JP7388098B2 - Electronic component unit, its manufacturing method, and mounting member - Google Patents

Description

The present disclosure relates to an electronic component unit having a fixing pin, a manufacturing method thereof, and a mounting member.

Electronic components such as capacitors are mounted on circuit boards by soldering such as flow soldering or reflow soldering, or by press-fitting compliant pins into through holes. As a mounting technique by press-fitting a compliant pin, an electronic component consisting of an electrolytic capacitor body, a holder, and a compliant pin is known (for example, Patent Document 1). In this known electronic component, a holder holds and fixes the electrolytic capacitor body, and a compliant pin, which is partially fixed to the holder, has a connection with a lead wire at one end and a tip at the other. A portion thereof has a connection fixing portion that is press-fitted into a through hole of a circuit board. Electronic components with compliant pins are secured into through-holes in the circuit board with pressure. Therefore, a soldering process is not necessary, and mounting costs can be suppressed.

Japanese Patent Application Publication No. 2008-124244

By the way, circuit boards on which electronic components are mounted are used not only in static environments but also in environments with vibrations. Further, even when used in a stationary environment, the circuit board will be subject to vibrations due to the occurrence of an abnormal situation such as an earthquake. The vibration resistance of a circuit board is one of the important performances of a circuit board, and may be affected by the mounting state of electronic components on the circuit board.

Therefore, an object of the present disclosure is to improve the stability of mechanical and electrical connections of electronic components to substrates and the like.

According to the first aspect of the present disclosure, the electronic component unit includes a holder and a mounting member. The holder is for holding electronic components. The mounting member is fixed to the holder and includes a terminal connection portion for connecting to the electronic component, a plurality of fixing pins used for fixing to the board, and a conductor connection for connecting the terminal connection portion to the plurality of fixation pins. Including. The conductor connection portion can be divided into a center portion and side portions sandwiching the center portion, the terminal connection portion is disposed in the center portion of the conductor connection portion, and the plurality of fixing pins are connected to the conductor connection portion. They are respectively disposed on the side portions of the connection portion.

In the electronic component unit, the distance between the fixing pins may be greater than or equal to the distance between the plurality of lead terminals of the electronic component, and less than or equal to the width of the electronic component in the direction in which the fixing pins are separated.

The electronic component unit may include at least two of the mounting members, and may include at least four of the fixing pins.

In the electronic component unit, the distance between the adjacent fixing pins of the two mounting members is greater than or equal to the distance between the plurality of lead terminals of the electronic component , and the electronic component is arranged in a direction in which the adjacent fixing pins are separated. It may be less than or equal to the width of .

In the electronic component unit, the terminal connection portion and the fixing pin may be arranged on the same plane as the conductor connection portion.

In the electronic component unit, the terminal connection portion and the fixing pin may be perpendicular or substantially perpendicular to the longitudinal direction of the conductor connection portion.

In the electronic component unit, a part of the mounting member may be embedded inside the holder by insert molding.

In the electronic component unit, the lead terminal of the electronic component may pass through a through hole of the holder, may be bent along a lower surface of the holder, and is connected to the terminal connection portion of the mounting member. You can.

According to the second aspect of the present disclosure, a method for manufacturing an electronic component unit includes: a terminal connection portion for connecting to an electronic component; a plurality of fixing pins used for fixing to a substrate; and a step of fixing the mounting member to a holder for holding the electronic component. The conductor connection portion can be divided into a center portion and side portions sandwiching the center portion, the terminal connection portion is disposed in the center portion of the conductor connection portion, and the plurality of fixing pins are connected to the conductor connection portion. They are respectively disposed on the side portions of the connection portion.

According to the third aspect of the present disclosure, the mounting member is for mounting an electronic component. The mounting member includes a conductor connecting portion, a terminal connecting portion for connecting to the electronic component, and a plurality of fixing pins used for fixing to the board. The conductor connection portion can be divided into a center portion and side portions sandwiching the center portion. A terminal connection part is arranged at the center part of the conductor connection part, and a plurality of fixing pins are arranged at the side parts of the conductor connection part.

According to the present disclosure, any of the following effects can be obtained.

(1) Since the electronic components are connected to multiple fixed pins, the stability of the connection is increased.

(2) Electronic components can be connected to circuits, etc. using multiple fixed pins. Therefore, even if a problem occurs in some of the connections, the connection between the electronic component and the circuit can be maintained using other connections, and the reliability of the connection can be improved.

FIG. 3 is a diagram showing an example of an electronic component unit according to the first embodiment. FIG. 3 is a plan view of the electronic component unit. FIG. 3 is a bottom view of the electronic component unit. 4A is a front view of the mounting member, and FIG. 4B is a plan view of the mounting member. FIG. 3 is a diagram showing an example of force applied to an electronic component unit. FIG. 7 is a diagram showing another example of the force applied to the electronic component unit. It is a figure which shows an example of the manufacturing method of an electronic component unit. It is a figure which shows an example of the connection of a lead terminal and a terminal connection part. FIG. 7 is a diagram showing an example of an electronic component unit according to a second embodiment. 10A is a plan view of the mounting member, and FIG. 10B is a front view of the mounting member. FIG. 3 is a diagram showing the force applied to the electronic component unit. It is a figure which shows an example of the manufacturing method of an electronic component unit. It is a figure which shows an example of the manufacturing method of an electronic component unit. It is a figure which shows the other example of the connection of a lead terminal and a terminal connection part.

Embodiments will be described below with reference to the drawings.

First embodiment

FIG. 1 shows an example of an electronic component unit according to the first embodiment. FIG. 2 is a plan view of the electronic component unit, and FIG. 3 is a bottom view of the electronic component unit. In FIG. 2, in order to show the surface of the holder on which the electronic component is installed (electronic component installation surface), the electronic component is omitted and only the outline of the electronic component is shown by a broken line. The configurations shown in FIGS. 1 to 3 are examples, and the technology of the present disclosure is not limited to such configurations. In the present disclosure, the fixing pin side of the electronic component unit is defined as the lower side, and the electronic component side is defined as the upper side.

