JPH02250388A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPH02250388A JPH02250388A JP7048689A JP7048689A JPH02250388A JP H02250388 A JPH02250388 A JP H02250388A JP 7048689 A JP7048689 A JP 7048689A JP 7048689 A JP7048689 A JP 7048689A JP H02250388 A JPH02250388 A JP H02250388A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed board
- board
- circuit board
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、集積回路に関し、特にフレキシブルプリント
板と絶縁回路基板とをはんだ接続する混成集積回路に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit, and particularly to a hybrid integrated circuit in which a flexible printed board and an insulated circuit board are connected by soldering.
従来の混成集積回路では、その構成部品であるフレキシ
ブルプリント板と絶縁回路基板との間を電気的に接続す
るためにコネクタが用いられていた。すなわちフレキシ
ブルプリント板及び絶縁回路基板の各々に、コネクタを
取り付け、このコネクタを介して電気的に接続していた
。In conventional hybrid integrated circuits, connectors have been used to electrically connect the flexible printed circuit board and the insulated circuit board that are its components. That is, a connector is attached to each of the flexible printed board and the insulated circuit board, and electrical connection is made via the connector.
従って従来の混成集積回路では、フレキシブルプリント
板と絶縁回路基板との間を電気的に接続するために高価
なコネクタを使用しており、製造コストが高くなるとい
う欠点があった。またコネクタを使用する接続構造では
、コネクタ部品を取り付けるため、絶縁基板にスルーホ
ールが必要となり、高密度パターンを形成することが困
難であるという欠点があった。Therefore, conventional hybrid integrated circuits use expensive connectors to electrically connect the flexible printed board and the insulated circuit board, resulting in high manufacturing costs. Furthermore, connection structures using connectors require through holes in the insulating substrate in order to attach connector parts, and have the disadvantage that it is difficult to form high-density patterns.
本発明の目的は、このような欠点を解消し、安価でかつ
高密度の混成集積回路を提供することにある。An object of the present invention is to eliminate such drawbacks and provide an inexpensive and high-density hybrid integrated circuit.
本発明は、複数個の絶縁回路基板間をフレキシブルプリ
ント板で電気的接続された混成集積回路において、
前記絶縁回路基板と前記フレキシブルプリント板とを共
に挟みこれらの導体部分と接触する先端部と、外部回路
に接続するための基部とを有するリード端子を備え、
前記先端部は前記導体部分にはんだ接続されたことを特
徴とする。The present invention provides a hybrid integrated circuit in which a plurality of insulated circuit boards are electrically connected by a flexible printed board, comprising: a tip portion that sandwiches the insulated circuit board and the flexible printed board together and contacts the conductor portions thereof; The lead terminal has a base for connection to an external circuit, and the tip is connected to the conductor portion by solder.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は、本発明の一実施例を示す図であり、（ａ）は
正面図、（ｂ）は切断線Ａ−Ａ’に沿った断面図である
。FIG. 1 is a diagram showing an embodiment of the present invention, in which (a) is a front view and (b) is a sectional view taken along the cutting line AA'.
この混成集積回路は、フレキシブルプリント板ｌと、絶
縁回路基板２と、リード端子３とから成り、フレキシブ
ルプリント板１と絶縁回路基板２とが電気的に接触し、
しかも外部回路と電気的に接続できるように複数のリー
ド端子３が設けられている。This hybrid integrated circuit consists of a flexible printed board 1, an insulated circuit board 2, and a lead terminal 3, and the flexible printed board 1 and the insulated circuit board 2 are in electrical contact with each other.
Moreover, a plurality of lead terminals 3 are provided so as to be electrically connected to an external circuit.
フレキシブルプリントＷ１．１は、例えば長方形の形状
をしたフレキシブルな薄いプリント板であり、長手方向
にＵ字形に折り曲げられている。このプリント板には、
片面等に回路設計に基づいて、回路が印刷してあり、リ
ード端子３との接触部分は導体になっている。The flexible print W1.1 is a flexible thin printed board having a rectangular shape, for example, and is bent into a U-shape in the longitudinal direction. This printed board has
A circuit is printed on one side based on the circuit design, and the contact portion with the lead terminal 3 is a conductor.
