JPH01123805A - Photocurable resin composition - Google Patents
Photocurable resin compositionInfo
- Publication number
- JPH01123805A JPH01123805A JP28189187A JP28189187A JPH01123805A JP H01123805 A JPH01123805 A JP H01123805A JP 28189187 A JP28189187 A JP 28189187A JP 28189187 A JP28189187 A JP 28189187A JP H01123805 A JPH01123805 A JP H01123805A
- Authority
- JP
- Japan
- Prior art keywords
- acrylate
- meth
- resin composition
- photocurable resin
- reaction product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 28
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 claims abstract 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 abstract description 17
- 239000003054 catalyst Substances 0.000 abstract description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003085 diluting agent Substances 0.000 abstract description 6
- 239000003505 polymerization initiator Substances 0.000 abstract description 6
- 239000003112 inhibitor Substances 0.000 abstract description 5
- 238000006116 polymerization reaction Methods 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 150000008064 anhydrides Chemical class 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 abstract description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 abstract description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 abstract description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 abstract 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 44
- -1 azide compounds Chemical class 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 17
- 230000000704 physical effect Effects 0.000 description 13
- 239000007788 liquid Substances 0.000 description 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- RKYJPYDJNQXILT-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxycarbonyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCCOC(=O)C=C RKYJPYDJNQXILT-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 101100360207 Caenorhabditis elegans rla-1 gene Proteins 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 101150025379 RPA1 gene Proteins 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- LIYCXGAVARSRKN-UHFFFAOYSA-N [S].CNC Chemical compound [S].CNC LIYCXGAVARSRKN-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 description 1
- 229960001748 allylthiourea Drugs 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 150000001851 cinnamic acid derivatives Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- UEHUZQKLOWYOMO-UHFFFAOYSA-N diethylazanium;acetate Chemical compound CC(O)=O.CCNCC UEHUZQKLOWYOMO-UHFFFAOYSA-N 0.000 description 1
- XHFGWHUWQXTGAT-UHFFFAOYSA-N dimethylamine hydrochloride Natural products CNC(C)C XHFGWHUWQXTGAT-UHFFFAOYSA-N 0.000 description 1
- IQDGSYLLQPDQDV-UHFFFAOYSA-N dimethylazanium;chloride Chemical compound Cl.CNC IQDGSYLLQPDQDV-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- JUVGLPRIQOJMIR-UHFFFAOYSA-N oxiran-2-ylmethyl 3-phenylprop-2-enoate Chemical compound C=1C=CC=CC=1C=CC(=O)OCC1CO1 JUVGLPRIQOJMIR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- ZKDDJTYSFCWVGS-UHFFFAOYSA-M sodium;diethoxy-sulfanylidene-sulfido-$l^{5}-phosphane Chemical compound [Na+].CCOP([S-])(=S)OCC ZKDDJTYSFCWVGS-UHFFFAOYSA-M 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymerisation Methods In General (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、新規な光硬化性樹脂組成物に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a novel photocurable resin composition.
[従来の技術]
近年、光硬化性樹脂は種々の分野において広く研究され
、実用化されているものも多い。これは光硬化性樹脂が
従来の熱硬化型、溶剤溶解型樹脂に比べて、生産性、省
エネルギー性、無公害性等の観点において多くの利点を
有しているためである。[Prior Art] In recent years, photocurable resins have been widely studied in various fields, and many have been put into practical use. This is because photocurable resins have many advantages over conventional thermosetting and solvent-soluble resins in terms of productivity, energy saving, non-polluting properties, and the like.
一般に光硬化性樹脂は、感光性基の種類により桂皮酸エ
ステル等の光二量化型、アクリル酸エステル等の光重合
型、アジド化合物等の光分解型等に分類されるが、なか
でも光重合型のアクリル酸エステル系は硬化性、被膜物
性ともに優れた性能を有することにより最も広く用いら
れている。In general, photocurable resins are classified into photodimerizable types such as cinnamic acid esters, photopolymerizable types such as acrylic esters, and photodegradable types such as azide compounds, depending on the type of photosensitive group. The acrylic ester type is the most widely used because it has excellent performance in both curability and film properties.
アクリル酸エステル系の光硬化性樹脂は、高分子量のア
クリルオリゴマーに反応性希釈剤どしてアクリルモノマ
ーを加えたものを主成分とし、必要に応じて光重合開始
剤、増感剤、その他各種の添加節1を加えた形で用いら
れている。The main component of acrylic ester-based photocurable resin is a high-molecular-weight acrylic oligomer with acrylic monomer added as a reactive diluent, and optionally a photopolymerization initiator, sensitizer, and other various substances. It is used with addition clause 1 added.
