JPH01138781A - Semiconductor laser device - Google Patents

Abstract

PURPOSE:To compensate easily the deviation of laser rays from an optical axis in an assembly process by a method wherein a heat sink provided with a face, which is obliquely cut to enable the bonded surface of the sink with a primary face of a stem not to form a right angle with a semiconductor laser mounting face, is employed. CONSTITUTION:A tapered block 6 is provided, where a submount 3 and a semiconductor laser chip 1 are mounted on a face of the block 6 which makes a oblique angle with the tapered face and the tapered face of the tapered block 6 is bonded to the primary face 4 of the stem 5 so as to make a light emitting point of the semiconductor laser chip 1 be situated at the center of the stem 5, so that laser rays can be taken out perpendicularly to the stem primary face 4 even if the laser chip 1, which does not emit laser rays in parallel with the bonded face of the semiconductor laser chip 1, is used. Therefore, the deviation of laser rays from an optical axis can be decreased and a device of this design can be improved in a coupling efficiency with an external optical system. So that, a semiconductor laser device can be decreased in a laser ray output, consequently in a heat release by operating it with small current, and improved in reliability.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor laser device.

[Conventional technology]

FIG. 61 is a diagram showing an example of a conventional assembly method.

(a) is a perspective view, and (b) is a side view. In i3Q, (1) is a semiconductor laser chip, (2) is a heat sink to which this semiconductor laser chip (YU) is attached, and in this conventional example, a rectangular block, +31 is a semiconductor laser chip (1) and a block (2+). The submount sandwiched between them, +41 is the semiconductor laser chip (1), and the main surface 4 (5) of the stem is attached to the surface perpendicular to the block surface on which the submount (3) is attached. be.

Next, a conventional manufacturing method will be explained. block(
2! The submount (3) and the semiconductor laser chip (11) are attached in this order along the 1+surface 2 line with their end faces aligned, and the semiconductor laser chip (11) is used as a heat sink.

Submount (3) is half Ij! It is sandwiched between the non-laser chip (1) and the block (21) in order to alleviate the strain caused by the difference in thermal expansion coefficient, and a method of relaxing the strain by using soft alloy solder as the submount 131 will also be described.Next, 2
The emission direction of the laser beam of the semiconductor laser chip (1) is set in the direction of the stem body (51) in order to increase the coupling efficiency with the external optical system.
It is necessary to match the central axis of the bite. Therefore, the block (21) with the semiconductor laser chip (1) and the submount (3) attached is placed perpendicular to the stem main thI+41, and the light emitting points of the half-four laser chips (1) are placed on the stem wood. The blocks were glued to match the central axis of the.

[Problems that the invention helps solve]

Since the conventional semiconductor laser device is assembled as described above, the semiconductor laser chip (1) is attached to the main surface of the stem (41
It was always mounted perpendicular to the

For this reason, when the semiconductor laser chip fi+ is mounted, the laser light does not emit parallel to the surface.

There was a problem in that the laser beam could not be extracted perpendicularly to the main surface (4) of the stem. This causes a problem in that the coupling efficiency with the external optical system is reduced and the astigmatism difference becomes large.

This invention solves the above-mentioned problems, and provides a semiconductor laser device that outputs laser light perpendicular to the main surface of the stem, even for semiconductor laser chips that do not emit laser light parallel to the surface. The purpose is to obtain.

[Means for solving problems]

That is, the present invention is a heat sink that is bonded to the stem using a heat sink that has an adhesive surface with the main surface of the stem and a surface that is cut diagonally so that the adhesive surface and the surface on which the semiconductor laser chip is attached are not perpendicular to each other. It is.

[For production]

In the heat sink with an obliquely cut surface according to the present invention, the -10,000 side is glued to the main surface of the stem, and a semiconductor laser chip is attached to a surface that is at an angle to this side, thereby achieving a half-Ij! The mounting of this laser chip allows laser light to be extracted perpendicularly to the main surface of the stem even in a semiconductor laser chip that does not emit laser light parallel to the surface.

[Implementation sequence of the invention]

Hereinafter, one embodiment of the invention will be described with reference to the figures. 1st
FIG. 1(a) is a perspective view, and FIG. 1(b) is a side view.