The electronic component unit 2 includes an electronic component 4, a holder 6, and a plurality of mounting members 8. The number of mounting members 8 is, for example, two, as shown in FIG. The electronic component unit 2 is a unit that can be mounted on a board 58 (A in FIG. 5, B in FIG. 5) such as a circuit board. By mounting on the board 58, the electronic component 4 is connected to, for example, a circuit on the board 58.

The electronic component 4 includes a component body 12 and a plurality of lead terminals 14. The number of lead terminals 14 is, for example, two, as shown in FIG. 3, and matches the number of mounting members 8. The component main body 12 has, for example, a cylindrical shape, but may have another shape. The electronic component 4 is, for example, a capacitor, but may be another electronic component such as an inductor, diode, or transistor.

The holder 6 is a rigid member that holds the electronic component 4, and is made of, for example, an insulating resin. As shown in FIG. 2, the holder 6 has an installation portion 22, a plurality of side walls 24, an engagement groove 26, and a protruding end portion 28 on the upper surface, that is, the surface on which the electronic component 4 is installed, and as shown in FIG. As shown, the lower surface, that is, the mounting surface, has a plurality of supporting protrusions 30 and ribs 32.

The installation section 22 has a surface on which the electronic component 4 is installed, and has a through hole 34 through which the lead terminal 14 extending downward from the electronic component 4 passes. The through hole 34 is formed at a position facing the lead terminal 14. Therefore, when the electronic component 4 is installed in the installation part 22, the lead terminal 14 passes through the through hole 34 and projects to the lower surface side of the holder 6. The lead terminals 14 on the lower surface side of the holder 6 are bent along the lower surface of the holder 6 and connected to the mounting member 8 on the outside of the holder 6, as shown in FIG.

The side wall portion 24 is adjacent to and arranged around the installation portion 22 . The inner surface of the side wall portion 24 has a shape that follows the outer surface of the electronic component 4 installed in the installation portion 22, and surrounds the electronic component 4. Therefore, the holder 6 can hold the electronic component 4 by the installation part 22 and the side wall part 24. The outer surface of the side wall portion 24 has a first flat surface 24-1 and a second flat surface 24-2 disposed on both sides of the first flat surface. The holder 6 has, for example, four side wall parts 24. As shown in FIG. 2, the four side walls 24 form a partial circular surface on the inside and a partial regular octagonal surface on the outside. In other words, the four side walls 24 generally form a regular octagonal prism having a cylindrical space inside. The second flat surfaces 24-2 of the adjacent side wall portions 24 are spaced apart, and a gap portion 36 is formed between the adjacent side wall portions 24. The first side surface of this regular octagonal prism is formed by the first flat surfaces 24-1 of the four side wall sections 24, and the second side surface is formed by the two second flat surfaces 24-2 of the adjacent side wall sections 24. and a gap 36 between them.

The engagement groove 26 has a groove into which the mounting member 8 is inserted. The engagement groove 26 has a depression inside. The recess of the engagement groove 26 engages with the protrusion of the mounting member 8, and the inserted mounting member 8 is prevented from coming off. The engagement groove 26 includes a through hole 37, and the through hole 37 allows the fixing pin 42 of the mounting member 8 to pass through to the lower surface side of the holder 6, as shown in FIG. The engagement groove 26 is disposed on the outside of the side wall portion 24, for example, on the outside of the second side surface of the regular octagonal prism described above.

The protruding end portion 28 is formed outside a portion of the engagement groove 26 . This protruding end portion 28 is used, for example, to determine the position or orientation of the electronic component unit 2 when the electronic component unit 2 is mounted.

As shown in FIG. 3, the support protrusion 30 is arranged near the inside of the fixing pin 42 of the mounting member 8, which is arranged on the lower surface side of the holder 6. The support protrusion 30 allows the insertion amount of the fixing pin 42 to be optimized when the electronic component unit 2 is mounted.

The rib 32 connects to the support protrusion 30 and the edge of the holder 6 and is arranged around the through hole 34 . The ribs 32 increase the rigidity of the holder 6.

Each mounting member 8 includes a conductor connection portion 38, a terminal connection portion 40, and a plurality of fixing pins 42. The number of the plurality of fixing pins 42 of each mounting member 8 is, for example, two. The mounting member 8 is symmetrical with respect to the terminal connection portion 40, as shown in FIGS. 4A and 4B. The mounting member 8 has conductivity and includes, for example, a metal such as copper and a plating material such as tin formed on the surface of the metal. Therefore, the conductor connection portion 38 physically and electrically connects the terminal connection portion 40 to the plurality of fixing pins 42 . A portion of the mounting member 8 is inserted into the engagement groove 26 of the holder 6. The mounting member 8 is fixed to the holder 6 to prevent it from coming off as described above, and is integrated with the holder 6. As shown in FIG. 2, the two mounting members 8 face each other with the installation section 22 in between. Further, the terminal connecting portions 40 of the two mounting members 8 and the two through holes 34 are arranged in a straight line, as shown in FIG. 3.

As shown in FIG. 4A and FIG. 4B, the conductor connection portion 38 is a plate-shaped or almost plate-shaped member bent at two places, and includes a central portion 38-1 and two side portions 38-1. 2. The two side portions 38-2 sandwich the center portion 38-1 and are connected to both ends of the center portion 38-1 at a predetermined angle θ. The central part 38-1 is arranged along the first flat surface 24-1 of the side wall part 24 of the holder 6, as shown in FIG. It is arranged along the second flat surface 24-2 of the side wall portion 24 and the gap portion 36. When the four side wall parts 24 form a regular octagonal prism, the angle θ between the center part 38-1 and the side part 38-2 matches or almost matches the interior angle of the regular octagon, and is 135 degrees or approximately 135 degrees. Become.