ここで、公知のアクリルオリゴマーとしては、ポリエス
テルアクリレート、エポキシアクリレート、ウレタンア
クリレート、ポリエーテルアクリレート、アクリルアク
リレート、アルキッドアクリレート等が挙げられるが、
なかでもポリエステルアクリレートは、安価でかつバラ
ンスのよい性能を示すことにより最も広く用いられてい
るものである。Here, examples of known acrylic oligomers include polyester acrylate, epoxy acrylate, urethane acrylate, polyether acrylate, acrylic acrylate, alkyd acrylate, etc.
Among them, polyester acrylate is the most widely used because it is inexpensive and exhibits well-balanced performance.
[発明が解決しようとする問題点]
しかしながら、従来のポリエステルアクリレートを主成
分とする光硬化性樹脂組成物は、特に空気存在下におけ
る硬化速度が遅く、充分に満足し得る光硬化速度を有す
るものは未だ見い出されていない。[Problems to be Solved by the Invention] However, conventional photocurable resin compositions containing polyester acrylate as a main component have a slow curing speed, especially in the presence of air, and do not have a sufficiently satisfactory photocuring speed. has not yet been discovered.
本発明者らは、貯蔵安定性、硬化物の物性を低下させる
ことなく短時間の光照射で硬化し得る樹脂組成物を開発
すべく鋭意研究を重ねた結果、特定の多価カルボン酸若
しくはその無水物を原料として得られるアクリル系化合
物が、所望の効果を有することを見い出し、この知見に
基づいて本発明を完成するに至った。The present inventors have conducted extensive research to develop a resin composition that can be cured by short-term light irradiation without reducing storage stability or physical properties of the cured product. It was discovered that an acrylic compound obtained using an anhydride as a raw material has the desired effect, and based on this knowledge, the present invention was completed.
即ち、本発明は従来になく速硬化性の新規な光硬化性樹
脂組成物を提供することを目的とする。That is, an object of the present invention is to provide a novel photocurable resin composition that cures faster than ever before.
[問題点を解決するための手段]
本発明に係る光硬化性樹脂組成物は、1,2゜3.4−
ブタンテトラカルボン酸(以下rBTCJと略称する。[Means for solving the problems] The photocurable resin composition according to the present invention has a temperature of 1,2°3.4-
Butanetetracarboxylic acid (hereinafter abbreviated as rBTCJ).
)又はその酸無水物と、少なくとも1個のエチレン性不
飽和基を有し、かつ水酸基若しくはグリシジル基を有す
る化合物との反応生成物を硬化性成分として含有するこ
とを特徴とする。) or its acid anhydride and a compound having at least one ethylenically unsaturated group and a hydroxyl group or a glycidyl group as a curable component.
斯かる反応生成物は、BTC又はその酸無水物と、少な
くとも1個のエチレン性不飽和基を有し、かつ水酸基若
しくはグリシジル基を有する化合物とを好ましくは触媒
の存在下、及び熱重合禁止剤の存在下で、溶媒中又は溶
媒を使わずして約50〜150’Cで5〜20時間程度
、加熱下で撹拌することにより合成することができる。Such a reaction product comprises BTC or its acid anhydride and a compound having at least one ethylenically unsaturated group and a hydroxyl group or a glycidyl group, preferably in the presence of a catalyst and a thermal polymerization inhibitor. It can be synthesized by stirring under heating in the presence of a solvent or without using a solvent at about 50 to 150'C for about 5 to 20 hours.
少なくとも1個のエチレン性不飽和基を有し、かつ水酸
基を有する化合物としては、例えば2−ヒドロキシエチ
ル(メタ〉アクリレート、2−ヒドロキシプロピル(メ
タ)アクリレート、ポリエチレングリコール(メタ)ア
クリレート、トリメチロールプロパン(メタ)アクリレ
ート、ペンタエリスリトール(メタ)アクリレート、ビ
スフェノール型のエポキシ(メタ)アクリレート、2−
ヒドロキシエチルシンナメート等が挙げられる。Examples of compounds having at least one ethylenically unsaturated group and a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, polyethylene glycol (meth)acrylate, and trimethylolpropane. (meth)acrylate, pentaerythritol (meth)acrylate, bisphenol type epoxy (meth)acrylate, 2-
Examples include hydroxyethyl cinnamate.
又、少なくとも1@のエチレン性不飽和基を有し、かつ
グリシジル基を有する化合物としては、グリシジル(メ
タ)アクリレート、グリシジルシンナメート、エポキシ
ステアリル(メタ)アクリレート、ビスフェノールA型
又はビスフェノールF型エポキシの2個のグリシジル基
の1個が(メタ)アクリレート化された化合物等が例示
される。In addition, examples of compounds having at least 1 ethylenically unsaturated group and a glycidyl group include glycidyl (meth)acrylate, glycidyl cinnamate, epoxy stearyl (meth)acrylate, bisphenol A type or bisphenol F type epoxy. Examples include compounds in which one of two glycidyl groups is (meth)acrylated.
これらの化合物は単独で用いても2種以上混合して用い
てもよく、又、未反応のまま残る過剰分はそのまま光硬
化性樹脂組成物中の反応性希釈剤として用いることも出
来る。These compounds may be used alone or in combination of two or more, and the excess remaining unreacted can be used as is as a reactive diluent in the photocurable resin composition.
