JPH01296700A - Semiconductor packaging device - Google Patents

Abstract

PURPOSE:To improve a semiconductor chip in productivity by a method wherein the positioning of an outer shape of the chip is made through a chip positioning means and a pattern is positioned through a table correcting means. CONSTITUTION:A semiconductor chip packaging device, which transfers a semiconductor chip 3 to an XY table 2 that holds a wiring board 1 and joins the semiconductor chip 3 to the wiring board 1, is provided, where a chip positioning means 5 which makes the positioning of the outer shape of the semiconductor chip 3 and a table correcting means 6 which corrects the position of the XY table recognizing a prescribed pattern in the semiconductor chip 3 are provided to a semiconductor chip transferring process. And, a rough adjustment is made by the chip positioning means 5 and a fine adjustment is made by the table correcting means 6. Therefore, the pattern in the semiconductor chip 3 is correctly positioned toward the wiring board 1. By these processes, the adjustment of a mounting position of a semiconductor chip 3 packaged wiring board 1 can be eliminated, so that a semiconductor chip device can be improved in productivity.

Description

[Detailed description of the invention]

[Industrial Application Field 1] The present invention relates to a semiconductor chip mounting device e+ for mounting semiconductor chips such as diodes, transistors, etc. on a wiring board.
It is something that will last for a long time. [Conventional Techniques] Conventionally, this type of semiconductor chip mounting equipment, which mounts semiconductor chips such as diodes, transistors, and ■C, on wiring boards, positions the semiconductor chips cut out from the wafer based on the outer shape of the semiconductor chips and then mounts them on the wiring board. was implemented and bonded. [Problems to be Solved by the Invention] However, in the above-mentioned conventional example, if the process of cutting out semiconductor chips from a wafer has poor precision, the relative position of the pattern of the semiconductor chip with respect to the external shape of the semiconductor chip may shift. If the semiconductor chip is positioned based on the external shape of the semiconductor chip and mounted on the wiring board, the pattern of the semiconductor chip may not be positioned in the designated position when the wiring board is placed in the case, so the semiconductor chip may not be mounted properly. The mounting position of the wiring board! There was a problem in that productivity decreased and costs increased due to the need for adjustments. That is, when a semiconductor chip is bonded to a wiring board and this wiring board is placed in a predetermined position in a case, after bonding the semiconductor chip to the wiring board, the mounting position of the wiring board to the case is adjusted and the semiconductor This necessitates a mounting position adjustment step for aligning the chip pattern to a predetermined position, resulting in problems such as poor productivity and high adjustment costs. The present invention has been made in view of the above points, and its purpose is to improve productivity without requiring adjustment of the mounting position of a wiring board on which a semiconductor chip is mounted, and to improve productivity. An object of the present invention is to provide a semiconductor chip mounting apparatus that can reduce rR cost. [Means for Solving the Problems] A semiconductor chip mounting apparatus according to claim 1 of the present invention transfers a semiconductor chip to an XY table that holds a wiring board, and bonds the semiconductor chip to the wiring board. In the mounting apparatus, chip positioning means for positioning the outer shape of the semiconductor chip and table correction means for correcting the position of the XY table by recognizing a predetermined pattern within the semiconductor chip are provided in the semiconductor chip transfer process. Further, a semiconductor chip mounting apparatus according to claim 2 is a semiconductor chip mounting apparatus in which a semiconductor chip is transferred to an XY table that holds a wiring board, and the semiconductor chip is bonded to a predetermined position on the wiring board. A chip positioning means for positioning the outer shape, and a first chip positioning means mounted on the wiring board.
recognizes a predetermined pattern in the second semiconductor chip, and also recognizes a predetermined pattern in the second semiconductor chip positioned by the chip positioning means, and positions the XY table so that the relative positions of both patterns are in a predetermined relationship. A table correction means for correction is provided in the semiconductor chip transfer process. [Function 1] The present invention is configured as described above, and in the first aspect, in the semiconductor chip transfer step of transferring the semiconductor chip to the XY table that holds the wiring board, In addition to the chip positioning means for positioning the outer shape, table correction means is provided for recognizing a predetermined pattern within the semiconductor chip and correcting the position of the XY table.The chip positioning means positions the outer shape, and the table correction means Since the pattern is positioned at the position, the pattern inside the semiconductor chip is accurately positioned with respect to the wiring board, and the mounting position of the wiring board on which the semiconductor chip is mounted is determined. ! Productivity can be improved without the need for maintenance, and sl! It is now possible to reduce the cost of maintenance. Further, in the second aspect, the predetermined pattern in the first semiconductor chip mounted on the wiring board and the predetermined pattern in the second semiconductor chip positioned by the chip positioning means are respectively recognized. However, a table correction means for correcting the position of the XY table so that the relative positions of both patterns have a predetermined relationship is provided in the semiconductor chip transfer process, and the relative positions of patterns in multiple semiconductor chips can be accurately positioned. It can then be mounted on a wiring board.