絶縁回路基板２は、複数の集積回路等のチップ部品４を
搭載し、絶縁物より成るガラスエポキシ等の樹脂基板の
上に、片面等に回路部品類を接続する電気配線を、回路
設計に基づいて印刷しである。この絶縁回路基板２とリ
ード端子３との接触部分は導体となっており、絶縁回路
基板２が複数枚、Ｕ字に折り曲げられたフレキシブルプ
リント板１の外面に、粘着テープ等で固定されている。The insulated circuit board 2 has a plurality of chip components 4 such as integrated circuits mounted thereon, and has electrical wiring for connecting the circuit components on one side of the resin substrate made of an insulating material such as glass epoxy based on the circuit design. It is printed. The contact portion between the insulated circuit board 2 and the lead terminal 3 is a conductor, and a plurality of insulated circuit boards 2 are fixed to the outer surface of the flexible printed board 1 bent into a U shape with adhesive tape or the like. .
リード端子３は、基部６と、先端部７と、接触部８とを
備え、フレキシブルプリント板１の導体部分と絶縁回路
基板２の導体部分とをはんだ接続部分５ではんだ接続さ
れ、電気的に接続されると共に、混成集積回路と外部回
路との電気的接続も行う。またこのリード端子は、例え
ばニッケル・金めつきから成る円柱状の細い棒の形をし
ており、その棒の一方が、二股に分かれ、開いた輪を形
成している。また、この開いた輪の２つの先端が、輪の
外側にわずかに湾曲し、この２つの湾曲した部分が、フ
レキシブルプリント板１の導体部分と絶縁回路基板２の
導体部分に接触し、電気的に接続している。The lead terminal 3 includes a base portion 6, a tip portion 7, and a contact portion 8, and the conductor portion of the flexible printed board 1 and the conductor portion of the insulated circuit board 2 are connected by solder at the solder connection portion 5, and electrically connected. At the same time, the hybrid integrated circuit is electrically connected to an external circuit. The lead terminal is in the form of a thin cylindrical rod made of, for example, nickel and gold plating, and one end of the rod is bifurcated to form an open ring. Also, the two tips of this open ring are slightly curved outwards, and these two curved parts contact the conductor part of the flexible printed board 1 and the conductor part of the insulated circuit board 2, and electrically is connected to.
基部６は、細く曲がりのない部分であり、混成集積回路
を外部回路に接続する部分である。接続するときは、プ
リント基板に加工された導体の穴に、この部分を差し込
み、はんだ付けすることにより、混成集積回路を外部回
路に接続すること力ζできる。The base portion 6 is a thin and uncurved portion that connects the hybrid integrated circuit to an external circuit. When connecting, the hybrid integrated circuit can be connected to an external circuit by inserting this part into a conductor hole processed on the printed circuit board and soldering it.
先端部７は、リード端子３の開いた輪の２つの先端が輪
の外側にわずかに湾曲した部分であり、この部分がフレ
キシブルプリント板１と絶縁回路基板２を挟んでいる。The tip portion 7 is a portion where the two tips of the open ring of the lead terminal 3 are slightly curved toward the outside of the ring, and this portion sandwiches the flexible printed board 1 and the insulated circuit board 2.
接触部８は、フレキシブルプリント板１と絶縁回路基板
２の導体部分と接触する部分であり、動かないように、
はんだによりはんだ接続されている。The contact portion 8 is a portion that comes into contact with the conductor portions of the flexible printed board 1 and the insulated circuit board 2, and is
Connected by solder.
混成集積回路を製造する場合は、まずフレキシブルプリ
ント板１及びｖＩＡ縁回路基板２の基板上に、回路設計
に基づいた回路を形成する。また絶縁回路基板２には、
集積回路等の複数チップ部品４を搭載し、はんだ付けに
より固定し接続する。絶縁回路基板を複数枚、Ｕ字形に
折り曲げられたフレキシブルプリント板１の外側側面に
並べて粘着テープで貼り合わせる。次に外部端子用のリ
ード端子３でフレキシブルプリント板１と絶縁回路基板
２を挾み、はんだによりはんだ接続部分５ではんだ付け
する。When manufacturing a hybrid integrated circuit, first, a circuit based on a circuit design is formed on the flexible printed board 1 and the vIA edge circuit board 2. In addition, the insulated circuit board 2 includes
A plurality of chip components 4 such as integrated circuits are mounted and fixed and connected by soldering. A plurality of insulated circuit boards are lined up on the outer side surface of a flexible printed board 1 bent into a U shape and pasted together with adhesive tape. Next, the flexible printed board 1 and the insulated circuit board 2 are sandwiched between lead terminals 3 for external terminals, and soldered at the solder connection portions 5 using solder.