この反応は無触媒でも可能であるが、工業的には適当な
触媒を加えるのがより好ましい。適当な触媒としては硫
1、リン酸、p−トルエンスルホン酸等の酸触媒、トリ
エチルアミン、トリエタノールアミン、N、N−ジメチ
ルアニリン等の第3級アミン、ジメチルアミン塩酸塩、
ジエチルアミン酢酸塩、ジメチルアミン硫rIi塩等の
アミン塩等が例示され、その使用量は、O,O’l〜1
0重量%程度、好ましくは0.1〜5重量%程度である
。This reaction can be carried out without a catalyst, but from an industrial perspective it is more preferable to add a suitable catalyst. Suitable catalysts include acid catalysts such as sulfuric acid, phosphoric acid, p-toluenesulfonic acid, tertiary amines such as triethylamine, triethanolamine, N,N-dimethylaniline, dimethylamine hydrochloride,
Examples include amine salts such as diethylamine acetate and dimethylamine sulfur rIi salt, and the amount used is O, O'l~1
It is about 0% by weight, preferably about 0.1 to 5% by weight.
熱重合禁止剤としては、ベンゾキノン、ナフトキノン等
のキノン類、ハイドロキノン、ハイドロキノンモノメチ
ルエーテル
テコール等のフェノール類、ナフテン酸銅等の金属塩等
が挙げられ、その添加量は、約0.005〜0.1重量
%、好ましくは0.01〜0.03重量%程度である。Examples of thermal polymerization inhibitors include quinones such as benzoquinone and naphthoquinone, phenols such as hydroquinone and hydroquinone monomethyl ether tecol, and metal salts such as copper naphthenate. .1% by weight, preferably about 0.01 to 0.03% by weight.
重合を抑制するためには、更に反応系へ空気等の酸素を
含有するガスを少量ずつ供給しながら反応を行なう方法
も有効である。In order to suppress polymerization, it is also effective to carry out the reaction while supplying a gas containing oxygen, such as air, little by little to the reaction system.
溶媒を使用する場合には、ベンゼン、トルエン、クロル
ベンゼン、1,4−ジオキサン等の不活性溶媒を用いて
反応後留去する方法、トリメチロールプロパントリ(メ
タ)アクリレート等の上記反応条件下で不活性な硬化性
化合物を用いて、反応後も除去せずそのまま硬化性樹脂
組成物中の反応性希釈剤とする方法等が挙げられる。When using a solvent, use an inert solvent such as benzene, toluene, chlorobenzene, 1,4-dioxane, etc. and distill it off after the reaction, or use trimethylolpropane tri(meth)acrylate under the above reaction conditions. Examples include a method in which an inert curable compound is used as a reactive diluent in the curable resin composition without being removed after the reaction.
本発明に係る光硬化性樹脂組成物は、以上のようにして
得られた硬化性化合物に必要に応じて反応性希釈剤、重
合開始剤、増感剤等を配合することにより得られる。The photocurable resin composition according to the present invention can be obtained by blending a reactive diluent, a polymerization initiator, a sensitizer, etc. as necessary with the curable compound obtained as described above.
反応性希釈剤としては、2−エチルヘキシル(メタ)ア
クリレート、ラウリル(メタ)アクリレート、2−ヒド
ロキシエチル(メタ)アクリレ−ト、2−ヒドロキシプ
ロピル(メタ)アクリレート、シクロヘキシル(メタ)
アクリレート、テトラヒドロフルフリル(メタ)アクリ
レート、フェノキシエチル(メタ)アクリレート、エチ
レングリコールジ(メタ)アクリレート、ジエチレング
リコールジ(メタ)アクリレート、トリエチレングリコ
ールジ(メタ)アクリレート、ポリエヂレングリコール
ジ(メタ)アクリレート、プロピレングリコールジ(メ
タ)アクリレート、ジプロピレングリコールジ(メタ)
アクリレート、トリプロピレングリコールジ(メタ)ア
クリレート、ポリプロピレングリコールジ(メタ)アク
リレート、1,3−ブタンジオールジ(メタ)アクリレ
ート、1,4−ブタンジオールジ(メタ)アクリレート
、1,6−ヘキサンシオールジ(メタ)アクリレート、
ネオペンチルグリコールジ(メタ)アクリレート、ヒド
ロキシピバリン酸エステルネオペンチルグリコールジ(
メタ)アクリレート、トリメチロールプロパントリ(メ
タ)アクリレート、ペンタエリスリトールトリ(メタ)
アクリレート、ジペンタエリスリトールヘキサ(メタ)
アクリレート、ジアリルフタレート、トリアリルシアヌ
レート、N−ビニルピロリドン、酢酸ビニル、スチレン
、ビニルトルエン等が挙げられ、その配合量は、当該硬
化性化合物100重量部に対して100重量部以下、好
ましくは50重量部以下である。Examples of reactive diluents include 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and cyclohexyl (meth)acrylate.