The upper flat end surfaces of the center portion 38-1 and the side portions 38-2 form a pressure receiving portion 44. The pressure receiving section 44 is disposed above the fixing pin 42, and at least a portion of the pressure receiving section 44 receives the pressure Fp (such as A in FIG. 5) applied when the electronic component unit 2 is mounted. The pressure receiving part 44 has a surface parallel to a plane OP that passes through the upper end of the fixing pin 42 and is orthogonal to the fixing pin 42, and is exposed as shown in FIGS. 1 and 2. Moreover, a part of the pressure receiving part 44 is adjacent to the gap part 36 between the side wall parts 24, as shown in FIG.

Each side portion 38-2 includes an engaging protrusion 46, a first stopper portion 48, and a second stopper portion 50.

The engagement protrusion 46 is arranged between the pressure receiving part 44 and the fixing pin 42. The engagement protrusion 46 engages with the engagement groove 26 when the side portion 38-2 of the mounting member 8 is inserted into the engagement groove 26 of the holder 6, thereby preventing the mounting member 8 from coming off. Prevention is planned.

The first stopper part 48 is formed at the upper part of the side end of the side part 38-2, and has a flat surface on the lower side. The second stopper portion 50 is a flat surface on the lower side of the side portion 38-2, and is disposed closer to the center portion 38-1 than the engagement protrusion 46. When the side part 38-2 of the mounting member 8 is inserted into the engagement groove 26 of the holder 6, the first stopper part 48 and the second stopper part 50 contact both outer sides of the engagement groove 26, The state of insertion into the engagement groove 26 is properly regulated.

The terminal connection part 40 is arranged at the center of the lower end of the central part 38-1. The terminal connection portion 40 has two connection pieces 52 extending in the vertical direction, and these two connection pieces 52 are arranged on the same plane as the center portion 38-1 of the conductor connection portion 38. The two connecting pieces 52 are arranged a predetermined distance L apart to form a recess 54 between the connecting pieces 52 and an opening in the direction toward which the tip of the fixing pin 42 faces, that is, on the lower side. ing. Each connecting piece 52 has an inclined surface 56 around the opening. Therefore, the openings of the two connecting pieces 52 are wider than the bottom of the recess 54. The inclined surface 56 can guide the lead terminal 14 into the recess 54, thereby reducing the burden of inserting the lead terminal 14 into the recess 54. The lower end of the terminal connection part 40 is arranged, for example, on the plane OP.

The distance L between the connecting pieces 52 is set to be slightly narrower than the diameter of the lead terminal 14. Therefore, the connection piece 52 pinches the lead terminal 14 inserted into the recess 54 and tightens it. The electronic component 4 is electrically connected to the mounting member 8 through the connection between the connection piece 52 and the lead terminal 14 .

The fixing pin 42 is disposed below the pressure receiving part 44 and the engagement protrusion 46 and on the same plane as the side part 38-2 of the conductor connecting part 38. The fixing pin 42 has a function of engaging, for example, a connection hole 60 (A in FIG. 5, B in FIG. 5) of the substrate 58, and is, for example, a press-fit connector or a press-fit terminal.

The electronic component unit 2 includes, for example, two mounting members 8, and each mounting member 8 has, for example, two fixing pins 42. As shown in FIGS. 2 and 3, a total of four fixing pins 42 are arranged at equal or approximately equal intervals around the electronic component 4, and are located near the four corners of the lower surface of the holder 6, which has an approximately rectangular shape. Placed. Therefore, in the mounted state of the electronic component unit 2, the electronic component unit 2 is fixed near the four corners, and a stable mounted state can be obtained.

The distance Lp1 between the two fixing pins 42 of each mounting member 8 is preferably greater than or equal to the distance Lt between the two lead terminals 14 of the electronic component 4, as shown in FIG. In addition, it is preferable that the width D1 of the electronic component 4 in the direction in which the fixing pins 42 are separated is equal to or less than the diameter of the electronic component 4. When the distance Lp1 is greater than or equal to the distance Lt, the stability of the electronic component unit 2 in the mounted state is enhanced. Further, when the distance Lp1 is equal to or less than the width D1, it is possible to suppress an increase in the installation area of the electronic component unit 2.

As shown in FIG. 3, the distance Lp2 between two adjacent fixing pins 42 of the two mounting members 8 is preferably greater than or equal to the distance Lt, and as shown in FIG. It is preferable that the width D2 of the electronic component 4 is equal to or less than the diameter of the electronic component 4. When the distance Lp2 is greater than or equal to the distance Lt, the stability of the electronic component unit 2 in the mounted state is enhanced. Furthermore, when the distance Lp2 is equal to or less than the width D2, it is possible to suppress an increase in the installation area of the electronic component unit 2.

A in FIG. 5 shows an example of the force applied to the electronic component unit during the mounting, and B in FIG. 5 shows an example of the force applied to the electronic component unit at the end of the mounting. In FIGS. 5A and 5B, the fixing pins and connection holes in the board are shown with broken lines. In FIGS. 5A and 5B, solid line arrows indicate forces applied to the electronic component unit 2. In FIGS. In FIG. 5A, a dashed arrow indicates the moving direction of the electronic component unit 2, and in FIG. 5B, a dashed arrow indicates a drag force that may be applied to the holder 6.

The electronic component unit 2 is mounted, for example, on a board 58, as shown in FIGS. 5A and 5B. The board 58 has a connection hole 60 at a position corresponding to the fixing pin 42 of the electronic component unit 2. The connection hole 60 is, for example, a through hole.

