JPH01150464A - Vapor phase soldering device - Google Patents
Vapor phase soldering deviceInfo
- Publication number
- JPH01150464A JPH01150464A JP30931687A JP30931687A JPH01150464A JP H01150464 A JPH01150464 A JP H01150464A JP 30931687 A JP30931687 A JP 30931687A JP 30931687 A JP30931687 A JP 30931687A JP H01150464 A JPH01150464 A JP H01150464A
- Authority
- JP
- Japan
- Prior art keywords
- mist
- vapor
- liquid
- suction port
- partition plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 18
- 239000012808 vapor phase Substances 0.000 title claims description 12
- 239000003595 mist Substances 0.000 claims abstract description 66
- 239000007788 liquid Substances 0.000 claims abstract description 61
- 238000005192 partition Methods 0.000 claims abstract description 28
- 238000011084 recovery Methods 0.000 claims abstract description 13
- 238000009834 vaporization Methods 0.000 claims description 6
- 230000008016 vaporization Effects 0.000 claims description 6
- 239000012442 inert solvent Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 230000000630 rising effect Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はベーパの気化潜熱を利用してリフローはんだ付
けを行う気相式はんだ付け装置である。[Detailed Description of the Invention] [Object of the Invention] (Industrial Field of Application) The present invention is a vapor phase soldering device that performs reflow soldering using the latent heat of vaporization of vapor.
（従来の技術）
従来、第４図に示されるように、蒸気槽１０の下部に形
成された液槽部１１に液１２が溜められ、この液１２が
ヒータ１３によって加熱蒸発されて蒸気槽１０の内部に
ベーパ１４が形成され、このベーパ１４の気化潜熱を利
用してベーパ中に搬入されたワークＷがリフローはんだ
付けされる気相式はんだ付け装置がある。(Prior Art) Conventionally, as shown in FIG. 4, a liquid 12 is stored in a liquid tank section 11 formed at the lower part of a steam tank 10, and this liquid 12 is heated and evaporated by a heater 13, and the liquid 12 is heated and evaporated by a heater 13. There is a vapor phase soldering device in which a vapor 14 is formed inside the vapor phase soldering device, and a workpiece W carried into the vapor is reflow soldered using the latent heat of vaporization of the vapor 14.
この気相式はんだ付け装置は、前記ベーパ１４の気化潜
熱を利用してリフローはんだ付けを行う蒸気槽１０のワ
ーク搬入側およびワーク搬出側に、ワーク搬送コンベヤ
１５に沿ってダクト１６．１７が設けられ、このダクト
１６．１７の内部に、ベーパ１４およびベーパの周囲に
漂うミストの外部への漏出を防止するための冷却器１８
が設けられ、このワーク搬入側およびワーク搬出側のダ
クト１６．１７の開口端部にミストをダクト内から回収
するミスト吸引口１９が設けられている。In this vapor phase soldering apparatus, ducts 16 and 17 are provided along a workpiece conveyor 15 on the workpiece loading side and workpiece unloading side of a steam tank 10 that performs reflow soldering using the latent heat of vaporization of the vapor 14. A cooler 18 is provided inside the duct 16, 17 to prevent the vapor 14 and the mist floating around the vapor from leaking to the outside.
A mist suction port 19 is provided at the open ends of the ducts 16 and 17 on the workpiece loading side and the workpiece loading side to collect mist from inside the duct.
前記ミスト吸引口１９は、図示されないミスト回収ユニ
ットに連通され、このミスト回収ユニットにて、ベーパ
よりも粒子の大きなミストが、物理的な衝突作用および
冷却による凝縮作用を受けて液化され、このミスト回収
ユニットからポンプによって液が前記液槽部１１に戻さ
れる。The mist suction port 19 communicates with a mist collection unit (not shown), in which the mist, which has larger particles than the vapor, is liquefied by physical collision and condensation due to cooling. The liquid is returned to the liquid tank section 11 from the recovery unit by a pump.
（発明が解決しようとする問題点）
しかし、従来は、ミスト回収ユニットの能力を超えるほ
どの多量のミストが前記ミスト吸引口１９からミスト回
収ユニットに吸引され、ミスト回収ユニットが過負荷状
態となって機能停止するおそれもあった。(Problem to be Solved by the Invention) However, conventionally, a large amount of mist exceeding the capacity of the mist collection unit is sucked into the mist collection unit from the mist suction port 19, causing the mist collection unit to be overloaded. There was also a risk that the system would stop functioning.