Acrylate, tetrahydrofurfuryl (meth)acrylate, phenoxyethyl (meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate , propylene glycol di(meth)acrylate, dipropylene glycol di(meth)
Acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate (meth)acrylate,
Neopentyl glycol di(meth)acrylate, hydroxypivalic acid ester neopentyl glycol di(meth)acrylate,
meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)
Acrylate, dipentaerythritol hexa(meth)
Examples include acrylate, diallyl phthalate, triallyl cyanurate, N-vinylpyrrolidone, vinyl acetate, styrene, vinyltoluene, etc., and the amount thereof is 100 parts by weight or less, preferably 50 parts by weight, based on 100 parts by weight of the curable compound. Parts by weight or less.
重合開始剤としては、例えばベンゾインエチルエーテル
(以下rBEEJと略称する。)、ベンゾフェノン、2
,2−ジェトキシアセトフェノン、ベンジルジメチルケ
タール、2−エチルアンスラキノン、ミヒラーズケトン
等が掲げられる。Examples of the polymerization initiator include benzoin ethyl ether (hereinafter abbreviated as rBEEJ), benzophenone, 2
, 2-jethoxyacetophenone, benzyl dimethyl ketal, 2-ethyl anthraquinone, Michler's ketone and the like.
又、増感剤としては、トリエチルアミン、トリエチレン
テトラミン等のアミン類、アリルチオ尿素等の尿素類、
ナトリウムジエチルジチオホスフェート等の硫黄化合物
、N、N−ジメチル−p−アミノベンゾニトリル等のニ
トリル類、トリーn−ブチルホスフィン等のリン化合物
等が例示される。In addition, as sensitizers, amines such as triethylamine and triethylenetetramine, ureas such as allylthiourea,
Examples include sulfur compounds such as sodium diethyldithiophosphate, nitriles such as N,N-dimethyl-p-aminobenzonitrile, and phosphorus compounds such as tri-n-butylphosphine.
上記夫々の配合量は、硬化性成分100重量部に対して
0.01〜20重量部程度、好ましくは0.1〜10重
量部の範囲である。The blending amount of each of the above components is approximately 0.01 to 20 parts by weight, preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the curable component.
尚、本発明に係る硬化性樹脂組成物は、光硬化のみなら
ず、重合開始剤や硬化促進剤の存在下、熱硬化若しくは
常温硬化も可能である。係る重合開始剤としては、ベン
ゾイルパーオキサイド、ジクミルパーオキサイド、te
rt−ブチルパーベンゾエート等の各種過酸化物、アゾ
ビスイソブチロニトリル、フェニルアセトアルデヒド等
が例示され、又、硬化促進剤としてはナフテン酸コバル
ト、ナフテン酸マンガン等の金属塩類、N、N−ジメチ
ルアニリン、N、N−ジメチル−p−トルイジン等の芳
香族第3級アミン類等の上記各種過酸化物とレドックス
触媒系を形成する化合物が例示される。このものの硬化
性成分に対する配合量は、光硬化の場合と同様である。The curable resin composition according to the present invention can be not only photocured but also thermocured or room temperature cured in the presence of a polymerization initiator or a curing accelerator. Such polymerization initiators include benzoyl peroxide, dicumyl peroxide, te
Various peroxides such as rt-butyl perbenzoate, azobisisobutyronitrile, phenylacetaldehyde, etc. are exemplified, and as curing accelerators, metal salts such as cobalt naphthenate and manganese naphthenate, N,N-dimethyl Examples include compounds that form a redox catalyst system with the above various peroxides, such as aromatic tertiary amines such as aniline and N,N-dimethyl-p-toluidine. The amount of this compound relative to the curable component is the same as in the case of photocuring.
本発明に係る硬化性樹脂組成物には必要に応じて他の反
応性オリゴマーや充填剤、着色剤、レベリング剤、可塑
剤等の各種添加剤を適宜加えることができる。Various additives such as other reactive oligomers, fillers, colorants, leveling agents, and plasticizers can be appropriately added to the curable resin composition according to the present invention, if necessary.
かくして得られた硬化物は、塗料、ワニス、コーティン
グ剤、接着剤、粘着剤、バインダー、シーラント、印刷
インキ、製版材料、フォトレジスト、電気部品の封止材
、ポツティング剤、レンズ、光デイスク基盤等の成形材
料等の各種用途に好適である。The cured products thus obtained can be used as paints, varnishes, coating agents, adhesives, pressure-sensitive adhesives, binders, sealants, printing inks, plate-making materials, photoresists, sealants for electrical parts, potting agents, lenses, optical disk substrates, etc. It is suitable for various uses such as molding materials.