During the mounting process, the electronic component unit 2 is subjected to a pressure Fp and a dynamic frictional force Fd, as shown in FIG. 5A. The pressure Fp is a downward force for inserting the fixing pin 42 of the electronic component unit 2 into the connection hole 60 of the board 58, and is applied to a part of the exposed pressure receiving part 44 of the mounting member 8, for example, as shown in FIG. It is added directly above the fixing pin 42 as shown in FIG. The dynamic frictional force Fd is generated by friction between the fixing pin 42 and the connection hole 60. The dynamic frictional force Fd has a direction opposite to the pressure Fp and cancels out the pressure Fp. Due to the insertion of the fixing pin 42, the pressure Fp has a magnitude greater than the dynamic frictional force Fd. The portion of the pressure receiving portion 44 that receives the pressure Fp (the portion where the arrow representing the pressure Fp is in contact with the pressure receiving portion 44) is arranged directly above the fixing pin 42, that is, on the perpendicular line of the board 58 passing through the fixing pin 42. . Therefore, the pressure Fp opposes the dynamic frictional force Fd on a straight line.

At the end of the mounting, the electronic component unit 2 is subjected to a pressure Fp and a static friction force Fs, as shown in FIG. 5B. The static frictional force Fs is generated by friction between the fixing pin 42 and the connection hole 60. Static frictional force Fs has a direction opposite to pressure Fp and cancels out pressure Fp. The maximum static friction force of the static friction force Fs is larger than the dynamic friction force Fd. Therefore, if the pressure Fp is set to a value that is greater than or equal to the dynamic frictional force Fd and less than or equal to the maximum static frictional force, the pressure Fp will be balanced with the static frictional force Fs at the end of mounting. Therefore, the support protrusion 30 of the holder 6 can gently contact the substrate 58. In other words, the drag force Fr that the support protrusion 30 receives from the substrate 58 can be suppressed. The pressure Fp, which is larger than the maximum static friction force, balances the static friction force Fs and the drag force Fr, as shown in FIG. 5B.

The pressure Fp is generated, for example, by a pressurizing device (not shown) corresponding to the electronic component unit 2. The pressurizing device includes, for example, a stop setting value for pressurizing. The stop setting value is a setting value related to the distance from the board 58. When the pressurizing device pushes down the pressure receiving part 44 toward the substrate 58 by the distance set by the stop setting value, the pressurizing device stops pressurizing. The distance from the board 58 set by the stop setting value is, for example, the distance from the board 58 to the pressure receiving part 44 shown in FIG. 5B. Such a pressurizing device stops pressurizing when the fixing pin 42 is inserted into the connection hole 60 to an appropriate position. Therefore, even if the pressure Fp is greater than the maximum static friction force, the generation of the drag force Fr can be suppressed.

Both the pressure receiving portion 44 and the fixing pin 42 are formed on the mounting member 8, and the portion of the pressure receiving portion 44 that receives the pressure Fp is arranged directly above the fixing pin 42. Therefore, the pressure Fp, the dynamic frictional force Fd, and the static frictional force Fs act on a limited area of the mounting member 8, that is, the area 61 between the portion of the pressure receiving part 44 that receives the pressure Fp and the fixing pin 42, and the electronic component 4 And the action of force on the holder 6 is suppressed. Moreover, when the pressure receiving part 44 is arranged directly above the fixing pin 42, the direction in which the pressure Fp is applied matches or almost matches the direction from the pressure receiving part 44 toward the fixing pin 42. Therefore, the pressure Fp can be easily transmitted to the fixing pin 42, and the mounting efficiency of the electronic component unit 2 can be improved.

Since the terminal connecting portion 40 is separated from the region 61 between the portion of the pressure receiving portion 44 that receives the pressure Fp and the fixing pin 42, the action of force on the terminal connecting portion 40 is suppressed.

The drag force Fr acts on the holder 6 near the fixing pin 42. Therefore, the pressure Fp, the static friction force Fs, and the drag force Fr are applied to a limited area of the mounting member 8 and the holder 6, that is, the area between the fixing pin 42, the support protrusion 30, and the pressure receiving part 44 where the force is applied. 62. Therefore, even if the drag force Fr occurs, the force acting on the electronic component 4 and the holder 6 is suppressed. Further, since the terminal connecting portion 40 is disposed between adjacent supporting protrusions 30, furthermore, in the middle of the supporting protruding portions 30 and is away from the region 62, even if the resistance Fr occurs, the terminal connecting portion 40 The effect of force on is suppressed.

As shown in FIG. 5B, the lead terminal 14 is connected to the terminal connection portion 40 near the board 58 in the mounted state. A connection near the substrate 58 can improve the stability of the connection against vibration, for example, compared to a connection at a position distant from the substrate 58. Furthermore, as shown in FIG. 5B, the substrate 58 faces the opening of the terminal connection section 40 with a slight gap in between, so that vibrations of the substrate 58 can be prevented from being directly transmitted to the terminal connection section 40.

Since the portion of the pressure receiving portion 44 to which the pressure Fp is applied is adjacent to the gap portion 36, free space exists on both sides of the pressure receiving portion 44. There are few obstacles around the pressure receiving part 44, and a work space for applying pressure to the pressure receiving part 44 is secured. Therefore, the workability for mounting the electronic component unit 2 is improved. For example, the risk of unintentional contact of the pressurizing device with the electronic component unit 2 can be suppressed.

The portion to which the pressure Fp is applied is not limited to directly above the fixing pin 42. For example, as shown in A of FIG. 6, a pressure Fp may be applied between the position directly above the fixing pin 42 and the position directly above the terminal connection part 40, and for example, as shown in B of FIG. The pressure Fp may be applied directly above the mounting member 8, that is, at the center of the mounting member 8. In other words, the portion of the pressure receiving portion 44 that receives the pressure Fp may be located away from the perpendicular line of the substrate 58 passing through the fixing pin 42. Even if the portion receiving the pressure Fp is away from the perpendicular line of the board 58 passing through the fixing pin 42, the effect of force on the electronic component 4 and the holder 6 can be suppressed. Furthermore, even if the pressure Fp is applied between the position directly above the fixing pin 42 and the position directly above the terminal connection part 40, the terminal connection part 40 is moved between the part of the pressure receiving part 44 that receives the pressure Fp and the fixed pin 42. It can be placed at a position away from area 61.