これは、前記冷却器１８を乗越えてミスト吸引口１９に
達するミスト吊が多いためで、従来のダクト構造では、
冷却器１８の能力にも限界がある。This is because there is a lot of mist hanging over the cooler 18 and reaching the mist suction port 19, and in the conventional duct structure,
The capacity of the cooler 18 also has a limit.
本発明の目的は、ダクト内構造を改良することにより、
ミスト吸引口に流れ込むミスト予を激減させ、ミスト回
収ユニットに過大な負担をかけないようにすることにあ
る。The purpose of the present invention is to improve the internal structure of the duct,
The purpose is to drastically reduce the amount of mist flowing into the mist suction port and to avoid placing an excessive burden on the mist collection unit.
（問題点を解決するための手段）
本発明は、ベーパ２６の気化潜熱を利用してリフローは
んだ付けを行う蒸気槽２１の下部に液槽部２２が設けら
れ、この液槽部２２のワーク搬入側およびワーク搬出側
にワーク搬送経路３１に沿ってダクト３２．３３が設け
られ、このダクト３２．３３の内部に、ベーパ２６およ
びベーパの周囲に漂うミストの外部への漏出を防止する
ための冷却器３４が設けられ、このワーク搬入側および
ワーク搬出側のダクト３２゜３３の開口端部にミストを
ダクト内から回収するミスト吸引口３５が設けられた気
相式はんだ付け装置において、ワーク搬送経路３１の下
側に位置する冷却器３４の下側に、前記液槽部２２に向
って下降傾斜する仕切板５１が設けられ、この仕切板５
１のミスト吸引口側端とミスト吸引口３５の周囲に設け
られた障害板５３との間に開口部５４が設けられ、この
開口部５４が前記仕切板５１の下側に形成された下降傾
斜状の凝縮液回収間隙５６を経て前記液槽部２２に連通
されたものである。(Means for Solving the Problems) The present invention includes a liquid tank section 22 provided at the lower part of a steam tank 21 that performs reflow soldering using the latent heat of vaporization of vapor 26, and a workpiece in the liquid tank section 22. A duct 32.33 is provided along the workpiece conveyance path 31 on the side and the workpiece unloading side, and inside this duct 32.33, a cooling device is installed to prevent the vapor 26 and the mist floating around the vapor from leaking to the outside. In a vapor phase soldering apparatus, a workpiece transport path is provided with a mist suction port 35 for collecting mist from inside the duct at the open ends of the ducts 32 and 33 on the workpiece carry-in side and workpiece carry-out side. A partition plate 51 that slopes downward toward the liquid tank section 22 is provided below the cooler 34 located below the cooler 31 .
An opening 54 is provided between the mist suction port side end of No. 1 and an obstruction plate 53 provided around the mist suction port 35, and this opening 54 has a downward slope formed on the lower side of the partition plate 51. It is connected to the liquid tank section 22 through a condensate collection gap 56 having a shape of .
（作用）
本発明は、多くのベーパ２６およびミストが冷却器３４
によって凝縮され、生じた液が仕切板５１の上面を流れ
落ちて液槽部２２に回収されるが、一部のミストが仕切
板５１のミスト吸引口側端から開口部５４に至る。その
ミストの多くは、ミスト吸引口３５に向って移動する段
階で障害板５３に当って液化し、凝縮液回収間隙５６を
経て液槽部２２に流れ落ちる。(Function) According to the present invention, much of the vapor 26 and mist are transferred to the cooler 34.
The resulting liquid flows down the upper surface of the partition plate 51 and is collected in the liquid tank 22, but some of the mist reaches the opening 54 from the end of the partition plate 51 on the side of the mist suction port. Most of the mist hits the obstacle plate 53 and liquefies while moving toward the mist suction port 35, and flows down into the liquid tank section 22 through the condensate collection gap 56.
（実施例）
以下、本発明を、第１図乃至第３図に示される実施例を
参照して詳細に説明する。(Example) Hereinafter, the present invention will be explained in detail with reference to the example shown in FIGS. 1 to 3.