更に、本発明に係る硬化性化合物がカルボキシル基を有
する場合、゛アルカリ水可溶の硬化性化合物として製版
材料、レジスト、接着剤等に非常に有用である。又、エ
ポキシ樹脂の硬化剤として用いることも可能であり、そ
の場合、従来のエポキシ樹脂硬化剤と異なり、光によっ
て予備硬化し、次いで加熱処理により完全硬化すること
ができるため生産性の改善等に非常に有効である。Furthermore, when the curable compound according to the present invention has a carboxyl group, it is very useful as a curable compound soluble in alkaline water for plate-making materials, resists, adhesives, etc. It can also be used as a curing agent for epoxy resins, and in that case, unlike conventional epoxy resin curing agents, it can be pre-cured by light and then completely cured by heat treatment, which can improve productivity. Very effective.
[実施例コ 以下に実施例を掲げ、本発明の詳細な説明する。[Example code] The present invention will be described in detail below with reference to Examples.
実施例1
BTC二無水物999.2−ヒドロキシエチルアクリレ
ート(以下、rHEAJと略称する。〉139.9!?
、触媒としてトリエチルアミン(以下rTEAJと略称
する。)0.21、重合禁止剤としてハイドロキノンモ
ノメチルエーテル(以下、rMEHQJと略称する。)
0.0449の夫々を反応容器中に仕込み、80’Cで
10時間反応し、1.2.3.4−ブタンテトラカルボ
ン酸ジアクリロイルオキシエチルエステル(以下rBT
c−2HEAJと略称する。)とHEAからなる無色透
明な液体状の反応生成物を得た。Example 1 BTC dianhydride 999.2-hydroxyethyl acrylate (hereinafter abbreviated as rHEAJ) 139.9!?
, triethylamine (hereinafter abbreviated as rTEAJ) 0.21 as a catalyst, and hydroquinone monomethyl ether (hereinafter abbreviated as rMEHQJ) as a polymerization inhibitor.
0.0449 were charged into a reaction vessel and reacted at 80'C for 10 hours to form 1.2.3.4-butanetetracarboxylic acid diacryloyloxyethyl ester (rBT
It is abbreviated as c-2HEAJ. ) and HEA were obtained as a colorless and transparent liquid reaction product.
得られた反応生成物100重量部に対し、重合開始剤と
してBEE3重量部を配合し、第1表に掲げる光硬化性
樹脂組成物を調製した。3 parts by weight of BEE as a polymerization initiator was blended with 100 parts by weight of the obtained reaction product to prepare photocurable resin compositions listed in Table 1.
1qられた光硬化性樹脂組成物の回転粘度、硬化時間、
及びその硬化物の鉛筆硬度、密着性、耐屈曲性を測定し
た。得られた結果を第1表に示す。The rotational viscosity and curing time of the photocurable resin composition obtained by 1q,
The pencil hardness, adhesion, and bending resistance of the cured product were measured. The results obtained are shown in Table 1.
なお、各物性値の測定方法は下記の通りである。The method for measuring each physical property value is as follows.
、回転粘度 E型回転粘度計を用いて、30’Cで測定した。, rotational viscosity It was measured at 30'C using an E-type rotational viscometer.
丈±笠岡
ブリキ板上にB形フィルムアプリケーターを用いて硬化
性樹脂組成物を塗布し、空気中で100Wの高圧水銀灯
を用いて、10cmの距離から紫外線を照射し、塗膜表
面の指触乾燥時間を測定した。A curable resin composition was applied onto a length ± Kasaoka tin plate using a B-type film applicator, and ultraviolet rays were irradiated from a distance of 10 cm using a 100 W high-pressure mercury lamp in the air to dry the coating surface to the touch. The time was measured.
鉛筆硬度
鋼板上に塗付した硬化性樹脂組成物を10100W−1
0の高圧水銀灯で所定時間光硬化した。得られた硬化膜
(厚さ約50μ)をJIS−に5400の「鉛筆引っか
き試験」に準拠して測定した。A curable resin composition coated on a pencil hardness steel plate was heated to 10100W-1.
It was photocured for a predetermined time using a high-pressure mercury lamp at 0°C. The resulting cured film (thickness: approximately 50 μm) was measured in accordance with JIS-5400 “Pencil Scratch Test”.
密着性
鉛筆硬度測定の場合と同様にして得られた硬化膜に縦横
各1#間隔で切れ目を入れて100個の基盤目をつくり
、次いでセロファンテープによる剥ぎ取りを行ない、鋼
板上に残った基盤目の数を測定した。The cured film obtained in the same manner as in the case of adhesion pencil hardness measurement was cut at intervals of 1# vertically and horizontally to create 100 base marks, and then peeled off with cellophane tape to remove the base remaining on the steel plate. The number of eyes was measured.
鮭凪典且
ブリキ板上に塗付した光硬化性樹脂組成物を10100
W−10の高圧水銀灯で所定時間光硬化した。得られた
硬化膜の耐屈曲性をJIS−に5400に準拠して測定
した。10100 of the photocurable resin composition coated on the tin plate.