7 and 8 show an example of a manufacturing procedure for an electronic component unit. The manufacturing procedure shown in FIGS. 7 and 8 is an example of a method for manufacturing an electronic component unit.

The electronic component 4, holder 6, and mounting member 8 are prepared. The electronic component 4 may be independently manufactured or may be a commercially available electronic component. The holder 6 is manufactured, for example, by resin molding using a mold. The holder 6 may be manufactured using a 3D printer, for example. The mounting member 8 is manufactured through, for example, a cutting process, a molding process, and a plating process. In the cutting process, a metal plate such as a copper plate is punched into a predetermined shape using, for example, a die. In the cutting step, it is sufficient to obtain a metal plate having a predetermined shape, and the metal plate may be cut with a cutting machine such as a laser cutting machine or a water jet cutting machine. In the molding process, a metal plate having a predetermined shape is molded into a predetermined shape using, for example, a mold. In the plating process, the surface of the formed metal plate is plated. The cutting process and the forming process may be performed integrally.

The fixing pin 42, the engagement protrusion 46 and the side part 38-2 of the mounting member 8 are inserted into the engagement groove 26 of the holder 6, the fixation pin 42 is protruded from the lower surface of the holder 6, and the engagement protrusion 46 is inserted into the engagement groove. 26. A mounting member 8 is installed integrally with the holder 6.

The lead terminals 14 of the electronic component 4 are inserted into the through holes 34 of the holder 6, and the component main body 12 of the electronic component 4 is installed in the installation section 22 of the holder 6. Lead terminals 14 protruding from the lower surface of the holder 6 are bent along the lower surface of the holder 6 and connected to the terminal connecting portions 40 of the mounting member 8, as shown in FIG. Through these steps, the electronic component unit 2 is obtained.

For example, the electronic component unit 2 obtained through the above steps includes a pressure receiving part 44 above the fixing pin 42. Pressure Fp is applied to the pressure receiving part 44 of the electronic component unit 2, the fixing pin 42 of the electronic component unit 2 is inserted into the connection hole 60 of the board 58, and the electronic component unit 2 is mounted on the board 58. It is possible to obtain electronic equipment equipped with

According to the first embodiment, the following effects can be obtained.

(1) Since the mounting member 8, which is different from the holder 6, includes the fixing pin 42 and the pressure receiving part 44 disposed above the fixing pin 42, the pressure applied to the pressure receiving part 44 is mainly applied to the mounting member 8. It acts on a limited area 61 between the fixing pin 42 and the portion of the pressure receiving part 44 that receives the pressure Fp. Therefore, pressurization of the holder 6 and the electronic component 4 can be suppressed.

(2) Since pressurization of the holder 6 and the electronic component 4 can be suppressed, the risk of malfunction of the holder 6 and the electronic component 4 during mounting can be suppressed.

(3) The action of force on the terminal connection portion 40 is suppressed. Therefore, a stable connection between the terminal connecting portion 40 and the lead terminal 14 can be obtained.

(4) A decrease in the connection strength between the lead terminal 14 and the fixing pin 42 due to mounting on the board 58, a decrease in the performance of the electronic component 4, or damage to the holder 6 can be suppressed or prevented.

(5) Each lead terminal 14 of the electronic component 4 is connected to a plurality of fixing pins 42. Therefore, the electronic component unit 2 is fixed to, for example, the substrate 58 with at least twice the number of fixing pins 42 as the number of lead terminals 14, and the stability of the connection of the electronic component unit 2 is enhanced.

(6) Each lead terminal 14 of the electronic component 4 can be connected to, for example, a circuit on the board 58 using a plurality of fixing pins 42. Therefore, even if a problem occurs in some of the connections, the connection between the electronic component 4 and the circuit can be maintained using other connections, and the reliability of the connection can be improved.

(7) Since the electronic component unit 2 has the terminal connection portion 40 that opens at the bottom, the lead terminal 14 can be connected to the terminal connection portion 40 from the bottom to the top. Therefore, the electronic component unit 2 can mount the electronic component 4 on the board 58 such that the lead terminal 14 of the electronic component 4 is arranged on the board 58 side.

Second embodiment

FIG. 9 shows an example of an electronic component unit according to the second embodiment. The configuration shown in FIG. 9 is an example, and the technology of the present disclosure is not limited to such a configuration. In FIG. 9, the same parts as in any of FIGS. 1 to 3 are given the same reference numerals.

The electronic component unit 72 includes the electronic component 4 described above, a holder 76, and a plurality of mounting members 78. The number of mounting members 78 is, for example, two. The electronic component unit 72 can be mounted, for example, on the board 58 described above, and by mounting it on the board 58, for example, the electronic component 4 is connected to the circuit of the board 58.

The holder 76 is a rigid member that holds the electronic component 4, and is made of, for example, an insulating resin. The holder 76 has the installation part 22 already described in the first embodiment and a plurality of side wall parts 80 on the upper surface, and the plurality of support protrusions 30 already described in the first embodiment on the lower surface. and ribs 32.

The side wall portion 80 has a structure in which the two adjacent side wall portions 24 described in the first embodiment are integrated. That is, the holder 76 has a side wall instead of the gap 36 between the two adjacent side walls 24, and the two adjacent side walls 24 and the side wall between them form one side wall 80. ing. The holder 76 includes two side walls 80, and a gap 36 is formed between the side walls 80.