[Embodiment 1] Figures 1 to 6 show an embodiment of the present invention, in which a semiconductor chip 3 is transferred to an XY table 2 that holds a wiring board 1, and the semiconductor chip 3 is placed in a predetermined position on the wiring board 1. In a semiconductor chip mounting apparatus in which the semiconductor chip 3 is bonded to a position using a bonding device fi4, a chip positioning means 5 for positioning the outer shape of the semiconductor chip 3 and a predetermined pattern Px that is easy to identify in the pattern P in the semiconductor chip 3 are recognized and placed. A table correction means 6 for correcting the position of the XY table 2 so that the pattern is placed at a predetermined position on the wiring board 1 is provided in the semiconductor chip transfer process. In the embodiment, the XY table 2 holds the wiring board 1 (for example, holds it by suction) and [
It can be moved laterally. The bonding device 4 holds the semiconductor chip 3 using a vacuum chuck method, and is capable of reciprocating horizontally between the upper positioning position and the upper bonding position, and is also vertically movable, and is capable of moving vertically between the bonding position (bonding head 4
Lower limit of a! ! At the same time, the semiconductor chip 3 is bonded to the wiring board 1 by applying ultrasonic waves or heat to the bonding head 4a. Further, the bonding head 4a that holds the semiconductor chip 3 is formed with a so-called collet-type suction holding part having a pyramid-shaped recess, so that the outer shape of the semiconductor chip 3 can be held with high precision. The chip positioning means 5 is operated by a drive device (not shown). 4. The two pairs of opposing positioning claws 5a that are driven closed and the mounted semiconductor chip 3 are connected to a vacuum device! ! (not shown), and the semiconductor chip 3 is moved by driving the positioning claws 5 & towards the center (moves against the suction and holding force). ) to position the outer shape at a predetermined position. The table correction means 6 includes an imaging device f! for photographing a predetermined pattern Px of the semiconductor chip 3. 16 m, a deviation measuring means (not shown) for detecting the deviation of the imaged predetermined pattern from the reference position, and driving the XY table 2 based on the output of the deviation measuring means to correct the position of the XY table 2. A table driving means (not shown) is provided for driving the table. Note that the bonding device 4 has a predetermined pattern P for the outer shape.
When the reference semiconductor chip 3 with x formed at the regular position is positioned by the chip positioning means 5, the reference semiconductor chip 3 is placed on the wiring board 1 placed on the XY table 2.
The operation is controlled so that it can be joined accurately at a predetermined position. The operation of the embodiment will be described below. Now, wafer W
The semiconductor chip 3 cut out from the semiconductor chip 3 is placed on the suction holding table 5b of the positioning means 5 by an appropriate transfer means, and its outer shape is positioned at a predetermined position by the closing operation of the positioning claw 5a. Although the positioning claws 5& perform a closing operation after the completion of positioning, since the semiconductor chip 3 is suction-held by the suction-holding table 5b, the position of the semiconductor chip 3 once positioned is maintained. Imaging device in this state! !
6a reads the predetermined pattern Px of the semiconductor chip 3, and the reference position (semiconductor chip 3 serving as a reference) is read.
The position fa of the predetermined pattern P× when positioning is
) is detected. In this embodiment, the predetermined pattern Px is used as a chip electrode, and as shown in FIG.
Imaging device so that it is in the center of the screen! ! 6a is set, the external shape is the predetermined pattern P for the external shape of the semiconductor chip 3 positioned by the positioning means 5.
The deviation of x is the deviation amount (AX, Ay) of the chip electrode image Px° from the center of the screen, as shown in (a) of FIG. 6(b).
It will be detected as follows. This deviation fi(ax,