It was photocured for a predetermined time using a W-10 high pressure mercury lamp. The bending resistance of the obtained cured film was measured in accordance with JIS-5400.
実施例2
BEEの添加量を1重量部に置換えた以外は実施例1と
同様にして光硬化性樹脂組成物を調製し、その物性を測
定した。得られた結果を第1表に示す。Example 2 A photocurable resin composition was prepared in the same manner as in Example 1, except that the amount of BEE added was replaced with 1 part by weight, and its physical properties were measured. The results obtained are shown in Table 1.
実施例3
HEAの仕込み巖を169.8gとしてBTC−21−
I E AとHEAの含有比率を代えた以外は実施例1
と同様にして光硬化性樹脂組成物を調製し、その物性を
測定した。得られた結果を第1表に示す。Example 3 BTC-21- with the amount of HEA added as 169.8g
Example 1 except that the content ratio of IEA and HEA was changed.
A photocurable resin composition was prepared in the same manner as above, and its physical properties were measured. The results obtained are shown in Table 1.
実施例4
B −r C二無水物999.2−ヒト[1キシプロピ
ルアクリレート(以下rHPAJと略称する。)187
.39、TEAo、29g及びM、EHQO,048g
の夫々を反応容器中に仕込み、実施例1に準じて1,2
,3.4−ブタンテトラカルボン酸ジアクリロイルオキ
シプロピルエステル(以下rBTc−2HPAJと略称
する。)とH1〕Aからなる無色透明な液体状の反応生
成物を得た。係る反応生成物より実施例1と同様にして
光硬化性樹脂組成物を調製し、その物性を測定した。Example 4 B -r C dianhydride 999.2-human [1-xypropyl acrylate (hereinafter abbreviated as rHPAJ) 187
.. 39, TEAo, 29g and M, EHQO, 048g
1 and 2 in accordance with Example 1.
, 3,4-butanetetracarboxylic acid diacryloyloxypropyl ester (hereinafter abbreviated as rBTc-2HPAJ) and H1]A, a colorless and transparent liquid reaction product was obtained. A photocurable resin composition was prepared from the reaction product in the same manner as in Example 1, and its physical properties were measured.
得られた結果を第1表に示す。The results obtained are shown in Table 1.
実施例5
BTC二無水物99g、HEA121.8y、1.6−
ヘキサンジオールジアクリレート(以下rHDDAJと
略称する。)48g、TEAo、279及びMEHQo
、051gの夫々を反応容器中に仕込み、80°Cで1
5時間反応を行ない、BTC−2HEAとHDDAとか
らなる無色透明な液体状の反応生成物を得た。係る反応
生成物より実施例1と同様にして光硬化性樹脂組成物を
調製し、その物性を測定した。得られた結果を第1表に
示す。Example 5 BTC dianhydride 99g, HEA121.8y, 1.6-
48 g of hexanediol diacrylate (hereinafter abbreviated as rHDDAJ), TEAo, 279 and MEHQo
, 051g of each were placed in a reaction vessel and heated at 80°C for 1
The reaction was carried out for 5 hours to obtain a colorless and transparent liquid reaction product consisting of BTC-2HEA and HDDA. A photocurable resin composition was prepared from the reaction product in the same manner as in Example 1, and its physical properties were measured. The results obtained are shown in Table 1.
実施例6
BTC二無水物99g、HEA121.8g、トリメチ
ロールプロパントリアクリレート(以下rTMPTAJ
と略称する。>65.99、触媒としてTEAo、29
9及び重合禁止剤としてMEHQo、055gの夫々を
反応容器中に仕込み、実施例5に準じてBTC−2HE
AとTMPTAとからなる無色透明な液体状の反応生成
物を得た。Example 6 99 g of BTC dianhydride, 121.8 g of HEA, trimethylolpropane triacrylate (hereinafter referred to as rTMPTAJ)
It is abbreviated as. >65.99, TEAo as catalyst, 29
9 and 055 g of MEHQo as a polymerization inhibitor were charged into a reaction vessel, and BTC-2HE was prepared according to Example 5.
A colorless and transparent liquid reaction product consisting of A and TMPTA was obtained.
係る反応生成物より実施例1と同様にして光硬化性樹脂
組成物を調製し、その物性を測定した。得られた結果を
第1表に示す。A photocurable resin composition was prepared from the reaction product in the same manner as in Example 1, and its physical properties were measured. The results obtained are shown in Table 1.
実施例7
BTC二無水物99g、HEA121.EEF、2−エ
チルへキシルアクリレート(以下rEHAJと略称する
。>32.1g、TEAo、25!7及びMEHQo、
045!?の夫々を反応容器中に仕込み、実施例5に準
じてBTC−2HEAとEHAとからなる無色透明な液
体状の反応生成物を得た。係る反応生成物より実施例1
と同様にして光硬化性樹脂組成物を調製し、その物性を
測定した。Example 7 99 g of BTC dianhydride, 121 g of HEA. EEF, 2-ethylhexyl acrylate (hereinafter abbreviated as rEHAJ.>32.1g, TEAo, 25!7 and MEHQo,
045! ? were charged into a reaction vessel, and a colorless and transparent liquid reaction product consisting of BTC-2HEA and EHA was obtained according to Example 5. Example 1 from such reaction products
A photocurable resin composition was prepared in the same manner as above, and its physical properties were measured.