Each mounting member 78 is partially embedded inside the holder 76 and is fixed and integrated with the holder 76. The mounting member 78 includes a conductor connection portion 82, a terminal connection portion 84, and a plurality of fixing pins 86, as shown in FIGS. 10A and 10B. The number of the plurality of fixing pins 86 is, for example, two. The mounting member 78 is symmetrical with respect to the terminal connection portion 84 . The mounting member 78 has conductivity and includes, for example, a metal such as copper and a plating material such as tin formed on the surface of the metal. Therefore, the conductor connecting portion 82 physically and electrically connects the terminal connecting portion 84 to the plurality of fixing pins 86 . The two mounting members 78, similar to the mounting member 8 already described in the first embodiment, face each other via the installation portion 22, and the terminal connecting portions 84 of the two mounting members 78 and the two through holes 34 are placed in a straight line.

The conductor connection portion 82 is a plate-shaped or substantially plate-shaped member, as shown in FIGS. 10A and 10B. The conductor connection portion 82 includes a recessed portion 88-1 to avoid contact with the through hole 34 of the holder 76. Further, the conductor connecting portion 82 includes retreating portions 88-2 and 88-3 in order to prevent the conductor connecting portion 82 from dividing the holder 76 in the vertical direction. The conductor connection portion 82 can be divided into three equal parts in the left-right direction, for example, into a center portion 82-1 and two side portions 82-2. The two side portions 82-2 sandwich the center portion 82-1 and are connected to both ends of the center portion 82-1, respectively.

Each side portion 82-2 includes a pressure receiving portion 90. The pressure receiving part 90 is disposed above the fixing pin 86 and is further disposed directly above the fixing pin 86. In the electronic component unit 72, in particular, the pressure receiving portion 90 is adjacent to the fixing pin 86. The pressure receiving portion 90 has a surface that is parallel or substantially parallel to a plane OP that passes through the upper end of the fixing pin 86 and is perpendicular to the fixing pin 86 . The pressure receiving part 90 is disposed near the outside of the side wall part 80 of the holder 76, as shown in FIG. 9, and is exposed.

The terminal connection part 84 is arranged at the center of one end of the central part 82-1. The terminal connection portion 84 has two connection pieces 92 extending in the longitudinal direction of the conductor connection portion 82 and in a direction perpendicular or substantially perpendicular to the main surface. The distance L between the two connection pieces 92, the recess 54, the opening, and the inclined surface 56 are the same as in the terminal connection part 40 already described in the first embodiment.

The fixing pin 86 is arranged below the pressure receiving part 90. The fixing pin 86 has a function of engaging, for example, the connection hole 60 of the substrate 58, and is, for example, a press-fit connector or a press-fit terminal. The fixing pin 86 extends in the longitudinal direction of the conductor connection portion 82 and in a direction perpendicular or substantially perpendicular to the main surface.

The electronic component unit 72 includes, for example, two mounting members 78, and each mounting member 78 has, for example, two fixing pins 86. A total of four fixing pins 86 are arranged at equal or approximately equal intervals around the electronic component 4, as described in the first embodiment. Further, a total of four fixing pins 86 are arranged on every other side near the eight sides of the lower surface of the holder 76 having an octagonal shape. Therefore, a stable mounting state of the electronic component unit 72 can be obtained.

The distance Lp3 between the two fixing pins 86 of each mounting member 78 is preferably equal to or greater than the distance Lt, and preferably equal to or less than the width D1, similarly to the distance Lp1 already described in the first embodiment. . Further, the distance between the two adjacent fixing pins 86 of the two mounting members 78 is preferably at least the distance Lt, and the width is at most D2, similar to the distance Lp2 described in the first embodiment. It is preferable that there be.

A in FIG. 11 shows the force applied to the electronic component unit during the mounting, and B in FIG. 11 shows the force applied to the electronic component unit at the end of the mounting. In FIGS. 11A and 11B, fixing pins and connection holes in the board are shown with broken lines. In FIGS. 11A and 11B, solid arrows indicate forces applied to the electronic component unit 72. In FIGS. In FIG. 11A, a dashed arrow indicates the direction of movement of the electronic component unit 72, and in FIG. 11B, a dashed arrow indicates a drag force that may be applied to the holder 76.

During the mounting process, the electronic component unit 72 is subjected to the pressure Fp and the dynamic frictional force Fd already described in the first embodiment, as shown in FIG. 11A. The pressure Fp is applied to the pressure receiving portion 90 of the mounting member 78. At the end of the mounting, the electronic component unit 72 is subjected to the pressure Fp and static friction force Fs already described in the first embodiment, as shown in FIG. 11B. Further, at the end of the mounting, the electronic component unit 72 may be subjected to the drag force Fr already described in the first embodiment, as shown in B of FIG.

Both the pressure receiving part 90 and the fixing pin 86 are formed on the mounting member 78, and the pressure receiving part 90 is arranged above the fixing pin 86, and further, directly above the fixing pin 86. Therefore, the pressure Fp, the dynamic frictional force Fd, and the static frictional force Fs act on a limited area of the mounting member 78, that is, the area 61 between the pressure receiving part 90 and the fixing pin 86, and the force on the electronic component 4 and the holder 76 is reduced. The effect is suppressed. In the electronic component unit 72, in particular, the pressure receiving portion 90 is adjacent to the fixing pin 86. Therefore, the area on which the pressure Fp, the dynamic frictional force Fd, and the static frictional force Fs act can be limited to a very limited area, that is, the narrow area 61 between the pressure receiving part 90 and the fixed pin 86. Further, when the pressure receiving part 90 is arranged directly above the fixing pin 86, the direction in which the pressure Fp is applied matches or almost matches the direction from the pressure receiving part 90 toward the fixing pin 86. Therefore, the pressure Fp can be easily transmitted to the fixing pin 86. The ease of mounting the electronic component unit 72 can be improved.

Since the terminal connecting portion 84 is separated from the region 61 between the pressure receiving portion 90 and the fixing pin 86, the action of force on the terminal connecting portion 84 is suppressed.