When Ay) is detected by the deviation measuring means, the table driving means drives the XY table 2 so as to correct the amount of deviation. In this state, the positioned semiconductor chip 3 is picked up by the bonding device 4 and transferred onto the XY table 2, and the bonding head 4a is lowered to bond the semiconductor chip 3 to the wiring board 1. At this time, the coordinates of the XY table 2 on which the wiring board 1 is placed are:
Since the deviation of the predetermined pattern Px is corrected based on the deviation fi (ax, Jy), the semiconductor chip 3 bonded to the wiring board 1 is mounted with the predetermined pattern Px accurately positioned at the predetermined position of the wiring board 1. That will happen. Figure 6 (a
) (b) (1-) shows a state in which a semiconductor chip 3 whose pattern is shifted from the outer shape (in the illustrated example, shifted to the upper right) is mounted on the wiring board 1. , Llx
Even if the coordinates of the XY table 2 are corrected so that '-1=L, x+, L+3''+ΔF=L2F'' and the semiconductor chip 3 with pattern deviation is mounted,
L+x=L2X, L+F=L231, and the semiconductor chip 3 is mounted with the predetermined pattern Px positioned at a predetermined position on the wiring board 1. Therefore, if this wiring board 1 is installed in a predetermined position of the case, the center of the p (turn) of the semiconductor chip 3 will always be positioned at the same position with respect to the case.
Wiring board] mounting position W! 4-alignment work becomes unnecessary. FIGS. 7 to 7 show other embodiments, in which a semiconductor chip mounting apparatus similar to the above embodiment recognizes a predetermined pattern Px in a first semiconductor chip 3a mounted on a wiring board 1, and Table correction means that recognizes a predetermined pattern Px in the second semiconductor chip 3b positioned by the chip positioning means 5 and corrects the position of the XY table 2 so that the relative positions of both patterns Px have a predetermined relationship. 6 is provided in the semiconductor chip transfer process, and the other h1 configurations and operations are substantially the same as in the direct mounting embodiment. The operation of the embodiment will be described below. 9 and 10 are process diagrams and 70-charts showing the operation of this embodiment. Now, the first semiconductor chip 3a to be mounted on the wiring board 1 first is positioned by the positioning means 5, It is bonded to a predetermined position on the wiring board 1 by the bonding device 4 . The predetermined pattern P of this first semiconductor chip 3a is read by the imaging device 6a, and the deviation amount A from the case where the reference semiconductor chip 3 is mounted on the wiring board 1
(I!IXa% 11Iya) is detected by the deviation measuring means. On the other hand, the second semiconductor chip 3b is positioned by the chip positioning means 5, and in this positioned state, a deviation jlB (Δ
ayb) is detected. The predetermined pattern Px of the amphiphilic conductor chips 3 a and 3 b detected as described above
The amount of correction of the coordinates of the XY table 2 is calculated based on the deviation amounts A and B, the coordinates of the XY table 2 are corrected, and the semiconductor chip 3b is bonded to a predetermined position by the bonding device 4. Here, in this embodiment, a predetermined pattern Px in the first semiconductor chip 3a mounted on the wiring board 1 and a predetermined pattern in the second semiconductor chip 3b positioned by the chip positioning means 5 are used. Px
A table correction means 6 is provided in the semiconductor chip transfer process to recognize the respective patterns Px+Px and correct the position of the XY table 2 so that the relative positions of both patterns Px+Px have a predetermined relationship. Qax in Figure 0, which allows the relative position of the pattern in 3b to be accurately positioned and mounted on the wiring board 1. Q, ay are the bonding positions of the semiconductor chip 3a, αp
xe (Lpy is the predetermined pattern recognition position of the semiconductor chip 3a, L x, L y are the semiconductor chip 3 at 3 b
The dimension between αbx*QbF is the bonding position of the reference semiconductor chip 3b (!! (pattern deviation correction surface), Qbx'