得られた結果を第2表に示す。The results obtained are shown in Table 2.
実施例8
BTC二無水物99g、HEA187.5!?、TEA
o、36g及びMEHQo、056gの夫々を反応容器
中に仕込み、80℃で10時間反応を行なった。冷却後
、グリシジルメタクリレート719を仕込み、更に95
℃で7時間反応を行ない、無色透明な液体状の1.2,
3.4−ブタンテトラカルボン酸シアクロイルオキシエ
チル七ノー2−ヒドロキシ−3−メタクリロイルオキシ
エチルエステル(以下rBTC−2HEA−1GMA」
と略称する。)とHEAからなる反応生成物を得た。係
る反応生成物より実施例1と同様にして光硬化性樹脂組
成物を調製し、その物性を測定した。得られた結果を第
2表に示す。Example 8 BTC dianhydride 99g, HEA 187.5! ? , T.E.A.
36 g of MEHQo and 056 g of MEHQo were charged into a reaction vessel, and the reaction was carried out at 80° C. for 10 hours. After cooling, add glycidyl methacrylate 719 and further 95
The reaction was carried out at ℃ for 7 hours, and a colorless and transparent liquid of 1.2,
3.4-Butanetetracarboxylic acid cyacroyloxyethyl 7-hydroxy-3-methacryloyloxyethyl ester (rBTC-2HEA-1GMA)
It is abbreviated as. ) and HEA were obtained. A photocurable resin composition was prepared from the reaction product in the same manner as in Example 1, and its physical properties were measured. The results obtained are shown in Table 2.
比較例1
無水フタル酸148g、HEA121.8!?、TEA
o、279、MEHQo、056gの夫々を反応容器中
に仕込み、80’Cで7時間反応を行ない、フタル酸モ
ノアクリロイルオキシエチルエステル(以下rPA−1
HEAと略称する。)とHEAからなる、わずかに白濁
した液体状の反応生成物を得た。係る反応生成物より実
施例1と同様にして光硬化性樹脂組成物を調製し、その
物性を測定した。得られた結果を第2表に示す。Comparative Example 1 Phthalic anhydride 148g, HEA 121.8! ? , T.E.A.
o, 279 and MEHQo, 056 g were charged into a reaction vessel, and the reaction was carried out at 80'C for 7 hours to form phthalic acid monoacryloyloxyethyl ester (hereinafter referred to as rPA-1).
It is abbreviated as HEA. ) and HEA, a slightly cloudy liquid reaction product was obtained. A photocurable resin composition was prepared from the reaction product in the same manner as in Example 1, and its physical properties were measured. The results obtained are shown in Table 2.
比較例2
無水ピロメリット1109g、HEA266g、TEA
o、38g、MEHQo、06!?の夫々を反応容器中
に仕込み、80’Cで7時間反応を行ない、ピロメリッ
ト酸ジアクリロイルオキシエチルエステル(以下rPM
DA−2HEAJと略称する。)とHEAからなる黄色
透明な液体状の反応生成物を得た。係る反応生成物より
実施例1と同様に光硬化性樹脂組成物を調製し、その物
性を測定した。得られた結果を第2表に示す。Comparative Example 2 Anhydrous Pyromellit 1109g, HEA 266g, TEA
o, 38g, MEHQo, 06! ? were charged into a reaction vessel and reacted at 80'C for 7 hours to form pyromellitic acid diacryloyloxyethyl ester (hereinafter referred to as rPM).
It is abbreviated as DA-2HEAJ. ) and HEA were obtained as a yellow transparent liquid reaction product. A photocurable resin composition was prepared from the reaction product in the same manner as in Example 1, and its physical properties were measured. The results obtained are shown in Table 2.
比較例3
ポリエステルアクリレート(無水フタル酸−ネオペ゛ン
ヂルグリコール系)100重量部にBFE3重は部を配
合して調製した光硬化性樹脂組成物の物性を実施例1と
同様にして測定した。得られた結果を第2表に示す。Comparative Example 3 The physical properties of a photocurable resin composition prepared by blending 3 parts by weight of BFE with 100 parts by weight of polyester acrylate (phthalic anhydride-neopedyl glycol system) were measured in the same manner as in Example 1. The results obtained are shown in Table 2.
[発明の効果]
本発明に係るBTCを原料として得られるポリエステル
アクリレートを硬化性成分として含有する光硬化性樹脂
組成物は、優れた硬化物性を保持するとともに、極めて
速やかに硬化が完了する。[Effects of the Invention] The photocurable resin composition containing as a curable component a polyester acrylate obtained using BTC as a raw material according to the present invention maintains excellent cured physical properties and is completely cured extremely quickly.