The terminal connection portion 84 is arranged between adjacent support protrusions 30, and further between the support protrusions 30, and the drag force Fr acts on the holder 76 in the vicinity of the fixing pin 86. Therefore, as already described in the first embodiment, even if the drag force Fr occurs, the force acting on the electronic component 4, the holder 76, and the terminal connection portion 84 is suppressed.

As shown in FIG. 11B, the lead terminal 14 is connected to the terminal connection part 84 near the board 58 in the mounted state, and the board 58 faces the opening of the terminal connection part 84 with a small gap in between. . Therefore, as already described in the first embodiment, the connection near the board 58 can improve the stability of the connection against vibrations, for example, and prevent the vibration of the board 58 from being directly transmitted to the terminal connection part 40. can be prevented.

FIG. 12 shows an example of a manufacturing procedure for an electronic component unit. The manufacturing procedure shown in FIG. 12 is an example of a method for manufacturing an electronic component unit.

A mounting member 78 is produced. The mounting member 78 is manufactured through, for example, a cutting process, a molding process, and a plating process. In the cutting process, as shown in FIG. 12A, a metal plate such as a copper plate is punched into a predetermined shape using, for example, a die. The punched metal plate has two expanded parts of mounting members 78 and a frame 94. The frame 94 is arranged outside the expanded parts of the two mounting members 78, and is connected to each expanded part at a plurality of positions. Therefore, the frame 94 can fix the relative positions of the two deployed parts placed within the frame. Further, the frame 94 has a plurality of positioning holes 96. The plurality of positioning holes 96 can position, for example, two deployed parts or two mounting members 78 in a process subsequent to the molding process. In the cutting step, it is sufficient to obtain a metal plate having a predetermined shape, and the metal plate may be cut with a cutting machine such as a laser cutting machine or a water jet cutting machine.

In the forming process, as shown in FIG. 12B, a metal plate is formed into a predetermined shape using, for example, a mold. In the plating process, the surface of the formed metal plate is plated. The cutting process and the forming process may be performed integrally.

As shown in FIG. 12C, a holder 76 is molded around the manufactured mounting member 78. The holder 76 is manufactured, for example, by resin molding using a mold. In molding the holder 76, a portion of the mounting member 78 is embedded inside the holder 76 by insert molding. By molding the holder 76, the mounting member 78 is inserted into the holder 76 and integrated with the holder 76.

As shown in FIG. 12D, the mounting member 78 is removed from the frame 94 to obtain the holder 76 to which the mounting member 78 is attached.

As shown in FIG. 13, the lead terminals 14 of the electronic component 4 are inserted into the through holes 34 of the holder 76, and the component body 12 of the electronic component 4 is installed in the installation section 22 of the holder 76. The lead terminals 14 protruding from the lower surface of the holder 76 are bent and connected to the terminal connecting portions 84 of the mounting member 78 in the same way as in the first embodiment. Through these steps, the electronic component unit 72 is obtained.

For example, the electronic component unit 72 obtained through the above steps includes a pressure receiving portion 90 above the fixing pin 86. When pressure Fp is applied to the pressure receiving part 90 of the electronic component unit 72 and the fixing pin 86 of the electronic component unit 72 is inserted into the connection hole 60 of the board 58 and the electronic component unit 72 is mounted on the board 58, the electronic component unit 72 It is possible to obtain electronic equipment equipped with

According to the second embodiment, the following effects can be obtained.

(1) Effects similar to those already described in the first embodiment can be obtained.

(2) A part of the mounting member 78 is embedded inside the holder 76 by insert molding. Therefore, the holder 76 does not need to have an engagement groove, and the side surface of the mounting member 78 from the pressure receiving part 90 to the fixing pin 86 can be exposed. Therefore, the bottom area of the electronic component unit 72 can be suppressed. However, in the electronic component unit 2 according to the first embodiment, the mounting member 8 is entirely disposed outside the side wall portion 24. Therefore, the height of the electronic component unit 2 can be suppressed.

Characteristics and modifications of the embodiment described above are listed below.

(1) In the above embodiment, the electronic component 4 has two lead terminals 14, and the electronic component units 2, 72 include the same number of mounting members 8, 78 as the lead terminals 14. The number of lead terminals 14 and mounting members 8, 78 may be one, or three or more. Furthermore, the electronic component units 2 and 72 include a smaller number of mounting members 8 and 78 than the number of lead terminals 14, so that some of the lead terminals 14 can be connected to the circuit without using the mounting members 8 and 78. You may also do so.

(2) In the embodiment described above, the side wall portions 24 and 80 form a regular octagon in plan view. If the side walls 24, 80 have a regular octagonal shape, the four fixing pins 42, 86 can be arranged on alternate sides, as shown in FIGS. 2 and 3, and the fixing pins 42, 86 can be They can be arranged equidistantly or approximately equidistantly around the part 4. Further, the two terminal connecting portions 40 and 84 and the two through holes 34 can be arranged in a straight line. However, the shape of the side wall portions 24, 80 may be a regular octagon with different side lengths, a circle, or another polygon. For example, if the shape of the side wall part is a regular dodecagon, six fixing pins can be arranged on every other side, and three terminal connecting parts can be arranged on every other side. Fixing pins and terminal connections can be arranged at equal or nearly equal intervals around the electronic component, and for example, the connectivity of three lead terminals arranged at three corners of an equilateral triangle can be improved. can.

(3) In the embodiment described above, the pressure receiving portions 44 and 90 have a surface parallel to the plane OP orthogonal to the fixing pins 42 and 86, or a surface substantially parallel to the plane OP. However, it is sufficient that downward pressure Fp can be applied to the pressure receiving parts 44, 90, and the pressure receiving parts 44, 90 are not limited to surfaces parallel to the plane OP or substantially parallel to the plane OP.

(4) In the first embodiment, the pressure receiving portion 44 receives the pressure Fp at one or two locations, but may receive the pressure Fp at three or more locations.