In the figure, 11) and (;3) to 5) are equivalent to the conventional example shown in the sixth south. (6) is a heat sink having an obliquely cut surface, which is a feature of the present invention, and in this embodiment, it is a tapered block in which one side of a rectangular parallelepiped block is cut obliquely. This diagonally cut angle is the angle between the mounting surface of the semiconductor laser chip (1) and its laser beam (the angle with the optical axis is 2-L).
ffi: ), and the directions cancel each other out, resulting in nine directions.

According to this invention, in the two-tapered block (6),
The submount (3) and the semiconductor laser chip (1) are attached to form an oblique angle with the tapered surface, and the taper of the tapered block (6) is adjusted so that the light emitting point of the semiconductor laser chip fi+ is located at the center of the stem. The main surface of the stem (
4) In order to bond to the laser beam or semiconductor laser chip (
Mounting 1) allows the laser beam to be extracted perpendicularly [σ] to the stem main surface (4) even in a chip that does not emit light parallel to the surface. Therefore, compared to the conventional laser device, it is possible to reduce the angular deviation of the laser beam from the optical axis and increase the coupling efficiency with the external optical system. By adjusting this coupling efficiency, it is possible to reduce the amount of light emitted by the half-four laser device, reduce heat generation of the semiconductor laser chip with low current operation, and improve reliability. , S
I can do it.

In the above W example, the tapered surface of the tapered block (6) was attached to the main main surface of the stem f41 K g , but the tapered surface and the semi-4 V, i laser emitted light (1) k and submount (31) were attached. You may also replace the other side.

In addition, it is not necessary to attach the heat sink (7) to the diagonally cut surface of the patent Shimizu range i1'g5 with a block, and the main surface of the stem (41, the adhesive surface, and the surface on which the semiconductor laser chip is attached) can be attached at an oblique angle. Any shape may be used as long as it has a heat sink (FIG. 21).

J: In the above embodiment, a submount (31
However, the semiconductor laser chip (11) may be directly attached to the heat sink.

However, in a configuration using submount +31, the fourth
A similar effect can be obtained by using a submount (8) whose adhesive surface is cut obliquely as shown in the figure.

Furthermore, as shown in Figure 5, even when the heat sink is integrated with the stem wood, the same effect can be achieved if the main surface of the stem (4) and the surface on which the semiconductor laser chip (1) is attached are at an oblique angle. .

〔Effect of the invention〕

As described above, this invention has the effect of easily compensating for the angular deviation from the original axis of the laser beam during the assembly process by using a heat sink with a diagonally cut curve. .

[Brief explanation of the drawing]

FIG. 1(a) is a perspective view showing the manufacturing process of a semiconductive laser device according to an embodiment of the present invention, FIG. 1(b) is a side view thereof, and FIGS. Ikenomi 1M example 1
FIG. 6(a) is a perspective view of the conventional example,
FIG. 6(b) is its ν1j plane view. In the figure, (1) is the fast guide laser chip, (3) is the submount, (41 is the main surface of the stem, (5) is the stem body,
(6) is a tapered block, (7) is a heat sink with an obliquely cut surface, and (8) is a submount with an obliquely cut surface. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa (Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 Satoru) Procedural amendment (voluntary)! , small case display patent application No. 62-298126 3,
Relationship with the case of the person making the amendment Patent Applicant Address 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) Mitsubishi Electric Corporation Representative Moriya Shiki 4, Representative Address Chiyoda-ku, Tokyo Marunouchi 2-2-3 Mitsubishi Electric Corporation 63.2. `` '' - 5. Detailed description of the invention in the specification to be amended and drawing 6. Contents of the amendment + 1) Figures 2 to 5 of the drawings are corrected as shown in the attached sheet. (2) The specification shall be amended as follows.

Claims (1)

[Claims] (1) In a semiconductor laser device comprising a semiconductor laser chip, a heat sink that adheres the semiconductor laser chip, and a stem having a main surface of the stem that adheres a pond surface of the heat sink, the heat sink is emitted from the semiconductor laser chip. A semiconductor laser device characterized by having a surface cut diagonally so as to compensate for an angular deviation between the optical axis of the laser beam and the main surface of the stem.