第１図に示されるように、蒸気＋！！２１の下部に液槽
部２２が形成され、この液槽部２２に液（フッ素系不活
性溶剤、商品名フロリナート）２３が溜められ、この液
２３は、液槽部２２の外側に設けられたヒータ２４によ
って、伝熱セメント２５等を介し間接的に加熱され、蒸
発される。これにより、蒸気槽２１の内部に比重の大き
なベーパ（飽和蒸気相）２６が形成される。そして、こ
のベーパ２６の気化潜熱を利用して、ベーパ中に搬入さ
れたワークＷがリフ０−はんだ付けされる。As shown in Figure 1, Steam+! ! A liquid tank part 22 is formed at the lower part of the liquid tank part 21, and a liquid (fluorinated inert solvent, trade name Fluorinert) 23 is stored in this liquid tank part 22. It is indirectly heated by the heater 24 via the heat transfer cement 25 and the like, and is evaporated. As a result, vapor (saturated vapor phase) 26 with a large specific gravity is formed inside the steam tank 21 . Then, by utilizing the latent heat of vaporization of the vapor 26, the workpiece W carried into the vapor is subjected to ref-0-soldering.
前記液槽部２２のワーク搬入側およびワーク搬出側には
、ワーク搬送経路３１に沿ってダクト３２゜３３が設け
られ、このダクト３２．３３の内部であってワーク搬送
経路３１の下側に、ベーパ２６およびベーパの周囲に漂
うミストの外部への漏出を防止するための冷却器３４が
設けられ、さらに、ワーク搬入側およびワーク搬出側の
ダクト３２．３３の開目端部にミストをダクト内から回
収するミスト吸引口３５が設けられている。ワーク搬入
側のダクト３２内では、ワーク搬送経路３１に沿ってそ
の上側および下側にワークＷのプリヒート温度の降下を
防止するための保温ヒータ３６が設けられ、また、ワー
ク搬出側のダクト３３内では、ワーク搬送経路３１に沿
ってその上側にも冷却器３７が設けられている。第２図
および第３図に示されるワーク搬送用のコンペヤ３８は
、一対のガイドレールに沿って一対のエンドレスチェン
の移動が案内されるもので、一対のチェン間にワーク（
プリント配線基板）Ｗが掛渡されて搬送される。Ducts 32 and 33 are provided along the workpiece conveyance path 31 on the workpiece loading side and workpiece unloading side of the liquid tank section 22, and inside the ducts 32 and 33 and below the workpiece conveyance path 31, A cooler 34 is provided to prevent the vapor 26 and the mist floating around the vapor from leaking to the outside, and a cooler 34 is provided to prevent the vapor 26 and the mist floating around the vapor from leaking to the outside. A mist suction port 35 is provided to collect mist from the air. Inside the duct 32 on the workpiece carry-in side, a heat-retaining heater 36 is provided above and below the workpiece transport path 31 to prevent the preheating temperature of the workpiece W from dropping. In this case, a cooler 37 is also provided along and above the workpiece conveyance path 31. The work conveyor 38 shown in FIGS. 2 and 3 has a pair of endless chains guided along a pair of guide rails, and the workpiece (
Printed wiring board) W is hung and transported.
このような気相式はんだ付け装置において、第１図およ
び第２図に示されるように、前記液槽部２２からワーク
搬送経路３１の近傍まで、ワークＷの外側からワークの
上側にベーパを吹上げるためのベーパ吹出ノズル４１が
設けられている。このノズル４１は、全体的には外側の
角筒と内側の角筒とを同心的に配置することによって形
成されている。In such a vapor phase soldering apparatus, as shown in FIGS. 1 and 2, vapor is blown from the outside of the workpiece W to the upper side of the workpiece from the liquid tank section 22 to the vicinity of the workpiece conveyance path 31. A vapor blowing nozzle 41 is provided for raising the vapor. The nozzle 41 is generally formed by concentrically arranging an outer rectangular tube and an inner rectangular tube.
さらに、ノズル４１の下部開口４２は内周側に拡大され
ているから、多聞の液から蒸発されたベーパがノズル内
に集められる。また、ノズル４１の先端開口４３は、内
側に向けて突出されるとともに、上方に向って開口幅が
徐々に狭まるように絞られ、上側から全体的に見るとス
リット状吹出口が正方形の４辺を形作っている。Further, since the lower opening 42 of the nozzle 41 is enlarged toward the inner circumference, vapor evaporated from the liquid is collected in the nozzle. In addition, the tip opening 43 of the nozzle 41 projects inward and is narrowed so that the opening width gradually narrows upward, and when viewed from above as a whole, the slit-shaped outlet is formed on four sides of a square. is forming.