(5) In the embodiment described above, the pressure receiving parts 44 and 90 are exposed. However, the pressure receiving parts 44 and 90 may be covered with a cover (not shown), for example. In this case, the pressure Fp is transmitted to the pressure receiving parts 44 and 90 via the cover. Therefore, regardless of whether or not the cover is coupled to the holders 6, 76, the action of force on the electronic component 4 and the holders 6, 76 can be suppressed.

(6) The mounting members 8 and 78 include a metal such as copper and a plating material such as tin formed on the surface of this metal. Therefore, the mounting members 8 and 78 have excellent conductivity, and due to the tin plating, they have excellent rust prevention properties and electrical connection stability. However, the mounting members 8 and 78 are not limited to such materials as long as they have conductivity.

(7) In the first embodiment, the electronic component 4 is installed on the holder 6 after the mounting member 8 is installed integrally on the holder 6. However, the manufacturing procedure of the present disclosure is not limited to such a procedure. For example, the electronic component 4 is placed in the holder 6, the lead terminals 14 are bent along the lower surface of the holder 6, and then, as shown in FIG. 40 may be connected to the lead terminal 14. According to such a manufacturing procedure, it is possible to avoid connecting the lead terminal 14 to the terminal connection part 40 while bending it, and therefore the stability of the electrical connection can be improved.

(8) In the second embodiment, the pressure receiving part 90 of the electronic component unit 72 is adjacent to the side wall part 80, but as already mentioned in the first embodiment, the pressure receiving part 90 is located in the gap 36. may be adjacent to. Due to the arrangement of the gap portions 36, free spaces are formed on both sides of the pressure receiving portion 90. Therefore, there are fewer obstacles around the pressure receiving part 90, and a work space for applying pressure to the pressure receiving part 90 can be secured.

(9) In the above embodiment, the electronic component units 2 and 72 include one electronic component 4, but the electronic component units 2 and 72 include a plurality of electronic components 4, and the holders 6 and 76 contain a plurality of electronic components. Part 4 may also be held. In this case, some or all of the lead terminals 14 of the plurality of electronic components 4 may be connected to the mounting member 8 or the mounting member 78.

As explained above, the most preferred embodiment of the present disclosure has been described, but the present disclosure is not limited to the above description, and the present disclosure is not limited to the inventions described in the claims or disclosed in the specification. It goes without saying that those skilled in the art can make various modifications and changes based on the gist of this disclosure, and it goes without saying that such modifications and changes are included within the scope of the present disclosure.

The technology of the present disclosure can be used, for example, for mounting electronic components on a board, and is useful.

2, 72 Electronic component unit 4 Electronic component 6, 76 Holder 8, 78 Mounting member 14 Lead terminal 22 Installation part 24, 80 Side wall part 24-1 First flat surface 24-2 Second flat surface 26 Engagement groove 28 Projecting end portion 30 Support protrusion 34, 37 Through hole 36 Gap portion 38, 82 Conductor connection portion 38-1, 82-1 Center portion 38-2, 82-2 Side portion 40, 84 Terminal connection portion 42, 86 Fixing pin 44, 90 Pressure receiving part 46 Engaging protrusion 48 First stopper part 50 Second stopper part 52, 92 Connection piece 54 Recessed part 56 Inclined surface 61, 62 Area

Claims (10)

a holder for holding electronic components;
A mounting that is fixed to the holder and includes a terminal connection part for connecting to the electronic component, a plurality of fixing pins used for fixing to the board, and a conductor connection part for connecting the terminal connection part to the plurality of fixation pins. parts and
Equipped with
The conductor connection portion can be divided into a center portion and side portions sandwiching the center portion,
The terminal connection part is arranged in the center part of the conductor connection part,
The electronic component unit, wherein the plurality of fixing pins are respectively arranged on the side portions of the conductor connection portion. 2. The distance between the fixing pins is greater than or equal to the distance between the plurality of lead terminals of the electronic component, and less than or equal to the width of the electronic component in the direction in which the fixing pins are separated. electronic component unit. 3. The electronic component unit according to claim 1, wherein the electronic component unit includes at least two of the mounting members and at least four of the fixing pins. The distance between the adjacent fixing pins of the two mounting members is greater than or equal to the distance between the plurality of lead terminals of the electronic component , and is less than or equal to the width of the electronic component in the direction in which the adjacent fixing pins are separated. The electronic component unit according to claim 3, characterized in that: The electronic component unit according to any one of claims 1 to 4, wherein the terminal connection portion and the fixing pin are arranged on the same plane as the conductor connection portion. The electronic component unit according to any one of claims 1 to 4, wherein the terminal connection portion and the fixing pin are perpendicular or substantially perpendicular to the longitudinal direction of the conductor connection portion. 7. The electronic component unit according to claim 6, wherein a part of the mounting member is embedded inside the holder by insert molding. The lead terminal of the electronic component passes through the through hole of the holder, is bent along the lower surface of the holder, and is connected to the terminal connection portion of the mounting member. The electronic component unit according to any one of Item 7. forming a mounting member including a terminal connection part for connecting to an electronic component, a plurality of fixing pins used for fixing to the board, and a conductor connection part connecting the terminal connection part to the plurality of fixation pins;
fixing the mounting member to a holder for holding the electronic component;
Equipped with
The conductor connection portion can be divided into a center portion and side portions sandwiching the center portion,
The terminal connection part is arranged in the center part of the conductor connection part,
The method for manufacturing an electronic component unit, wherein the plurality of fixing pins are respectively arranged on the side portions of the conductor connection portion. A mounting member for mounting electronic components,
a conductor connection portion that can be divided into a center portion and side portions sandwiching the center portion;
a terminal connection part for connecting to the electronic component, arranged in the center part of the conductor connection part;
a plurality of fixing pins used for fixing to the substrate, each arranged on the side part of the conductor connection part;
A mounting member comprising:

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