wQbV' is the bonding position fi (after pattern deviation correction) of the semiconductor chip 3b with pattern deviation, and three or more semiconductor chips 3a, 3b...
. When mounting the semiconductor chips 3a one after another, the above-described operations are repeated to mount each semiconductor chip 3a. It goes without saying that the relative positions of 3b... can be sequentially and accurately determined. [Effects of the Invention] The present invention is configured as described above, and in addition to chip positioning means for positioning the external shape of the semiconductor chip in the semiconductor chip transfer process of transferring the semiconductor chip to the XY table that holds the wiring board. A table correction means is provided to recognize a predetermined pattern within the semiconductor chip and correct the position of the XY table.The chip positioning means performs coarse adjustment, and the table correction means performs fine adjustment. As a result, the pattern inside the semiconductor chip is accurately positioned with respect to the wiring board, and there is no need to adjust the mounting position of the wiring board on which the semiconductor chip is mounted, improving productivity and reducing adjustment costs. The effect is that it can be done. Further, in the second aspect, the predetermined pattern in the first semiconductor chip mounted on the wiring board and the predetermined pattern in the second semiconductor chip positioned by the chip positioning means are respectively recognized. However, table correction means for correcting the position of the XY table so that the relative positions of both patterns have a predetermined relationship is provided in the semiconductor chip transfer process.
This has the advantage that it can be mounted on a wiring board with precise positioning.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing the schematic configuration of one embodiment of the present invention;
The figure is a sectional view of the main part of the same as the above, FIG. 3 is a perspective view of the main part of the same as the above, FIG. 4 is a perspective view of the main part of the same as the above, FIG. b) is a top view of the main parts of the same as above, ! @6
Figures (a) and (b) are explanatory views of the same operation as above, Figure 7 is a perspective view showing a schematic configuration of another embodiment, Figures 8 and 9 are explanatory views of the same operation as above, and Figure 10 is an explanatory view of the same as above. 70 - Chart. 1 is a wiring board, 2 is an XY table, 3.3a and 3b are semiconductor chips, 4 is a bonding device, 5 is a positioning means, and 6 is a table correction means. Agent Patent Attorney Ishi 1) 艮 712 Figure 3 ＼ Figure 4 1! To: 7 Diagram 6

Claims (2)

[Claims] (1) In a semiconductor chip mounting apparatus that transfers a semiconductor chip to an XY table that holds a wiring board and joins the semiconductor chip to a predetermined position on the wiring board, a chip positioning means that positions the outer shape of the semiconductor chip; Semiconductor chip mounting characterized in that a semiconductor chip transfer process is provided with table correction means for recognizing a predetermined pattern within the semiconductor chip and correcting the position of the XY table so that the pattern is placed at a predetermined position on the wiring board. Device. (2) in a semiconductor chip mounting device that transfers a semiconductor chip to an XY table that holds a wiring board and joins the semiconductor chip to a predetermined position on the wiring board, chip positioning means that positions the outer shape of the semiconductor chip; Recognizing a predetermined pattern in a first semiconductor chip mounted on a wiring board and also recognizing a predetermined pattern in a second semiconductor chip positioned by a chip positioning means, so that the relative positions of both patterns are brought into a predetermined relationship. A semiconductor chip mounting apparatus characterized in that a table correction means for correcting the position of an XY table so that the position of the XY table is corrected is provided in a semiconductor chip transfer process.