さらに、このノズル４１の外周部に間隙４４を介して隔
壁筒４５が設けられ、この隔壁筒４５によって、前記ダ
クト３２．３３の底面を流れ落ちて液槽部２２に戻され
る低温の液を予熱するためのスペース４６を確保する。Furthermore, a partition cylinder 45 is provided on the outer circumference of this nozzle 41 with a gap 44 in between, and the partition cylinder 45 preheats the low-temperature liquid flowing down the bottom surface of the duct 32, 33 and returned to the liquid tank section 22. A space 46 is secured for the purpose.
このスペース４６で予熱され高温となった液は、隔壁筒
４５の下端通液溝４７およびノズル４１の下端通液溝４
８を経てノズル４１の下部開口４２さらには液槽部２２
の中央に戻される。The liquid preheated to a high temperature in this space 46 is transferred to the lower end liquid passage groove 47 of the partition tube 45 and the lower end liquid passage groove 4 of the nozzle 41.
8 to the lower opening 42 of the nozzle 41 and further to the liquid tank section 22.
returned to the center.
さらに、第１図および第３図に示されるように、ワーク
搬送経路３１の下側に位置する冷却２！ｉ３４の下側に
、前記液槽部２２に向って下降傾斜する仕切板５１が設
けられ、この仕切板５１のミスト吸引口側端に、上方に
突出されたミスト流出阻止板部５２が一体に設けられて
いる。また、下側のミスト吸引口３５の周囲には円筒形
の障害板５３が設けられ、前記仕切板５１のミスト流出
阻止板部５２とこの障害板５３との間に開口部５４が設
けられている。この開口部５４には冷却器５５が設けら
れている。さらに、この開口部５４が、前記仕切板５１
の下側に形成された下降傾斜状の凝縮液回収間隙５６を
経て前記液槽部２２に連通されている。前記回収間隙５
６と液槽部２２との間には、前記仕切板５１の液槽側端
から下方に突出されたベーパ立上げ板部５７が介在され
、この立上げ板部５７の下側に戻り液通孔５８が設けら
れている。さらに、この仕切板５１の液槽側端上には、
戻り液通孔６１を介してベーパ立上げ板６２が設けられ
ている。そして、前記立上げ板部５７およびこの立上げ
板６２によって、ベーパ２６のレベルがワーク搬送経路
３１より上側に上昇されるとともに、ベーパ２６のダク
ト側への流出が極力防止されている。Furthermore, as shown in FIGS. 1 and 3, cooling 2! is located below the workpiece conveyance path 31! A partition plate 51 that slopes downward toward the liquid tank section 22 is provided on the lower side of the i34, and a mist outflow prevention plate section 52 that projects upward is integrally formed at the end of the partition plate 51 on the side of the mist suction port. It is provided. Further, a cylindrical obstruction plate 53 is provided around the lower mist suction port 35, and an opening 54 is provided between the mist outflow prevention plate portion 52 of the partition plate 51 and this obstruction plate 53. There is. A cooler 55 is provided in this opening 54 . Furthermore, this opening 54 is connected to the partition plate 51.
It communicates with the liquid tank section 22 through a downwardly sloping condensate recovery gap 56 formed on the lower side. The collection gap 5
6 and the liquid tank part 22, a vapor rising plate part 57 protruding downward from the liquid tank side end of the partition plate 51 is interposed. A hole 58 is provided. Furthermore, on the liquid tank side end of this partition plate 51,
A vapor rising plate 62 is provided through the return liquid passage hole 61. The rising plate portion 57 and the rising plate 62 raise the level of the vapor 26 above the workpiece conveyance path 31, and prevent the vapor 26 from flowing to the duct side as much as possible.