本発明において使用されるフレキシブルプリント板は、
材料の種類により限定されないが、はんだ付は温度に強
いポリイミドが望ましい。また絶縁回路基板は、ガラス
エポキシのような樹脂基板、厚膜抵抗の形成されたアル
ミナ基板等の通常回路基板として使用されているもので
あり、材料により限定されない。The flexible printed board used in the present invention is
Although not limited by the type of material, it is desirable to use polyimide, which is resistant to temperature, for soldering. Further, the insulated circuit board is not limited by the material, and may be a resin board such as glass epoxy, an alumina board on which a thick film resistor is formed, etc., which are commonly used as circuit boards.
〔発明の効果〕
以上説明したように、本発明はリード端子を使用してフ
レキシブルプリント板と絶縁回路基板とをはんだ接続す
ることにより、高価なコネクタ部品を使用することなく
、安価でかつ高密度の混成集積回路が製造できる効果が
ある。[Effects of the Invention] As explained above, the present invention connects a flexible printed board and an insulated circuit board by soldering using lead terminals, thereby achieving an inexpensive and high-density connection without using expensive connector parts. This has the effect of making it possible to manufacture hybrid integrated circuits.
第１図は、本発明の一実施例による図であり、（ａ）は
正面図、（ｂ）は切断線Ａ−Ａ’に沿う断面図である。
１・・・・・フレキシブルプリント板
２・・・・・絶縁回路基板
３・ ・ ・ ・・リード端子
４・・・・・チップ部品
５・・・・・はんだ接続部分
６・・・・・基部
７・・・・・先端部
８・・・・・接触部
代理人 弁理士 岩 佐 義 幸FIG. 1 is a diagram according to an embodiment of the present invention, in which (a) is a front view and (b) is a sectional view taken along cutting line AA'. 1... Flexible printed board 2... Insulated circuit board 3... Lead terminal 4... Chip component 5... Solder connection part 6... Base 7...Tip 8...Contact Department Agent Patent Attorney Yoshiyuki Iwasa
Claims (1)
板で電気的接続された混成集積回路において、 前記絶縁回路基板と前記フレキシブルプリント板とを共
に挟みこれらの導体部分と接触する先端部と、外部回路
に接続するための基部とを有するリード端子を備え、 前記先端部は前記導体部分にはんだ接続されたことを特
徴とする混成集積回路。(1) In a hybrid integrated circuit in which a plurality of insulated circuit boards are electrically connected by a flexible printed board, a tip portion that sandwiches the insulated circuit board and the flexible printed board together and contacts these conductor parts, and an external 1. A hybrid integrated circuit, comprising: a lead terminal having a base portion for connection to a circuit, the tip portion being soldered to the conductor portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7048689A JPH02250388A (en) | 1989-03-24 | 1989-03-24 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7048689A JPH02250388A (en) | 1989-03-24 | 1989-03-24 | Hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02250388A true JPH02250388A (en) | 1990-10-08 |
Family
ID=13432900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7048689A Pending JPH02250388A (en) | 1989-03-24 | 1989-03-24 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02250388A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107855U (en) * | 1991-02-27 | 1992-09-17 | 三洋電機株式会社 | hybrid integrated circuit |
| US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
| US5947753A (en) * | 1997-01-13 | 1999-09-07 | Amphenol Corporation | High density connector arrangement for a circuit board module |
| EP1422717A1 (en) * | 2002-11-21 | 2004-05-26 | Infineon Technologies AG | Memory system and memory subsystem |
-
1989
- 1989-03-24 JP JP7048689A patent/JPH02250388A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107855U (en) * | 1991-02-27 | 1992-09-17 | 三洋電機株式会社 | hybrid integrated circuit |
| US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
| US5947753A (en) * | 1997-01-13 | 1999-09-07 | Amphenol Corporation | High density connector arrangement for a circuit board module |
| EP1422717A1 (en) * | 2002-11-21 | 2004-05-26 | Infineon Technologies AG | Memory system and memory subsystem |
| US7035116B2 (en) | 2002-11-21 | 2006-04-25 | Infineon Technologies Ag | Memory system and memory subsystem |
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