特許出願人 新日本理化株式会社Patent applicant: Shin Nippon Rika Co., Ltd.
Claims (1)
酸無水物と少なくとも1個のエチレン性不飽和基を有し
、かつ水酸基若しくはグリシジル基を有する化合物との
反応生成物を硬化性成分として含有することを特徴とす
る光硬化性樹脂組成物。1 A reaction product of 1,2,3,4-butanetetracarboxylic acid or its acid anhydride and a compound having at least one ethylenically unsaturated group and a hydroxyl group or a glycidyl group as a curable component A photocurable resin composition comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62281891A JPH0621134B2 (en) | 1987-11-07 | 1987-11-07 | Photocurable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62281891A JPH0621134B2 (en) | 1987-11-07 | 1987-11-07 | Photocurable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01123805A true JPH01123805A (en) | 1989-05-16 |
JPH0621134B2 JPH0621134B2 (en) | 1994-03-23 |
Family
ID=17645403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62281891A Expired - Lifetime JPH0621134B2 (en) | 1987-11-07 | 1987-11-07 | Photocurable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0621134B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5218070A (en) * | 1991-02-11 | 1993-06-08 | Dentsply G.M.B.H. | Dental/medical composition and use |
JP2005002064A (en) * | 2003-06-13 | 2005-01-06 | Daicel Ucb Co Ltd | Polyfunctional (meth)acrylic acid ester, method for producing the same, active energy ray-curable type (meth)acrylic acid ester resin composition, and its cured product |
JPWO2005105866A1 (en) * | 2004-04-28 | 2008-03-13 | 東洋インキ製造株式会社 | Photocurable composition and antireflection film using the same |
JP2012047903A (en) * | 2010-08-25 | 2012-03-08 | Jsr Corp | Photosensitive composition and color filter |
JP2014224250A (en) * | 2013-04-26 | 2014-12-04 | 東洋インキScホールディングス株式会社 | Adhesive and optical member using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6041012B2 (en) * | 2015-05-07 | 2016-12-07 | 大日本印刷株式会社 | Decorative sheet and decorative molded product using the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036526A (en) * | 1973-08-06 | 1975-04-05 | ||
JPS523431A (en) * | 1975-06-25 | 1977-01-11 | Canon Inc | Video correcting method |
JPS5454196A (en) * | 1977-10-07 | 1979-04-28 | Teijin Ltd | Photosensitive polymer and its preparation |
JPS5930809A (en) * | 1982-08-11 | 1984-02-18 | Asahi Chem Ind Co Ltd | Photo-setting material |
JPS6216449A (en) * | 1985-07-08 | 1987-01-24 | Nippon Shokubai Kagaku Kogyo Co Ltd | Carboxyl group-containing (meth)acrylate prepolymer, production thereof and composition containing same |
-
1987
- 1987-11-07 JP JP62281891A patent/JPH0621134B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5036526A (en) * | 1973-08-06 | 1975-04-05 | ||
JPS523431A (en) * | 1975-06-25 | 1977-01-11 | Canon Inc | Video correcting method |
JPS5454196A (en) * | 1977-10-07 | 1979-04-28 | Teijin Ltd | Photosensitive polymer and its preparation |
JPS5930809A (en) * | 1982-08-11 | 1984-02-18 | Asahi Chem Ind Co Ltd | Photo-setting material |
JPS6216449A (en) * | 1985-07-08 | 1987-01-24 | Nippon Shokubai Kagaku Kogyo Co Ltd | Carboxyl group-containing (meth)acrylate prepolymer, production thereof and composition containing same |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5218070A (en) * | 1991-02-11 | 1993-06-08 | Dentsply G.M.B.H. | Dental/medical composition and use |
AU653980B2 (en) * | 1991-02-11 | 1994-10-20 | Dentsply Gmbh | Dental/medical composition and use |
JP2005002064A (en) * | 2003-06-13 | 2005-01-06 | Daicel Ucb Co Ltd | Polyfunctional (meth)acrylic acid ester, method for producing the same, active energy ray-curable type (meth)acrylic acid ester resin composition, and its cured product |
JP4573256B2 (en) * | 2003-06-13 | 2010-11-04 | ダイセル・サイテック株式会社 | Multifunctional (meth) acrylic acid ester, method for producing the same, active energy ray-curable (meth) acrylic acid ester resin composition, and cured product thereof |
JPWO2005105866A1 (en) * | 2004-04-28 | 2008-03-13 | 東洋インキ製造株式会社 | Photocurable composition and antireflection film using the same |
JP2012047903A (en) * | 2010-08-25 | 2012-03-08 | Jsr Corp | Photosensitive composition and color filter |
JP2014224250A (en) * | 2013-04-26 | 2014-12-04 | 東洋インキScホールディングス株式会社 | Adhesive and optical member using the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0621134B2 (en) | 1994-03-23 |
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