次に、この実施例の作用を説明すると、蒸気槽２１の内
部では、液槽部２２から蒸発され自然対流によってワー
ク（プリント配線基板）Ｗの上面まで回り込むベーパに
加えて、ノズル４１から吹上げられたベーパがワーク（
プリント配線基板）Ｗの周囲から上面中央部まで迅速に
回り込み、プリント配線基板上に熱容量の大きな部品が
あっても、それらに十分なベーパ２６が強制的に供給さ
れるから、ワーク全体の温度がリフローはんだ付けに必
要な温度まで急速上昇され、基板・部品間のクリームは
んだが比較的短時間で溶融される。Next, to explain the operation of this embodiment, inside the steam tank 21, in addition to the vapor that is evaporated from the liquid tank section 22 and circulates to the upper surface of the workpiece (printed wiring board) W by natural convection, the vapor is blown up from the nozzle 41. The vapor that was released is the workpiece (
Even if there are components with large heat capacity on the printed wiring board, sufficient vapor 26 is forcibly supplied to them, so that the temperature of the entire workpiece is maintained. The temperature is rapidly raised to the temperature required for reflow soldering, and the cream solder between the board and components is melted in a relatively short time.
このようにして、リフローはんだ付けに使用されたベー
パ２６およびベーパの周囲に漂うミストは冷却器３４に
よって凝縮され、生じた液は仕切板５１の上面に沿って
流れ落ら、液槽部２２の予熱スペース４６に回収される
。そのとき、多くのベーパおよびミストが液化して液槽
部２２に回収されるが、一部のミストは仕切板５１のミ
スト流出阻止板部５２を乗越えて開口部５４に至る。そ
のようなミストの多くも、ミスト吸引口３５に向って移
動する段階で障害板５３に当って液化し、凝縮液回収間
隙５６を流れ落ちて液槽部２２に回収される。In this way, the vapor 26 used for reflow soldering and the mist floating around the vapor are condensed by the cooler 34, and the resulting liquid flows down along the upper surface of the partition plate 51, and is stored in the liquid tank 22. It is collected in the preheating space 46. At that time, much of the vapor and mist are liquefied and collected in the liquid tank section 22, but some of the mist passes over the mist outflow prevention plate section 52 of the partition plate 51 and reaches the opening section 54. Most of such mist also liquefies when it hits the obstruction plate 53 while moving toward the mist suction port 35, flows down through the condensate collection gap 56, and is collected in the liquid tank section 22.
この液槽部２２に回収された液は、いったん予熱スペー
ス４６に溜められ、ここで沸点近くの温度まで加熱され
てから、ノズル４１内や蒸気槽中央部分に移動する。The liquid collected in the liquid tank section 22 is once stored in the preheating space 46, heated here to a temperature close to its boiling point, and then moved to the inside of the nozzle 41 or the central part of the steam tank.
また、４箇所のミスト吸引口３５から図示しないミスト
回収ユニットのブロワの吸引力によってミスト回収タン
クに吸引されたミストは、そのタンク内の冷却器の働き
で凝縮され、その液は図示しないポンプによって液槽部
２２の予熱スペース４６に戻される。Further, the mist sucked into the mist collection tank from the four mist suction ports 35 by the suction force of the blower of the mist collection unit (not shown) is condensed by the function of the cooler in the tank, and the liquid is collected by the pump (not shown). The liquid is returned to the preheating space 46 of the liquid tank section 22.
本発明によれば、冷却器の下側に仕切板が設けられたか
ら、先ずこの仕切板上で第１段階の液回収がなされ、ま
た、仕切板のミスト吸引口側端とミスト吸引口の周囲の
障害板との間に開口部が設けられ、この開口部が仕切板
下側の凝縮液回収間隙を経て液槽部に連通されているか
ら、前記仕切板を通過したミストの多くも、障害板の外
周面で液化され、凝縮液回収間隙を経て液槽部に第２段
階の液回収がなされる。したがってミスト吸引口からミ
スト回収ユニットに回収されるミスト堡を少くすること
ができ、ミスト回収ユニットに過大な負担をかけない。According to the present invention, since the partition plate is provided on the lower side of the cooler, the first stage of liquid recovery is first performed on this partition plate, and also the end of the partition plate on the mist suction port side and the area around the mist suction port. An opening is provided between the barrier plate and the barrier plate, and this opening communicates with the liquid tank through the condensate recovery gap on the lower side of the partition plate, so that most of the mist that has passed through the partition plate also passes through the barrier plate. The liquid is liquefied on the outer circumferential surface of the plate, and the second stage of liquid recovery is performed in the liquid tank through the condensate recovery gap. Therefore, the amount of mist collected from the mist suction port to the mist collection unit can be reduced, and an excessive burden is not placed on the mist collection unit.
