕの範囲内
で電極より広くしているのでこの部分にはんだが付着し
、固着される。１ｆｆｉ１１という寸法ははんだが溶融
しているときに電子部品チップが泳動せず且つはんだが
固まったときに充分な固着力を得るための実験によって
得た最適値である。On the other hand, in the width direction of the pole, since it is wider than the electrode within a range of 1 + u on both sides of the electrode, the solder adheres to this part and is fixed. The dimension 1ffi11 is an optimum value obtained through experiments to prevent electronic component chips from migrating while the solder is melting and to obtain sufficient adhesion force when the solder hardens.
（実 施 例）
以下、本発明の実施例について図面を参照して説明する
。(Embodiments) Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図は、本発明方法の実施例を示す図である。FIG. 1 is a diagram showing an embodiment of the method of the present invention.
図（ａ）は側面図であり、図（ｂ）は平面図である。パ
ッド３の外側端は電［１１’および同１″の先端に一致
させてあり、幅方向には図（ｂ）に示すように丁度Ｉ
Ｉｎずつ広くなるように設けられている。Figure (a) is a side view, and figure (b) is a plan view. The outer edge of the pad 3 is aligned with the tip of the electrodes [11' and 1'', and in the width direction, it is exactly I as shown in Figure (b).
It is provided so that it becomes wider by In.
こうすることにより、ツームストーン現象を生ザしぬる
、パッド電極間における溶融はんだの付着がなくなる。This eliminates the adhesion of molten solder between the pad electrodes, which causes the tombstone phenomenon.
パッドは、パッドとはんだとの固着力の要求下限を下が
らない範囲で電極先端より内側へ下げてもよい０幅方向
においてはある程度までは広くする程はんだの付着量が
多くなるので固化したときの固着力は大きくなるが電極
幅より２ ａｍ以上広くするとはんだの溶融時に電子部
品チップ１がパッド３，３の上を泳動して斜めになった
まま固着することがあるのでこれ以上幅を広げることは
好ましくない、結局両側で１ ＋ａ＋＊ずつが限度とい
うことになる。The pad may be lowered inward from the tip of the electrode as long as it does not lower the required lower limit of the adhesion force between the pad and the solder.In the width direction, the wider the pad is to a certain extent, the more the amount of solder will adhere to it. The adhesion force will increase, but if it is made wider than the electrode width by 2 am or more, the electronic component chip 1 may migrate over the pads 3 and 3 when the solder melts and become stuck obliquely, so do not increase the width any more. is undesirable; in the end, the limit is 1 + a + * on both sides.
（発明の効果）
以上説明したように、本発明方法では、実装基板上のは
んだ付層パッドを、電子部品の長手方向においては電子
部品チップの電極先端から出ないようにし、幅方向では
電極の幅よりも両側各々１−層以下の範囲で広くなるよ
うな位置および寸法関係で設け、このパッド上に上記位
置関係で電子部品チップを配置してはんだ付けするよう
にしたので、ツームストーン現象を起さず且つ所定の位
置で確実にはんだ付けすることができるという利点があ
る。(Effects of the Invention) As explained above, in the method of the present invention, the soldering layer pad on the mounting board is prevented from protruding from the tip of the electrode of the electronic component chip in the longitudinal direction of the electronic component, and is prevented from protruding from the tip of the electrode of the electronic component chip in the width direction. The pads are positioned and dimensioned so that they are wider than the width by one layer or less on each side, and electronic component chips are placed and soldered on these pads in the above positional relationship, thereby preventing the tombstone phenomenon. There is an advantage that soldering can be performed reliably at a predetermined position without causing the soldering to occur.
一第１図は本発明の実施例を示す図、第２図はツームス
トーン現象発生のメカニズム説明図、第３図はパッドの
電子部品長手方向の辺長に対するツームストーン発生率
の実験データを示すグラフである。
１・・・・・・電子部品チップ、 １′、１“・・・・
・・電極、２・・・・・・実装基板、 ３・・・・・・
パッド。
察 ／ 図Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is an explanatory diagram of the mechanism of occurrence of tombstone phenomenon, and Fig. 3 is experimental data of tombstone occurrence rate with respect to the side length of the electronic component in the longitudinal direction of the pad. It is a graph. 1...Electronic component chip, 1', 1"...
...electrode, 2...mounting board, 3...
pad. Inspection / Diagram
Claims (1)
端の電極に対応させて、はんだ付け用パッドを、電子部
品の長手方向においては電子部品チップ電極先端からは
み出さず且つ幅方向では電子部品チップ電極幅より両側
各１ｍｍ以下の範囲で広くなる位置および寸法関係で設
け、このはんだ付け用パッドに電子部品を上記位置関係
で配置し加熱してはんだ付けすることを特徴とする表面
実装用基板への電子部品の実装方法。Soldering pads are placed on the surface mounting board in correspondence with the electrodes at both ends of the electronic component chip to be mounted, so that the soldering pads do not protrude from the tip of the electronic component chip electrode in the longitudinal direction of the electronic component, and that the electronic component chip does not protrude from the tip of the electronic component chip electrode in the width direction. A surface mounting board characterized in that it is provided at a position and dimension that is wider than the chip electrode width by 1 mm or less on each side, and electronic components are placed on this soldering pad in the above positional relationship and soldered by heating. How to mount electronic components on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7634189A JPH02254787A (en) | 1989-03-28 | 1989-03-28 | Mounting of electronic component onto surface mounting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7634189A JPH02254787A (en) | 1989-03-28 | 1989-03-28 | Mounting of electronic component onto surface mounting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02254787A true JPH02254787A (en) | 1990-10-15 |
Family
ID=13602655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7634189A Pending JPH02254787A (en) | 1989-03-28 | 1989-03-28 | Mounting of electronic component onto surface mounting substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02254787A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1565046A1 (en) * | 2004-02-12 | 2005-08-17 | Kabushiki Kaisha Toyota Jidoshokki | Surface mounting structure for surface mounting an electronic component |
| JP2012248846A (en) * | 2011-05-26 | 2012-12-13 | Samsung Electro-Mechanics Co Ltd | Mounting structure of circuit board of multilayer ceramic capacitor |
| JP2015037182A (en) * | 2013-08-14 | 2015-02-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Mounting board for multilayer ceramic capacitor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6181695A (en) * | 1984-09-28 | 1986-04-25 | 八木アンテナ株式会社 | Printed circuit board |
| JPS63169793A (en) * | 1987-01-07 | 1988-07-13 | 株式会社村田製作所 | Structure of fitting chip parts onto printed board |
-
1989
- 1989-03-28 JP JP7634189A patent/JPH02254787A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6181695A (en) * | 1984-09-28 | 1986-04-25 | 八木アンテナ株式会社 | Printed circuit board |
| JPS63169793A (en) * | 1987-01-07 | 1988-07-13 | 株式会社村田製作所 | Structure of fitting chip parts onto printed board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1565046A1 (en) * | 2004-02-12 | 2005-08-17 | Kabushiki Kaisha Toyota Jidoshokki | Surface mounting structure for surface mounting an electronic component |
| US7186926B2 (en) | 2004-02-12 | 2007-03-06 | Kabushiki Kaisha Toyota Jidoshokki | Surface mounting structure for surface mounting an electronic component |
| JP2012248846A (en) * | 2011-05-26 | 2012-12-13 | Samsung Electro-Mechanics Co Ltd | Mounting structure of circuit board of multilayer ceramic capacitor |
| JP2015037182A (en) * | 2013-08-14 | 2015-02-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Mounting board for multilayer ceramic capacitor |
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