第１図は本発明の気相式はんだ付け装置の一実施例を示
す断面図、第２図は第１図のｌｌ−４線断面図、第３図
はＩＩＩ−Ｉ線断面図、第４図は従来の気相式はんだ付
け装置を示す断面図である。
２１・・蒸気槽、２２・◆液槽部、２６φ拳ベーパ、３
１・・ワーク搬送経路、３２．３３・・ダクト、３４・
・冷却器、３５・・ミスト吸引口、５１・・仕切板、５
３・・障害板、５４・・開口部、５６・・凝縮液回収間
隙。
昭和６２年１２月７日FIG. 1 is a sectional view showing an embodiment of the vapor phase soldering apparatus of the present invention, FIG. 2 is a sectional view taken along the line ll-4 in FIG. 1, FIG. The figure is a sectional view showing a conventional vapor phase soldering device. 21・・Steam tank, 22・◆Liquid tank part, 26φ fist vapor, 3
1. Workpiece conveyance path, 32. 33. Duct, 34.
・Cooler, 35...Mist suction port, 51...Partition plate, 5
3. Obstacle plate, 54. Opening, 56. Condensate collection gap. December 7, 1986
Claims (1)
を行う蒸気槽の下部に液槽部が設けられ、この液槽部の
ワーク搬入側およびワーク搬出側にワーク搬送経路に沿
つてダクトが設けられ、このダクトの内部に、ベーパお
よびベーパの周囲に漂うミストの外部への漏出を防止す
るための冷却器が設けられ、このワーク搬入側およびワ
ーク搬出側のダクトの開口端部にミストをダクト内から
回収するミスト吸引口が設けられた気相式はんだ付け装
置において、ワーク搬送経路の下側に位置する冷却器の
下側に、前記液槽部に向つて下降傾斜する仕切板が設け
られ、この仕切板のミスト吸引口側端とミスト吸引口の
周囲に設けられた障害板との間に開口部が設けられ、こ
の開口部が前記仕切板の下側に形成された下降傾斜状の
凝縮液回収間隙を経て前記液槽部に連通されたことを特
徴とする気相式はんだ付け装置。(1) A liquid tank is provided at the bottom of the steam tank that performs reflow soldering using the latent heat of vaporization of vapor, and ducts are provided along the work transfer route on the workpiece loading and unloading sides of this liquid tank. A cooler is provided inside this duct to prevent the vapor and the mist floating around the vapor from leaking to the outside, and the mist is ducted to the open ends of the duct on the workpiece loading side and workpiece loading side. In a vapor phase soldering apparatus equipped with a mist suction port for collecting mist from inside, a partition plate is provided below a cooler located below a workpiece conveyance path and is inclined downward toward the liquid tank. , an opening is provided between the end of the partition plate on the side of the mist suction port and an obstruction plate provided around the mist suction port, and this opening is formed in a downwardly sloping shape formed on the lower side of the partition plate. A vapor phase soldering device, characterized in that the device is connected to the liquid tank through a condensate recovery gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30931687A JPH01150464A (en) | 1987-12-07 | 1987-12-07 | Vapor phase soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30931687A JPH01150464A (en) | 1987-12-07 | 1987-12-07 | Vapor phase soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01150464A true JPH01150464A (en) | 1989-06-13 |
Family
ID=17991549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30931687A Pending JPH01150464A (en) | 1987-12-07 | 1987-12-07 | Vapor phase soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01150464A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05318099A (en) * | 1992-05-21 | 1993-12-03 | Hitachi Techno Eng Co Ltd | Vapor reflow soldering device |
| US5446328A (en) * | 1993-09-08 | 1995-08-29 | Mabuchi Motor Co., Ltd. | Miniature motor with preassembled commutator |
| JP2007227741A (en) * | 2006-02-24 | 2007-09-06 | Denso Corp | Reflow-soldering method and equipment |
-
1987
- 1987-12-07 JP JP30931687A patent/JPH01150464A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05318099A (en) * | 1992-05-21 | 1993-12-03 | Hitachi Techno Eng Co Ltd | Vapor reflow soldering device |
| US5446328A (en) * | 1993-09-08 | 1995-08-29 | Mabuchi Motor Co., Ltd. | Miniature motor with preassembled commutator |
| JP2007227741A (en) * | 2006-02-24 | 2007-09-06 | Denso Corp | Reflow-soldering method and equipment |
| JP4525611B2 (en) * | 2006-02-24 | 2010-08-18 | 株式会社デンソー | Reflow soldering method and apparatus |
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